Seoul LU581 Infrared lamp led Datasheet

SPECIFICATIONS
MODEL
Infrared LAMP LED
PART NO.
LI520C
[Contents]
1.
Devices ------------------------------------------------
1
2.
Outline Dimensions ---------------------------------
1
3.
Absolute Maximum Ratings -----------------------
2
4.
Electro-Optical Characteristics --------------------
3
5.
Reliability Tests --------------------------------------
4
6.
Characteristic Diagrams ----------------------------
5
7.
Bin Code Description -------------------------------
6
8.
Packing ------------------------------------------------
7
9.
Soldering Profile -------------------------------------
10
10.
Reference ---------------------------------------------
11
11.
Precaution For Use ----------------------------------
12
Rev : 0.0
1. Devices
Lens
Part Number
LI520C
Source
Color
Diffusion
Dice Source
Color
Blue -Risen
Non-Diffused
GaAlAs/GaAs
Infrared
2. Outline Dimensions
1.0
MAX1.0
4.98±0.2
2.5±0.05
2.5±0.2
5.00±0.2
1.0±0.2
28.0MIN
8.72±0.2
Notes : 1. All dimensions are in millimeters.
2. Protruded epoxy is 1.0mm maximum.
1
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
5.90±0.2
DETAIL
-0.1
0.5 +0.2
0.5±0.05
CATHODE
1.8±0.2
3. Absolute Maximum Ratings (at Ta = 25ºC)
Item
Symbol
Value
Unit
DC Forward Current
IF
100
mA
Forward Peak Pulse Current
IFM*1
1000
mA
Reverse Voltage
VR
5
V
Power Dissipation
PD
150
mW
Operating Temperature
Topr
-20 ~ +80
ºC
Storage Temperature
Tstg
-30 ~ +100
ºC
Solder Temperature
TS
260 ºC for 5 second*2
ºC
Notes :*1. t ≤ 0.01ms, D = 1/100
*2. 3mm bellow seating plane
2
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
4. Electro-Optical Characteristics (at IF = 100mA, Ta = 25ºC)
Value
Item
Symbol
Unit
Min.
Typ.
Max.
Radiant Intensity
Ie
30
65
130
mW/sr
Peak Wavelength
λp
-
940
-
nm
Spectrum Radiation Bandwidth
∆λ
-
50
-
nm
Forward Voltage
VF
-
1.2
1.55
V
View Angle
2θ½
24
deg.
Reverse Current (at VR = 5V)
IR
10
µA
Note : 1. Radiant Intensity Tolerance ± 10%
3
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
5. RELIABLITY TESTS
Item
Condition
Ta = RT,
Life Test
IF = 100mA
Note
Failures
1000 hrs
0/22
High Temperature
Operating
Ta = 85ºC, IF = 25mA
1000 hrs
0/22
Low Temperature
Operating
Ta = -40ºC, IF = 100mA
1000 hrs
0/22
Thermal Shock
Ta = -30ºC ~ +100º
(Transfer time : 5sec , 1 Cycle =1hr)
100 cycles
0/22
Temperature Cycle
Ta = -20ºC ~ +80ºC
(Transfer time : 5min , 1 Cycle =1hr)
100 cycles
0/22
Resistance to soldering
Heat
Ts = 260 ± 5ºC, t = 10 ± 1 sec
1 time
0/22
ESD
(Human Body Model)
1 kV, 1.5 kΩ ; 100 pF
1 time
0/22
High Temperature
Storage
Ta = 100ºC
1000 hrs
0/22
Low Temperature
Storage
Ta = -30ºC
1000 hrs
0/22
Temperature Humidity
Storage
Ta = +85ºC,RH=85%
1000hrs
0/22
Temperature Humidity
Operating
Ta = +85ºC,RH=85%
IF = 25mA
100hrs
0/22
< Judging Criteria For Reliability Tests >
VF
USL 1 X 1.2
IR
USL X 2.0
IV
LSL 2 X 0.5
Notes : 1.USL : Upper Standard Level
2.LSL : Lower Standard Level.
4
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
6. Characteristic Diagrams
Irel = f (θ ), Ta= 25ºC
IF = f (VF), Ta= 25ºC
1.0
100
Forward Current IF [mA]
Relative Luminous Intensity
0.8
0.6
0.4
0.2
0.0
-90
-60
-30
0
30
60
10
1
90
1.00
Off Axis Angle [deg.]
1.15
1.20
1.25
1.30
Forward Voltage vs. Forward Current
IV = f (IF), Ta= 25ºC
120
120
100
100
Forward Current IF [mA]
Radiant Intensity [mW/sr]
1.10
Forward Voltage VF [V]
Off Axis Angle vs. Relative Radiant Intensity
80
60
40
20
0
1.05
IF = f (Ta), Ta= 25ºC
80
60
40
20
20
40
60
80
100
0
-20
120
Forward Current IF [mA]
0
20
40
60
80
100
o
Ambient Temperature Ta [ C]
Forward Current vs. Radiant Intensity
Ambient Temperature vs. Forward Current
5
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
1.35
7. Bin Code Description
**
BIN CODE
Radiant Intensity
Radiant Intensity (Ie)
@ IF = 100mA
BIN
CODE
Min.
Max.
A
30
55
B
55
65
C
65
70
D
70
130
Peak Wavelength
Forward Voltage
Dominant Wavelength (nm)
@ IF = 100mA
1
940
Forward Voltage (V)
@ IF = 100mA
BIN
CODE
Min.
Max.
1
1.2
1.55
** Note : Binning range can be changed by customer’s requirement.
6
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
8. PACKING
1) Bulk Packing
(1) Antistatic poly vinyl bag apply
Poly bag:
5φ Lamp Series : 500pcs
3φ Lamp Series : 500pcs
(2) Inner box structure
SEOUL SEMICONDUCTOR CO.,LTD
170mm
TEL : (02) 3281-6269
97.0mm
P/O No.
Lot No
70mm
Box : 2 poly bags
260mm
(3) Outer box structure
315.0mm
Box : 27 boxes
485.0mm
7
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
2) Tapping Outline Dimensions
P
0±1.3
0±2.0
W
Wo
W2
Ho
W1
F
Do
Po
Package Dimensions (unit : mm)
Ho*
P
12.7±0.5
W
18.0 +1.0
-0.5
Po
12.7±0.3
Wo
13.0±0.3
F
2.54±0.5
W1
1.0±0.5
Do
φ4.0±0.5
W2
9.0±0.5
1 Box contain quantity.
* Remark : Ho - users define.
∗ 3φ Lamp Series : 3000pcs
* 5φ Lamp Series : 2000pcs
8
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
3) Forming Outline Dimensions
Po
W
Wo
W2
Ho
H
F
W1
H1
P
Do
Package Dimensions (unit : mm)
H*
W2
9.0±0.5
Ho *
P
12.7±0.5
H1 *
Po
12.7±0.3
W
18.0 +1.0
-0.5
F
5.0±0.5
Wo
13.0±0.3
Do
φ4.0±0.5
W1
1.0±0.5
1 Box contain quantity.
∗ 3φ Lamp Series : 2000pcs
* Remark : H / Ho / H1- users define.
* 5φ Lamp Series : 1500pcs
9
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
9. SOLDERING PROFILE
1) Wave Soldering Conditions / Profile
• Preliminary heating to be at 85ºC(120 ºC max) for 20 seconds(60 seconds max).
• Soldering heat to be at 235 ºC (260ºC max) for 5 seconds (10 seconds max.)
• Soak time above 200 ºC is 5 seconds
250
PEAK
5s (10s Max)
O
Temperature [ C]
200
235 ºC(260 ºC Max)
150
PREHEAT
100
20s (60s Max)
85 ºC(120 ºC max)
50
0
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
T im e [s ]
2) Hand Soldering conditions
• Not more than 5 seconds at max. 300ºC, under Soldering iron.
Note : In case the soldered products are reused in soldering process, we don’t guarantee the products.
10
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
34
36
10. PART NUMBERING SYSTEM
1
2
3
4
5
6
7
8
A
B
C
L* * * * * * * - * * *
1) Lamp LED initial
2) Color
U: Ultra Violet,
B : Blue (460~490),
C : Cyan (490~510),
T : True Green (510~540), G : Yellow-Green (540~580)
Y : Yellow (580~600)
O : Orange (600~620)
R : Red (620~700)
W : White
M : Warm
I : Infrared
3) If the products have 2 or 3chips
GR : Green + Red ( according to wavelength),
FL : Full color
4) Outline type
1 : 3x2(square),
2 : 5x2(square),
6 : 3Phi Oval,
7 : 5Phi Oval
3 : Phi3,
5 : Phi 5 ,
5) Half angle
1: ~14O, 2: 15~24O , 3: 25~34O, 4: 35~44O, 5 : 45~54O… 0 : more than 100O
6) 1st Development according to a chip
7) 2nd Development (other material)
D : diffused C : colored Z : zener chip attached
8) Stand off type
A, B, C : Bin cord description A: IV, B: WD C: VF
11
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
11. PRECAUTION FOR USE
1)
In order to avoid the absorption of moisture, it is recommended to store in the dry box (or
desiccators) with a desiccant .
2)
In case of more than 1 week passed after opening or change color of indicator on
desiccant components shall be dried 10-12Hr, at 60±5℃.
3)
In case of supposed the components is humid, shall be dried dip-solder just before, 12Hr
at 80±5℃ or 10Hr at 100±5℃.
4)
Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temp. after soldering.
5)
Quick cooling shall not be avoid.
6)
Components shall not be mounted on warped direction of PCB.
7)
Anti radioactive ray design is not considered for the products listed here in.
8)
This device should not be used in any type of fluid such as water, oil, organic solvent and
etc. When washing is required, IPA should be used.
9)
When the LEDs are illuminating, operating current should be decided after considering
the ambient maximum temperature.
10)
LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months
or more after being shipped from SSC, a sealed container with a nitrogen atmosphere
should be used for storage.
11)
The LEDs must be soldered within seven days after opening the moisture-proof packing.
12)
Repack unused products with anti-moisture packing, fold to close any opening and then
store in a dry place.
13)
The appearance and specifications of the product may be modified for improvement
without notice.
12
SEOUL SEMICONDUCTOR CO., LTD.
148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL : 82-2-3281-6269 FAX : 82-2-857-5430
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