NSC LMH6622MMX Dual wideband, low noise, 160mhz, operational amplifier Datasheet

LMH6622
Dual Wideband, Low Noise, 160MHz, Operational
Amplifiers
General Description
Features
The LMH6622 is a dual high speed voltage feedback operational amplifier specifically optimized for low noise. A voltage
noise specification of 1.6nV/
, a current noise specification 1.5pA/
, a bandwidth of 160MHz, and a harmonic
distortion specification that exceeds 90dBc combine to make
the LMH6622 an ideal choice for the receive channel amplifier in ADSL, VDSL, or other xDSL designs. The LMH6622
operates from ± 2.5V to ± 6V in dual supply mode and from
+5V to +12V in single supply configuration. The LMH6622 is
stable for AV ≥ 2 or AV ≤ −1. The fabrication of the LMH6622
on National Semiconductor’s advanced VIP10 process enables excellent (160MHz) bandwidth at a current consumption of only 4.3mA/amplifier. Packages for this dual amplifier
are the 8-lead SOIC and the 8-lead MSOP.
VS = ± 6V, TA = 25˚C, Typical values unless specified
n Bandwidth (AV = +2)
160MHz
± 2.5V to ± 6V
n Supply Voltage Range
+5V to +12
n Slew rate
85V/µs
n Supply current
4.3mA/amp
n Input common mode voltage
−4.75V to +5.7V
± 4.6V
n Output Voltage Swing (RL = 100Ω)
n Input voltage noise
1.6nV/
n Input current noise
1.5pA/
n Linear output current
90mA
n Excellent harmonic distortion
90dBc
Applications
n
n
n
n
n
xDSL receiver
Low noise instrumentation front end
Ultrasound preamp
Active filters
Cellphone basestation
20029226
xDSL Analog Front End
© 2002 National Semiconductor Corporation
DS200292
www.national.com
LMH6622 Dual Wideband, Low Noise, 160MHz, Operational Amplifiers
February 2002
LMH6622
Absolute Maximum Ratings
Wave Soldering (10 sec)
(Note 1)
Storage Temperature Range
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Operating Ratings
2kV (Note 2)
Machine Model
200V (Note 2)
± 1.2V
VIN Differential
+
−
Supply Voltage (V – V )
Voltage at Input Pins
13.2V
+150˚C
(Note 1)
Supply Voltage (V+– V−)
± 2.25V to ± 6V
Junction Temperature Range
(Note 3), (Note 4)
−40˚C to +85˚C
Package Thermal Resistance (Note 4) (θJA)
V+ +0.5V, V− −0.5V
Soldering Information
Infrared or Convection (20 sec)
−65˚C to +150˚C
Junction Temperature (Note 4)
ESD Tolerance
Human Body Model
260˚C
235˚C
8-pin SOIC
166˚C/W
8-pin MSOP
211˚C/W
± 6V Electrical Characteristics
Unless otherwise specified, TJ = 25˚C, V+ = 6V, V− = −6V, VCM = 0V, AV = +2, RF = 500Ω, RL = 100Ω. Boldface limits apply
at the temperature extremes.
Symbol
Parameter
Conditions
Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
Dynamic Performance
fCL
−3dB BW
VO = 200mVPP
160
MHz
BW0.1dB
0.1dB Gain Flatness
VO = 200mVPP
30
MHz
SR
Slew Rate (Note 8)
VO = 2VPP
85
V/µs
TS
Settling Time
VO = 2VPP to ± 0.1%
40
VO = 2VPP to ± 1.0%
35
ns
Tr
Rise Time
VO = 0.2V Step, 10% to 90%
2.3
ns
Tf
Fall Time
VO = 0.2V Step, 10% to 90%
2.3
ns
f = 100kHz
1.6
nV/
pA/
Distortion and Noise Response
en
Input Referred Voltage Noise
in
Input Referred Current Noise
f = 100kHz
1.5
DG
Differential Gain
RL = 150Ω, RF = 470Ω, NTSC
0.03
%
DP
Differential Phase
RL = 150Ω, RF = 470Ω, NTSC
0.03
deg
HD2
2nd Harmonic Distortion
fc = 1MHz, VO = 2VPP, RL = 100Ω
−90
fc = 1MHz, VO = 2VPP, RL = 500Ω
−100
HD3
MTPR
3rd Harmonic Distortion
fc = 1MHz, VO = 2VPP, RL = 100Ω
−94
fc = 1MHz, VO = 2VPP, RL = 500Ω
−100
Upstream
VO = 0.6 VRMS, 26kHz to 132kHz
(see test circuit 5)
−78
Downstream
VO = 0.6 VRMS, 144kHz to 1.1MHz
(see test circuit 5)
−70
dBc
dBc
dBc
Input Characteristics
VOS
Input Offset Voltage
VCM = 0V
TC VOS
Input Offset Average Drift
VCM = 0V (Note 7)
IOS
Input Offset Current
VCM = 0V
IB
Input Bias Current
VCM = 0V
RIN
Input Resistance
CIN
Input Capacitance
www.national.com
−1.2
−2
+0.2
+1.2
+2
−1
−1.5
−0.04
1
1.5
µA
4.7
10
15
µA
−2.5
mV
µV/˚C
Common Mode
17
MΩ
Differential Mode
12
kΩ
Common Mode
0.9
pF
Differential Mode
1.0
pF
2
(Continued)
Unless otherwise specified, TJ = 25˚C, V+ = 6V, V− = −6V, VCM = 0V, AV = +2, RF = 500Ω, RL = 100Ω. Boldface limits apply
at the temperature extremes.
