SILABS CYW255OXC 200 mhz 24-output buffer for 4 ddr or 3 sdram dimm Datasheet

W255
200 MHz 24-Output Buffer for 4 DDR or 3 SDRAM DIMMS
Features
Functional Description
• One input to 24 output buffer/driver
• Supports up to 4 DDR DIMMs or 3 SDRAM DIMMS
• One additional output for feedback
• SMBus interface for individual output control
• Low skew outputs (< 100 ps)
• Supports 266-, 333-, and 400 MHz DDR SDRAM
• Dedicated pin for power management support
• Space-saving 48-pin SSOP package
The W255 is a 3.3V/2.5V buffer designed to distribute
high-speed clocks in PC applications. The part has 24 outputs.
Designers can configure these outputs to support four unbuffered DDR DIMMS or to support three unbuffered standard
SDRAM DIMMs and two DDR DIMMS. The W255 can be used
in conjunction with the W250 or similar clock synthesizer for
the VIA Pro 266 chipset.
The W255 also includes an SMBus interface which can enable
or disable each output clock. On power-up, all output clocks
are enabled (internal pull up).
Pin Configuration[1]
Block Diagram
FBOUT
BUF_IN
DDR0T_SDRAM10
DDR0C_SDRAM11
DDR1T_SDRAM0
DDR1C_SDRAM1
SDATA
SMBus
Decoding
SCLOCK
DDR2T_SDRAM2
DDR2C_SDRAM3
DDR3T_SDRAM4
DDR3C_SDRAM5
DDR4T_SDRAM6
DDR4C_SDRAM7
DDR5T_SDRAM8
DDR5C_SDRAM9
DDR6T
DDR6C
DDR7T
DDR7C
DDR8T
DDR8C
DDR9T
DDR9C
DDR10T
PWR_DWN#
Power Down Control
DDR10C
DDR11T
DDR11C
SEL_DDR
.......................... Document #: 38-07255 Rev. *D Page 1 of 9
400 West Cesar Chavez, Austin, TX 78701
1+(512) 416-8500
SSOP
Top View
FBOUT
VDD3.3_2.5
GND
DDR0T_SDRAM10
DDR0C_SDRAM11
DRR1T_SDRAM0
DDR1C_SDRAM1
VDD3.3_2.5
GND
DDR2T_SDRAM2
DDR2C_SDRAM3
VDD3.3_2.5
BUF_IN
GND
DDR3T_SDRAM4
DDR3C_SDRAM5
VDD3.3_2.5
GND
DDR4T_SDRAM6
DDR4C_SDRAM7
DDR5T_SDRAM8
DDR5C_SDRAM9
VDD3.3_2.5
SDATA
1
2
48
47
3
46
4
45
5
44
6
43
7
42
8
9
41
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
21
29
28
22
27
23
26
24
25
SEL_DDR*
VDD2.5
GND
DDR11T
DDR11C
DDR10T
DDR10C
VDD2.5
GND
DDR9T
DDR9C
VDD2.5
PWR_DWN#*
GND
DDR8T
DDR8C
VDD2.5
GND
DDR7T
DDR7C
DDR6T
DDR6C
GND
SCLK
Note:
1. Internal 100K pull-up resistors present on inputs marked
with *. Design should not rely solely on internal pull-up resistor
to set I/O pins HIGH.
1+(512) 416-9669
www.silabs.com
W255
Pin Summary
Pin Name
SEL_DDR
Pins
48
Pin Description
Input to configure for DDR-ONLY mode or STANDARD SDRAM
mode.
1 = DDR-ONLY mode.
0 = STANDARD SDRAM mode.
When SEL_DDR is pulled HIGH or configured for DDR-ONLY mode, pin
4, 5, 6, 7, 10, 11,15, 16, 19, 20, 21, 22, 27, 28, 29, 30, 33, 34, 38, 39,
42, 43, 44 and 45 will be configured as DDR outputs.
