LM1086 www.ti.com SNVS039H – JUNE 2000 – REVISED MAY 2013 LM1086 1.5A Low Dropout Positive Regulators Check for Samples: LM1086 FEATURES DESCRIPTION • The LM1086 is a series of low dropout positive voltage regulators with a maximum dropout of 1.5V at 1.5A of load current. It has the same pin-out as TI's industry standard LM317. 1 2 • • • • Available in 1.8V, 2.5V, 2.85V, 3.3V, 3.45V, 5V and Adjustable Versions Current Limiting and Thermal Protection Output Current 1.5A Line Regulation 0.015% (typical) Load Regulation 0.1% (typical) APPLICATIONS • • • • • • SCSI-2 Active Terminator High Efficiency Linear Regulators Battery Charger Post Regulation for Switching Supplies Constant Current Regulator Microprocessor Supply The LM1086 is available in an adjustable version, which can set the output voltage with only two external resistors. It is also available in six fixed voltages: 1.8V, 2.5V, 2.85V, 3.3V, 3.45V and 5.0V. The fixed versions integrate the adjust resistors. The LM1086 circuit includes a zener trimmed bandgap reference, current limiting and thermal shutdown. Connection Diagram ADJ/GND 1 VIN 2 8 VOUT 7 VOUT VOUT N/C 3 6 VOUT N/C 4 5 N/C Pins 6, 7, and 8 must be tied together. Figure 1. TO-220 Top View Figure 2. DDPAK/TO-263 Top View Figure 4. Basic Functional Diagram, Adjustable Version Figure 3. WSON Top View Figure 5. Application Circuit 1.2V to 15V Adjustable Regulator 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM1086 SNVS039H – JUNE 2000 – REVISED MAY 2013 www.ti.com Simplified Schematic 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 LM1086 www.ti.com SNVS039H – JUNE 2000 – REVISED MAY 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Maximum Input-to-Output Voltage Differential LM1086-ADJ 29V LM1086-1.8 27V LM1086-2.5 27V LM1086-2.85 27V LM1086-3.3 27V LM1086-3.45 27V LM1086-5.0 25V Power Dissipation (3) Internally Limited Junction Temperature (TJ) (4) 150°C Storage Temperature Range -65°C to 150°C Lead Temperature 260°C, to 10 sec (5) 2000V ESD Tolerance (1) (2) (3) (4) (5) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Power dissipation is kept in a safe range by current limiting circuitry. Refer to OVERLOAD RECOVERY in Application Note. The value θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations in the Application Notes. For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF. Operating Ratings (1) Junction Temperature Range (TJ) (2) Control Section "C" Grade "I" Grade (1) (2) 0°C to 125°C Output Section 0°C to 150°C Control Section −40°C to 125°C Output Section −40°C to 150°C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations in the Application Notes. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 3 LM1086 SNVS039H – JUNE 2000 – REVISED MAY 2013 www.ti.com Electrical Characteristics Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire junction temperature range for operation. Symbol VREF VOUT ΔVOUT ΔVOUT Reference Voltage Output Voltage (3) Line Regulation (4) Load Regulation (4) Dropout Voltage (5) (1) (2) (3) (4) (5) 4 Min Typ Max (1) Units LM1086-ADJ IOUT = 10mA, VIN−VOUT = 3V 10mA ≤IOUT ≤ IFULL LOAD, 1.5V ≤ VIN−VOUT ≤ 15V (3) 1.238 1.225 1.250 1.250 1.262 1.270 V V LM1086-1.8 IOUT = 0mA, VIN = 5V 0 ≤ IOUT ≤ IFULL LOAD, 3.3V ≤ VIN ≤ 18V 1.782 1.764 1.8 1.8 1.818 1.836 V LM1086-2.5 IOUT = 0mA, VIN = 5V 0 ≤ IOUT ≤ IFULL LOAD, 4.0V ≤ VIN ≤ 18V 2.475 2.450 2.50 2.50 2.525 2.55 V LM1086-2.85 IOUT = 0mA, VIN = 5V 0 ≤ IOUT ≤ IFULL LOAD, 4.35V ≤ VIN ≤ 18V 2.82 2.79 2.85 2.85 2.88 2.91 V V LM1086-3.3 IOUT = 0mA, VIN = 5V 0 ≤ IOUT ≤ IFULL LOAD, 4.75V ≤ VIN ≤ 18V 3.267 3.235 3.300 3.300 3.333 3.365 V V LM1086-3.45 IOUT = 0mA, VIN = 5V 0 ≤ IOUT ≤ IFULL LOAD, 4.95V ≤ VIN ≤ 18V 3.415 3.381 3.45 3.45 3.484 3.519 V V LM1086-5.0 IOUT = 0mA, VIN = 8V 0 ≤ IOUT ≤ IFULL LOAD, 6.5V ≤ VIN ≤ 20V 4.950 4.900 5.000 5.000 5.050 5.100 V V 0.015 0.035 0.2 0.2 % % LM1086-1.8 IOUT = 0mA, 3.3V ≤ VIN ≤ 18V 0.3 0.6 6 6 mV LM1086-2.5 IOUT = 0mA, 4.0V ≤ VIN ≤ 18V 0.3 0.6 6 6 mV LM1086-2.85 IOUT = 0mA, 4.35V ≤ VIN ≤ 18V 0.3 0.6 6 6 mV mV LM1086-3.3 IOUT = 0mA, 4.5V ≤ VIN ≤ 18V 0.5 1.0 10 10 mV mV LM1086-3.45 IOUT = 0mA, 4.95V ≤ VIN ≤ 18V 0.5 1.0 10 10 mV mV LM1086-5.0 IOUT = 0mA, 6.5V ≤ VIN ≤ 20V 0.5 1.0 10 10 mV mV LM1086-ADJ (VIN-V OUT ) = 3V, 10mA ≤ IOUT ≤ IFULL LOAD 0.1 0.2 0.3 0.4 % % LM1086-1.8 ,2.5, 2.85 VIN = 5V, 0 ≤ IOUT ≤ IFULL LOAD 3 6 12 20 mV mV LM1086-3.3, 3.45 VIN = 5V, 0 ≤ IOUT ≤ IFULL LOAD 3 7 15 25 mV mV LM1086-5.0 VIN = 8V, 0 ≤ IOUT ≤ IFULL LOAD 5 10 20 35 mV mV LM1086-ADJ, 1.8, 2.5,2.85, 3.3, 3.45, 5 ΔVREF, ΔVOUT = 1%, IOUT = 1.5A 1.3 1.5 V Parameter Conditions LM1086-ADJ IOUT =10mA, 1.5V≤ (VIN-VOUT) ≤ 15V (1) (2) All limits are specified by testing or statistical analysis. Typical Values represent the most likely parametric norm. IFULL LOAD is defined in the current limit curves. The IFULL LOAD Curve defines current limit as a function of input-to-output voltage. Note that 15W power dissipation for the LM1086 is only achievable over a limited range of input-to-output voltage. Load and line regulation are measured at constant junction temperature, and are specified up to the maximum power dissipation of 15W. Power dissipation is determined by the input/output differential and the output current. Ensured maximum power dissipation will not be available over the full input/output range. Dropout voltage is specified over the full output current range of the device. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 LM1086 www.ti.com SNVS039H – JUNE 2000 – REVISED MAY 2013 Electrical Characteristics (continued) Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire junction temperature range for operation. Symbol ILIMIT Min Typ LM1086-ADJ VIN−VOUT = 5V VIN−VOUT = 25V 1.50 0.05 2.7 0.15 A A LM1086-1.8,2.5, 2.85, 3.3, 3.45, VIN = 8V 1.5 2.7 A LM1086-5.0, VIN = 10V 1.5 2.7 A Parameter Conditions Current Limit Minimum Load Current (6) Max (1) Units 5.0 10.0 mA LM1086-1.8, 2.5, 2.85, VIN ≤ 18V 5.0 10.0 mA LM1086-3.3, VIN ≤ 18V 5.0 10.0 mA LM1086-3.45, VIN ≤ 18V 5.0 10.0 mA LM1086-5.0, VIN ≤ 20V 5.0 10.0 mA Thermal Regulation TA = 25°C, 30ms Pulse 0.008 0.04 %/W Ripple Rejection fRIPPLE = 120Hz, COUT = 25µF Tantalum, IOUT = 1.5A LM1086-ADJ, CADJ = 25µF, (VIN−VO) = 3V 60 75 dB LM1086-1.8, 2.5, 2.85, VIN = 6V 60 72 dB LM1086-3.3, VIN= 6.3V 60 72 dB LM1086-3.45, VIN= 6.3V 60 72 dB LM1086-5.0 VIN = 8V 60 68 dB Adjust Pin Current LM1086 55 120 µA Adjust Pin Current Change 10mA ≤ IOUT ≤ IFULL LOAD, 1.5V ≤ (VIN−VOUT) ≤ 15V 0.2 5 µA Temperature Stability (6) (2) LM1086-ADJ VIN −VOUT = 25V Quiescent Current θJC (1) 0.5 Long Term Stability TA = 125°C, 1000Hrs RMS Noise (% of VOUT) 10Hz ≤ f≤ 10kHz Thermal Resistance Junction-to-Case 3-Lead DDPAK/TO-263: Control Section/Output Section 3-Lead TO-220: Control Section/Output Section 0.3 % 1.0 0.003 % % 1.5/4.0 1.5/4.0 °C/W °C/W The minimum output current required to maintain regulation. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 5 LM1086 SNVS039H – JUNE 2000 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics 6 Dropout Voltage vs. Output Current Short-Circuit Current vs. Input/Output Difference Figure 6. Figure 7. Load Regulation vs. Temperature Percent Change in Output Voltage vs. Temperature Figure 8. Figure 9. Adjust Pin Current vs. Temperature Maximum Power Dissipation vs. Temperature Figure 10. Figure 11. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 LM1086 www.ti.com SNVS039H – JUNE 2000 – REVISED MAY 2013 Typical Performance Characteristics (continued) Ripple Rejection vs. Frequency (LM1086-Adj.) Ripple Rejection vs. Output Current (LM1086-Adj.) Figure 12. Figure 13. Ripple Rejection vs. Frequency (LM1086-5) Ripple Rejection vs. Output Current (LM1086-5) Figure 14. Figure 15. Line Transient Response Load Transient Response Figure 16. Figure 17. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 7 LM1086 SNVS039H – JUNE 2000 – REVISED MAY 2013 www.ti.com APPLICATION NOTE GENERAL Figure 18 shows a basic functional diagram for the LM1086-Adj (excluding protection circuitry) . The topology is basically that of the LM317 except for the pass transistor. Instead of a Darlingtion NPN with its two diode voltage drop, the LM1086 uses a single NPN. This results in a lower dropout voltage. The structure of the pass transistor is also known as a quasi LDO. The advantage a quasi LDO over a PNP LDO is its inherently lower quiescent current. The LM1086 is specified to provide a minimum dropout voltage 1.5V over temperature, at full load. Figure 18. Basic Functional Diagram for the LM1086, excluding Protection circuitry OUTPUT VOLTAGE The LM1086 adjustable version develops at 1.25V reference voltage, (VREF), between the output and the adjust terminal. As shown in figure 2, this voltage is applied across resistor R1 to generate a constant current I1. This constant current then flows through R2. The resulting voltage drop across R2 adds to the reference voltage to sets the desired output voltage. The current IADJ from the adjustment terminal introduces an output error . But since it is small (120uA max), it becomes negligible when R1 is in the 100Ω range. For fixed voltage devices, R1 and R2 are integrated inside the devices. Figure 19. Basic Adjustable Regulator STABILITY CONSIDERATION Stability consideration primarily concern the phase response of the feedback loop. In order for stable operation, the loop must maintain negative feedback. The LM1086 requires a certain amount series resistance with capacitive loads. This series resistance introduces a zero within the loop to increase phase margin and thus increase stability. The equivalent series resistance (ESR) of solid tantalum or aluminum electrolytic capacitors is used to provide the appropriate zero (approximately 500 kHz). 8 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 LM1086 www.ti.com SNVS039H – JUNE 2000 – REVISED MAY 2013 The Aluminum electrolytic are less expensive than tantalums, but their ESR varies exponentially at cold temperatures; therefore requiring close examination when choosing the desired transient response over temperature. Tantalums are a convenient choice because their ESR varies less than 2:1 over temperature. The recommended load/decoupling capacitance is a 10uF tantalum or a 50uF aluminum. These values will assure stability for the majority of applications. The adjustable versions allows an additional capacitor to be used at the ADJ pin to increase ripple rejection. If this is done the output capacitor should be increased to 22uF for tantalums or to 150uF for aluminum. Capacitors other than tantalum or aluminum can be used at the adjust pin and the input pin. A 10uF capacitor is a reasonable value at the input. See RIPPLE REJECTION section regarding the value for the adjust pin capacitor. It is desirable to have large output capacitance for applications that entail large changes in load current (microprocessors for example). The higher the capacitance, the larger the available charge per demand. It is also desirable to provide low ESR to reduce the change in output voltage: ΔV = ΔI x ESR It is common practice to use several tantalum and ceramic capacitors in parallel to reduce this change in the output voltage by reducing the overall ESR. Output capacitance can be increased indefinitely to improve transient response and stability. RIPPLE REJECTION Ripple rejection is a function of the open loop gain within the feed-back loop (refer to Figure 18 and Figure 19). The LM1086 exhibits 75dB of ripple rejection (typ.). When adjusted for voltages higher than VREF, the ripple rejection decreases as function of adjustment gain: (1+R1/R2) or VO/VREF. Therefore a 5V adjustment decreases ripple rejection by a factor of four (−12dB); Output ripple increases as adjustment voltage increases. However, the adjustable version allows this degradation of ripple rejection to be compensated. The adjust terminal can be bypassed to ground with a capacitor (CADJ). The impedance of the CADJ should be equal to or less than R1 at the desired ripple frequency. This bypass capacitor prevents ripple from being amplified as the output voltage is increased. 1/(2π*fRIPPLE*CADJ) ≤ R1 LOAD REGULATION The LM1086 regulates the voltage that appears between its output and ground pins, or between its output and adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the best load regulation, a few precautions are needed. Figure 20 shows a typical application using a fixed output regulator. Rt1 and Rt2 are the line resistances. VLOAD is less than the VOUT by the sum of the voltage drops along the line resistances. In this case, the load regulation seen at the RLOAD would be degraded from the data sheet specification. To improve this, the load should be tied directly to the output terminal on the positive side and directly tied to the ground terminal on the negative side. Figure 20. Typical Application using Fixed Output Regulator Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 9 LM1086 SNVS039H – JUNE 2000 – REVISED MAY 2013 www.ti.com When the adjustable regulator is used (Figure 21), the best performance is obtained with the positive side of the resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with 0.05Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05Ω x IL. If R1 (=125Ω) is connected near the load the effective line resistance will be 0.05Ω (1 + R2/R1) or in this case, it is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to provide remote ground sensing and improve load regulation. Figure 21. Best Load Regulation using Adjustable Output Regulator PROTECTION DIODES Under normal operation, the LM1086 regulator does not need any protection diode. With the adjustable device, the internal resistance between the adjustment and output terminals limits the current. No diode is needed to divert the current around the regulator even with a capacitor on the adjustment terminal. The adjust pin can take a transient signal of ±25V with respect to the output voltage without damaging the device. When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage of the regulator, and rate of decrease of VIN. In the LM1086 regulator, the internal diode between the output and input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large output capacitor (≥1000 µf), and with input instantaneously shorted to ground, the regulator could be damaged. In this case, an external diode is recommended between the output and input pins to protect the regulator, shown in Figure 22. Figure 22. Regulator with Protection Diode 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 LM1086 www.ti.com SNVS039H – JUNE 2000 – REVISED MAY 2013 OVERLOAD RECOVERY Overload recovery refers to regulator's ability to recover from a short circuited output. A key factor in the recovery process is the current limiting used to protect the output from drawing too much power. The current limiting circuit reduces the output current as the input to output differential increases. Refer to short circuit curve in the Typical Performance Characteristics section. During normal start-up, the input to output differential is small since the output follows the input. But, if the output is shorted, then the recovery involves a large input to output differential. Sometimes during this condition the current limiting circuit is slow in recovering. If the limited current is too low to develop a voltage at the output, the voltage will stabilize at a lower level. Under these conditions it may be necessary to recycle the power of the regulator in order to get the smaller differential voltage and thus adequate start up conditions. Refer to Typical Performance Characteristics section for the short circuit current vs. input differential voltage. THERMAL CONSIDERATIONS ICs heats up when in operation, and power consumption is one factor in how hot it gets. The other factor is how well the heat is dissipated. Heat dissipation is predictable by knowing the thermal resistance between the IC and ambient (θJA). Thermal resistance has units of temperature per power (C/W). The higher the thermal resistance, the hotter the IC. The LM1086 specifies the thermal resistance for each package as junction to case (θJC). In order to get the total resistance to ambient (θJA), two other thermal resistance must be added, one for case to heat-sink (θCH) and one for heatsink to ambient (θHA). The junction temperature can be predicted as follows: TJ = TA + PD (θJC + θCH + θHA) = TA + PD θJA where • • • TJ is junction temperature TA is ambient temperature PD is the power consumption of the device Device power consumption is calculated as follows: IIN = IL + IG PD = (VIN−VOUT) IL + VINIG Figure 23 shows the voltages and currents which are present in the circuit. Figure 23. Power Dissipation Diagram Once the device power is determined, the maximum allowable (θJA(max)) is calculated as: θJA (max) = TR(max)/PD = TJ(max) − TA(max))/PD The LM1086 has different temperature specifications for two different sections of the IC: the control section and the output section. The Electrical Characteristics table shows the junction to case thermal resistances for each of these sections, while the maximum junction temperatures (TJ(max)) for each section is listed in the Absolute Maximum section of the datasheet. TJ(max) is 125°C for the control section, while TJ(max) is 150°C for the output section. θJA (max) should be calculated separately for each section as follows: θJA (max, CONTROL SECTION) = (125°C for TA(max))/PD θJA (max, OUTPUT SECTION) = (150°C for TA(max))/PD Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 11 LM1086 SNVS039H – JUNE 2000 – REVISED MAY 2013 www.ti.com The required heat sink is determined by calculating its required thermal resistance (θHA(max)). θHA(max) = θJA(max) − (θJC + θCH) θHA (max) should be calculated twice as follows: θHA (max) = θJA(max, CONTROL SECTION) - (θJC (CONTROL SECTION) + θCH) θHA (max)= θJA(max, OUTPUT SECTION) - (θJC(OUTPUT SECTION) + θCH) If thermal compound is used, θCH can be estimated at 0.2 C/W. If the case is soldered to the heat sink, then a θCH can be estimated as 0 C/W. After, θHA (max) is calculated for each section, choose the lower of the two θHA appropriate heat sink. (max) values to determine the If PC board copper is going to be used as a heat sink, then Figure 24 can be used to determine the appropriate area (size) of copper foil required. Figure 24. Heat sink thermal Resistance vs. Area Typical Applications Figure 25. 5V to 3.3V, 1.5A Regulator 12 Submit Documentation Feedback Figure 26. Adjustable @ 5V Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 LM1086 www.ti.com SNVS039H – JUNE 2000 – REVISED MAY 2013 Figure 27. 1.2V to 15V Adjustable Regulator Figure 28. 5V Regulator with Shutdown Figure 29. Battery Charger Figure 30. Adjustable Fixed Regulator Figure 31. Regulator with Reference Figure 32. High Current Lamp Driver Protection Figure 33. Battery Backup Regulated Supply Figure 34. Ripple Rejection Enhancement Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 13 LM1086 SNVS039H – JUNE 2000 – REVISED MAY 2013 www.ti.com Figure 35. Automatic Light control Figure 36. Remote Sensing Figure 37. SCSI-2 Active termination 14 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 LM1086 www.ti.com SNVS039H – JUNE 2000 – REVISED MAY 2013 REVISION HISTORY Changes from Revision G (May 2013) to Revision H • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 14 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1086 15 PACKAGE OPTION ADDENDUM www.ti.com 2-Jul-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM1086CS-2.5/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR LM1086CS-3.3/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR LM1086CS-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR LM1086CS-ADJ ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI LM1086 CS-ADJ LM1086CS-ADJ/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR LM1086 CS-ADJ LM1086CSX-2.5/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR LM1086CSX-3.3/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR LM1086 CS-3.3 LM1086CSX-ADJ/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR LM1086 CS-ADJ LM1086CT-3.3/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM LM1086 CT-3.3 LM1086CT-5.0 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM1086 CT-5.0 LM1086CT-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM1086 CT-5.0 LM1086CT-ADJ/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM LM1086ILD-3.3 ACTIVE WSON NGN 8 1000 TBD Call TI Call TI -40 to 125 1086I33 LM1086ILD-3.3/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS & no Sb/Br) SN Level-3-260C-168 HR -40 to 125 1086I33 LM1086IS-1.8/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR LM1086IS-3.3 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM1086 IS-3.3 LM1086IS-3.3/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM1086 IS-3.3 Addendum-Page 1 -40 to 125 LM1086 CS-2.5 LM1086 CS-3.3 -40 to 125 -40 to 125 LM1086 CS-5.0 LM1086 CS-2.5 LM1086 CT-ADJ LM1086 IS-1.8 Samples PACKAGE OPTION ADDENDUM www.ti.com 2-Jul-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM1086IS-5.0 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI LM1086 IS-5.0 LM1086IS-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM1086 IS-5.0 LM1086IS-ADJ/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM1086 IS-ADJ LM1086ISX-1.8/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR LM1086ISX-3.3/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM1086 IS-3.3 LM1086ISX-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM1086 IS-5.0 LM1086ISX-ADJ/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM1086 IS-ADJ LM1086IT-3.3/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM1086 IT-3.3 LM1086IT-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM1086 IT-5.0 LM1086IT-ADJ/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM1086 IT-ADJ LM1086 IS-1.8 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 2-Jul-2013 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM1086CSX-2.5/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1086CSX-3.3/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1086CSX-ADJ/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1086ILD-3.3 WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1086ILD-3.3/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1086ISX-1.8/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1086ISX-3.3/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1086ISX-5.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1086ISX-ADJ/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1086CSX-2.5/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1086CSX-3.3/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1086CSX-ADJ/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1086ILD-3.3 WSON NGN 8 1000 210.0 185.0 35.0 LM1086ILD-3.3/NOPB WSON NGN 8 1000 213.0 191.0 55.0 LM1086ISX-1.8/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1086ISX-3.3/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1086ISX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1086ISX-ADJ/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA NDE0003B www.ti.com MECHANICAL DATA NGN0008A LDC08A (Rev B) www.ti.com MECHANICAL DATA KTT0003B TS3B (Rev F) BOTTOM SIDE OF PACKAGE www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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