TI1 LMV339M General-purpose, low-voltage, tiny pack comparator Datasheet

Product
Folder
Sample &
Buy
Tools &
Software
Technical
Documents
Support &
Community
LMV331-N, LMV339-N, LMV393-N
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
LMV33x-N / LMV393-N General-Purpose, Low-Voltage, Tiny Pack Comparators
1 Features
•
•
•
•
•
1
•
•
•
(For 5-V Supply, Typical Unless Otherwise Noted)
Ensured 2.7-V and 5-V Performance
Industrial Temperature Range −40°C to 85°C
Low Supply Current 60 µA/Channel
Input Common Mode Voltage Range Includes
Ground
Low Output Saturation Voltage 200 mV
Propagation Delay 200 ns
Space-Saving 5-Pin SC70 and 5-Pin SOT23
Packages
The LMV393-N is available in 8-pin SOIC and
VSSOP packages. The LMV339-N is available in 14pin SOIC and TSSOP packages.
The LMV331-N/393-N/339-N is the most costeffective solution where space, low voltage, low
power, and price are the primary specification in
circuit design for portable consumer products. They
offer specifications that meet or exceed the familiar
LM393/339 at a fraction of the supply current.
The chips are built with TI's advanced Submicron
Silicon-Gate BiCMOS process. The LMV331-N/393N/339-N have bipolar input and output stages for
improved noise performance.
2 Applications
•
•
•
•
•
Mobile Communications
Notebooks and PDAs
Battery-Powered Electronics
General-Purpose Portable Devices
General-Purpose, Low-Voltage Applications
3 Description
Table 1. Device Information(1)
PART NUMBER
LMV331-N
LMV339-N
LMV393-N
PACKAGE
BODY SIZE (NOM)
SC70 (5)
2.00 mm × 1.25 mm
SOT-23 (5)
2.90 mm × 1.6 mm
SOIC (14)
8.65 mm × 3.91 mm
TSSOP (14)
5.00 mm × 4.40 mm
SOIC (8)
4.90 mm × 3.91 mm
VSSOP (8)
3.00 mm × 3.00 mm
The LMV393-N and LMV339-N are low-voltage (2.7
to 5 V) versions of the dual and quad comparators,
LM393/339, which are specified at 5 to 30 V. The
LMV331-N is the single version, which is available in
space-saving, 5-pin SC70 and 5-pin SOT23
packages. The 5-pin SC70 is approximately half the
size of the 5-pin SOT23.
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Low Supply Current
Fast Response Time
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMV331-N, LMV339-N, LMV393-N
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
4
4
4
4
4
5
5
6
7
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
2.7-V DC Electrical Characteristics...........................
2.7-V AC Electrical Characteristics ...........................
5-V DC Electrical Characteristics..............................
5-V AC Electrical Characteristics ..............................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................... 9
7.4 Device Functional Modes.......................................... 9
8
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Applications ................................................ 16
9 Power Supply Recommendations...................... 21
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Example .................................................... 22
11 Device and Documentation Support ................. 23
11.1
11.2
11.3
11.4
11.5
11.6
Device Support......................................................
Documentation Support ........................................
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
23
23
23
23
23
23
12 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (Feburary 2013) to Revision H
•
2
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Submit Documentation Feedback
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
LMV331-N, LMV339-N, LMV393-N
www.ti.com
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
5 Pin Configuration and Functions
DCK and DBV Package
5-Pin SC70 / SOT23
Top View
D and DGK Package
8-Pin SOIC / VSSOP
Top View
D and PW Package
14-Pin SOIC / TSSOP
Top View
Pin Functions
PIN
NAME
LMV331-N
DVB,DCK
LMV393-N
D,DGK
LMV339-N
PW
TYPE
DESCRIPTION
+IN
1
-
-
I
Noninverting input
+IN A
-
3
5
I
Noninverting input, channel A
+IN B
-
5
7
I
Noninverting input, channel B
+IN C
-
-
9
I
Noninverting input, channel C
+IN D
-
-
11
I
Noninverting input, channel D
-IN
3
-
-
I
Inverting input
-IN A
-
2
4
I
Inverting input, channel A
-IN B
-
6
6
I
Inverting input, channel B
-IN C
-
-
8
I
Inverting input, channel C
-IN D
-
-
10
I
Inverting input, channel D
OUT
4
-
-
O
Output
OUT A
-
1
2
O
Output, channel A
OUT B
-
7
1
O
Output, channel B
OUT C
-
-
14
O
Output, channel C
OUT D
-
-
13
O
Output, channel D
V+
5
8
3
P
Positive (highest) power supply
V-
2
4
12
P
Negative (lowest) power supply
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
Submit Documentation Feedback
3
LMV331-N, LMV339-N, LMV393-N
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN
Differential Input Voltage
MAX
UNIT
±Supply
Voltage
Voltage on any pin (referred to V− pin)
5.5
V
235
°C
150
°C
150
°C
Soldering Information
Infrared or Convection (20 sec)
Junction Temperature
(3)
−65
Storage temperature, Tstg
(1)
(2)
(3)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and
specifications.