Connect VDD3.3_2.5 to a 2.5V power supply in DDR-ONLY mode.
When SEL_DDR is pulled LOW or configured for STANDARD SDRAM
output, pin 4, 5, 6, 7, 10, 11, 15, 16, 19 and 20, 21, 22 will be configured
as STANDARD SDRAM outputs.Pin 27, 28, 29, 30, 33, 34, 38, 39, 42,
43, 44 and 45 will be configured as DDR outputs.
Connect VDD3.3_2.5 to a 3.3V power supply in STANDARD SDRAM
mode.
SCLK
25
SMBus clock input
SDATA
24
SMBus data input
BUF_IN
13
Reference input from chipset. 2.5V input for DDR-ONLY mode; 3.3V
input for STANDARD SDRAM mode.
FBOUT
1
Feedback clock for chipset. Output voltage depends on VDD3.3_2.5V.
PWR_DWN#
36
Active LOW input to enable power-down mode; all outputs will be
pulled LOW.
DDR[6:11]T
28, 30, 34, 39, 43, 45
Clock outputs. These outputs provide copies of BUF_IN.
DDR[6:11]C
27, 29, 33, 38, 42, 44
Clock outputs. These outputs provide complementary copies of
BUF_IN.
DDR[0:5]T_SDRAM
[10,0,2,4,6,8]
4, 6, 10, 15, 19, 21
Clock outputs. These outputs provide copies of BUF_IN. Voltage swing
depends on VDD3.3_2.5 power supply.
DDR[0:5]C_SDRAM 5, 7, 11, 16, 20, 22
[11,1,3,5,7,9]
Clock outputs. These outputs provide complementary copies of
BUF_IN when SEL_DDR is active. These outputs provide copies of
BUF_IN when SEL_DDR is inactive. Voltage swing depends on
VDD3.3_2.5 power supply.
VDD3.3_2.5
2, 8, 12, 17, 23
Connect to 2.5V power supply when W255 is configured for
DDR-ONLY mode. Connect to 3.3V power supply, when W255 is
configured for standard SDRAM mode.
VDD2.5
32, 37, 41, 47
2.5V voltage supply
GND
3, 9, 14, 18, 26, 31, 35, 40, 46 Ground
..........................Document #: 38-07255 Rev. *D Page 2 of 9
W255
Serial Configuration Map
• The serial bits will be read by the clock driver in the following
order:
Byte 0 - Bits 7, 6, 5, 4, 3, 2, 1, 0
Byte 1 - Bits 7, 6, 5, 4, 3, 2, 1, 0
.
.
Byte N - Bits 7, 6, 5, 4, 3, 2, 1, 0
• Reserved and unused bits should be programmed to “0.”
• SMBus Address for the W255 is:
Table 1.
A6
A5
A4
A3
A2
A1
A0
R/W
1
1
0
1
0
0
1
----
Byte 6: Outputs Active/Inactive Register
(1 = Active, 0 = Inactive), Default = Active
Bit
Pin #
Description
Default
Bit 7 –
Reserved, drive to 0
0
Bit 6 –
Reserved, drive to 0
0
Bit 5 –
Reserved, drive to 0
0
Bit 4 1
FBOUT
1
Bit 3 45,44
DDR11T, DDR11C
1
Bit 2 43, 42 DDR10T, DDR10C
1
Bit 1 39, 38 DDR9T, DDR9C
1
Bit 0 34, 33 DDR8T, DDR8C
1
..........................Document #: 38-07255 Rev. *D Page 3 of 9
Byte 7: Outputs Active/Inactive Register
(1 = Active, 0 = Inactive), Default = Active
Bit
Pin #
Description
Default
Bit 7
30, 29
DDR7T, DDR7C
1
Bit 6
28, 27
DDR6T, DDR6C
1
Bit 5
21, 22
DDR5T_SDRAM8,
DDR5C_SDRAM9
1
Bit 4
19, 20
DDR4T_SDRAM6,
DDR4C_SDRAM7
1
Bit 3
15,16
DDR3T_SDRAM4,
DDR3C_SDRAM5
1
Bit 2
10, 11
DDR2T_SDRAM2,
DDR2C_SDRAM3
1
Bit 1
6, 7
DDR1T_SDRAM0,
DDR1C_SDRAM1
1
Bit 0
4, 5
DDR0T_SDRAM10,
DDR0C_SDRAM11
1
W255
Maximum Ratings
Storage Temperature...................................–65°C to +150°C
Supply Voltage to Ground Potential..................–0.5 to +7.0V
Static Discharge Voltage .......................................... > 2000V
(per MIL-STD-883, Method 3015)
DC Input Voltage (except BUF_IN)............ –0.5V to VDD+0.5
Operating Conditions[2]
Parameter
Description
Min.
Typ.
Max.
Unit
VDD3.3
Supply Voltage
3.135
3.465
V
VDD2.5
Supply Voltage
2.375
2.625
V
TA
Operating Temperature (Ambient Temperature)
COUT
Output Capacitance
0
6
70
pF
°C
CIN
Input Capacitance
5
pF
Electrical Characteristics Over the Operating Range
Parameter
Description
VIL
Input LOW Voltage
VIH
Input HIGH Voltage
Test Conditions
Min.
Typ.
For all pins except SMBus
Max.
Unit
0.8
V
2.0
V
IIL
Input LOW Current
VIN = 0V
50
A
IIH
Input HIGH Current
VIN = VDD
50
A
IOH
Output HIGH Current
VDD = 2.375V
VOUT = 1V
–18
–32
mA
IOL
Output LOW Current
VDD = 2.375V
VOUT = 1.2V
26
35
mA
VOL
Output LOW Voltage[3]
IOL = 12 mA, VDD = 2.375V
VOH
Output HIGH Voltage[3]
IOH = –12 mA, VDD = 2.375V
Current[3]
0.6
V
1.7
V
IDD
Supply
(DDR-only mode)
Unloaded outputs, 133 MHz
400
mA
IDD
Supply Current
(DDR-only mode)
Loaded outputs, 133 MHz
500
mA
IDDS
Supply Current
PWR_DWN# = 0
VOUT
Output Voltage Swing
See test circuity (refer to
Figure 1)
VOC
Output Crossing Voltage
INDC
Input Clock Duty Cycle
Switching Characteristics
Parameter
0.7
(VDD/2) –
0.1
VDD/2
100
A
VDD +0.6
V
(VDD/2) +
0.1
V
52
%
48
[4]
Name
Test Conditions
Min.
Typ.
Max.
Unit
66
200
MHz
INDC –
5%
INDC +
5%
%
–
Operating Frequency
–
Duty Cycle[3, 5] = t2 t1
Measured at 1.4V for 3.3V outputs
Measured at VDD/2 for 2.5V outputs
t3
SDRAM Rising Edge Rate[3]
Measured between 0.4V and 2.4V
1.0
2.75
V/ns
t4
SDRAM Falling Edge Rate[3]
Measured between 2.4V and 0.4V
1.0
2.75
V/ns
Measured between 20% to 80% of
output (refer to Figure 1)
0.5
1.50
V/ns
t3d
DDR Rising Edge
Rate[3]
Notes:
2. Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
3. Parameter is guaranteed by design and characterization. Not 100% tested in production.
4. All parameters specified with loaded outputs.
5. Duty cycle of input clock is 50%. Rising and falling edge rate is greater than 1 V/ns.
..........................Document #: 38-07255 Rev. *D Page 4 of 9
W255
Switching Characteristics (continued)[4]
Parameter
Name
Test Conditions
Rate[3]
Max.
