Foshan BZT52C36S Zener diode in a sod-323 plastic package. Datasheet

BZT52CXXXS
Rev.F Mar.-2015
描述
/
DATA SHEET
Descriptions
SOD-323 塑封封装 稳压二极管。
Zener Diode in a SOD-323 Plastic Package.
特征
/ Features
200mW 功耗，中等电流，自动贴片组装。
200mW Power dissipation, medium current, automated assembly processes.
用途
/
Applications
适用于 2.4V-39V 的宽范围稳压电路。
2.4V to 39V wide zener voltage range applications.
内部等效电路
引脚排列
/ Equivalent Circuit
/ Pinning
1
2
PIN1:Cathode
放大及印章代码
PIN2:Anode
/ hFE Classifications & Marking
见电性能参数。See Electrical Characteristics.
http://www.fsbrec.com
1/7
BZT52CXXXS
Rev.F Mar.-2015
极限参数
/
DATA SHEET
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
符号
Symbol
数值
Rating
单位
Unit
Forward Voltage (Note 2) ( IF=10mA)
VF
0.9
V
Power Dissipation(Note 1)
PD
200
mW
RθJA
625
℃/W
Tj,Tstg
-65～150
℃
Typical Thermal Resistance Junction to
Ambient(Note 1)
Junction and Storage Temperature
Range
电性能参数
Type Number
/ Electrical Characteristics(Ta=25℃)
Mark
-ing
Code
Zener Voltage Range
(Note 2)
Vz @IZT
IZT
Nom
(V)
Min
(V)
Max
(V)
mA
Maximum Zener
mpedance (Note 3)
Maximum
Reverse
Current
(Note 2)
ZZT
@IZT
IZK
IR
@VR
mA
uA
V
Min
Max
mA
ZZK
@IZK
Ω
Typical
Temperature
Coefficient
@IZTC
mV/ºC
Test
Curre
nt IZTC
BZT52C2V4S
HWX
2.4
2.2
2.6
5
100
600
1
50
1
-3.5
0
5
BZT52C2V7S
HW1
2.7
2.5
2.9
5
100
600
1
20
1
-3.5
0
5
BZT52C3V0S
HW2
3.0
2.8
3.2
5
95
600
1
10
1
-3.5
0
5
BZT52C3V3S
HW3
3.3
3.1
3.5
5
95
600
1
5
1
-3.5
0
5
BZT52C3V6S
HW4
3.6
3.4
3.8
5
90
600
1
5
1
-3.5
0
5
BZT52C3V9S
HW5
3.9
3.7
4.1
5
90
600
1
3
1
-3.5
0
5
BZT52C4V3S
HW6
4.3
4
4.6
5
90
600
1
3
1
-3.5
0
5
BZT52C4V7S
HW7
4.7
4.4
5
5
80
500
1
3
2
-3.5
0.2
5
BZT52C5V1S
HW8
5.1
4.8
5.4
5
60
480
1
2
2
-2.7
1.2
5
BZT52C5V6S
HW9
5.6
5.2
6
5
40
400
1
1
2
-2
2.5
5
BZT52C6V2S
HWA
6.2
5.8
6.6
5
10
150
1
3
4
0.4
3.7
5
BZT52C6V8S
HWB
6.8
6.4
7.2
5
15
80
1
2
4
1.2
4.5
5
BZT52C7V5S
HWC
7.5
7
7.9
5
15
80
1
1
5
2.5
5.3
5
BZT52C8V2S
HWD
8.2
7.7
8.7
5
15
80
1
0.7
5
3.2
6.2
5
BZT52C9V1S
HWE
9.1
8.5
9.6
5
15
100
1
0.5
6
3.8
7
5
BZT52C10S
HWF
10
9.4
10.6
5
20
150
1
0.2
7
4.5
8
5
http://www.fsbrec.com
2/7
BZT52CXXXS
Rev.F Mar.-2015
电性能参数
DATA SHEET
/ Electrical Characteristics(Ta=25℃)
Zener Voltage Range
(Note 2)
Type
Number
Marking
Code
Vz @IZT
IZT
Nom
(V)
Min
(V)
Max
(V)
mA
Maximum Zener
mpedance (Note 3)
Maximum
Reverse
Current
(Note 2)
ZZT
@IZT
IZK
IR
@VR
mA
uA
V
Min
Max
mA
ZZK
@IZK
Ω
Typical
Temperature
Coefficient
@IZTC
mV/ºC
Test
Curre
nt IZTC
BZT52C11S
HWG
11
10.4
11.6
5
20
150
1
0.1
8
5.4
9
5
BZT52C12S
HWH
12
11.4
12.7
5
25
150
1
0.1
8
6
10
5
BZT52C13S
HWI
13
12.4
14.1
5
30
170
1
0.1
8
7
11
5
BZT52C15S
HWJ
15
13.8
15.6
5
30
200
1
0.1
10.5
9.2
13
5
BZT52C16S
HWK
16
15.3
17.1
5
40
200
1
0.1
11.2
10.4
14
5
BZT52C18S
HWL
18
16.8
19.1
5
45
225
1
0.1
12.6
12.4
16
5
BZT52C20S
HWM
20
18.8
21.2
5
55
225
1
0.1
14
14.4
18
5
BZT52C22S
HWN
22
20.8
23.3
5
55
250
1
0.1
15.4
16.4
20
5
BZT52C24S
HWO
24
22.8
25.6
5
70
250
1
0.1
16.8
18.4
22
5
BZT52C27S
HWP
27
25.1
28.9
2
80
300
0.5
0.1
18.9
21.4
25.3
2
BZT52C30S
HWQ
30
28
32
2
80
300
0.5
0.1
21
24.4
29.4
2
BZT52C33S
HWR
33
31
35
2
80
325
0.5
0.1
23.1
27.4
33.4
2
BZT52C36S
HWS
36
34
38
2
90
350
0.5
0.1
25.2
30.4
37.4
2
BZT52C39S
HWT
39
37
41
2
130
350
0.5
0.1
27.3
33.4
41.2
2
Notes:
1. Part mounted on FR-4 PC board with recommended pad layout, as per
http://www.diodes.com/datasheets/ap02001.pdf..
2. Short duration test pulse used to minimize self-heating effect.
3. f = 1kHz.
http://www.fsbrec.com
3/7
BZT52CXXXS
Rev.F Mar.-2015
电参数曲线图
DATA SHEET
/ Electrical Characteristic Curve
http://www.fsbrec.com
4/7
BZT52CXXXS
Rev.F Mar.-2015
外形尺寸图
DATA SHEET
/ Package Dimensions
http://www.fsbrec.com
5/7
BZT52CXXXS
Rev.F Mar.-2015
印章说明
/
DATA SHEET
Marking Instructions
HWX
说明：
H： 
为公司代码
WX：
为型号代码
Note:
H:
Company Code.
WX:
Product Type.
http://www.fsbrec.com
6/7
BZT52CXXXS
Rev.F Mar.-2015
DATA SHEET
回流焊温度曲线图(无铅)
/
Temperature Profile for IR Reflow Soldering(Pb-Free)
说明：
Note:
1、预热温度 25～150℃，时间 60～90sec;
1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 245±5℃，时间持续为 5±0.5sec;
2.Peak Temp.:245±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2～10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件
/
Resistance to Soldering Heat Test Conditions
温度：260±5℃
包装规格
Time:10±1 sec
/ REEL
Package Type
封装形式
使用说明
Temp.:260±5℃
/ Packaging SPEC.
卷盘包装
SOD-323
时间：10±1 sec.
Units 包装数量
Dimension
包装尺寸
3
(unit：mm )
Units/Reel
只/卷盘
Reels/Inner Box
卷盘/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Reel
Inner Box 盒
Outer Box 箱
3,000
10
30,000
8
240,000
7〞×8
180×120×180
385×257×392
/ Notices
http://www.fsbrec.com
7/7