Symbol
CMVR
CMRR
Parameter
Conditions
Input Common Mode Voltage
Range
CMRR ≥ 60dB
Common-Mode Rejection Ratio
Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
−4.75
−4.5
Units
V
5.5
+5.7
Input Referred,
VCM = −4.2 to +5.2V
80
75
100
dB
74
70
83
dB
−75
dB
Transfer Characteristics
AVOL
Large Signal Voltage Gain
VO = 4VPP
Xt
Crosstalk
f = 1MHz
Output Characteristics
VO
Output Swing
No Load, Positive Swing
4.8
4.6
No Load, Negative Swing
RL = 100Ω, Positive Swing
5.2
−5.0
4.0
3.8
RL = 100Ω, Negative Swing
−4.6
RO
Output Impedance
f = 1MHz
Output Short Circuit Current
Sourcing to Ground
∆VIN = 200mV (Note 3), (Note 9)
100
135
Sinking to Ground
∆VIN = −200mV (Note 3), (Note 9)
100
130
Output Current
V
4.6
ISC
IOUT
−4.6
−4.4
−4
−3.8
Ω
0.08
mA
90
Sourcing, VO = +4.3V
Sinking, VO = −4.3V
mA
Power Supply
+PSRR
Positive Power Supply
Rejection Ratio
Input Referred,
VS = +5V to +6V
80
74
95
−PSRR
Negative Power Supply
Rejection Ratio
Input Referred,
VS = −5V to −6V
75
69
90
IS
Supply Current (per amplifier)
No Load
4.3
dB
6
6.5
mA
± 2.5V Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.5V, V− = −2.5V, VCM = 0V, AV = +2, RF = 500Ω,
RL = 100Ω. Boldface limits apply at the temperature extremes.
Symbol
Parameter
Conditions
Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
Dynamic Performance
fCL
−3dB BW
VO = 200mVPP
150
MHz
BW0.1dB
0.1dB Gain Flatness
VO = 200mVPP
20
MHz
SR
Slew Rate (Note 8)
VO = 2VPP
80
V/µs
TS
Settling Time
VO = 2VPP to ± 0.1%
45
VO = 2VPP to ± 1.0%
40
ns
Tr
Rise Time
VO = 0.2V Step, 10% to 90%
2.5
ns
Tf
Fall Time
VO = 0.2V Step, 10% to 90%
2.5
ns
Distortion and Noise Response
en
Input Referred Voltage Noise
f = 100kHz
1.7
nV/
in
Input Referred Current Noise
f = 100kHz
1.5
pA/
3
www.national.com
LMH6622
± 6V Electrical Characteristics
LMH6622
± 2.5V Electrical Characteristics
(Continued)
Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.5V, V− = −2.5V, VCM = 0V, AV = +2, RF = 500Ω,
RL = 100Ω. Boldface limits apply at the temperature extremes.