The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC board.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±800
Machine model
±120
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
MIN
Supply Voltage
Temperature Range
(1)
(2)
(2)
MAX
UNIT
2.7
5
V
−40
85
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC board.
6.4 Thermal Information
LMV331-N
THERMAL METRIC (1)
RθJA
(1)
Junction-to-ambient thermal resistance
LMV339-N
LMV393-N
DCK
DBV
D
PW
D
DGK
5 PINS
5 PINS
14 PINS
14 PINS
8 PINS
8 PINS
478
265
145
155
190
23
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 2.7-V DC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 2.7V, V− = 0V.
PARAMETER
TEST CONDITIONS
VOS
Input Offset Voltage
TCVOS
Input Offset Voltage Average Drift
(1)
(2)
4
MIN
(1)
At the temperature extremes
TYP
MAX
1.7
7
(2)
5
(1)
UNIT
mV
µV/°C
All limits are ensured by testing or statistical analysis.
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
Submit Documentation Feedback
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
LMV331-N, LMV339-N, LMV393-N
www.ti.com
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
2.7-V DC Electrical Characteristics (continued)
Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 2.7V, V− = 0V.
PARAMETER
IB
TEST CONDITIONS
MIN
(1)
TYP
MAX
10
250
(2)
Input Bias Current
At the temperature extremes
IOS
UNIT
nA
400
Input Offset Current
5
At the temperature extremes
VCM
(1)
50
nA
150
Input Voltage Range
−0.1
V
2.0
V
120
mV
VSAT
Saturation Voltage
ISINK ≤ 1 mA
IO
Output Sink Current
VO ≤ 1.5V
IS
Supply Current
LMV331-N
40
100
µA
LMV393-N
Both Comparators
70
140
µA
140
200
µA
5
23
LMV339-N
All four Comparators
Output Leakage Current
mA
.003
At the temperature extremes
µA
1
6.6 2.7-V AC Electrical Characteristics
TJ = 25°C, V+ = 2.7 V, RL = 5.1 kΩ, V− = 0 V.
PARAMETER
tPHL
Propagation Delay (High to Low)
tPLH
(1)
(2)
TEST CONDITIONS
Propagation Delay (Low to High)
MIN
(1)
TYP
MAX
(2)
(1)
UNIT
Input Overdrive = 10 mV
1000
ns
Input Overdrive = 100 mV
350
ns
Input Overdrive = 10 mV
500
ns
Input Overdrive = 100 mV
400
ns
All limits are ensured by testing or statistical analysis.
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
6.7 5-V DC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 5 V, V− = 0 V.
PARAMETER
VOS
TEST CONDITIONS
MIN
(1)
Input Offset Voltage
TYP
MAX
1.7
7
(2)
At the temperature extremes
TCVOS
Input Offset Voltage Average Drift
IB
Input Bias Current
5
25
2
At the temperature extremes
Input Voltage Range
AV
Voltage Gain
mV
µV/°C
250
nA
400
Input Offset Current
VCM
UNIT
9
At the temperature extremes
IOS
(1)
50
nA
150
−0.1
V
4.2
(1)
(2)
20
50
V
V/mV
All limits are ensured by testing or statistical analysis.
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
Submit Documentation Feedback
5
LMV331-N, LMV339-N, LMV393-N
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
www.ti.com
5-V DC Electrical Characteristics (continued)
Unless otherwise specified, all limits ensured for TJ = 25°C, V+ = 5 V, V− = 0 V.