Unit
1.50
V/ns
DDR Falling Edge
t5
Output to Output Skew for DDR[3] All outputs equally loaded
100
ps
t6
Output to Output Skew for
SDRAM[3]
All outputs equally loaded
150
ps
t7
SDRAM Buffer LH Prop. Delay[3]
Input edge greater than 1 V/ns
5
10
ns
t8
Delay[3]
Input edge greater than 1 V/ns
5
10
ns
Switching Waveforms
Duty Cycle Timing
t1
t2
All Outputs Rise/Fall Time
OUTPUT
2.4V
0.4V
3.3V
2.4V
0.4V
0V
t4
t3
Output-Output Skew
OUTPUT
OUTPUT
t5
SDRAM Buffer HH and LL Propagation Delay
1.5V
INPUT
1.5V
OUTPUT
t6
t7
..........................Document #: 38-07255 Rev. *D Page 5 of 9
0.5
Typ.
t4d
SDRAM Buffer HL Prop.
Measured between 20% to 80% of
output (refer to Figure 1)
Min.
W255
Figure 1 shows the differential clock directly terminated by a 120resistor.
VCC
Device
Under
Test
Out
VCC
)
60W
VTR
RT =120
Out
)
60W
Receiver
VCP
Figure 1. Differential Signal Using Direct Termination Resistor
..........................Document #: 38-07255 Rev. *D Page 6 of 9
W255
Layout Example for DDR 2.5V Only
+2.5V Supply
FB
VDDQ2
0.005 mF
10 mF
C4
G
G
G
G
G
G
1 G
2 V
3 G
4
5
6
7 G
8 V
9 G
10
11 G
12 V
G
13
14
15
16 G
17 V
18 G
19
20
21
22 G
23 V
24 G
48
47
G
46
45
44
43
G
42
V 41
G 40
39
G 38
V
37
G
36
G 35
34
G 33
V
32
G
31
30
29
28
27
G 26
25
V
W255
G
C3
G
FB = Dale ILB1206 - 300 (300@ 100 MHz) or TDK ACB 2012L-120
C4 = 0.005 F
Ceramic Caps C3 = 10–22 F
G = VIA to GND plane layer
V = VIA to respective supply plane layer
Note: Each supply plane or strip should have a ferrite bead and capacitors
All bypass caps = 0.1F ceramic
..........................Document #: 38-07255 Rev. *D Page 7 of 9
G
G
G
G
W255
Layout Example SDRAM (Mixed Voltage)
+2.5V Supply
+3.3V Supply
FB
FB
VDDQ2
VDDQ3
C4
0.005 mF
G
G
G
G
G
C1
C3
10 mF
1
2 V
G
3
4
5
6
7 G
8 V
9
10
11 G
12V
G
13
14 G
15
16 G
17V
18 G
19
20
21
22
23V
24 G
0.005 mf
C2
G
G
G
48
47
46
45
44
43
G 42
V 41
G
40
39
G 38
V
37
G
36
G 35
34
G 33
V
32
G 31
30
29
28
27
G 26
25
G
V
W255
G
10 mF
G
FB = Dale ILB1206 - 300 (300@ 100 MHz) or TDK ACB 2012L-120
Ceramic Caps C1 and C3 = 10–22 FC2 & C4 = 0.005 F C6 = 0.1F
G = VIA to GND plane layer
V = VIA to respective supply plane layer
Note: Each supply plane or strip should have a ferrite bead and capacitors
All bypass caps = 0.1F ceramic
..........................Document #: 38-07255 Rev. *D Page 8 of 9
G
G
G
G
W255
Ordering Information
Ordering Code
Package Type
Operating Range
W255H
48-pin SSOP
Commercial
W255HT
48-pin SSOP–Tape and Reel Option
Commercial
CYW255OXC
48-pin SSOP
Commercial
CYW255OXCT
48-pin SSOP–Tape and Reel Option
Commercial
Lead-free
Package Drawing and Dimensions
48-lead Shrunk Small Outline Package O48
51 85061 *C
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use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or
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..........................Document #: 38-07255 Rev. *D Page 9 of 9
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