Symbol
HD2
HD3
MTPR
Parameter
2nd Harmonic Distortion
Conditions
Min
(Note 6)
Typ
(Note 5)
fc = 1MHz, VO = 2VPP, RL = 100Ω
−88
fc = 1MHz, VO = 2VPP, RL = 500Ω
−98
fc = 1MHz, VO = 2VPP, RL = 100Ω
−92
fc = 1MHz, VO = 2VPP, RL = 500Ω
−100
Upstream
VO = 0.4VRMS,26kHz to 132kHz
(see test circuit 5)
−76
Downstream
VO = 0.4VRMS,144kHz to 1.1MHz
(see test circuit 5)
−68
3rd Harmonic Distortion
Max
(Note 6)
Units
dBc
dBc
dBc
Input Characteristics
VOS
Input Offset Voltage
VCM = 0V
TC VOS
Input Offset Average Drift
VCM = 0V (Note 7)
IOS
Input Offset Current
VCM = 0V
IB
Input Bias Current
VCM = 0V
RIN
Input Resistance
CIN
CMVR
CMRR
Input Capacitance
−1.5
−2.3
+0.3
+1.5
+2.3
−1.5
−2.5
+0.01
1.5
2.5
µA
4.6
10
15
µA
−2.5
mV
µV/˚C
Common Mode
17
MΩ
Differential Mode
12
kΩ
Common Mode
0.9
pF
Differential Mode
1.0
pF
Input Common Mode Voltage
Range
CMRR ≥ 60dB
Common Mode Rejection Ratio
−1.25
−1
V
2
+2.2
Input Referred,
VCM = −0.7 to +1.7V
80
75
100
dB
74
82
dB
−75
dB
Transfer Characteristics
AVOL
Large Signal Voltage Gain
VO = 1VPP
Xt
Crosstalk
f = 1MHz
Output Characteristics
VO
Output Swing
No Load, Positive Swing
1.4
1.2
No Load, Negative Swing
RL = 100Ω, Positive Swing
1.7
−1.5
1.2
1
1.5
RL = 100Ω, Negative Swing
−1.4
0.1
RO
Output Impedance
f = 1MHz
ISC
Output Short Circuit Current
Sourcing to Ground
∆VIN = 200mV (Note 3), (Note 9)
100
137
Sinking to Ground
∆VIN = −200mV (Note 3), (Note 9)
100
134
IOUT
Output Current
90
Sourcing, VO = +0.8V
Sinking, VO = −0.8V
−1.2
−1
V
−1.1
−0.9
Ω
mA
mA
Power Supply
+PSRR
Positive Power Supply Rejection
Ratio
Input Referred,
VS = +2.5V to +3V
78
72
93
−PSRR
Negative Power Supply
Rejection Ratio
Input Referred,
VS = −2.5V to −3V
75
70
88
www.national.com
4
dB
dB
LMH6622
± 2.5V Electrical Characteristics
(Continued)
Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.5V, V− = −2.5V, VCM = 0V, AV = +2, RF = 500Ω,
RL = 100Ω. Boldface limits apply at the temperature extremes.
Symbol
IS
Parameter
Supply Current (per amplifier)
Conditions
No Load
Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
4.1
5.8
6.4
Units
mA
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human body model, 1.5kΩ in series with 100pF. Machine model, 0Ω in series with 200pF.
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150˚C.
Note 4: The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient temperature is PD =
(TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly onto a PC board.
Note 5: Typical values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: Offset voltage average drift is determined by dividing the change in VOS at temperature extremes into the total temperature change.
Note 8: Slew rate is the slowest of the rising and falling slew rates.
Note 9: Short circuit test is a momentary test. Output short circuit duration is infinite for VS ≤ ± 2.5V, at room temperature and below. For VS > ± 2.5V, allowable short
circuit duration is 1.5ms.
5
www.national.com
LMH6622
Typical Performance Characteristics
Current and Voltage Noise vs. Frequency
Current and Voltage Noise vs. Frequency
20029225
20029224
Frequency Response vs. Input Signal Level
Frequency Response vs. Input Signal Level
20029202
20029203
Inverting Amplifier Frequency Response
Non-Inverting Amplifier Frequency Response
20029246
www.national.com
20029247
6
LMH6622
Typical Performance Characteristics
(Continued)
Open Loop Gain and Phase Response
Crosstalk vs. Frequency
20029201
20029205
PSRR vs. Frequency
CMRR vs. Frequency
20029206
20029204
Positive Output Swing vs. Source Current
Negative Output Swing vs. Sink Current
20029248
20029249
7
www.national.com
LMH6622
Typical Performance Characteristics
(Continued)
Non-Inverting Small Signal Pulse Response
VS = ± 2.5V, RL = 100Ω, AV = +2, RF = 500Ω
Non-Inverting Small Signal Pulse Response
VS = ± 6V, RL = 100Ω, AV = +2, RF = 500Ω
20029207
20029209
Non-Inverting Large Signal Pulse Response
VS = ± 2.5V, RL = 100Ω, AV = +2, RF = 500Ω
Non-Inverting Large Signal Pulse Response
VS = ± 6V, RL = 100Ω, AV = +2, RF = 500Ω
20029208
20029210
Harmonic Distortion vs. Input Signal Level
Harmonic Distortion vs. Input Signal Level
20029212
www.national.com
20029213
