TI1 CD4059A Cmos programmable divide-by-n counter Datasheet

Data sheet acquired from Harris Semiconductor
SCHS109B – Revised June 2003
The CD4059A-series types are supplied in
24-lead dual-in-line plastic packages
(E suffix), and 24-lead small-outline
packages (M and M96 suffixes).
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
Copyright © 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CD4059AD3
ACTIVE
CDIP SB
JD
24
1
TBD
POST-PLATE N / A for Pkg Type
Purchase Samples
CD4059AE
ACTIVE
PDIP
N
24
15
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
CD4059AEE4
ACTIVE
PDIP
N
24
15
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
CD4059AM
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD4059AME4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD4059AMG4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4059A, CD4059A-MIL :
• Catalog: CD4059A
• Military: CD4059A-MIL
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
MECHANICAL DATA
MCDI005 – JANUARY 1998
JD (R-CDIP-T**)
CERAMIC SIDE-BRAZE DUAL-IN-LINE PACKAGE
24 PINS SHOWN
A
24
13
0.590 (15,00)
TYP
1
12
0.065 (1,65)
0.045 (1,14)
0.620 (15,75)
0.590 (14,99)
0.175 (4,45)
0.140 (3,56)
0.075 (1,91) MAX (4 Places)
Seating Plane
0.020 (0,51) MIN
0.021 (0,53)
0.015 (0,38)
0.100 (2,54)
PINS **
DIM
A MAX
0°– 15°
0.125 (3,18) MIN
0.012 (0,30)
0.008 (0,20)
24
28
40
48
52
1.250
(31,75)
1.450
(36,83)
2.050
(52,07)
2.435
(61,85)
2.650
(67,31)
4040087/B 04/95
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package is hermetically sealed with a metal lid.
The terminals are gold-plated.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
N (R–PDIP–T24)
PLASTIC DUAL–IN–LINE
1.222 (31,04) MAX
24
13
0.360 (9,14) MAX
1
12
0.070 (1,78) MAX
0.200 (5,08) MAX
0.425 (10,80) MAX
0.020 (0,51) MIN
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0’–15’
0.021 (0,53)
0.015 (0,38)
0.010 (0,25)
0.010 (0,25) NOM
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI008 – OCTOBER 1994
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
A
24
13
0.560 (14,22)
0.520 (13,21)
1
12
0.060 (1,52) TYP
0.200 (5,08) MAX
0.610 (15,49)
0.590 (14,99)
0.020 (0,51) MIN
Seating Plane
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.125 (3,18) MIN
0.010 (0,25) M
PINS **
0°– 15°
0.010 (0,25) NOM
24
28
32
40
48
52
A MAX
1.270
(32,26)
1.450
(36,83)
1.650
(41,91)
2.090
(53,09)
2.450
(62,23)
2.650
(67,31)
A MIN
1.230
(31,24)
1.410
(35,81)
1.610
(40,89)
2.040
(51,82)
2.390
(60,71)
2.590
(65,79)
DIM
4040053 / B 04/95
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Falls within JEDEC MS-011
Falls within JEDEC MS-015 (32 pin only)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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