Microchip MCP6002T-I/ST 1 mhz, low-power op amp Datasheet

MCP6001/2/4
1 MHz, Low-Power Op Amp
Features
Description
•
•
•
•
•
•
•
The Microchip Technology Inc. MCP6001/2/4 family of
operational amplifiers (op amps) is specifically
designed for general-purpose applications. This family
has a 1 MHz Gain Bandwidth Product (GBWP) and
90° phase margin (typ.). It also maintains 45° phase
margin (typ.) with a 500 pF capacitive load. This family
operates from a single supply voltage as low as 1.8V,
while drawing 100 µA (typ.) quiescent current.
Additionally, the MCP6001/2/4 supports rail-to-rail
input and output swing, with a common mode input
voltage range of VDD + 300 mV to VSS – 300 mV. This
family of op amps is designed with Microchip’s
advanced CMOS process.
Available in SC-70-5 and SOT-23-5 packages
Gain Bandwidth Product: 1 MHz (typ.)
Rail-to-Rail Input/Output
Supply Voltage: 1.8V to 5.5V
Supply Current: IQ = 100 µA (typ.)
Phase Margin: 90° (typ.)
Temperature Range:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
• Available in Single, Dual and Quad Packages
Applications
•
•
•
•
•
•
The MCP6001/2/4 family is available in the industrial
and extended temperature ranges, with a power supply
range of 1.8V to 5.5V.
Automotive
Portable Equipment
Photodiode Amplifier
Analog Filters
Notebooks and PDAs
Battery-Powered Systems
Package Types
MCP6001
MCP6002
SC-70-5, SOT-23-5
PDIP, SOIC, MSOP
5 VDD
VOUT 1
Available Tools
FilterLab® Software (at www.microchip.com)
+
SPICE Macro Models (at www.microchip.com)
VSS 2
VINA– 2
-
4 VIN–
VIN+ 3
VOUTA 1
VINA+ 3
8 VDD
7 VOUTB
- +
+
-
VSS 4
6 VINB–
5 VINB+
Typical Application
MCP6001R
VDD
VIN
SOT-23-5
5 VSS
VOUT 1
+
VDD 2
+
VOUT
MCP6001
–
VOUTA 1
-
VIN+ 3
MCP6004
PDIP, SOIC, TSSOP
4 VIN–
VSS
14 VOUTD
VINA– 2
- + + - 13 VIND–
VINA+ 3
12 VIND+
VDD 4
MCP6001U
R1
VREF
SOT-23-5
R1
Gain = 1 + -----R2
Non-Inverting Amplifier
© 2005 Microchip Technology Inc.
VSS 2
VINB– 6
5 VDD
VIN+ 1
VINB+ 5
VOUTB 7
10 VINC+
- + + -
9 VINC–
8 VOUTC
+
R2
11 VSS
-
VIN– 3
4 VOUT
DS21733F-page 1
MCP6001/2/4
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VDD – VSS ........................................................................7.0V
All Inputs and Outputs ................... VSS – 0.3V to VDD + 0.3V
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
Difference Input Voltage ...................................... |VDD – VSS|
Output Short-Circuit Current .................................continuous
Current at Input Pins ....................................................±2 mA
Current at Output and Supply Pins ............................±30 mA
Storage Temperature.....................................-65°C to +150°C
Maximum Junction Temperature (TJ) .......................... +150°C
ESD Protection On All Pins (HBM;MM) ............... ≥ 4 kV; 200V
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2,
RL = 10 kΩ to VDD/2 and VOUT ≈ VDD/2.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Offset
Input Offset Voltage
Input Offset Drift with Temperature
Power Supply Rejection Ratio
VOS
-4.5
—
+4.5
ΔVOS/ΔTA
—
±2.0
—
PSRR
—
86
—
dB
IB
—
±1.0
—
pA
IB
—
19
—
pA
TA = +85°C
IB
—
1100
—
pA
TA = +125°C
IOS
—
±1.0
—
pA
mV
VCM = VSS (Note 1)
µV/°C TA= -40°C to +125°C,
VCM = VSS
VCM = VSS
Input Bias Current and Impedance
Input Bias Current:
Industrial Temperature
Extended Temperature
Input Offset Current
Common Mode Input Impedance
ZCM
—
1013||6
—
Ω||pF
Differential Input Impedance
ZDIFF
—
1013||3
—
Ω||pF
Common Mode Input Range
VCMR
VSS − 0.3
—
VDD + 0.3
V
Common Mode Rejection Ratio
CMRR
60
76
—
dB
VCM = -0.3V to 5.3V,
VDD = 5V
AOL
88
112
—
dB
VOUT = 0.3V to VDD – 0.3V,
VCM = VSS
—
VDD – 25
mV
VDD = 5.5V
—
±6
—
mA
VDD = 1.8V
—
±23
—
mA
VDD = 5.5V
VDD
1.8
—
5.5
V
IQ
50
100
170
µA
Common Mode
Open-Loop Gain
DC Open-Loop Gain (Large Signal)
Output
Maximum Output Voltage Swing
Output Short-Circuit Current
VOL, VOH VSS + 25
ISC
Power Supply
Supply Voltage
Quiescent Current per Amplifier
Note 1:
IO = 0, VDD = 5.5V, VCM = 5V
MCP6001/2/4 parts with date codes prior to December 2004 (week code 49) were tested to ±7 mV minimum/
maximum limits.
