LMH0344 www.ti.com SNLS233L – APRIL 2007 – REVISED APRIL 2013 3 Gbps HD/SD SDI Adaptive Cable Equalizer Check for Samples: LMH0344 FEATURES DESCRIPTION • The LMH0344 3 Gbps HD/SD SDI Adaptive Cable Equalizer is designed to equalize data transmitted over cable (or any media with similar dispersive loss characteristics). The equalizer operates over a wide range of data rates from 125 Mbps to 2.97 Gbps and supports SMPTE 424M, SMPTE 292M, SMPTE 344M, and SMPTE 259M. 1 2 • • • • • • • • • • • • • • SMPTE 424M, SMPTE 292M, SMPTE 344M, and SMPTE 259M Compliant Supports DVB-ASI at 270 Mbps Wide Range of Data Rates: 125 Mbps to 2.97 Gbps Equalizes up to 120 Meters of Belden 1694A at 2.97 Gbps, up to 140 Meters of Belden 1694A at 1.485 Gbps, or up to 400 Meters of Belden 1694A at 270 Mbps Equalizes 0-120m of Belden 1694A at 2.97 Gbps With 0.3 UI Maximum Output Jitter Manual Bypass and Output Mute With a Programmable Threshold Single-Ended or Differential Input 50Ω Differential Outputs (Internal 50Ω Pullups) Single 3.3V Supply Operation 280 mW Typical Power Consumption 16-Pin WQFN or 25-Ball CS-BGA Package Industrial Temperature Range: −40°C to +85°C HBM ESD Rating: 8 kV WQFN Version Footprint Compatible With the LMH0044 and LMH0074 Replaces the Gennum GS2974A or GS2974B The LMH0344 implements DC restoration to correctly handle pathological data conditions. The equalizer may be driven in either a single ended or differential configuration. Additional features include separate carrier detect and output mute pins which may be tied together to mute the output when no signal is present. A programmable mute reference is provided to mute the output at a selectable level of signal degradation. For applications which use the RGBα data patterns, the LMH0394 cable equalizer will provide better performance. The device is available in two space–saving packages: a 4 X 4 mm 16-pin WQFN and even more space-efficient 3 x 3 mm 25-ball CS-BGA package. APPLICATIONS • • • SMPTE 424M, SMPTE 292M, SMPTE 344M, and SMPTE 259M Serial Digital Interfaces Serial Digital Data Equalization and Reception Data Recovery Equalization 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007–2013, Texas Instruments Incorporated LMH0344 SNLS233L – APRIL 2007 – REVISED APRIL 2013 www.ti.com Typical Application LMH0344 3G SDI Adaptive Cable Equalizer Coaxial Cable 75: 1.0 PF SDO SDI SDI 3.9 nH LMH0341 3G SDI Deserializer RXIN0 RXIN0 TXOUT TXOUT Reclocked Loopthrough SDO 1.0 PF MUTE 75: RX[4:0] MUTEREF 37.4: CD 5-bit LVDS + clk AEC- AEC+ BYPASS To FPGA RXCLK MUTE MUTEREF 1.0 PF BYPASS CD These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Supply Voltage 4.0V −0.3V to VCC+0.3V Input Voltage (all inputs) −65°C to +150°C Storage Temperature Range Junction Temperature +125°C Lead Temperature +260°C (Soldering 4 Sec) Package Thermal Resistance θJA 16-pin WQFN +40°C/W θJC 16-pin WQFN +4.5°C/W θJA 25-ball CS-BGA ESD Rating 8 kV MM 400V CDM (1) +58.1°C/W HBM 2 kV Absolute Maximum Ratings are those parameter values beyond which the life and operation of the device cannot be ensured. The stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values. The table of Electrical Characteristics specifies acceptable device operating conditions. Recommended Operating Conditions Supply Voltage (VCC – VEE) 3.3V ±5% Input Coupling Capacitance 1.0 µF AEC Capacitor (Connected between AEC+ and AEC-) 1.0 µF −40°C to +85°C Operating Free Air Temperature (TA) 2 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0344 LMH0344 www.ti.com SNLS233L – APRIL 2007 – REVISED APRIL 2013 DC Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Symbol Parameter VCMIN Input Common Mode Voltage VSDI Input Voltage Swing VCMOUT Output Common Mode Voltage VSDO Output Voltage Swing Conditions (1) (2) . Reference Min Typ 720 800 SDI, SDI At LMH0344 input (3) SDO, SDO mVP−P 750 mVP-P 1.3 V 0.6 V MUTEREF CD V V 100Ω load, differential Carrier not present 950 VCC – VSDO/2 MUTEREF Range CD Output Voltage Units 1.9 (4) MUTEREF DC Voltage (floating) Max 2.4 V Carrier present MUTE Input Voltage Min to mute outputs 0.4 MUTE V Max to force outputs active ICC (1) (2) (3) (4) V 2.0 Supply Current 85 0.8 V 100 mA Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated referenced to VEE = 0 Volts. Typical values are stated for VCC = +3.3V and TA = +25°C. Specification is ensured by characterization. This specification is for 0m cable