PARAMETER
Vsat
TEST CONDITIONS
MIN
(1)
ISINK ≤ 4 mA
Saturation Voltage
TYP
MAX
200
400
(2)
At the temperature extremes
(1)
700
IO
Output Sink Current
VO ≤ 1.5V
84
10
IS
Supply Current
LMV331-N
60
120
At the temperature extremes
150
LMV393-N
Both Comparators
100
UNIT
mV
mA
µA
200
µA
At the temperature extremes
250
LMV339-N
All four Comparators
170
300
µA
At the temperature extremes
350
Output Leakage Current
.003
At the temperature extremes
1
µA
6.8 5-V AC Electrical Characteristics
TJ = 25°C, V+ = 5 V, RL = 5.1 kΩ, V− = 0 V.
PARAMETER
TEST CONDITIONS
tPHL
Propagation Delay (High to Low)
tPLH
Propagation Delay (Low to High)
(1)
(2)
6
MIN
(1)
TYP
(2)
MAX
(1)
UNIT
Input Overdrive = 10 mV
600
ns
Input Overdrive = 100 mV
200
ns
Input Overdrive = 10 mV
450
ns
Input Overdrive = 100 mV
300
ns
All limits are ensured by testing or statistical analysis.
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
Submit Documentation Feedback
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
LMV331-N, LMV339-N, LMV393-N
www.ti.com
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
6.9 Typical Characteristics
Unless otherwise specified, VS = +5V, single supply, TA = 25°C
Figure 1. Supply Current vs. Supply Voltage Output High
(LMV331-N)
Figure 2. Supply Current vs. Supply Voltage Output Low
(LMV331-N)
500
-40°C
400
VSAT (mV)
85°C
300
25°C
200
100
0
0
1
2
3
4
5
6
7
8
9
10
ISINK (mA)
Figure 3. Output Voltage vs. Output Current at 5-V Supply
Figure 4. Output Voltage vs. Output Current at 2.7-V Supply
Figure 5. Input Bias Current vs. Supply Voltage
Figure 6. Response Time vs. Input Overdrive Negative
Transition
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
Submit Documentation Feedback
7
LMV331-N, LMV339-N, LMV393-N
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
www.ti.com
Typical Characteristics (continued)
Unless otherwise specified, VS = +5V, single supply, TA = 25°C
Figure 7. Response Time for Input Overdrive Positive
Transition
Figure 8. Response Time vs. Input Overdrive Negative
Transition
Figure 9. Response Time for Input Overdrive Positive Transition
8
Submit Documentation Feedback
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
LMV331-N, LMV339-N, LMV393-N
www.ti.com
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
7 Detailed Description
7.1 Overview
The LMV331-N/393-N/339-N comparators features a supply voltage range of 2.7 V to 5 V with a low supply
current of 55 μA/channel with propagation delays as low as 200ns. They are avaialble in small, space-saving
packages, which makes these comparators versatile for use in a wide range of applications, from portable to
industrial. The open collector output configuration allows the device to be used in wired-OR configurations, such
as a window comparators.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Open Collector Output
The output of the LMV331-N/393-N/339-N series is the uncommitted collector of a grounded-emitter NPN output
transistor, which requires a pull-up resistor to a positive supply voltage for the output to switch properly. Many
collectors can be tied together to provide an output OR’ing function. An output pull-up resistor can be connected
to any available power supply voltage within the permitted V+ supply voltage range. The output pull-up resistor
should be chosen high enough so as to avoid excessive power dissipation yet low enough to supply enough
drive to switch whatever load circuitry is used on the comparator output. On the LMV331-N/393-N/339-N the pullup resistor should range between 1 k to 10 kΩ.
7.3.2 Ground Sensing Input
The LMV331-N/393-N/339-N has a typical input common mode voltage range of −0.1V below the ground to 0.8V
below Vcc.
7.4 Device Functional Modes
A basic comparator circuit is used for converting analog signals to a digital output.
The output is HIGH when the voltage on the non-inverting (+IN) input is greater than the inverting (-IN) input.
The output is LOW when the voltage on the non-inverting (+IN) input is less than the inverting (-IN) input.
The inverting input (-IN) is also commonly referred to as the "reference" or "VREF" input.
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
Submit Documentation Feedback
9
LMV331-N, LMV339-N, LMV393-N
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
www.ti.com
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Basic Comparator
The comparator compares the input voltage (VIN) at the non-inverting pin to the reference voltage (VREF) at the
inverting pin. If VIN is less than VREF, the output voltage (VO) is at the saturation voltage. On the other hand, if VIN
is greater than VREF, the output voltage (VO) is at VCC.