DS21733F-page 2
© 2005 Microchip Technology Inc.
MCP6001/2/4
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8 to 5.5V, VSS = GND, VCM = VDD/2,
VOUT ≈ VDD/2, RL = 10 kΩ to VDD/2 and CL = 60 pF.
Parameters
Sym
Min
Typ
Max
Units
Conditions
GBWP
—
1.0
—
MHz
Phase Margin
PM
—
90
—
°
Slew Rate
SR
—
0.6
—
V/µs
Input Noise Voltage
Eni
—
6.1
—
µVp-p
f = 0.1 Hz to 10 Hz
Input Noise Voltage Density
eni
—
28
—
nV/√Hz
f = 1 kHz
Input Noise Current Density
ini
—
0.6
—
fA/√Hz
f = 1 kHz
AC Response
Gain Bandwidth Product
G = +1
Noise
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +5.5V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Industrial Temperature Range
TA
-40
—
+85
°C
Extended Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 5L-SC70
θJA
—
331
—
°C/W
Thermal Resistance, 5L-SOT-23
θJA
—
256
—
°C/W
Thermal Resistance, 8L-PDIP
θJA
—
85
—
°C/W
Thermal Resistance, 8L-SOIC (150 mil)
θJA
—
163
—
°C/W
Thermal Resistance, 8L-MSOP
θJA
—
206
—
°C/W
°C/W
Conditions
Temperature Ranges
Note
Thermal Package Resistances
Thermal Resistance, 14L-PDIP
θJA
—
70
—
Thermal Resistance, 14L-SOIC
θJA
—
120
—
°C/W
Thermal Resistance, 14L-TSSOP
θJA
—
100
—
°C/W
Note:
The industrial temperature devices operate over this extended temperature range, but with reduced
performance. In any case, the internal Junction Temperature (TJ) must not exceed the Absolute Maximum
specification of +150°C.
© 2005 Microchip Technology Inc.
DS21733F-page 3
MCP6001/2/4
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
100
PSRR, CMRR (dB)
64,695 Samples
VCM = VSS
95
90
PSRR (VCM = VSS)
85
80
CMRR (VCM = -0.3V to +5.3V)
75
-25
CMRR
40
30
100
1.E+02
14%
12%
10%
100k
1.E+05
PSRR, CMRR vs.
40
8%
6%
4%
2%
-150
0
-180
VCM = VSS
-20
-210
1k 10k
0.1 1.E
1 1.E
10 100
1M 10M
1.E1.E 1.E
1.E 100k
1.E 1.E
1.E
01 +00 +01 Frequency
+02 +03 +04
(Hz) +05 +06 +07
55%
50%
45%
40%
35%
30%
25%
20%
15%
10%
5%
0%
30
27
24
21
18
15
12
9
6
3
Input Bias Current (pA)
FIGURE 2-3:
DS21733F-page 4
Input Bias Current at +85°C.
Open-Loop Gain, Phase vs.
605 Samples
VDD = 5.5V
VCM = VDD
TA = +125°C
0
0%
-120
Gain
20
FIGURE 2-5:
Frequency.
1230 Samples
VDD = 5.5V
VCM = VDD
TA = +85°C
0
Percentage of Occurrences
FIGURE 2-2:
Frequency.
1k
10k
1.E+03
1.E+04
Frequency (Hz)
Percentage of Occurrences
20
10
1.E+01
-90
1500
50
-60
Phase
60
1350
PSRR+
80
1200
60
-30
1050
PSRR–
100
450
70
0
900
80
120
750
Open-Loop Gain (dB)
VCM = VSS
90
125
CMRR, PSRR vs. Ambient
300
100
PSRR, CMRR (dB)
FIGURE 2-4:
Temperature.
Input Offset Voltage.
150
FIGURE 2-1:
0
25
50
75
100
Ambient Temperature (°C)
Open-Loop Phase (°)
-50
Input Offset Voltage (mV)
600
5
4
3
2
1
0
-1
-2
-3
70
-4
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
5
Percentage of Occurrences
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
RL = 10 kΩ to VDD/2 and CL = 60 pF.
Input Bias Current (pA)
FIGURE 2-6:
Input Bias Current at +125°C.
© 2005 Microchip Technology Inc.