only. AC Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Symbol Parameter BRMIN Minimum Input Data Rate BRMax Maximum Input Data Rate Conditions Reference (1) . Min SDI, SDI Typ Jitter for Various Cable Lengths 270 Mbps, Belden 1694A, 0-400 meters (2) 270 Mbps, Belden 1694A, 0-400 meters (3) Mbps 0.2 UI UI 0.08 2.97 Gbps, Belden 1694A, 0-120 meters (2) 0.18 SDO, SDO UI UI 0.3 2.97 Gbps, Belden 1694A, 0-120 meters (3) 20% – 80% (4) Mbps 2970 0.25 1.485 Gbps, Belden 1694A, 0-140 meters (3) Output Rise Time, Fall Time Units 0.07 1.485 Gbps, Belden 1694A, 0-140 meters (2) tr,tf Max 125 UI UI 60 130 ps Mismatch in Rise/Fall Time (4) 2 15 ps tOS Output Overshoot (4) 1 5 % ROUT Output Resistance single-ended RLIN Input Return Loss 5 MHz - 1.5 GHz (5) 50 SDI, SDI 1.5 GHz - 3.0 GHz (5) Ω 15 dB 10 dB RIN Input Resistance single-ended 1.3 kΩ CIN Input Capacitance single-ended 1 pF (1) (2) (3) (4) (5) Typical values are stated for VCC = +3.3V and TA = +25°C. Based on characterization data over the full range of recommended operating conditions of the device. Jitter is measured in accordance with SMPTE RP 184, SMPTE RP 192, and the applicable serial data transmission standard: SMPTE 424M, SMPTE 292M, or SMPTE 259M. Measured with Pseudo Matrix Pathological test signal. Specification is ensured by characterization. Input return loss is dependent on board design. The LMH0344 exceeds this specification on the SD344 evaluation board with a return loss network consisting of an 8.2 nH inductor in parallel with a 0.5 pF capacitor in parallel with the 75Ω series resistor on the input. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0344 3 LMH0344 SNLS233L – APRIL 2007 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics Figure 1. After Equalization: 120m of Belden 1694A with 2.97 Gbps PRBS 4 Figure 2. After Equalization: 120m of Belden 1694A with 2.97 Gbps Pseudo Matrix Pathological Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0344 LMH0344 www.ti.com SNLS233L – APRIL 2007 – REVISED APRIL 2013 2 SDI 3 VEE 4 CD MUTE VCC 14 13 LMH0344SQ (top view) AEC+ 5 6 7 8 MUTEREF SDI 15 BYPASS 1 16 AEC- VEE VCC CONNECTION DIAGRAM 12 VEE 11 SDO 10 SDO 9 VEE The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative power supply voltage. Figure 3. 16-Pin WQFN See Package Number RUM A B C D E 1 2 3 4 5 VCC CD VCC VCC NC A1 A2 A3 A4 A5 VEE VCC MUTE VEE NC B1 B2 B3 B4 B5 SDI NC NC NC SDO C1 C2 C3 C4 C5 SDI VEE BYPASS NC SDO D1 D2 D3 D4 D5 NC AEC+ AEC- MUTEREF VEE E1 E2 E3 E4 E5 LMH0344GR (top view) Figure 4. 25-Ball CS-BGA See Package Number NYA Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0344 5 LMH0344 SNLS233L – APRIL 2007 – REVISED APRIL 2013 www.ti.com PIN DESCRIPTIONS WQFN Pin CS-BGA Ball Name Description 2 C1 SDI Serial data true input. 3 D1 SDI Serial data complement input. 5 E2 AEC+ AEC loop filter external capacitor (1µF) positive connection. 6 E3 AEC- AEC loop filter external capacitor (1µF) negative connection. 7 D3 BYPASS Bypasses equalization and DC restoration when high. No equalization occurs in this mode. 8 E4 MUTEREF Mute reference. Sets the threshold for CD and (with CD tied to MUTE) determines the maximum cable to be equalized before muting. MUTEREF may be either unconnected or connected to ground for maximum equalization. 10 D5 SDO Serial data complement output. 11 C5 SDO Serial data true output. 14 B3 MUTE Output mute. To disable the mute function and enable the output, MUTE must be tied to GND or a low level signal. To force the outputs to a muted state, tie to VCC. CD may be tied to this pin to inhibit the output when no input signal is present. MUTE has no function in BYPASS mode. 15 A2 CD Carrier detect. CD is high when no signal is present. CD has no function in BYPASS mode. 13, 16 A1, A3, A4, B2 VCC Positive power supply (+3.3V). DAP, 1, 4, 9, 12 B1, B4, D2, E5 VEE Negative power supply (ground). — A5, B5, C2, NC C3, C4, D4, E1 No connect. BLOCK DIAGRAM BYPASS Output Driver SDI SDI DC Restoration/ Level Control Equalizer Filter Energy Detect SDO SDO Energy Detect 6 Automatic Equalization Control Carrier Detect/ Mute CD MUTE MUTEREF AEC+ 6 AEC- Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0344 LMH0344 www.ti.com SNLS233L – APRIL 2007 – REVISED APRIL 2013 DEVICE OPERATION BLOCK DESCRIPTION The Equalizer Filter block is a multi-stage adaptive filter. If Bypass is high, the equalizer filter is disabled. The DC Restoration / Level Control block receives the differential signals from the equalizer filter block. This block incorporates a self-biasing DC restoration circuit to fully DC restore the signals. If Bypass is high, this function is disabled. The signals before and after the DC Restoration / Level Control block are used to generate the Automatic Equalization Control (AEC) signal. This control signal sets the gain and bandwidth of the equalizer filter. The loop response in the AEC block is controlled by an external 1µF capacitor placed across the AEC+ and AECpins. The Carrier Detect / Mute block generates the carrier detect signal and controls the mute function of the output. This block utilizes the CD and MUTE signals along with Mute Reference (MUTEREF). The Output Driver produces SDO and SDO. MUTE REFERENCE (MUTEREF) The mute reference sets the threshold for CD and (with CD tied to MUTE) determines the amount of cable to equalize before automatically muting the outputs. This is set by applying a voltage inversely proportional to the length of cable to equalize. The applied voltage must be greater than the MUTEREF floating voltage (typically 1.3V) in order to change the CD threshold. As the applied MUTEREF voltage is increased, the amount of cable that can be equalized before carrier detect is de-asserted and the outputs are muted is decreased. MUTEREF may be left unconnected or connected to ground for maximum equalization before muting. CARRIER DETECT (CD) AND MUTE Carrier detect CD indicates if a valid signal is present at the LMH0344 input. If MUTEREF is used, the carrier detect threshold will be altered accordingly. CD provides a high voltage when no signal is present at the LMH0344 input. CD is low when a valid input signal is detected. MUTE can be used to manually mute or enable SDO and SDO. Applying a high input to MUTE will mute the LMH0344 outputs by forcing the output to a logic zero. Applying a low input will force the outputs to be active. CD and MUTE may be tied together to automatically mute the output when no input signal is present. INPUT INTERFACING The LMH0344 accepts either differential or single-ended input. The input must be AC coupled. Transformer coupling is not supported. The LMH0344 correctly handles equalizer pathological signals for standard definition and high definition serial digital video, as described in SMPTE RP 178 and RP 198, respectively. OUTPUT INTERFACING The SDO and SDO outputs are internally loaded with 50Ω. They produce a 750 mVP-P differential output, or a 375 mVP-P single-ended output. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0344 7 LMH0344 SNLS233L – APRIL 2007 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision K (April 2013) to Revision L • 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0344 PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LMH0344GR/NOPB ACTIVE csBGA NYA 25 1000 Green (RoHS & no Sb/Br) CU SNAGCU Level-1-260C-UNLIM -40 to 85 344G LMH0344GRE/NOPB ACTIVE csBGA NYA 25 250 Green (RoHS & no Sb/Br) CU SNAGCU Level-1-260C-UNLIM -40 to 85 344G LMH0344GRX/NOPB ACTIVE csBGA NYA 25 3500 Green (RoHS & no Sb/Br) CU SNAGCU Level-1-260C-UNLIM -40 to 85 344G LMH0344SQ/NOPB ACTIVE WQFN RUM 16 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L0344 LMH0344SQE/NOPB ACTIVE WQFN RUM 16 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L0344 LMH0344SQX/NOPB ACTIVE WQFN RUM 16 4500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L0344 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing LMH0344GR/NOPB csBGA NYA 25 LMH0344GRE/NOPB csBGA NYA LMH0344GRX/NOPB csBGA NYA LMH0344SQ/NOPB WQFN LMH0344SQE/NOPB LMH0344SQX/NOPB SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1000 178.0 12.4 3.3 3.3 1.6 8.0 12.0 Q1 25 250 178.0 12.4 3.3 3.3 1.6 8.0 12.0 Q1 25 3500 330.0 12.4 3.3 3.3 1.6 8.0 12.0 Q1 RUM 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 WQFN RUM 16 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 WQFN RUM 16 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMH0344GR/NOPB csBGA NYA 25 1000 210.0 185.0 35.0 LMH0344GRE/NOPB csBGA NYA 25 250 210.0 185.0 35.0 LMH0344GRX/NOPB csBGA NYA 25 3500 367.0 367.0 35.0 LMH0344SQ/NOPB WQFN RUM 16 1000 210.0 185.0 35.0 LMH0344SQE/NOPB WQFN RUM 16 250 210.0 185.0 35.0 LMH0344SQX/NOPB WQFN RUM 16 4500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NYA0025A GRA25A (Rev A) www.ti.com MECHANICAL DATA RUM0016A SQB16A (Rev A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated