Surface Mount Relay G6H–2F Low Profile, Miniature, Surface Mount Relay Ultra low profile only 5.2mm. Can be soldered by VPS or IRS methods. Impulse withstand voltage meets FCC and CCITT rules. Low power consumption, 140mW. Available on tape for automatic insertion. Ordering Information Classification Single-side stable DPDT Fully sealed G6H-2F Note: 1. When ordering, add the rated coil voltage to the model number. Example: G6H-2F 12 VDC Rated coil voltage 2. When ordering tape packing, add ‘TR’ to the model number. Example: G6H-2F TR 12 VDC Tape packing 3. ‘TR’is not part of the relay model number, it is not marked on the relay case. Model Number Legend: G6H–2F 2 1 1. Taped Version TR: Taped right TL: Taped left 2. Rated Coil Voltage 5, 12, 24 VDC Specifications Coil Ratings Single-side Stable Types Rated voltage 5 VDC 12 VDC 24 VDC Rated current 28.1 mA 11.7 mA 8.3 mA Coil resistance 178 Ω 1,028 Ω 2,880 Ω Coil inductance Armature OFF 0.065 0.43 1.2 (H) (ref. value) Armature ON 0.058 0.37 1.0 Must operate voltage 75% max. of rated voltage Must release voltage 10% min. of rated voltage Max. voltage 200% of rated voltage at 23_C, 150% at 70_C 170% of rated voltage at 23_C, 130% at 70_C Power consumption Approx. 140 mW Approx. 200 mW Note: 1. The rated current and coil resistance are measured at a coil temperature of 23_C with a tolerance of ±10%. 2. Operating characteristics are measured at a coil temperature of 23_C. Contact Ratings Load Resistive load (cos∅ = 1) Rated load 0.5 A at 125 VAC; 1 A at 30 VDC Contact material Ag (Au-clad) Rated carry current 1A Max. switching voltage 125 VAC, 110 VDC Max. switching current 1A Max. switching capacity 62.5 VA, 33 W Min. permissible load 10 µA at 10 mVDC Note: P level: λ60 = 0.1 x 10-6/operation Characteristics Contact resistance 60 mΩ max. Operate (set) time 3 ms max. (mean value: approx. 2 ms) Release (reset) time 2 ms max. (mean value: approx. 1 ms) Bounce time Operate: 0.5 ms max. Release: 0.5 ms max. Max. operating frequency Mechanical: 36,000 operations/hr Electrical: 1,800 operations/hr (under rated load) Insulation resistance 1,000 MΩ min. (at 500 VDC) Dielectric withstand voltage 1,000 VAC, 50/60 Hz for 1 min between coil and contacts 1,000 VAC, 50/60 Hz for 1 min between contacts of different polarity 750 VAC, 50/60 Hz for 1 min between contacts of same polarity Impulse withstand voltage 1,500 V 10 x 160 µs between contacts of same polarity (conforms to FCC Part 68) Vibration resistance Destruction: 10 to 55 Hz, 5-mm double amplitude Malfunction: 10 to 55 Hz, 3-mm double amplitude Shock resistance Destruction: 1,000 m/s2 (approx. 100G) Malfunction: 500 m/s2 (approx. 50G) Life expectancy Mechanical: 100,000,000 operations min. (at 36,000 operations/hr) Electrical: 200,000 operations min. (0.1 A at 110 VAC inductive load) Ambient temperature Operating: –40_C to 85_C (with no icing) Ambient humidity Operating: 35% to 85% Weight Approx. 1.5 g Note: The data shown above are initial values. Approved by Standards UL114, UL478 (File No. E41515)/CSA C22.2 No. 0, No. 14 (File No. LR24825) Model Contac tform G6H–2F Contac tform DPDT Contact form 3 to 48 VDC 1A, 30 VDC 0.3A, 100 VDC 0.5A, 125 VDC Engineering Data AC resistive load DC resistive load Life Expectancy Life expectancy (x103 operations) Switching current (A) Max. Switching Capacity 10,000 7,000 5,000 3,000 30-VDC resistive load 1,000 700 500 300 125-VAC resistive load 100 Switching voltage (V) Switching current (A) Dimensions 0.3 Note: Orientation marks are as follows: 2.54 1 2.94 14 9 Glue Pads 5.2 0.2 6.5 2 0.25 9.56 0.5 2.54 7.62 11.5 14 Precautions Surface Temperature of PC Board VS. Recommended Soldering Time 2. IRS 215_C max. Soldering 215 180 to 200 Air cooling Preheating Temperature (_ C) Temperature (_ C) 1. VPS 220 to 240 Soldering Air cooling 180 to 200 Preheating 150 90 to 100 90 to 120 90 to 120 40 to 60 20 to 30 Time (s) Time (s) 3. Other Considerations • Soldering iron heat Temperature at tip: 280_C to 300_C Power: 30 W to 60 W Heating time: 3 s to 5 s • Glue pads When soldering with a pulse heater, hot air, or laser, take into account such factors as heat stress, and test the process under actual conditions. Mounting • Can be mounted in any orientation. • Not suitable for socket mounting. • Do not reverse the coil polarity. • The diagram below the minimum spacing necessary when mounting more than one relay on a printed circuit board. Surface Mounting Terminals Glue Pads Glue pads are projections from the relay case where adhesive is applied to temporarily attach the relay to the printed circuit board before soldering. The soldering points are where solder is applied during soldering. • 2,54 mm min. Terminals L Terminals (G6H–2F) Glue pads are for use with epoxy or UV adhesives. Glue pads are located on the sides to allow UV illumination and adhesive curing. Two points are provided for stability. Orientation Marks These marks are provided to properly position the relays when they are supplied to the printed circuit board automatically. Two types of orientation marks are provided. • Mechanical: A U-shaped impression along the top edge is used for alignment. • Optical: A dark mark on the top surface is used for alignment. Cleaning Methods Characteristics • Soldering methods IRS (Infrared radiation furnace) VPS (Vapor phase) • Removal and replacement is simple. Brushing Dipping Fine as long as the detergent has no chemical or electrical affect on the relay. Spraying Vapor Hot water Ultrasonic Fine as long as the detergent has no chemical or electrical affect on the relay. The model number of the ultrasound cleaning-type relay ends in “-U”. Tape Packing • Taping method Tape type: TE2416R (or L) Reel type: R53 There are 500 relays per reel. Relay orientation: Direction G6H–2F–TL Direction G6H-2F-TR 29.5 Dimensions Cover tape ∅330 Carrier tape emboss tape 0.38 ±0.05 1.55 dia. 1.75 4 2 0.3 11.5 24 14.5±0.1 R0.3 max. (10.75) 16 1.5 dia. min. 4 12.1 0.3 6.9±0.1