MCP6001/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
RL = 10 kΩ to VDD/2 and CL = 60 pF.
FIGURE 2-7:
vs. Frequency.
Input Noise Voltage Density
FIGURE 2-10:
Input Offset Voltage (µV)
Input Offset Voltage (µV)
-300
-400
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
-500
-600
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-700
12
10
8
6
4
2
0
-2
100
50
VDD = 5.5V
0
VDD = 1.8V
-50
-100
-150
VCM = VSS
-200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Output Voltage (V)
FIGURE 2-11:
Output Voltage.
FIGURE 2-8:
Input Offset Voltage vs.
Common Mode Input Voltage at VDD = 1.8V.
Input Offset Voltage vs.
30
VDD = 5.5V
Short Circuit Current
Magnitude (mA)
Input Offset Voltage (µV)
-4
150
Common Mode Input Voltage (V)
-100
Input Offset Voltage Drift.
200
VDD = 1.8V
-200
0
-6
Input Offset Voltage Drift (µV/°C)
0
-100
8%
6%
4%
2%
0%
-12
10
0.1 1.E+0
1
10 1.E+0
100 1.E+0
1k 1.E+0
10k 1.E+0
100k
1.E-01
1.E+0
0
Frequency
1
2 (Hz)
3
4
5
1225 Samples
TA = -40°C to +125°C
VCM = VSS
-8
100
18%
16%
14%
12%
10%
-10
Percentage of Occurrences
Input Noise Voltage Density
(nV/—Hz)
1,000
-200
-300
-400
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
-500
-600
Common Mode Input Voltage (V)
FIGURE 2-9:
Input Offset Voltage vs.
Common Mode Input Voltage at VDD = 5.5V.
© 2005 Microchip Technology Inc.
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-700
25
20
15
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
10
5
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
FIGURE 2-12:
Output Short-Circuit Current
vs. Power Supply Voltage.
DS21733F-page 5
MCP6001/2/4
0.08
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
G = +1 V/V
Falling Edge, VDD = 5.5V
Falling Edge, VDD = 1.8V
Rising Edge, VDD = 5.5V
Rising Edge, VDD = 1.8V
-50
-25
0
25
50
75
100
Output Voltage (20 mV/div)
Slew Rate (V/µs)
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
RL = 10 kΩ to VDD/2 and CL = 60 pF.
125
0.06
0.04
0.02
0.00
-0.02
-0.04
-0.06
-0.08
0.E+00
1.E-06
2.E-06
3.E-06
4.E-06
FIGURE 2-13:
Temperature.
Slew Rate vs. Ambient
FIGURE 2-16:
Pulse Response.
Output Voltage Headroom
(mV)
1,000
6.E-06
7.E-06
8.E-06
10
Output Voltage (V)
VDD – VOH
VOL – VSS
G = +1 V/V
VDD = 5.0V
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
100µ
1m
1.E-04
1.E-03
Output Current Magnitude (A)
10m
1.E-02
0.0
0.E+00
180
Quiescent Current
per amplifier (µA)
160
VDD = 5.5V
3.E-05
4.E-05
5.E-05
6.E-05
7.E-05
8.E-05
9.E-05
1.E-04
VDD = 1.8V
Large-Signal, Non-Inverting
VCM = VDD - 0.5V
140
120
100
80
60
40
20
DS21733F-page 6
2.E-05
FIGURE 2-17:
Pulse Response.
10
FIGURE 2-15:
Frequency.
1.E-05
Time (10 µs/div)
FIGURE 2-14:
Output Voltage Headroom
vs. Output Current Magnitude.
0.1
1k
1.E+03
1.E-05
5.0
100
1
9.E-06
Small-Signal, Non-Inverting
4.5
1
10µ
1.E-05
Output Voltage Swing (V P-P)
5.E-06
Time (1 µs/div)
Ambient Temperature (°C)
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
0
10k
100k
1.E+04
1.E+05
Frequency (Hz)
1M
1.E+06
Output Voltage Swing vs.
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
FIGURE 2-18:
Quiescent Current vs.
Power Supply Voltage.
© 2005 Microchip Technology Inc.
MCP6001/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MCP6001
3.1
PIN FUNCTION TABLE
MCP6001R MCP6001U
MCP6002
Symbol
Description
1
1
4
1
1
VOUT, VOUTA Analog Output (op amp A)
4
4
3
2
2
VIN–, VINA– Inverting Input (op amp A)
3
3
1
3
3
VIN+, VINA+ Non-inverting Input (op amp A)
5
2
5
8
4
VDD
Non-inverting Input (op amp B)
Positive Power Supply
—
—
—
5
5
VINB+
—
—
—
6
6
VINB–
Inverting Input (op amp B)
—
—
—
7
7
VOUTB
Analog Output (op amp B)
—
—
—
—
8
VOUTC
Analog Output (op amp C)
—
—
—
—
9
VINC–
Inverting Input (op amp C)
—
—
—
—
10
VINC+
Non-inverting Input (op amp C)
2
5
2
4
11
VSS
—
—
—
—
12
VIND+
Non-inverting Input (op amp D)
—
—
—
—
13
VIND–
Inverting Input (op amp D)
—
—
—
—
14
VOUTD
Analog Output (op amp D)
Analog Outputs
The output pins are low-impedance voltage sources.
3.2
MCP6004
Analog Inputs
The non-inverting and inverting inputs are highimpedance CMOS inputs with low bias currents.
© 2005 Microchip Technology Inc.
3.3
Negative Power Supply
Power Supply (VSS and VDD)
The positive power supply (VDD) is 1.8V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need a local bypass capacitor (typically 0.01 µF to
0.1 µF) within 2 mm of the VDD pin. These parts can
share a bulk capacitor with analog parts (typically
2.2 µF to 10 µF) within 100 mm of the VDD pin.
DS21733F-page 7
MCP6001/2/4
4.0
APPLICATION INFORMATION
–
The MCP6001/2/4 family of op amps is manufactured
using Microchip’s state-of-the-art CMOS process and
is specifically designed for low-cost, low-power and
general-purpose applications. The low supply voltage,
low quiescent current and wide bandwidth makes the
MCP6001/2/4 ideal for battery-powered applications.
This device has high phase margin, which makes it
stable for larger capacitive load applications.
4.1
RIN
VIN
VOUT
( Maximum expected VIN ) – V DD
RIN ≥ ------------------------------------------------------------------------------2 mA
V SS – ( Minimum expected V IN )
R IN ≥ ---------------------------------------------------------------------------2 mA
Rail-to-Rail Input
The MCP6001/2/4 op amps are designed to prevent
phase reversal when the input pins exceed the supply
voltages. Figure 4-1 shows the input voltage exceeding
the supply voltage without any phase reversal.
FIGURE 4-2:
Resistor (RIN).
4.2
6
Input, Output Voltages (V)
MCP600X
+
VIN
VOUT
Rail-to-Rail Output
The output voltage range of the MCP6001/2/4 op amps
is VDD – 25 mV (min.) and VSS + 25 mV (max.) when
RL = 10 kΩ is connected to VDD/2 and VDD = 5.5V.
Refer to Figure 2-14 for more information.
VDD = 5.0V
G = +2 V/V
5
Input Current Limiting
4
3
4.3
2
1
0
-1
0.E+00
1.E-05
2.E-05
3.E-05
4.E-05
5.E-05
6.E-05
7.E-05
8.E-05
9.E-05
1.E-04
Time (10 µs/div)
FIGURE 4-1:
Phase Reversal.
The MCP6001/2/4 Show No
The input stage of the MCP6001/2/4 op amps use two
differential input stages in parallel. One operates at a
low common mode input voltage (VCM), while the other
operates at a high VCM. With this topology, the device
operates with a VCM up to 300 mV above VDD and
300 mV below VSS. The input offset voltage is
measured at VCM = VSS – 300 mV and VDD + 300 mV
to ensure proper operation.
Input voltages that exceed the input voltage range
(VSS – 0.3V to VDD + 0.3V at 25°C) can cause
excessive current to flow into or out of the input pins,
while current beyond ±2 mA can cause reliability
problems. Applications that exceed this rating must be
externally limited with a resistor, as shown in Figure 4-2.
Capacitive Loads
Driving large capacitive loads can cause stability problems for voltage feedback op amps. As the load capacitance increases, the feedback loop’s phase margin
decreases and the closed-loop bandwidth is reduced.
This produces gain peaking in the frequency response,
with overshoot and ringing in the step response. While
a unity-gain buffer (G = +1) is the most sensitive to
capacitive loads, all gains show the same general
behavior.
When driving large capacitive loads with these op
amps (e.g., > 100 pF when G = +1), a small series
resistor at the output (RISO in Figure 4-3) improves the
feedback loop’s phase margin (stability) by making the
output load resistive at higher frequencies. The bandwidth will be generally lower than the bandwidth with no
capacitance load.
–
VIN
MCP600X
+
RISO
VOUT
CL
FIGURE 4-3:
Output resistor, RISO
stabilizes large capacitive loads.
DS21733F-page 8
© 2005 Microchip Technology Inc.
MCP6001/2/4
Figure 4-4 gives recommended RISO values for
different capacitive loads and gains. The x-axis is the
normalized load capacitance (CL/GN), where GN is the
circuit's noise gain. For non-inverting gains, GN and the
Signal Gain are equal. For inverting gains, GN is
1+|Signal Gain| (e.g., -1 V/V gives GN = +2 V/V).