8
LMH6622
Typical Performance Characteristics
(Continued)
Harmonic Distortion vs. Frequency
Harmonic Distortion vs. Frequency
20029214
20029215
Harmonic Distortion vs. Input Signal Level
Harmonic Distortion vs. input Signal Level
20029216
20029217
Harmonic Distortion vs. Input Frequency
Harmonic Distortion vs. Input Frequency
20029218
20029219
9
www.national.com
LMH6622
Typical Performance Characteristics
(Continued)
Full Rate ADSL (DMT) Upstream MTPR @ VS = ± 2.5V
Full Rate ADSL (DMT) Downstream MTPR @ VS = ± 2.5V
20029256
20029258
Full Rate ADSL (DMT) Upstream MTPR @ VS = ± 6V
Full Rate ADSL (DMT) Downstream MTPR @ VS = ± 6V
20029257
www.national.com
20029259
10
LMH6622
Connection Diagram
8-Pin SOIC/MSOP
20029211
Top View
Ordering Information
Package
Part Number
Package Marking
Transport Media
NSC Drawing
8-Pin SOIC
LMH6622MA
LMH6622MA
95 Units per Rail
M08A
LMH6622MAX
8-Pin MSOP
2.5k Units Tape and Reel
LMH6622MM
A80A
1k Units Tape and Reel
LMH6622MMX
MUA08A
3.5k Units Tape and Reel
Test Circuits
20029253
3) Voltage Noise
RG = 1Ω for f ≤ 100kHz, RG = 20Ω for f > 100kHz
20029250
1) Non-Inverting Amplifier
20029252
4) Current Noise
RG = 1Ω for f ≤ 100kHz, RG = 20Ω for f > 100kHz
20029251
2) CMRR
11
www.national.com
LMH6622
Test Circuits
(Continued)
20029255
5) Multitone Power Ratio, RF = 500Ω, RG = 174Ω, RL =
437Ω
DSL Receive Channel Applications
20029223
FIGURE 1. ADSL Signal Description
receiver pre-amp which is both low noise and highly linear
for ADSL-standard operation. The LMH6622 is designed for
the twin performance parameters of low noise and high
linearity.
Applications ranging from +5V to +12V or ± 2.5V to ± 6V are
fully supported by the LMH6622. In Figure 2, the LMH6622 is
used as an inverting summing amplifier to provide both
received pre-amp channel gain and driver output signal cancellation, i.e., the function of a hybrid coupler.
The LMH6622 is a dual, wideband operational amplifier designed for use as a DSL line receiver. In the receive band of
a Customer Premises Equipment (CPE) ADSL modem it is
possible that as many as 255 Discrete Multi-Tone (DMT)
QAM signals will be present, each with its own carrier frequency, modulation, and signal level. The ADSL standard
requires a line referred noise power density of -140dBm/Hz
within the CPE receive band of 100KHz to 1.1MHz. The CPE
driver output signal will leak into the receive path because of
full duplex operation and the imperfections of the hybrid
coupler circuit. The DSL analog front end must incorporate a
www.national.com
12
LMH6622
DSL Receive Channel Applications
(Continued)
20029227
FIGURE 2. ADSL Receive Applications Circuit
13
www.national.com
LMH6622
DSL Receive Channel Applications
(Continued)
The two RS resistors are used to provide impedance matching through the 1:N transformer.
Receive Channel Noise Calculation
The circuit of Figure 2 also has the characteristic that it
cancels noise power from the drive channel.
The noise gain of the receive pre-amp is found to be:
Where RL is the impedance of the twisted pair line.
N is the turns ratio of the transformer.
The resistors R2 and RF are used to set the receive gain of
the pre-amp. The receive gain is selected to meet the ADC
full-scale requirement of a DSL chipset.
Resistor R1 and R2 along with RF are used to achieve
cancellation of the output driver signal at the output of the
receiver.
Since the LMH6622 is configured as an inverting summing
amplifier, VOUT is found to be,
Noise power at each of the output of LMH6622:
where
The expression for V1 and V2 can be found by using superposition principle.
When VS = 0,
Vn
Input referred voltage noise
in
Input referred current noise
inon-inv
Input referred non-inverting current noise
iinv
Input referred inverting current noise
k
Boltzmann’s constant, K = 1.38 x 10−23
T
Resistor temperature in k
R+
Source resistance at the non-inverting input
to balance offset voltage, typically very small
for this inverting summing applications
For a voltage feedback amplifier,
When VA = 0,
Therefore, total output noise from the differential pre-amp is:
Therefore,
The factor ’2 ’ appears here because of differential output.
