ON NCP582LXV29T2G Ultra-fast, low noise 150 ma cmos ldo Datasheet

NCP582
Ultra-Fast, Low Noise
150 mA CMOS LDO
Regulator with Enable
The NCP582 series of low dropout regulators are designed for
portable battery powered applications which require precise output
voltage accuracy, low quiescent current, and high ripple rejection.
These devices feature an enable function and are offered in active
low and active high with auto discharge.
The following ceramic capacitors are the recommended values to
be used with these devices; for Vout < 2.5 V, Cin = Cout = 1.0 mF,
Vout w 2.5 V, Cin = Cout = 0.47 mF.
•
•
MARKING
DIAGRAMS
Ultra−Low Dropout Voltage of 220 mV at 150 mA
Low Output Noise of 30 mVrms without Noise Reduction Cap
Excellent Line Regulation of 0.02%/V
Excellent Load Regulation of 22 mV
High Output Voltage Accuracy of "2%
Low Iq Current of 75 mA
Very Low Shutdown Current
Excellent Power Supply Rejection Ratio of 70 dB at f = 1.0 kHz
Wide Output Voltage Range of 1.5 V to 3.3 V
Fast Dynamic Performance
Fold Back Protection Circuit
Low Temperature Drift Coefficient on the Output Voltage of
"100 ppm/°C
Input Voltage up to 6.5 V
These are Pb−Free Devices
1
1
SOT−563
XV SUFFIX
CASE 463A
6
1
X
T
XX
TT
SC−82AB
SQ SUFFIX
CASE 419C
4
Features
•
•
•
•
•
•
•
•
•
•
•
•
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XXX
XTT
1
= Device Code
= Traceability Information
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
Typical Applications
• Portable Equipment
• Hand−Held Instrumentation
• Camcorders and Cameras
Vin
Vout
Vin
Vout
+
+
Vref
Vref
Current Limit
CE
Current Limit
GND
CE
Figure 1. Simplified Block Diagram
for Active Low
© Semiconductor Components Industries, LLC, 2009
May, 2009 − Rev. 10
GND
Figure 2. Simplified Block Diagram
for Active High with Auto Discharge
1
Publication Order Number:
NCP582/D
NCP582
PIN FUNCTION DESCRIPTION
SOT−563 Pin
SC−82AB Pin
Symbol
Description
1
4
Vin
2
2
GND
Power supply ground.
3
3
Vout
Regulated output voltage.
4
−
NC
No connect.
5
−
GND
6
1
CE or CE
Power supply inout voltage.
Power supply ground.
Chip enable pin.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage
Vin
6.5
V
Input Voltage (CE or CE Pin)
VCE
−0.3 to Vin +0.3
V
Output Voltage
Vout
−0.3 to Vin +0.3
V
Output Current
Iout
200
mA
Power Dissipation
SC−82AB
SOT−563
PD
mW
150
500
ESD Capability, Human Body Model, C = 100 pF, R = 1.5 kW
ESDHBM
2000
V
ESD Capability, Machine Model, C = 200 pF, R = 0 W
ESDMM
200
V
TA
−40 to +85
°C
TJ(max)
125
°C
Tstg
−55 to +150
°C
Operating Ambient Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (Vin = Vout + 1.0 V, TA = 25°C, unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
Vin
2.0
−
6.0
V