Figure 10. Basic Comparator
8.1.2 Comparator With Hysteresis
The basic comparator configuration may oscillate or produce a noisy output if the applied differential input
voltage is near the comparator's offset voltage. This usually happens when the input signal is moving very slowly
across the switching threshold of the comparator. This problem can be prevented by the addition of hysteresis or
positive feedback.
8.1.2.1 Inverting Comparator With Hysteresis
The inverting comparator with hysteresis requires a three resistor network that are referenced to the supply
voltage VCC of the comparator. When Vin at the inverting input is less than Va, the voltage at the non-inverting
node of the comparator (Vin < Va), the output voltage is high (for simplicity assume VO switches as high as VCC).
The three network resistors can be represented as R1//R3 in series with R2. The lower input trip voltage Va1 is
defined as:
(1)
When Vin is greater than Va (Vin > Va), the output voltage is low very close to ground. In this case the three
network resistors can be presented as R2//R3 in series with R1. The upper trip voltage Va2 is defined as:
(2)
10
Submit Documentation Feedback
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
LMV331-N, LMV339-N, LMV393-N
www.ti.com
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
Application Information (continued)
The total hysteresis provided by the network is defined as:
ΔVa = Va1 - Va2
(3)
To assure that the comparator will always switch fully to VCC and not be pulled down by the load the resistors
values should be chosen as follow:
RPULL-UP << RLOAD
and R1 > RPULL-UP.
(4)
(5)
Figure 11. Inverting Comparator With Hysteresis
8.1.2.1.1 Non-inverting Comparator With Hysteresis
Non-inverting comparator with hysteresis requires a two resistor network, and a voltage reference (Vref) at the
inverting input. When Vin is low, the output is also low. For the output to switch from low to high, Vin must rise up
to Vin1 where Vin1 is calculated by:
(6)
When Vin is high, the output is also high. To make the comparator switch back to its low state, Vin must equal Vref
before VA will again equal Vref. Vin can be calculated by:
(7)
The hysteresis of this circuit is the difference between Vin1 and Vin2.
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
Submit Documentation Feedback
11
LMV331-N, LMV339-N, LMV393-N
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
www.ti.com
Application Information (continued)
ΔVin = VCCR1/R2
(8)
Figure 12. Noninverting Comparator With Hystersis
Figure 13. Hysteresis Threshold Points
8.1.3 ORing the Output
By the inherit nature of an open-collector comparator, the outputs of several comparators can be tied together
with a shared pull-up resistor to VCC. If one or more of the comparators outputs goes low, the output VO will go
low.
12
Submit Documentation Feedback
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
LMV331-N, LMV339-N, LMV393-N
www.ti.com
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
Application Information (continued)
Figure 14. ORing the Outputs
8.1.4 Driving CMOS and TTL
The output of the comparator is capable of driving CMOS and TTL Logic circuits. The pull-up resistor may be
pulled-up to any voltage equal to, or less than the supply voltage on V+. However, it must not be pulled-up to a
voltage higher than V+.
Figure 15. Driving CMOS
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
Submit Documentation Feedback
13
LMV331-N, LMV339-N, LMV393-N
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
www.ti.com
Application Information (continued)
Figure 16. Driving TTL
8.1.5 AND Gates
The comparator can be used as three input AND gate. The operation of the gate is as follows:
The resistor divider at the inverting input establishes a reference voltage at that node. The non-inverting input is
the sum of the voltages at the inputs divided by the voltage dividers. The output will go high only when all three
inputs are high, casing the voltage at the non-inverting input to go above that at inverting input. The circuit values
shown work for a 0 equal to ground and a 1 equal to 5 V.
The resistor values can be altered if different logic levels are desired. If more inputs are required, diodes are
recommended to improve the voltage margin when all but one of the inputs are high.
Figure 17. AND Gate
8.1.6 OR Gates
A three input OR gate is achieved from the basic AND gate simply by increasing the resistor value connected
from the inverting input to Vcc, thereby reducing the reference voltage.
A logic 1 at any of the inputs will produce a logic 1 at the output.
14
Submit Documentation Feedback
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
LMV331-N, LMV339-N, LMV393-N
www.ti.com
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
Application Information (continued)
Figure 18. OR Gate
8.1.7 Large Fan-In Gate
Extra logic inputs may be added by ORing the input with multiple diodes.
