DDTA144ELP Features • • • • • Epitaxial Planar Die Construction Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes Lead Free By Design/RoHS Compliant (Note 1) "Green" Device (Note 2) 2 1 3 Mechanical Data • • • • • • • • Case: DFN1006-3 Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Terminal Connections: Collector Dot (See Diagram) Terminals: Finish — NiPdAu annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208 Marking Code P2, Dot denotes Collector Side Ordering Information: See Page 4 Weight: 0.001 grams (approximate) Fig. 1 OUT B IN 1 R1 R2 C 3 (or -supply) IN B 1 C OUT 3 (or -supply) 2 NEW PRODUCT PRE-BIASED (R1=R2) SMALL SIGNALSURFACE MOUNT 100mA PNP TRANSISTOR E E 2 + Supply or GND GND (or +supply) Equivalent Inverter Circuit Schematic and Pin Configuration Fig. 2 Component P/N R1(NOM) R2(NOM) Figure DDTA144ELP 47K 47K 2 Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Supply Voltage VCC -50 V Input Voltage VIN +10 to -40 V Output Current (Io) IC(max) -100 mA Power Dissipation (Note 3) Pd 250 mW Power Deration above 25°C Pder 2 mW/°C Thermal Characteristics Symbol Value Unit Junction Operation and Storage Temperature Range Characteristic Tj, Tstg -55 to +150 °C Thermal Resistance, Junction to Ambient Air (Note 3) (Equivalent to one heated junction of NPN) RθJA 400 °C/W Notes: 1. 2. 3. No purposefully added lead. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. Device mounted on FR-4 PCB, 1” x 0.85” x 0.062”; pad layout as shown on page 5 or Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. DS30844 Rev. 3 - 2 1 of 5 www.diodes.com DDTA144ELP © Diodes Incorporated NEW PRODUCT Electrical Characteristics Characteristic @TA = 25°C unless otherwise specified Symbol Min Typ Max Unit Test Condition Collector-Base Breakdown Voltage V(BR)CBO -50 ⎯ ⎯ V IC = -10μA, IE = 0 Collector-Emitter Breakdown Voltage V(BR)CEO -50 ⎯ ⎯ V IC = -1.0mA, IB = 0 Emitter-Base Breakdown Voltage* Off Characteristics (Note 4) B V(BR)EBO -4.5 ⎯ ⎯ V IE = -50μA, IC = 0 Collector Cutoff Current* ICEX ⎯ ⎯ -0.5 μA VCE = -50V, VEB(OFF) = 3.0V Base Cutoff Current (IBEX) IBL ⎯ ⎯ -0.5 μA VCE = -50V, VEB(OFF) = 3.0V Collector-Base Cut Off Current ICBO ⎯ ⎯ -0.5 μA VCB = -50V, IE = 0 Collector-Emitter Cut Off Current, IO(OFF) ICEO ⎯ ⎯ -0.5 μA VCE = -50V, IB = 0 IEBO ⎯ ⎯ -0.5 mA VEB = 4V, IC = 0 VI(OFF) ⎯ ⎯ -0.3 V VCC = -5V, IO = -100uA ⎯ ⎯ -0.69 V VCE = -5V, IC = -2mA ⎯ ⎯ -0.78 V VCE = -5V, IC = -10mA ⎯ ⎯ -0.88 V IC = -10mA, IB = -1mA, VCE = -5V ⎯ ⎯ -0.98 V IC = -50mA, IB = -5mA, VCE = -5V VI(ON) -3 ⎯ ⎯ V VO = -0.3V, IO = -20mA II ⎯ ⎯ -7.2 mA VI = -5V Emitter-Base Cut Off Current Input Off Voltage B On Characteristics (Note 4) Base-Emitter Turn-On Voltage* Base-Emitter Saturation Voltage* Input-On Voltage Input Current VBE(ON) VBE(SAT) B B 90 ⎯ ⎯ ⎯ VCE =-5V, IC = -2mA 120 ⎯ ⎯ ⎯ VCE = -5V, IC = -5mA 150 ⎯ ⎯ ⎯ VCE = -5V, IC = -10mA 100 ⎯ ⎯ ⎯ VCE = -5V, IC = -100mA 180 ⎯ ⎯ ⎯ VCE = -5V, IC = -200mA 250 ⎯ ⎯ ⎯ VCE = -5V, IC = -300mA ⎯ ⎯ -0.15 V IB = -1mA, IC = -10mA ⎯ ⎯ -0.85 V IB = -5mA, IC = -50mA VO(ON) ⎯ ⎯ -0.3 V II = -0.5mA, IO = -50mA Input Resistance R1 1.54 2.2 2.86 KΩ ⎯ Resistance Ratio (R2/R1) 17 21 26 ⎯ ⎯ fT ⎯ 250 ⎯ MHz DC Current Gain Collector-Emitter Saturation Voltage* Output On Voltage (Same as VCE(SAT)) hFE VCE(SAT) Small Signal Characteristics Current Gain-Bandwidth Product VCE = -10V, IE = -5mA, f = 100 MHz * Guaranteed by design. Notes: 4. Short duration test pulse used to minimize self-heating effect. Pulse Test: Pulse width tp<300 uS, Duty Cycle, d<=2%. DS30844 Rev. 3 - 2 2 of 5 www.diodes.com DDTA144ELP © Diodes Incorporated PD, POWER DISSIPATION (mW) 300 250 200 150 100 50 400 0 0 25 50 75 100 125 150 175 TA, AMBIENT TEMPERATURE (°C) Fig. 3 Power Derating Curve 4 V O = 0.3V I O = 5mA V CE = -5V 3.4 hFE, DC CURRENT GAIN VI(ON), INPUT VOLTAGE (V) 3.7 3.1 2.8 2.5 2.2 1.9 1.6 1.3 1 -60 -30 0 30 60 90 120 150 TA, AMBIENT TEMPERATURE (°C) Fig. 5 Input Voltage vs. TA IC, COLLECTOR CURRENT (mA) Fig. 6 DC Current Gain vs IC VCE(SAT), COLLECTOR VOLTAGE (V) VBE, BASE EMITTER VOLTAGE (V) NEW PRODUCT Typical Characteristics IC, COLLECTOR CURRENT (mA) Fig. 8 IC vs. VCE(SAT) IC, COLLECTOR CURRENT (mA) Fig. 7 IC vs. VBE(ON) DS30844 Rev. 3 - 2 IC/IB = 10 3 of 5 www.diodes.com DDTA144ELP © Diodes Incorporated VBE(SAT), BASE EMITTER VOLTAGE (V) NEW PRODUCT IC/IB = 10 IC, COLLECTOR CURRENT (mA) Fig. 9 IC vs. VBE(SAT) Ordering Information (Note 6) Marking Code P2 Device DDTA144ELP-7 Notes: Packaging DFN1006-3 Shipping 3000/Tape & Reel 6. For packaging details, please see page 5 or go to our website at http://www.diodes.com/ap2007.pdf. Marking Information P2 = Product Type Marking Code YM = Date Code Marking Y = Year ex: T = 2007 M = Month e.g. 9 = September Fig. 10 Date Code Key Year 2007 U Code 2008 V 2009 W 2010 X Month Jan Feb Mar Apr May Jun Jul Code 1 2 3 4 5 6 7 DS30844 Rev. 3 - 2 4 of 5 www.diodes.com 2011 Y Aug 8 Sep 9 2012 Z Oct O Nov N Dec D DDTA144ELP © Diodes Incorporated NEW PRODUCT Mechanical Details DFN1006-3 G Dim Min Max Typ A 0.95 1.05 1.00 B 0.55 0.65 0.60 C 0.45 0.55 0.50 D 0.20 0.30 0.25 G 0.47 0.53 0.50 H 0 0.05 0.03 K 0.10 0.20 0.15 L 0.20 0.30 0.25 M — — 0.35 N — — 0.40 H A K B C M All Dimensions in mm N D L Fig. 11 Suggested Pad Layout: (Based on IPC-SM-782) C DFN1006-3 X1 X G2 G1 Y Z 1.1 G1 0.3 G2 0.2 X 0.7 X1 0.25 Y 0.4 C 0.7 All Dimensions in mm Fig. 15 Z Fig. 12 IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. DS30844 Rev. 3 - 2 5 of 5 www.diodes.com DDTA144ELP © Diodes Incorporated