MOTOROLA MC74HCXXXAN Highâ performance siliconâ gate cmo Datasheet

SEMICONDUCTOR TECHNICAL DATA
High–Performance Silicon–Gate CMOS
The MC54/74HC393A is identical in pinout to the LS393. The device
inputs are compatible with standard CMOS outputs; with pullup resistors,
they are compatible with LSTTL outputs.
This device consists of two independent 4–bit binary ripple counters with
parallel outputs from each counter stage. A ÷ 256 counter can be obtained
by cascading the two binary counters.
Internal flip–flops are triggered by high–to–low transitions of the clock
input. Reset for the counters is asynchronous and active–high. State
changes of the Q outputs do not occur simultaneously because of internal
ripple delays. Therefore, decoded output signals are subject to decoding
spikes and should not be used as clocks or as strobes except when gated
with the Clock of the HC393A.
•
•
•
•
•
•
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 236 FETs or 59 Equivalent Gates
J SUFFIX
CERAMIC PACKAGE
CASE 632–08
14
1
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
14
1
1
D SUFFIX
SOIC PACKAGE
CASE 751A–03
1
DT SUFFIX
TSSOP PACKAGE
CASE 948G–01
14
14
ORDERING INFORMATION
MC54HCXXXAJ
MC74HCXXXAN
MC74HCXXXAD
MC74HCXXXADT
3, 11
1, 13
4, 10
BINARY
COUNTER
5, 9
6, 8
RESET
Ceramic
Plastic
SOIC
TSSOP
PIN ASSIGNMENT
LOGIC DIAGRAM
CLOCK
CLOCK a
1
14
VCC
RESET a
2
13
CLOCK b
Q1
Q1a
3
12
RESET b
Q2
Q2a
4
11
Q1b
Q3
Q3a
5
10
Q2b
Q4a
6
9
Q3b
GND
7
8
Q4b
Q4
2, 12
PIN 14 = VCC
PIN 7 = GND
FUNCTION TABLE
Inputs
Clock
Reset
Outputs
X
H
L
H
L
L
L
L
L
No Change
No Change
No Change
Advance to
Next State
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
10/95
 Motorola, Inc. 1995
1
REV 0
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MC54/74HC393A
MAXIMUM RATINGS*
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to GND)
Value
Unit
– 0.5 to + 7.0
V
V
Vin
DC Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air, Plastic or Ceramic DIP†
SOIC Package†
TSSOP Package†
750
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
_C
Iin
TL
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
v
v
_C
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
(Ceramic DIP)
260
300
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
Ceramic DIP: – 10 mW/_C from 100_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
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RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
DC Supply Voltage (Referenced to GND)
Min
Max
Unit
2.0
6.0
V
0
VCC
V
– 55
+ 125
_C
0
0
0
0
1000
600
500
400
ns
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
VCC
V
– 55 to
25_C
85_C
125_C
Unit
VIH
Minimum High–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
VIL
Maximum Low–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.80
0.5
0.9
1.35
1.80
0.5
0.9
1.35
1.80
V
Minimum High–Level Output
Voltage
Vin = VIH or VIL
|Iout|
20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
VOH
Vin = VIH or VIL |Iout|
|Iout|
|Iout|
MOTOROLA
2
2.4 mA
4.0 mA
5.2 mA
High–Speed CMOS Logic Data
DL129 — Rev 6
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MC54/74HC393A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
VOL
Parameter
Test Conditions
Maximum Low–Level Output
Voltage
Vin = VIH or VIL
|Iout|
20 µA
Vin = VIH or VIL |Iout|
|Iout|
|Iout|
Iin
ICC
2.4 mA
4.0 mA
5.2 mA
VCC
V
– 55 to
25_C
85_C
125_C
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
Unit
V
Maximum Input Leakage Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
µA
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0 µA
6.0
4
40
160
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
VCC
V
– 55 to
25_C
85_C
125_C
Unit
fmax
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 3)
2.0
3.0
4.5
6.0
10
15
30
50
9
14
28
45
8
12
25
40
MHz
tPLH,
tPHL
Maximum Propagation Delay, Clock to Q1
(Figures 1 and 3)
2.0
3.0
4.5
6.0
70
40
20
16
80
45
25
21
90
50
30
27
ns
tPLH,
tPHL
Maximum Propagation Delay, Clock to Q2
(Figures 1 and 3)
2.0
3.0
4.5
6.0
90
56
32
25
105
70
38
31
180
100
45
40
ns
tPLH,
tPHL
Maximum Propagation Delay, Clock to Q3
(Figures 1 and 3)
2.0
3.0
4.5
6.0
60
40
30
25
75
55
40
35
90
65
50
42
ns
tPLH,
tPHL
Maximum Propagation Delay, Clock to Q4
(Figures 1 and 3)
2.0
3.0
4.5
6.0
200
160
35
30
250
185
45
40
300
210
60
50
ns
tPHL
Maximum Propagation Delay, Reset to any Q
(Figures 2 and 3)
2.0
3.0
4.5
6.0
80
48
28
21
95
65
32
25
110
75
40
30
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
16
110
36
22
19
ns
Maximum Input Capacitance
—
10
10
10
pF
Cin
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Counter)*
35
pF
* Used to determine the no–load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
High–Speed CMOS Logic Data
DL129 — Rev 6
3
MOTOROLA
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MC54/74HC393A
TIMING REQUIREMENTS (Input tr = tf = 6 ns)
Guaranteed Limit
VCC
V
– 55 to
25_C
85_C
125_C
Minimum Recovery Time, Reset Inactive to Clock
(Figure 2)
2.0
3.0
4.5
6.0
25
15
5
5
30
20
6
5
40
30
10
7
ns
tw
Minimum Pulse Width, Clock
(Figure 1)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
15
110
36
22
19
ns
tw
Minimum Pulse Width, Reset
(Figure 2)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
15
110
36
22
19
ns
Maximum Input Rise and Fall Times
(Figure 1)
2.0
3.0
4.5
6.0
1000
800
500
400
1000
800
500
400
1000
800
500
400
ns
Symbol
trec
tr, tf
Parameter
Unit
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
MOTOROLA
4
High–Speed CMOS Logic Data
DL129 — Rev 6
MC54/74HC393A
PIN DESCRIPTIONS
INPUTS
vided for each counter. A high at the Reset input prevents
counting and forces all four outputs low.
Clock (Pins 1, 13)
Clock input. The internal flip–flops are toggled and the
counter state advances on high–to–low transitions of the
clock input.
OUTPUTS
CONTROL INPUTS
Q1, Q2, Q3, Q4 (Pins 3, 4, 5, 6, 8, 9, 10, 11)
Reset (Pins 2, 12)
Active–high, asynchronous reset. A separate reset is pro-
Parallel binary outputs Q4 is the most significant bit.
SWITCHING WAVEFORMS
CLOCK
tf
90%
50%
10%
tr
tw
VCC
50%
GND
GND
tw
tPHL
1/fmax
tPLH
tPHL
Q
VCC
RESET
50%
Q
90%
50%
10%
trec
VCC
50%
CLOCK
tTLH
GND
tTHL
Figure 1.
Figure 2.
EXPANDED LOGIC DIAGRAM
TEST
POINT
CLOCK
OUTPUT
DEVICE
UNDER
TEST
1, 13
C
D
Q
Q
3, 11
Q1
CL*
C
D
* Includes all probe and jig capacitance
Q
Q
4, 10
Q2
Figure 3. Test Circuit
C
D
C
D
RESET
High–Speed CMOS Logic Data
DL129 — Rev 6
5
Q
Q
5, 9
Q3
Q
Q
6, 8
Q4
2, 12
MOTOROLA
MC54/74HC393A
TIMING DIAGRAM
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
CLOCK
RESET
Q1
Q2
Q3
Q4
COUNT SEQUENCE
Outputs
MOTOROLA
Count
Q4
Q3
Q2
Q1
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
L
L
L
L
H
H
H
H
L
L
L
L
H
H
H
H
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
6
High–Speed CMOS Logic Data
DL129 — Rev 6
MC54/74HC393A
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
-A14
8
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMESNION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
-B-
C
-T-
L
DIM
A
B
C
D
F
G
J
K
L
M
N
K
SEATING
PLANE
F
G
D 14 PL
0.25 (0.010)
M
N
T A
M
J 14 PL
0.25 (0.010)
S
M
T
B
S
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
14
B
7
A
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
C
J
N
H
G
D
SEATING
PLANE
K
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
–A–
14
1
P 7 PL
0.25 (0.010)
7
G
D
0.25 (0.010)
High–Speed CMOS Logic Data
DL129 — Rev 6
M
T
F
J
M
K
14 PL
B
S
M
R X 45°
C
SEATING
PLANE
B
M
A
S
7
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
8
–B–
MILLIMETERS
MIN
MAX
19.05 19.94
6.23
7.11
3.94
5.08
0.39
0.50
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0°
15°
0.51
1.01
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
8
1
INCHES
MIN
MAX
0.750 0.785
0.245 0.280
0.155 0.200
0.015 0.020
0.055 0.065
0.100 BSC
0.008 0.015
0.125 0.170
0.300 BSC
0°
15°
0.020 0.040
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.75
8.55
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC
0.25
0.19
0.25
0.10
7°
0°
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7°
0°
0.228 0.244
0.010 0.019
MOTOROLA
MC54/74HC393A
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
–U–
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
DETAIL E
K
A
–V–
K1
J J1
SECTION N–N
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
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*MC54/74HC393A/D*
MC54/74HC393A/D
High–Speed CMOS Logic Data
DL129 — Rev 6