Figure 19. Large Fan-In and Gate
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
Submit Documentation Feedback
15
LMV331-N, LMV339-N, LMV393-N
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
www.ti.com
8.2 Typical Applications
8.2.1 Squarewave Oscillator
Figure 20. Squarewave Oscillator
8.2.1.1 Design Requirements
Comparators are ideal for oscillator applications. This square wave generator uses the minimum number of
components. The output frequency is set by the RC time constant of the capacitor C1 and the resistor in the
negative feedback R4. The maximum frequency is limited only by the large signal propagation delay of the
comparator in addition to any capacitive loading at the output, which would degrade the output slew rate.
8.2.1.2 Detailed Design Procedure
Figure 21. Squarewave Oscillator Timing Thresholds
To analyze the circuit, assume that the output is initially high. For this to be true, the voltage at the inverting input
Vc has to be less than the voltage at the non-inverting input Va. For Vc to be low, the capacitor C1 has to be
discharged and will charge up through the negative feedback resistor R4. When it has charged up to value equal
to the voltage at the positive input Va1, the comparator output will switch.
Va1 will be given by:
(9)
16
Submit Documentation Feedback
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
LMV331-N, LMV339-N, LMV393-N
www.ti.com
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
Typical Applications (continued)
If:
R1 = R2 = R3
(10)
Then:
Va1 = 2VCC/3
(11)
When the output switches to ground, the value of Va is reduced by the hysteresis network to a value given by:
Va2 = VCC/3
(12)
Capacitor C1 must now discharge through R4 towards ground. The output will return to its high state when the
voltage across the capacitor has discharged to a value equal to Va2.
For the circuit shown, the period for one cycle of oscillation will be twice the time it takes for a single RC circuit to
charge up to one half of its final value. The time to charge the capacitor can be calculated from:
(13)
Where Vmax is the max applied potential across the capacitor = (2VCC/3)
and VC = Vmax/2 = VCC/3
One period will be given by:
1/freq = 2t
(14)
or calculating the exponential gives:
1/freq = 2(0.694) R4 C1
(15)
Resistors R3 and R4 must be at least two times larger than R5 to ensure that VO will go all the way up to VCC in
the high state. The frequency stability of this circuit should strictly be a function of the external components.
8.2.1.3 Application Curve
5.0
4.5
VOUT
4.0
VOUT (V)
3.5
3.0
Va
2.5
2.0
1.5
1.0
Vc
0.5
0.0
0
5
10
15
20
25
30
35
TIME (µs)
40
C001
Figure 22. Waveforms for Circuit in Typical Applications
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
Submit Documentation Feedback
17
LMV331-N, LMV339-N, LMV393-N
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
www.ti.com
Typical Applications (continued)
8.2.2 Crystal Controlled Oscillator
Figure 23. Crystal Controlled Oscillator
A simple yet very stable oscillator that generates a clock for slower digital systems can be obtained by using a
resonator as the feedback element. It is similar to the squarewave oscillator, except that the positive feedback is
obtained through a quartz crystal. The circuit oscillates when the transmission through the crystal is at a
maximum, so the crystal in its series-resonant mode.
The value of R1 and R2 are equal so that the comparator will switch symmetrically about +VCC/2. The RC
constant of R3 and C1 is set to be several times greater than the period of the oscillating frequency, insuring a
50% duty cycle by maintaining a DC voltage at the inverting input equal to the absolute average of the output
waveform.
When specifying the crystal, be sure to order series resonant with the desired temperature coefficient.
18
Submit Documentation Feedback
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
LMV331-N, LMV339-N, LMV393-N
www.ti.com
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
Typical Applications (continued)
8.2.3 Pulse Generator With Variable Duty Cycle
Figure 24. Pulse Generator With Variable Duty Cycle
The pulse generator with variable duty cycle is just a minor modification of the basic square wave generator.
Providing a separate charge and discharge path for capacitor C1generates a variable duty cycle. One path,
through R2 and D2 will charge the capacitor and set the pulse width (t1). The other path, R1 and D1 will discharge
the capacitor and set the time between pulses (t2).