Input Voltage
Output Voltage (Iout = 1.0 mA to 30 mA)
Vout
Vout X 0.980
−
Vout X 1.020
V
Regline
−
0.02
0.10
%/V
Regload
−
22
40
mV
Dropout Voltage (Iout = 150 mA)
Vout = 1.5 V
Vout = 1.8 V
Vout = 2.5 V
2.8 V v Vout v 3.3 V
VDO
−
−
−
−
0.38
0.32
0.28
0.22
0.70
0.55
0.50
0.35
V
Quiescent Current (Iout = 0 mA)
Iq
−
75
95
mA
Output Current
Iout
150
−
−
mA
Shutdown Current (VCE = Gnd for Active High with Auto Discharge)
(VCE = Vin for Active Low)
ISD
−
0.1
1.0
mA
Output Short Circuit Current (Vout = 0)
Ilim
−
40
−
mA
Ripple Rejection (Iout = 30 mA)
RR
Line Regulation (Iout = 30 mA),
(Vout > 1.7 V; Vout + 0.5 V v Vin v 6.0 V)
(Vout = 1.5 V; 2.2 V v Vin v 6.0 V)
Load Regulation (Iout = 1.0 mA to 150 mA)
Enable Input Threshold Voltage
(Vout > 1.7 V; Vin – Vout = 1.0 V)
(Vout = 1.5 V; Vin – Vout = 1.2 V)
f = 1.0 kHz
f = 10 kHz
High
Low
−
−
70
60
−
−
Vthenh
Vthenl
1.5
0
−
−
Vin
0.3
V
Vn
−
30
−
mVrms
DVout/DT
−
"100
−
ppm/°C
RLow
−
60
−
W
Output Noise Voltage (Bandwidth = 10 Hz to 100 kHz)
Output Voltage Temperature Coefficient (Iout = 30 mA, −40°C v TA v 85°C)
N−Channel On Resistance for Auto Discharge
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2
dB
NCP582
TYPICAL CHARACTERISTICS
3.0
1.4
1.2
OUTPUT VOLTAGE Vout (V)
OUTPUT VOLTAGE Vout (V)
1.6
1.8 V
1.0
0.8
Vin = 3.5 V
2.5 V
0.6
0.4
2.0 V
Vout = 1.5 V
0.2
0
0
100
300
200
2.5
2.0
1.5
3.8 V
0
400
Vout = 2.8 V
0
100
200
300
400
OUTPUT CURRENT Iout (mA)
OUTPUT CURRENT Iout (mA)
Figure 3. Output Voltage vs. Output Current
Figure 4. Output Voltage vs. Output Current
2.9
2.8
OUTPUT VOLTAGE Vout (V)
1.6
1.5
Iout = 1.0 mA
1.4
1.3
Iout = 30 mA
1.2
Iout = 50 mA
1.1
Vout = 1.5 V
2.0
4.0
3.0
5.0
2.7
2.6
Iout = 1.0 mA
2.5
Iout = 30 mA
2.4
2.3
Iout = 50 mA
2.2
Vout = 2.8 V
2.1
2.0
2.0
6.0
3.0
4.0
6.0
5.0
INPUT VOLTAGE Vin (V)
INPUT VOLTAGE Vin (V)
Figure 5. Output Voltage vs. Input Voltage
Figure 6. Output Voltage vs. Input Voltage
90
90
80
80
70
60
50
40
30
20
Vout = 1.5 V
10
0
0
3.5 V
0.5
QUIESCENT CURRENT, Iq (mA)
OUTPUT VOLTAGE Vout (V)
QUIESCENT CURRENT, Iq (mA)
3.1 V
1.0
1.7
1.0
1.0
Vin = 4.8 V
1.0
2.0
3.0
4.0
5.0
70
60
50
40
30
20
0
0
6.0
Vout = 2.8 V
10
1.0
2.0
3.0
4.0
5.0
INPUT VOLTAGE Vin (V)
INPUT VOLTAGE Vin (V)
Figure 7. Quiescent Current vs. Input Voltage
Figure 8. Quiescent Current vs. Input Voltage
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3
6.0
NCP582
1.53
2.86
1.52
2.84
OUTPUT VOLTAGE, Vout (V)
OUTPUT VOLTAGE, Vout (V)
TYPICAL CHARACTERISTICS
1.51
1.50
1.49
1.48
Vout = 1.5 V
1.47
1.46
−40
−15
10
2.80
2.78
2.76
Vout = 2.8 V
60
35
2.82
2.74
−40
85
−15
90
80
80
QUIESCENT CURRENT, Iq (mA)
QUIESCENT CURRENT, Iq (mA)
90
70
60
50
40
30
20
Vout = 1.5 V
−15
10
35
60
70
60
50
40
30
20
Vout = 2.8 V
10
0
−40
85
−15
TEMPERATURE (°C)
35
60
85
Figure 12. Quiescent Current vs. Temperature
0.6
DROPOUT VOLTAGE, VDO (V)
0.6
DROPOUT VOLTAGE, VDO (V)
10
TEMPERATURE (°C)
Figure 11. Quiescent Current vs. Temperature
0.5
0.4
85°C
25°C
0.3
0.2
−40°C
0.1
Vout = 1.5 V
0.0
0
85
Figure 10. Output Voltage vs. Temperature
Figure 9. Output Voltage vs. Temperature
0
−40
60
35
TEMPERATURE (°C)
TEMPERATURE (°C)
10
10
25
50
75
100
125
0.5
0.4
85°C
0.3
0.2
−40°C
0.1
Vout = 1.8 V
0.0
0
150
25°C
OUTPUT CURRENT Iout (mA)
25
50
75
100
125
150
OUTPUT CURRENT Iout (mA)
Figure 13. Dropout Voltage vs. Output Current
Figure 14. Dropout Voltage vs. Output Current
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4
NCP582
90
0.35
80
0.30
85°C
0.25
25°C
0.20
0.15
−40°C
0.10
0.05
90
80
Vout = 2.8 V
25
50
75
100
125
Iout = 50 mA
Iout = 30 mA
50
40
30
20
Vin = 2.5 Vdc + 0.5 Vp−p
Cout = Ceramic 1.0 mF
10
1
Vout = 1.5 V
10
100
Figure 15. Dropout Voltage vs. Output Current
Figure 16. Ripple Rejection vs. Frequency
90
Iout = 1 mA
Iout = 50 mA
50
40
30
0
0.1
60
FREQUENCY, f (kHz)
60 Iout = 30 mA
10
70
OUTPUT CURRENT Iout (mA)
70
20
Iout = 1 mA
0
0.1
150
RIPPLE REJECTION, RR (dB)
0.00
0
RIPPLE REJECTION, RR (dB)
RIPPLE REJECTION, RR (dB)
0.40
Vin = 2.5 Vdc + 0.5 Vp−p
Cout = Ceramic 2.2 mF
Vout = 1.5 V
10
1
Iout = 1 mA
80
70
Iout = 30 mA
60
50
40
30
20
Vin = 3.8 Vdc + 0.5 Vp−p
Cout = Ceramic 0.47 mF
10
0
0.1
100
Iout = 50 mA
1
Vout = 2.8 V
10
FREQUENCY, f (kHz)
FREQUENCY, f (kHz)
Figure 17. Ripple Rejection vs. Frequency
Figure 18. Ripple Rejection vs. Frequency
90
RIPPLE REJECTION, RR (dB)
DROPOUT VOLTAGE, VDO (V)
TYPICAL CHARACTERISTICS
Iout = 1 mA
80
70
60
Iout = 30 mA
Iout = 50 mA
50
40
30
20
10
0
0.1
Vin = 3.8 Vdc + 0.5 Vp−p
Cout = Ceramic 1.0 mF
Vout = 2.8 V
10
1
FREQUENCY, f (kHz)
Figure 19. Ripple Rejection vs. Frequency
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5
100
100
NCP582
TYPICAL CHARACTERISTICS
Vout = 1.5 V
OUTPUT VOLTAGE, Vout (V)
1.54
Input Voltage
3
1.53
2
1.52
1
1.51
0
Output Voltage
1.50
1.49
0
10
20
30
40
50
60
70
80
90
INPUT VOLTAGE, Vin (V)
4
1.55
100
TIME, t (ms)
Vout = 2.8 V
6
2.84
5
Input Voltage
2.83
4
3
2.82
2
2.81
Output Voltage
1
2.80
2.79
0
10
20
30
50
40
60
70
80
90
TIME, t (ms)
Figure 20. Input Transient Response
(Iout = 30 mA, Cin = 0, tr = tf = 5.0 ms, Cout = 0.47 mF)
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6
0
100
INPUT VOLTAGE, Vin (V)
OUTPUT VOLTAGE, Vout (V)
2.85
NCP582
TYPICAL CHARACTERISTICS
150
1.70
100
OUTPUT VOLTAGE, Vout (V)
1.75
Output Current
1.65
50
1.60
0
1.55
Output Voltage
1.50
1.45
0
2
4
6
8
10
12
14
16
18
OUTPUT CURRENT, Iout (mA)
(Vin = 2.5 V, Cout = 1.0 mF, Vout = 1.5 V)
20
TIME, t (ms)
150
1.70
100
OUTPUT VOLTAGE, Vout (V)
1.75
Output Current
1.65
50
1.60
0
1.55
Output Voltage
1.50
1.45
0
2
4
6
8
10
12
14
TIME, t (ms)
Figure 21. Load Transient Response
(tr = tf = 0.5 ms, Cin = 1.0 mF)
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7
16
18
20
OUTPUT CURRENT, Iout (mA)
(Vin = 2.5 V, Cout = 2.2 mF, Vout = 1.5 V)
NCP582
TYPICAL CHARACTERISTICS
3.00
100
OUTPUT VOLTAGE, Vout (V)
150
Output Current
2.95
50
2.90
0
2.85
Output Voltage
2.80
2.75
0
2
4
6
8
10
12
14
16
18
OUTPUT CURRENT, Iout (mA)
(Vin = 3.8 V, Cout = 0.47 mF, Vout = 2.8 V)
3.05
20
TIME, t (ms)
3.00
100
OUTPUT VOLTAGE, Vout (V)
150
Output Current
2.95
50
2.90
0
2.85
Output Voltage
2.80
2.75
0
2
4
6
8
10
12
14
16
18
OUTPUT CURRENT, Iout (mA)
(Vin = 3.8 V, Cout = 1.0 mF, Vout = 2.8 V)
3.05
20
TIME, t (ms)
(Vin = 3.8 V, Cout = 2.2 mF, Vout = 2.8 V)
150
3.00
OUTPUT VOLTAGE, Vout (V)
100
Output Current
2.95
50
2.90
0
2.85
Output Voltage
2.80
2.75
0
2
4
6
8
10
12
14
TIME, t (ms)
Figure 22. Load Transient Response
(tr = tf = 0.5 ms, Cin = 1.0 mF)
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8
16
18
20
OUTPUT CURRENT, Iout (mA)
3.05
6
4
6
3
5
3
5
2
4
Vin
1
3
Iout = 0 mA
0
2
Iout = 30 mA
1
0
Iout = 150 mA
−5
0
5
10
15
20
2
4
Vin
1
3
Iout = 0 mA
0
2
Iout = 30 mA
1
0
OUTPUT VOLTAGE, Vout (V)
4
OUTPUT VOLTAGE, Vout (V)
CE INPUT VOLTAGE, VCE (V)
CE INPUT VOLTAGE, VCE (V)
NCP582
Iout = 150 mA
−2
25
−50
0
50
100 150 200 250 300 350 400 450
TIME, t (ms)
TIME, t (ms)
8
4
3
7
3
Vin
2
6
5
1
−1
4
Iout = 0 mA
0
3
Iout = 30 mA
2
1
Iout = 150 mA
−5
0
5
10
15
0
20
8
7
Vin
2
6
1
5
0
4
−1
3
Iout = 0 mA
Iout = 30 mA
1
0
Iout = 150 mA
25
−20
0
20
40
60
80
100 120 140 160 180
TIME, t (ms)
TIME, t (ms)
Figure 24. Turn−On/Off Speed with CE Pin (D Version)
(Vout = 2.8 V, Vin = 3.8 V, Cin = 0.47 mF, Cout = 0.47 mF)
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9
2
OUTPUT VOLTAGE, Vout (V)
4
OUTPUT VOLTAGE, Vout (V)
CE INPUT VOLTAGE, VCE (V)
CE INPUT VOLTAGE, VCE (V)
Figure 23. Turn−On/Off Speed with CE Pin (D Version)
(Vout = 1.5 V, Vin = 2.5 V, Cin = 1.0 mF, Cout = 1.0 mF)
NCP582
APPLICATION INFORMATION
Input Decoupling
performance, select a capacitor with low Equivalent Series
Resistance (ESR). For PCB layout considerations, place
the output capacitor close to the output pin and keep the
leads as short as possible.
A 1.0 mF ceramic capacitor is the recommended value to
be connected between Vin and GND. For PCB layout
considerations, the traces of Vin and GND should be
sufficiently wide in order to minimize noise and prevent
unstable operation.
Noise Decoupling
The NCP582 series are low noise regulators and reach a
noise level of only 30 mVrms between 10 Hz and 100 kHz.
Output Decoupling
It is best to use a 1.0 mF capacitor value when Vout
t2.5 V and a 0.47 mF when Vout w 2.5 V. For better
ORDERING INFORMATION
Output Type / Features
Nominal
Output
Voltage
Marking
Package
Shipping†
NCP582DSQ15T1G
Active High w/Auto Discharge
1.5
SF
SC−82AB (Pb−Free)
3000 Tape & Reel
NCP582DSQ18T1G
Active High w/Auto Discharge
1.8
SJ
SC−82AB (Pb−Free)
3000 Tape & Reel
NCP582DSQ25T1G
Active High w/Auto Discharge
2.5
TF
SC−82AB (Pb−Free)
3000 Tape & Reel
NCP582DSQ28T1G
Active High w/Auto Discharge
2.8
TJ
SC−82AB (Pb−Free)
3000 Tape & Reel
NCP582DSQ30T1G
Active High w/Auto Discharge
3.0
UA
SC−82AB (Pb−Free)
3000 Tape & Reel
NCP582DSQ33T1G
Active High w/Auto Discharge
3.3
UD
SC−82AB (Pb−Free)
3000 Tape & Reel
NCP582LSQ15T1G
Active Low
1.5
JF
SC−82AB (Pb−Free)
3000 Tape & Reel
NCP582LSQ18T1G
Active Low
1.8
JJ
SC−82AB (Pb−Free)
3000 Tape & Reel
NCP582LSQ25T1G
Active Low
2.5
KF
SC−82AB (Pb−Free)
3000 Tape & Reel
NCP582LSQ28T1G
Active Low
2.8
KJ
SC−82AB (Pb−Free)
3000 Tape & Reel
NCP582LSQ30T1G
Active Low
3.0
LA
SC−82AB (Pb−Free)
3000 Tape & Reel
NCP582LSQ33T1G
Active Low
3.3
LD
SC−82AB (Pb−Free)
3000 Tape & Reel
NCP582DXV15T2G
Active High w/Auto Discharge
1.5
F15D
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582DXV18T2G
Active High w/Auto Discharge
1.8
F18D
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582DXV25T2G
Active High w/Auto Discharge
2.5
F25D
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582DXV28T2G
Active High w/Auto Discharge
2.8
F28D
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582DXV29T2G
Active High w/Auto Discharge
2.9
F29D
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582DXV30T2G
Active High w/Auto Discharge
3.0
F30D
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582DXV33T2G
Active High w/Auto Discharge
3.3
F33D
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582LXV15T2G
Active Low
1.5
F15A
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582LXV18T2G
Active Low
1.8
F18A
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582LXV25T2G
Active Low
2.5
F25A
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582LXV28T2G
Active Low
2.8
F28A
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582LXV29T2G
Active Low
2.9
F29A
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582LXV30T2G
Active Low
3.0
F30A
SOT−563 (Pb−Free)
4000 Tape & Reel
NCP582LXV33T2G
Active Low
3.3
F33A
SOT−563 (Pb−Free)
4000 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Other voltages are available. Consult your ON Semiconductor representative.
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10
NCP582
PACKAGE DIMENSIONS
SOT−563
XV SUFFIX
CASE 463A−01
ISSUE F
D
−X−
6
5
1
e
2
A
4
E
−Y−
3
b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
L
DIM
A
b
C
D
E
e
L
HE
HE
C
5 PL
6
0.08 (0.003)
M
X Y
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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11
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
NCP582
PACKAGE DIMENSIONS
SC−82AB
SQ SUFFIX
CASE 419C−02
ISSUE E
A
G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. 419C−01 OBSOLETE. NEW STANDARD IS
419C−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
C
D 3 PL
N
4
3
K
B
S
1
DIM
A
B
C
D
F
G
H
J
K
L
N
S
2
F
L
H
J
0.05 (0.002)
MILLIMETERS
MIN
MAX
1.8
2.2
1.15
1.35
0.8
1.1
0.2
0.4
0.3
0.5
1.1
1.5
0.0
0.1
0.10
0.26
0.1
−−−
0.05 BSC
0.2 REF
1.8
2.4
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.008
0.016
0.012
0.020
0.043
0.059
0.000
0.004
0.004
0.010
0.004
−−−
0.002 BSC
0.008 REF
0.07
0.09
SOLDERING FOOTPRINT*
1.30
0.0512
0.65
0.026
1.90
0.95 0.075
0.037
0.90
0.035
0.70
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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