Recommended RISO (:)
1000
100
VDD = 5.0V
RL = 100 k:
GN = 1
GN t 2
4.5
PCB Surface Leakage
In applications where low input bias current is critical,
Printed Circuit Board (PCB) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
between nearby traces is 1012Ω. A 5V difference would
cause 5 pA of current to flow; which is greater than the
MCP6001/2/4 family’s bias current at 25°C (1 pA, typ.).
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is shown in
Figure 4-5.
VIN-
10
100p
1n
10n
10p
10n
1.E-11
1.E-10
1.E-09
1.E-08
Normalized Load Capacitance; CL/GN (F)
VIN+
VSS
FIGURE 4-4:
Recommended RISO values
for Capacitive Loads.
After selecting RISO for your circuit, double-check the
resulting frequency response peaking and step
response overshoot. Modify RISO’s value until the
response is reasonable. Bench evaluation and simulations with the MCP6001/2/4 SPICE macro model are
very helpful.
4.4
Supply Bypass
With this family of operational amplifiers, the power
supply pin (VDD for single-supply) should have a local
bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm
for good high-frequency performance. It also needs a
bulk capacitor (i.e., 1 µF or larger) within 100 mm to
provide large, slow currents. This bulk capacitor can be
shared with other analog parts.
© 2005 Microchip Technology Inc.
Guard Ring
FIGURE 4-5:
for Inverting Gain.
1.
2.
Example Guard Ring Layout
Non-inverting Gain and Unity-Gain Buffer:
a. Connect the non-inverting pin (VIN+) to the
input with a wire that does not touch the
PCB surface.
b. Connect the guard ring to the inverting input
pin (VIN–). This biases the guard ring to the
common mode input voltage.
Inverting Gain and Transimpedance Gain
Amplifiers (convert current to voltage, such as
photo detectors):
a. Connect the guard ring to the non-inverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the op
amp (e.g., VDD/2 or ground).
b. Connect the inverting pin (VIN–) to the input
with a wire that does not touch the PCB
surface.
DS21733F-page 9
MCP6001/2/4
4.6
4.6.1
Application Circuits
100 pF
UNITY-GAIN BUFFER
The rail-to-rail input and output capability of the
MCP6001/2/4 op amp is ideal for unity-gain buffer
applications. The low quiescent current and wide
bandwidth makes the device suitable for a buffer
configuration in an instrumentation amplifier circuit, as
shown in Figure 4-6.
–
1/2
MCP6002
VIN1
+
MCP6001
VOUT
+
1/2
MCP6002
VIN2
R2
+
R1
R1 = 20 kΩ
R2 = 10 kΩ
VREF
R1
V OUT = ( VIN2 – VIN1 ) • ------ + V REF
R2
FIGURE 4-6:
Instrumentation Amplifier
with Unity-Gain Buffer Inputs.
4.6.2
33 pF
4.6.3
–
–
+
MCP6002
FIGURE 4-7:
Low- Pass Filter.
R1
R2
VIN 14.3 kΩ 53.6 kΩ
ACTIVE LOW-PASS FILTER
The MCP6001/2/4 op amp’s low input bias current
makes it possible for the designer to use larger resistors and smaller capacitors for active low-pass filter
applications. However, as the resistance increases, the
noise generated also increases. Parasitic capacitances
and the large value resistors could also modify the frequency response. These trade-offs need to be
considered when selecting circuit elements.
Usually, the op amp bandwidth is 100X the filter cutoff
frequency (or higher) for good performance. It is possible to have the op amp bandwidth 10X higher than the
cutoff frequency, thus having a design that is more
sensitive to component tolerances.
Figure 4-7 shows a second-order Butterworth filter with
100 kHz cutoff frequency and a gain of +1 V/V; the op
amp bandwidth is only 10X higher than the cutoff
frequency. The component values were selected using
Microchip’s FilterLab® software.
–
VOUT
Active Second-Order
PEAK DETECTOR
The MCP6001/2/4 op amp has a high input impedance,
rail-to-rail input/output and low input bias current, which
makes this device suitable for peak detector applications. Figure 4-8 shows a peak detector circuit with
clear and sample switches. The peak-detection cycle
uses a clock (CLK), as shown in Figure 4-8.
At the rising edge of CLK, Sample Switch closes to
begin sampling. The peak voltage stored on C1 is sampled to C2 for a sample time defined by tSAMP. At the
end of the sample time (falling edge of Sample Signal),
Clear Signal goes high and closes the Clear Switch.
When the Clear Switch closes, C1 discharges through
R1 for a time defined by tCLEAR. At the end of the clear
time (falling edge of Clear Signal), op amp A begins to
store the peak value of VIN on C1 for a time defined by
tDETECT.
In order to define tSAMP and tCLEAR, it is necessary to
determine the capacitor charging and discharging
period. The capacitor charging time is limited by the
amplifier source current, while the discharging time (τ)
is defined using R1 (τ = R1C1). tDETECT is the time that
the input signal is sampled on C1 and is dependent on
the input voltage change frequency.
The op amp output current limit, and the size of the
storage capacitors (both C1 and C2), could create slewing limitations as the input voltage (VIN) increases.
Current through a capacitor is dependent on the size of
the capacitor and the rate of voltage change. From this
relationship, the rate of voltage change or the slew rate
can be determined. For example, with an op amp shortcircuit current of ISC = 25 mA and a load capacitor of
C1 = 0.1 µF, then:
EQUATION 4-1:
dV C1
I SC = C 1 ------------dt
dV C1
I SC
------------- = -------dt
C1
25mA
= --------------0.1μF
dVC1
------------ = 250mV ⁄ μs
dt
DS21733F-page 10
© 2005 Microchip Technology Inc.
MCP6001/2/4
This voltage rate of change is less than the MCP6001/2/4
slew rate of 0.6 V/µs. When the input voltage swings
below the voltage across C1, D1 becomes reversebiased. This opens the feedback loop and rails the
amplifier. When the input voltage increases, the amplifier
recovers at its slew rate. Based on the rate of voltage
change shown in the above equation, it takes an
extended period of time to charge a 0.1 µF capacitor. The
capacitors need to be selected so that the circuit is not
limited by the amplifier slew rate. Therefore, the capacitors should be less than 40 µF and a stabilizing resistor
(RISO) needs to be properly selected. (Refer to
Section 4.3 “Capacitive Loads”).
VIN
+
1/2
MCP6002
–
D1
RISO VC1
Op Amp A
C1
R1
RISO VC2
+ 1/2
MCP6002
–
C2
Op Amp B
+
MCP6001
–
VOUT
Op Amp C
Sample
Switch
Clear
Switch
tSAMP
Sample Signal
tCLEAR
Clear Signal
tDETECT
CLK
FIGURE 4-8:
Peak Detector with Clear and Sample CMOS Analog Switches.
© 2005 Microchip Technology Inc.
DS21733F-page 11
MCP6001/2/4
5.0
DESIGN TOOLS
Microchip provides the basic design tools needed for
the MCP6001/2/4 family of op amps.
5.1
SPICE Macro Model
The latest SPICE macro model for the MCP6001/2/4
op amps is available on our web site at
www.microchip.com. This model is intended to be an
initial design tool that works well in the op amp’s linear
region of operation at room temperature. See the
model file for information on its capabilities.
Bench testing is a very important part of any design and
cannot be replaced with simulations. Also, simulation
results using this macro model need to be validated by
comparing them to the data sheet specifications and
characteristic curves.
5.2
FilterLab® Software
Microchip’s FilterLab® software is an innovative
software tool that simplifies analog active filter (using
op amps) design. Available at no cost from our web site
at www.microchip.com, the FilterLab design tool
provides full schematic diagrams of the filter circuit with
component values. It also outputs the filter circuit in
SPICE format, which can be used with the macro
model to simulate actual filter performance.
DS21733F-page 12
© 2005 Microchip Technology Inc.
MCP6001/2/4
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
5-Lead SC-70 (MCP6001)
XXN (Front)
YWW (Back)
Example: (I-Temp)
Device
MCP6001
I-Temp
Code
E-Temp
Code
AAN
CDN
AA7 (Front)
432 (Back)
Note: Applies to 5-Lead SC-70.
OR
OR
XXNN
Device
I-Temp
Code
E-Temp
Code
MCP6001
AANN
CDNN
AA74
Note: Applies to 5-Lead SC-70.
Example: (E-Temp)
5-Lead SOT-23 (MCP6001/1R/1U)
4
5
XXNN
1
2
I-Temp
Code
E-Temp
Code
MCP6001
AANN
CDNN
MCP6001R
ADNN
CENN
MCP6001U
AFNN
CFNN
Device
3
4
5
CD25
1
2
3
Note: Applies to 5-Lead SOT-23.
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
Legend:
Note:
*
XX...X
YY
WW
NNN
Example:
MCP6002
I/P256
0432
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.
© 2005 Microchip Technology Inc.
DS21733F-page 13
MCP6001/2/4
Package Marking Information (Continued)
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
8-Lead MSOP
Example:
MCP6002
I/SN0432
256
Example:
XXXXXX
6002I
YWWNNN
432256
14-Lead PDIP (300 mil) (MCP6004)
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
14-Lead SOIC (150 mil) (MCP6004)
Example:
MCP6004-I/P
0432256
Example:
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
14-Lead TSSOP (MCP6004)
DS21733F-page 14
MCP6004ISL
0432256
Example:
XXXXXX
YYWW
6004ST
0432
NNN
256
© 2005 Microchip Technology Inc.
MCP6001/2/4
5-Lead Plastic Package (SC-70)
E
E1
D
p
B
n
1
Q1
A2
c
A
A1
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Top of Molded Pkg to Lead Shoulder
Lead Thickness
Lead Width
A
A2
A1
E
E1
D
L
Q1
c
B
MIN
.031
.031
.000
.071
.045
.071
.004
.004
.004
.006
INCHES
NOM
5
.026 (BSC)
MAX
.043
.039
.004
.094
.053
.087
.012
.016
.007
.012
MILLIMETERS*
NOM
5
0.65 (BSC)
0.80
0.80
0.00
1.80
1.15
1.80
0.10
0.10
0.10
0.15
MIN
MAX
1.10
1.00
0.10
2.40
1.35
2.20
0.30
0.40
0.18
0.30
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
JEITA (EIAJ) Standard: SC-70
Drawing No. C04-061
© 2005 Microchip Technology Inc.
DS21733F-page 15
MCP6001/2/4
5-Lead Plastic Small Outline Transistor (OT) (SOT23)
E
E1
p
B
p1
n
D
1
α
c
A
Units
Dimension Limits
n
Number of Pins
p
Pitch
p1
Outside lead pitch (basic)
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
φ
L
β
A
A2
A1
E
E1
D
L
φ
c
B
α
β
MIN
.035
.035
.000
.102
.059
.110
.014
0
.004
.014
0
0
A2
A1
INCHES*
NOM
5
.038
.075
.046
.043
.003
.110
.064
.116
.018
5
.006
.017
5
5
MAX
.057
.051
.006
.118
.069
.122
.022
10
.008
.020
10
10
MILLIMETERS
NOM
5
0.95
1.90
0.90
1.18
0.90
1.10
0.00
0.08
2.60
2.80
1.50
1.63
2.80
2.95
0.35
0.45
0
5
0.09
0.15
0.35
0.43
0
5
0
5
MIN
MAX
1.45
1.30
0.15
3.00
1.75
3.10
0.55
10
0.20
0.50
10
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091
DS21733F-page 16
© 2005 Microchip Technology Inc.
MCP6001/2/4
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
§
A
A2
A1
E
E1
D
L
c
B1
B
eB
α
β
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
© 2005 Microchip Technology Inc.
DS21733F-page 17
MCP6001/2/4
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21733F-page 18
© 2005 Microchip Technology Inc.
MCP6001/2/4
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
E1
p
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
n
p
MIN
INCHES
NOM
8
.026 BSC
.033
.193 TYP.
.118 BSC
.118 BSC
.024
.037 REF
.006
.012
-
MAX
MILLIMETERS*
NOM
8
0.65 BSC
0.75
0.85
0.00
4.90 BSC
3.00 BSC
3.00 BSC
0.40
0.60
0.95 REF
0°
0.08
0.22
5°
5°
-
MIN
Number of Pins
Pitch
A
.043
Overall Height
A2
.030
.037
Molded Package Thickness
.000
.006
A1
Standoff
E
Overall Width
E1
Molded Package Width
D
Overall Length
L
.016
.031
Foot Length
Footprint (Reference)
F
φ
Foot Angle
0°
8°
c
Lead Thickness
.003
.009
Lead Width
B
.009
.016
α
Mold Draft Angle Top
5°
15°
β
5°
15°
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
MAX
1.10
0.95
0.15
0.80
8°
0.23
0.40
15°
15°
JEDEC Equivalent: MO-187
Drawing No. C04-111
© 2005 Microchip Technology Inc.
DS21733F-page 19
MCP6001/2/4
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
eB
p
B
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
14
.100
.155
.130
MAX
MILLIMETERS
NOM
14
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
18.80
19.05
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
Molded Package Thickness
A2
.115
.145
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.313
.325
Molded Package Width
.240
.250
.260
E1
Overall Length
D
.740
.750
.760
Tip to Seating Plane
L
.125
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
B1
.045
.058
.070
Lower Lead Width
B
.014
.018
.022
Overall Row Spacing
§
eB
.310
.370
.430
α
Mold Draft Angle Top
5
10
15
β
Mold Draft Angle Bottom
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
DS21733F-page 20
MAX
4.32
3.68
8.26
6.60
19.30
3.43
0.38
1.78
0.56
10.92
15
15
© 2005 Microchip Technology Inc.
MCP6001/2/4
14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
α
h
45°
c
A2
A
φ
A1
L
β
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.053
.052
.004
.228
.150
.337
.010
.016
0
.008
.014
0
0
INCHES*
NOM
14
.050
.061
.056
.007
.236
.154
.342
.015
.033
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.347
.020
.050
8
.010
.020
15
15
MILLIMETERS
NOM
14
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
5.99
3.81
3.90
8.56
8.69
0.25
0.38
0.41
0.84
0
4
0.20
0.23
0.36
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
8.81
0.51
1.27
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
© 2005 Microchip Technology Inc.
DS21733F-page 21
MCP6001/2/4
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
φ
β
A1
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
φ
c
B1
α
β
MIN
.033
.002
.246
.169
.193
.020
0
.004
.007
0
0
INCHES
NOM
14
.026
.035
.004
.251
.173
.197
.024
4
.006
.010
5
5
A2
MAX
.043
.037
.006
.256
.177
.201
.028
8
.008
.012
10
10
MILLIMETERS*
NOM
MAX
14
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
4.90
5.00
5.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
DS21733F-page 22
© 2005 Microchip Technology Inc.
MCP6001/2/4
APPENDIX A:
REVISION HISTORY
Revision F (March 2005)
Updated 6.0 “Packaging Information” to include old
and new packaging examples.
Revision E (December 2004)
The following is the list of modifications:
1.
2.
3.
VOS specification reduced to ±4.5 mV from
±7.0 mV for parts starting with date code
YYWW = 0449
Corrected package markings in Section 6.0
“Packaging Information”
Added Appendix A: Revision History.
Revision D (May 2003)
Revision C (December 2002)
Revision B (October 2002)
Revision A (June 2002)
Original data sheet release.
© 2005 Microchip Technology Inc.
DS21733E-page 23
MCP6001/2/4
NOTES:
DS21733E-page 24
© 2005 Microchip Technology Inc.
MCP6001/2/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device
Temperature
Range
Package
Examples:
a)
b)
Device:
MCP6001T:
MCP6001RT:
MCP6001UT:
MCP6002:
MCP6002T:
MCP6004:
MCP6004T:
Single Op Amp (Tape and Reel)
(SC-70, SOT-23)
Single Op Amp (Tape and Reel) (SOT-23)
Single Op Amp (Tape and Reel) (SOT-23)
Dual Op Amp
Dual Op Amp (Tape and Reel)
(SOIC, MSOP)
Quad Op Amp
Quad Op Amp (Tape and Reel)
(SOIC, MSOP)
Temperature Range:
I
E
= -40°C to +85°C
= -40°C to +125°C
Package:
LT = Plastic Package (SC-70), 5-lead (MCP6001 only)
OT = Plastic Small Outline Transistor (SOT-23), 5-lead
(MCP6001, MCP6001R, MCP6001U)
MS = Plastic MSOP, 8-lead
P
= Plastic DIP (300 mil Body), 8-lead, 14-lead
SN = Plastic SOIC, (150 mil Body), 8-lead
SL = Plastic SOIC (150 mil Body), 14-lead
ST = Plastic TSSOP (4.4mm Body), 14-lead
c)
d)
MCP6001T-I/LT:
Tape and Reel,
Industrial Temperature,
5LD SC-70 package
MCP6001T-I/OT:
Tape and Reel,
Industrial Temperature,
5LD SOT-23 package.
MCP6001RT-I/OT: Tape and Reel,
Industrial Temperature,
5LD SOT-23 package.
MCP6001UT-E/OT: Tape and Reel,
Extended Temperature,
5LD SOT-23 package.
a)
MCP6002-I/MS:
b)
MCP6002-I/P:
c)
MCP6002-E/P:
d)
MCP6002-I/SN:
e)
MCP6002T-I/MS:
a)
MCP6004-I/P:
b)
MCP6004-I/SL:
c)
MCP6004-E/SL:
d)
MCP6004-I/ST:
e)
MCP6004T-I/SL:
f)
MCP6004T-I/ST:
Industrial Temperature,
8LD MSOP package.
Industrial Temperature,
8LD PDIP package.
Extended Temperature,
8LD PDIP package.
Industrial Temperature,
8LD SOIC package.
Tape and Reel,
Industrial Temperature,
8LD MSOP package.
Industrial Temperature,
14LD PDIP package.
Industrial Temperature,,
14LD SOIC package.
Extended Temperature,,
14LD SOIC package.
Industrial Temperature,
14LD TSSOP package.
Tape and Reel,
Industrial Temperature,
14LD SOIC package.
Tape and Reel,
Industrial Temperature,
14LD TSSOP package.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
Your local Microchip sales office
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com) to receive the most current information on our products.
© 2005 Microchip Technology Inc.
DS21733E-page 25
MCP6001/2/4
NOTES:
DS21733E-page 26
© 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2005 Microchip Technology Inc.
DS21733E-page 27
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
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Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
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Tel: 91-80-2229-0061
Fax: 91-80-2229-0062
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Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
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Tel: 91-11-5160-8631
Fax: 91-11-5160-8632
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Tel: 43-7242-2244-399
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Tel: 45-4450-2828
Fax: 45-4485-2829
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Tel: 86-28-8676-6200
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Canada
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Fax: 905-673-6509
10/20/04
DS21733E-page 28
© 2005 Microchip Technology Inc.