By varying resistor R1, the time between pulses of the generator can be changed without changing the pulse
width. Similarly, by varying R2, the pulse width will be altered without affecting the time between pulses. Both
controls will change the frequency of the generator. The pulse width and time between pulses can be found from:
(16)
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
Submit Documentation Feedback
19
LMV331-N, LMV339-N, LMV393-N
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
www.ti.com
Typical Applications (continued)
Solving these equations for t1 and t2
t1 = R4C1ln2
t2 = R5C1ln2
(17)
(18)
These terms will have a slight error due to the fact that Vmax is not exactly equal to 2/3 VCC but is actually
reduced by the diode drop to:
(19)
(20)
(21)
8.2.4 Positive Peak Detector
Figure 25. Positive Peak Detector
Positive peak detector is basically the comparator operated as a unit gain follower with a large holding capacitor
from the output to ground. Additional transistor is added to the output to provide a low impedance current source.
When the output of the comparator goes high, current is passed through the transistor to charge up the
capacitor. The only discharge path will be the 1-MΩ resistor shunting C1 and any load that is connected to the
output. The decay time can be altered simply by changing the 1-MΩ resistor. The output should be used through
a high impedance follower to a avoid loading the output of the peak detector.
8.2.5 Negative Peak Detector
Figure 26. Negative Peak Detector
For the negative detector, the output transistor of the comparator acts as a low impedance current sink. The only
discharge path will be the 1-MΩ resistor and any load impedance used. Decay time is changed by varying the 1MΩ resistor.
20
Submit Documentation Feedback
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
LMV331-N, LMV339-N, LMV393-N
www.ti.com
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
9 Power Supply Recommendations
The TLV170x is specified for operation from 2.2 V to 36 V (±1.1 to ±18 V); many specifications apply from –40°C
to +125°C. Parameters that can exhibit significant variance with regard to operating voltage or temperature are
presented in the Typical Characteristics.
CAUTION
Supply voltages larger than 5.5 V can permanently damage the device; see the
Specifications section.
Place 0.1-μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high
impedance power supplies. For more detailed information on bypass capacitor placement, refer to the Layout
Guidelines section
10 Layout
10.1 Layout Guidelines
Comparators are very sensitive to input noise. For best results, the following layout guidelines should be
maintained:
• Use a printed circuit board (PCB) with a good, unbroken low-inductance ground plane. Proper grounding (use
of ground plane) helps maintain specified performance of the comparator
• Connect low-ESR, 0.1-μF ceramic bypass capacitors between each supply pin and ground, placed as close
to the device as possible. A single bypass capacitor from V+ to ground is applicable for single supply
applications.
• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds paying attention to the flow of the ground current. For more detailed information refer to
SLOA089, Circuit Board Layout Techniques.
• In order to reduce parasitic coupling, run the input traces as far away from the supply or output traces as
possible. If it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular
as opposed to in parallel with the noisy trace.
• Place the external components as close to the device as possible, as shown in Layout Example.
• Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
• For slow-moving input signals, take care to prevent parasitic feedback. A small capacitor (1000 pF or less)
placed between the inputs can help eliminate oscillations in the transition region. This capacitor causes some
degradation to propagation delay when the impedance is low. Run the topside ground plane between the
output and inputs.
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
Submit Documentation Feedback
21
LMV331-N, LMV339-N, LMV393-N
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
www.ti.com
10.2 Layout Example
V+
IN+
+
OUT
INV(Schematic Representation)
Run the input traces
as far away from
the supply lines
as possible
Use low-ESR, ceramic
bypass capacitor
VS+
IN+
IN+
GND
V+
VS± or GND
V±
OUT
IN-
OUT
IN-
GND
Only needed for
dual-supply
operation
Figure 27. Comparator Board Layout
22
Submit Documentation Feedback
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
LMV331-N, LMV339-N, LMV393-N
www.ti.com
SNOS018H – AUGUST 1999 – REVISED DECEMBER 2014
11 Device and Documentation Support