Differential Analog-to-Digital Driver
And then,
Setting R1 = 2*R2 to cancel unwanted driver signal in the
receive path, then we have
We can also find that,
And then
20029239
FIGURE 3. Circuit for Differential A/D Driver
In conclusion, the peak-to-peak voltage to the ADC would
be,
www.national.com
14
LMH6622
DSL Receive Channel Applications
(Continued)
The LMH6622 is a low noise, low distortion high speed
operational amplifier. The LMH6622 comes in either SOIC-8
or MSOP-8 packages. Because two channels are available
in each package the LMH6622 can be used as a high
dynamic range differential amplifier for the purpose of driving
a high speed analog-to-digital converter. Driving a 1kΩ load,
the differential amplifier of Figure 3 provides 20dB gain, a flat
frequency response up to 6MHz, and harmonic distortion
that is lower than 80dBc. This circuit makes use of a transformer to convert a single-ended signal to a differential signal. The input resistor RIN is chosen by the following equation,
20029222
FIGURE 5. Total Output Referred Noise Density
The gain of this differential amplifier can be adjusted by RC
and RF,
20029221
FIGURE 4. Frequency Response
15
www.national.com
LMH6622
DSL Receive Channel Applications
Device
(Continued)
Circuit Layout Considerations
National Semiconductor suggests the copper patterns on the
evaluation boards listed below as a guide for high frequency
layout. These boards are also useful as an aid in device
testing and characterization. As is the case with all highspeed amplifiers, accepted-practice RF design technique on
the PCB layout is mandatory. Generally, a good high frequency layout exhibits a separation of power supply and
ground traces from the inverting input and output pins. Parasitic capacitances between these nodes and ground will
cause frequency response peaking and possible circuit oscillations (see Application Note OA-15 for more information).
High quality chip capacitors with values in the range of
1000pF to 0.1µF should be used for power supply bypassing. One terminal of each chip capacitor is connected to the
ground plane and the other terminal is connected to a point
that is as close as possible to each supply pin as allowed by
the manufacturer’s design rules. In addition, a tantalum capacitor with a value between 4.7µF and 10µF should be
connected in parallel with the chip capacitor. Signal lines
connecting the feedback and gain resistors should be as
short as possible to minimize inductance and microstrip line
effect. Input and output termination resistors should be
placed as close as possible to the input/output pins. Traces
greater than 1 inch in length should be impedance matched
to the corresponding load termination.
Symmetry between the positive and negative paths in the
layout of differential circuitry should be maintained so as to
minimize the imbalance of amplitude and phase of the differential signal.
www.national.com
Package
Evaluation Board P/N
LMH6622MA
SOIC-8
CLC730036
LMH6622MM
MSOP-8
CLC730123
These free evaluation boards are shipped when a device
sample request is placed with National Semiconductor.
Component value selection is another important parameter
in working with high speed/high performance amplifiers.
Choosing external resistors that are large in value compared
to the value of other critical components will affect the closed
loop behavior of the stage because of the interaction of
these resistors with parasitic capacitances. These parasitic
capacitors could either be inherent to the device or be a
by-product of the board layout and component placement.
Moreover, a large resistor will also add more thermal noise to
the signal path. Either way, keeping the resistor values low
will diminish this interaction. On the other hand, choosing
very low value resistors could load down nodes and will
contribute to higher overall power dissipation and worse
distortion.
Driving Capacitive Load
Capacitive Loads decrease the phase margin of all op amps.
The output impedance of a feedback amplifier becomes
inductive at high frequencies, creating a resonant circuit
when the load is capacitive. This can lead to overshoot,
ringing and oscillation. To eliminate oscillation or reduce
ringing, an isolation resistor can be placed between the load
and the output. In general, the bigger the isolation resistor,
the more damped the pulse response becomes. For initial
evaluation, a 50Ω isolation resistor is recommended.
16
LMH6622
Physical Dimensions
inches (millimeters)
unless otherwise noted
8-Pin SOIC
NS Package Number M08A
8-Pin MSOP
NS Package Number MUA08A
17
www.national.com
LMH6622 Dual Wideband, Low Noise, 160MHz, Operational Amplifiers
Notes
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
National Semiconductor
Corporation
Americas
Email: [email protected]
www.national.com
National Semiconductor
Europe
Fax: +49 (0) 180-530 85 86
Email: [email protected]
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
Email: [email protected]
National Semiconductor
Japan Ltd.
Tel: 81-3-5639-7560
Fax: 81-3-5639-7507
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
Similar pages