11.1 Device Support
11.1.1 Development Support
LMV331-N PSPICE Model, SNOM073
LMV339-N PSPICE Model, SNOM074
LMV393-N PSPICE Model, SNOM059
TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti
DIP Adapter Evaluation Module, http://www.ti.com/tool/dip-adapter-evm
TI Universal Operational Amplifier Evaluation Module, http://www.ti.com/tool/opampevm
11.2 Documentation Support
11.2.1 Related Documentation
AN-74 - A Quad of Independently Functioning Comparators, SNOA654
11.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LMV331-N
Click here
Click here
Click here
Click here
Click here
LMV339-N
Click here
Click here
Click here
Click here
Click here
LMV393-N
Click here
Click here
Click here
Click here
Click here
11.4 Trademarks
All trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LMV331-N LMV339-N LMV393-N
Submit Documentation Feedback
23
PACKAGE OPTION ADDENDUM
www.ti.com
4-Aug-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMV331M5
ACTIVE
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 85
C12
LMV331M5/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
C12
LMV331M5X
NRND
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 85
C12
LMV331M5X/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
C12
LMV331M7
NRND
SC70
DCK
5
1000
TBD
Call TI
Call TI
-40 to 85
C13
LMV331M7/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
C13
LMV331M7X
NRND
SC70
DCK
5
3000
TBD
Call TI
Call TI
-40 to 85
C13
LMV331M7X/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
C13
LMV339M
NRND
SOIC
D
14
55
TBD
Call TI
Call TI
-40 to 85
LMV339M
LMV339M/NOPB
ACTIVE
SOIC
D
14
55
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LMV339M
LMV339MT
NRND
TSSOP
PW
14
94
TBD
Call TI
Call TI
-40 to 85
LMV339
MT
LMV339MT/NOPB
ACTIVE
TSSOP
PW
14
94
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LMV339
MT
LMV339MTX
NRND
TSSOP
PW
14
2500
TBD
Call TI
Call TI
-40 to 85
LMV339
MT
LMV339MTX/NOPB
ACTIVE
TSSOP
PW
14
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LMV339
MT
LMV339MX/NOPB
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LMV339M
LMV393M
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
LMV
393M
LMV393M/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LMV
393M
LMV393MM
NRND
VSSOP
DGK
8
1000
TBD
Call TI
Call TI
-40 to 85
V393
LMV393MM/NOPB
ACTIVE
VSSOP
DGK
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
V393
LMV393MMX
NRND
VSSOP
DGK
8
3500
TBD
Call TI
Call TI
-40 to 85
V393
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
4-Aug-2015
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMV393MMX/NOPB
ACTIVE
VSSOP
DGK
8
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
V393
LMV393MX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 85
LMV
393M
LMV393MX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LMV
393M
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
4-Aug-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Nov-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LMV331M5
SOT-23
DBV
5
1000
178.0
8.4
LMV331M5/NOPB
SOT-23
DBV
5
1000
178.0
LMV331M5X
SOT-23
DBV
5
3000
178.0
LMV331M5X/NOPB
SOT-23
DBV
5
3000
LMV331M7
SC70
DCK
5
LMV331M7/NOPB
SC70
DCK
LMV331M7X
SC70
DCK
LMV331M7X/NOPB
SC70
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMV339MTX
TSSOP
PW
14
2500
330.0
12.4
6.95
5.6
1.6
8.0
12.0
Q1
LMV339MTX/NOPB
TSSOP
PW
14
2500
330.0
12.4
6.95
5.6
1.6
8.0
12.0
Q1
LMV339MX/NOPB
SOIC
D
14
2500
330.0
16.4
6.5
9.35
2.3
8.0
16.0
Q1
LMV393MM
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV393MM/NOPB
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV393MMX
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV393MMX/NOPB
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV393MX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LMV393MX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Nov-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMV331M5
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMV331M5/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMV331M5X
SOT-23
DBV
5
3000
210.0
185.0
35.0
LMV331M5X/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
LMV331M7
SC70
DCK
5
1000
210.0
185.0
35.0
LMV331M7/NOPB
SC70
DCK
5
1000
210.0
185.0
35.0
LMV331M7X
SC70
DCK
5
3000
210.0
185.0
35.0
LMV331M7X/NOPB
SC70
DCK
5
3000
210.0
185.0
35.0
LMV339MTX
TSSOP
PW
14
2500
367.0
367.0
35.0
LMV339MTX/NOPB
TSSOP
PW
14
2500
367.0
367.0
35.0
LMV339MX/NOPB
SOIC
D
14
2500
367.0
367.0
35.0
LMV393MM
VSSOP
DGK
8
1000
210.0
185.0
35.0
LMV393MM/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
LMV393MMX
VSSOP
DGK
8
3500
367.0
367.0
35.0
LMV393MMX/NOPB
VSSOP
DGK
8
3500
367.0
367.0
35.0
LMV393MX
SOIC
D
8
2500
367.0
367.0
35.0
LMV393MX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated