Microchip MCP1703T-1502E/MB 250 ma, 16v, low quiescent current Datasheet

MCP1703
250 mA, 16V, Low Quiescent Current
Features
Description
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The MCP1703 is a family of CMOS low dropout (LDO)
voltage regulators that can deliver up to 250 mA of
current while consuming only 2.0 µA of quiescent
current (typical). The input operating range is specified
from 2.7V to 16.0V, making it an ideal choice for two to
six primary cell battery-powered applications, 9V alkaline and one or two cell Li-Ion-powered applications.
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2.0 µA Typical Quiescent Current
Input Operating Voltage Range: 2.7V to16.0V
250 mA Output Current for Output Voltages ≥ 2.5V
200 mA Output Current for Output Voltages < 2.5V
Low Drop Out Voltage, 625 mV typical @ 250 mA
for VR = 2.8V
0.4% Typical Output Voltage Tolerance
Standard Output Voltage Options (1.2V, 1.5V,
1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, 5.0V)
Output voltage range 1.2V to 5.5V in 0.1V
increments (50 mV increments available upon
request)
Stable with 1.0 µF to 22 µF output capacitance
Short-Circuit Protection
Overtemperature Protection
The MCP1703 is capable of delivering 250 mA with
only 625 mV (typical) of input to output voltage differential (VOUT = 2.8V). The output voltage tolerance of the
MCP1703 is typically ±0.4% at +25°C and ±3%
maximum over the operating junction temperature
range of -40°C to +125°C. Line regulation is ±0.1%
typical at +25°C.
Output voltages available for the MCP1703 range from
1.2V to 5.5V. The LDO output is stable when using only
1 µF of output capacitance. Ceramic, tantalum or
aluminum electrolytic capacitors can all be used for
input and output. Overcurrent limit and overtemperature
shutdown provide a robust solution for any application.
Applications
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Battery-powered Devices
Battery-powered Alarm Circuits
Smoke Detectors
CO2 Detectors
Pagers and Cellular Phones
Smart Battery Packs
Low Quiescent Current Voltage Reference
PDAs
Digital Cameras
Microcontroller Power
Solar-Powered Instruments
Consumer Products
Battery Powered Data Loggers
Package options include the SOT-223-3, SOT-23A,
and SOT-89-3.
Related Literature
• AN765, “Using Microchip’s Micropower LDOs”,
DS00765, Microchip Technology Inc., 2002
• AN766, “Pin-Compatible CMOS Upgrades to
BiPolar LDOs”, DS00766,
Microchip Technology Inc., 2002
• AN792, “A Method to Determine How Much
Power a SOT23 Can Dissipate in an Application”,
DS00792, Microchip Technology Inc., 2001
Package Types
3-Pin SOT-23A
3-Pin SOT-89
VIN
VIN
SOT-223-3
4
3
1
2
GND VOUT
© 2007 Microchip Technology Inc.
1
2
3
GND VIN VOUT
1
VIN
2
3
GND VOUT
DS22049A-page 1
MCP1703
Functional Block Diagrams
MCP1703
VOUT
VIN
Error Amplifier
+VIN
Voltage
Reference
+
Overcurrent
Overtemperature
GND
Typical Application Circuits
MCP1703
VOUT
3.3V
VOUT
VIN
9V
Battery
DS22049A-page 2
+
CIN
1 µF Ceramic
VIN
VIN
COUT
1 µF Ceramic
IOUT
50 mA
GND
© 2007 Microchip Technology Inc.
MCP1703
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings †
VDD..................................................................................+18V
All inputs and outputs w.r.t. .............(VSS-0.3V) to (VIN+0.3V)
Peak Output Current ...................................................500 mA
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature ................................. +150°C
Operating Junction Temperature...................-40°C to +125°C
ESD protection on all pins (HBM;MM)............... ≥ 4 kV; ≥ 400V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1,
ILOAD = 100 µA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C.
Parameters
Symbol
Min
Typ
Max
Units
Conditions
VIN
2.7
—
16.0
V
Note 1
Iq
—
2.0
5
µA
IL = 0 mA
IOUT_mA
250
—
—
mA
For VR ≥ 2.5V
50
100
—
mA
For VR < 2.5V, VIN ≥ 2.7V
100
130
—
mA
For VR < 2.5V, VIN ≥ 2.95V
150
200
—
mA
For VR < 2.5V, VIN ≥ 3.2V
200
250
—
mA
For VR < 2.5V, VIN ≥ 3.45V
IOUT_SC
—
400
—
mA
VIN = VIN(MIN) (Note 1), VOUT = GND,
Current (average current) measured
10 ms after short is applied.
VOUT
VR-3.0%
VR-2.0%
VR±0.4
%
VR+3.0%
VR+2.0%
V
Note 2
Note 3
Input / Output Characteristics
Input Operating Voltage
Input Quiescent Current
Maximum Output Current
Output Short Circuit Current
Output Voltage Regulation
TCVOUT
—
50
150
ppm/°C
Line Regulation
ΔVOUT/
(VOUTXΔVIN)
-0.3
±0.1
+0.3
%/V
(VOUT(MAX) + VDROPOUT(MAX)) ≤ VIN
≤ 16V, Note 1
Load Regulation
ΔVOUT/VOUT
-2.5
±1.0
+2.5
%
IL = 1.0 mA to 250 mA for VR >= 2.5V
IL = 1.0 mA to 200 mA for VR < 2.5V
VIN = 3.65V, Note 4
VOUT Temperature Coefficient
Note 1:
2:
3:
4:
5:
6:
7:
The minimum VIN must meet two conditions: VIN ≥ 2.7V and VIN ≥ (VOUT(MAX) + VDROPOUT(MAX)).
VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.
The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or ViIN = 2.7V (whichever is greater); IOUT = 100 µA.
TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCVOUT.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
© 2007 Microchip Technology Inc.
DS22049A-page 3
MCP1703
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1,
ILOAD = 100 µA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C.
Parameters
Dropout Voltage
Note 1, Note 5
Symbol
6:
7:
Conditions
330
650
mV
IL = 250 mA, VR = 5.0V
725
mV
IL = 250 mA, 3.3V ≤ VR < 5.0V
—
625
975
mV
IL = 250 mA, 2.8V ≤ VR < 3.3V
—
750
1100
mV
IL = 250 mA, 2.5V ≤ VR < 2.8V
—
—
—
mV
VR < 2.5V, See Maximum Output
Current Parameter
TDELAY
—
1000
—
µs
VIN = 0V to 6V, VOUT = 90% VR,
RL = 50Ω resistive
eN
—
8
PSRR
—
44
—
dB
TSD
—
150
—
°C
Thermal Shutdown Protection
5:
Units
525
Power Supply Ripple
Rejection Ratio
4:
Max
—
Output Noise
3:
Typ
—
VDROPOUT
Output Delay Time
Note 1:
2:
Min
µV/(Hz)1/2 IL = 50 mA, f = 1 kHz, COUT = 1 µF
f = 100 Hz, COUT = 1 µF, IL = 100 µA,
VINAC = 100 mV pk-pk, CIN = 0 µF,
VR = 1.2V
The minimum VIN must meet two conditions: VIN ≥ 2.7V and VIN ≥ (VOUT(MAX) + VDROPOUT(MAX)).
VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.
The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or ViIN = 2.7V (whichever is greater); IOUT = 100 µA.
TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCVOUT.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
TEMPERATURE SPECIFICATIONS
Parameters
Sym
Min
Specified Temperature Range
TA
Operating Temperature Range
TA
Storage Temperature Range
Typ
Max
Units
Conditions
-40
+125
°C
-40
+125
°C
TA
-65
+150
°C
Thermal Resistance, 3LD-SOT-223
θJA
θJC
—
—
62
15
—
—
°C/W
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
Thermal Resistance, 3LD-SOT-23A
θJA
θJC
—
—
336
110
—
—
°C/W
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
Thermal Resistance, 3LD-SOT-89
θJA
θJC
—
—
75
10
—
—
°C/W
0.100 sq in copper on both sides of 2
sided board, with vias
Temperature Ranges
Thermal Package Resistance
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
DS22049A-page 4
© 2007 Microchip Technology Inc.
MCP1703
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
Note: Junction Temperature (TJ) is approximated by soaking the device under test to an ambient temperature equal to the desired junction
temperature. The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant.
120
VOUT = 1.2V
IOUT = 0 µA
5.00
4.00
GND Current (µA)
Quiescent Current (µA)
6.00
+130°C
-45°C
3.00
+90°C
+25°C
2.00
1.00
0°C
0.00
2
VOUT = 1.2V
VIN = 2.7V
100
80
60
40
20
0
4
6
8
10
12
14
16
0
18
40
80
Quiescent Current vs. Input
FIGURE 2-4:
Current.
5.00
4.00
+130°C
3.00
+90°C
2.00
+25°C
-45°C
1.00
0°C
VOUT = 5.0V
VIN = 6.0V
100
80
60
VOUT = 2.5V
VIN = 3.5V
40
20
0
0.00
2
4
6
8
10
12
14
16
0
18
50
100
FIGURE 2-2:
Voltage.
Quiescent Current vs. Input
6.00
Quiescent Current (µA)
0°C
4.00
-45°C
+130°C
3.00
+25°C
+90°C
2.00
FIGURE 2-5:
Current.
200
250
Ground Current vs. Load
3.00
VOUT = 5.0V
IOUT = 0 µA
5.00
150
Load Current (mA)
Input Voltage (V)
Quiescent Current (µA)
200
Ground Current vs. Load
120
VOUT = 2.5V
IOUT = 0 µA
GND Current (µA)
Quiescent Current (µA)
6.00
160
Load Current (mA)
Input Voltage (V)
FIGURE 2-1:
Voltage.
120
1.00
VOUT = 2.5V
VIN = 3.5V
2.50
VOUT = 1.2V
VIN = 2.7V
IOUT = 0 mA
2.00
1.50
1.00
VOUT = 5.0V
VIN = 6.0V
0.50
0.00
6
8
10
12
14
16
18
Input Voltage (V)
FIGURE 2-3:
Voltage.
Quiescent Current vs. Input
© 2007 Microchip Technology Inc.
-45
-20
5
30
55
80
105
130
Junction Temperature (°C)
FIGURE 2-6:
Quiescent Current vs.
Junction Temperature.
DS22049A-page 5
MCP1703
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
1.24
VOUT = 1.2V
ILOAD = 0.1 mA
1.230
-45°C
Output Voltage (V)
Output Voltage (V)
1.240
0°C
1.220
1.210
+130°C
1.200
+90°C
+25°C
1.190
1.180
1.23
-45°C
0°C
+25°C
1.22
+90°C
1.21
+130°C
1.20
VIN = 3.0V
VOUT = 1.2V
1.19
1.18
2
4
6
8
10
12
14
16
18
0
20
40
60
FIGURE 2-7:
Voltage.
Output Voltage vs. Input
FIGURE 2-10:
Current.
2.56
VIN = 3.5V
VOUT = 2.5V
2.53
2.54
+90°C
+130°C
2.52
Output Voltage vs. Load
2.54
VOUT = 2.5V
ILOAD = 0.1 mA
Output Voltage (V)
Output Voltage (V)
2.58
2.50
2.48
0°C
-45°C
+25°C
2.46
2.44
2.52
+25°C
+90°C
2.51
2.50
2.49
2.48
0°C
-45°C
2.47
+130°C
2.46
2
4
6
8
10
12
14
16
18
0
50
Input Voltage (V)
FIGURE 2-8:
Voltage.
5.16
Output Voltage vs. Input
150
200
5.04
5.00
-45°C
0°C
4.96
+25°C
4.92
250
Output Voltage vs. Load
5.06
+90°C
+130°C
5.04
FIGURE 2-11:
Current.
Output Voltage (V)
5.08
100
Load Current (mA)
VOUT = 5.0V
ILOAD = 0.1 mA
5.12
Output Voltage (V)
80 100 120 140 160 180 200
Load Current (mA)
Input Voltage (V)
4.88
VIN = 6V
VOUT = 5.0V
+90°C
+130°C
5.02
5.00
4.98
0°C
4.96
-45°C
+25°C
4.94
4.92
6
8
10
12
14
16
18
0
Input Voltage (V)
FIGURE 2-9:
Voltage.
DS22049A-page 6
Output Voltage vs. Input
50
100
150
200
250
Load Current (mA)
FIGURE 2-12:
Current.
Output Voltage vs. Load
© 2007 Microchip Technology Inc.
MCP1703
Dropout Voltage (V)
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
VOUT = 2.5V
+130°C
+90°C
+25°C
+0°C
-45°C
0
25
50
75 100 125 150 175 200 225 250
Load Current (mA)
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
Dropout Voltage vs. Load
+130°C
+90°C
+25°C
+0°C
-45°C
25
50
Dynamic Line Response.
900
VOUT = 5.0V
0
FIGURE 2-16:
Short Circuit Current (mA)
Dropout Voltage (V)
FIGURE 2-13:
Current.
VOUT = 2.5V
ROUT < 0.1?
800
700
600
500
400
300
200
100
0
75 100 125 150 175 200 225 250
2
4
6
8
Load Current (mA)
FIGURE 2-14:
Current.
Dropout Voltage vs. Load
10
12
14
16
18
Input Voltage (V)
FIGURE 2-17:
Input Voltage.
Short Circuit Current vs.
Load Regulation (%)
1.00
VOUT = 1.2V
IOUT = 1 mA to 200 mA
VIN = 6V
0.90
VIN = 12V
0.80
0.70
0.60
0.50
VIN = 16V
0.40
0.30
VIN = 14V
VIN = 3.8V
VIN = 3.2V
0.20
-45
-20
5
30
55
80
105
130
Temperature (°C)
FIGURE 2-15:
Dynamic Line Response.
© 2007 Microchip Technology Inc.
FIGURE 2-18:
Temperature.
Load Regulation vs.
DS22049A-page 7
MCP1703
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
1.00
VIN = 16V
0.80
0.20
VOUT = 2.5V
IOUT = 1 mA to 250 mA
0.60
Line Regulation (%/V)
Load Regulation (%)
1.20
VIN = 6V
0.40
0.20
0.00
VIN = 3.5V
VIN = 12V
-0.20
VIN = 14V
-0.40
-45
-20
5
30
55
80
105
VOUT = 2.5V
VIN = 3.5V to 16V
0.16
200 mA
0.08
100 mA
0.04
0 mA
0.00
-45
130
-20
5
Load Regulation (%)
0.80
FIGURE 2-22:
Temperature.
VOUT = 5.0V
IOUT = 1 to 250 mA
VIN = 16V
VIN = 6V
0.60
VIN = 12V
0.40
0.20
0.00
VIN = 8V
-0.20
VIN = 14V
-0.40
-45
-20
5
30
55
80
105
0.14
130
VOUT = 5.0V
VIN = 6.0V to 16.0V
200mA
0.14
250 mA
0.12
0.10
0 mA
100 mA
0.08
-45
-20
5
30
55
80
105
130
Temperature (°C)
Load Regulation vs.
FIGURE 2-23:
Temperature.
Line Regulation vs.
0
VIN = 3.0 to 16.0V
VOUT = 1.2V
-10
-20
0.12
0.10
105
0.06
130
200 mA
1 mA
0.08
0.06
0 mA
0.04
100 mA
PSRR (dB)
Line Regulation (%/V)
0.16
80
Line Regulation vs.
0.16
Temperature (°C)
FIGURE 2-20:
Temperature.
55
0.18
Line Regulation (%/V)
Load Regulation vs.
1.00
30
Temperature (°C)
Temperature (°C)
FIGURE 2-19:
Temperature.
250 mA
0.12
-30
-40
-50
VR=1.2V
VIN=2.7V
VINAC = 100 mV p-p
CIN=0 μF
IOUT=100 µA
-60
-70
0.02
-80
0.00
-45
-20
5
30
55
80
105
130
-90
0.01
0.1
Temperature (°C)
FIGURE 2-21:
Temperature.
DS22049A-page 8
Line Regulation vs.
FIGURE 2-24:
1
10
Frequency (kHz)
100
1000
PSRR vs. Frequency.
© 2007 Microchip Technology Inc.
MCP1703
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
0
PSRR (dB)
-10
-20
-30
-40
-50
VR=5.0V
VIN=6.0V
VINAC = 100 mV p-p
CIN=0 μF
IOUT=100 µA
-60
-70
-80
-90
0.01
0.1
FIGURE 2-25:
1
10
Frequency (KHz)
1000
PSRR vs. Frequency.
100
VR=5.0V, VIN=6.0V
Noise (µV/ √Hz)
100
FIGURE 2-28:
Dynamic Load Response.
FIGURE 2-29:
Dynamic Load Response.
IOUT=50 mA
10
1
VR=2.8V, VIN=3.8V
0.1
VR=1.2V, VIN=2.7V
0.01
0.001
0.01
0.1
1
10
Frequency (kHz)
100
1000
FIGURE 2-26:
Output Noise vs. Frequency.
FIGURE 2-27:
Power Up Timing.
© 2007 Microchip Technology Inc.
DS22049A-page 9
MCP1703
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MCP1703 PIN FUNCTION TABLE
Pin No.
SOT-223-3
Pin No.
SOT-23A
Pin No.
SOT-89-3
Name
2
1
1
GND
Ground Terminal
3
2
3
VOUT
Regulated Voltage Output
1
3
2,Tab
VIN
Unregulated Supply Voltage
-
-
NC
No connection
3.1
Ground Terminal (GND)
Regulator ground. Tie GND to the negative side of the
output and the negative side of the input capacitor.
Only the LDO bias current (2.0 µA typical) flows out of
this pin; there is no high current. The LDO output
regulation is referenced to this pin. Minimize voltage
drops between this pin and the negative side of the
load.
3.2
Regulated Output Voltage (VOUT)
Connect VOUT to the positive side of the load and the
positive terminal of the output capacitor. The positive
side of the output capacitor should be physically
located as close to the LDO VOUT pin as is practical.
The current flowing out of this pin is equal to the DC
load current.
DS22049A-page 10
Function
3.3
Unregulated Input Voltage (VIN)
Connect VIN to the input unregulated source voltage.
Like all low dropout linear regulators, low source
impedance is necessary for the stable operation of the
LDO. The amount of capacitance required to ensure
low source impedance will depend on the proximity of
the input source capacitors or battery type. For most
applications, 1 µF of capacitance will ensure stable
operation of the LDO circuit. For applications that have
load currents below 100 mA, the input capacitance
requirement can be lowered. The type of capacitor
used can be ceramic, tantalum or aluminum electrolytic. The low ESR characteristics of the ceramic will
yield better noise and PSRR performance at highfrequency.
© 2007 Microchip Technology Inc.
MCP1703
4.0
DETAILED DESCRIPTION
4.1
Output Regulation
4.3
A portion of the LDO output voltage is fed back to the
internal error amplifier and compared with the precision
internal band-gap reference. The error amplifier output
will adjust the amount of current that flows through the
P-Channel pass transistor, thus regulating the output
voltage to the desired value. Any changes in input
voltage or output current will cause the error amplifier
to respond and adjust the output voltage to the target
voltage (refer to Figure 4-1).
4.2
Overtemperature
The internal power dissipation within the LDO is a
function of input-to-output voltage differential and load
current. If the power dissipation within the LDO is
excessive, the internal junction temperature will rise
above the typical shutdown threshold of 150°C. At that
point, the LDO will shut down and begin to cool to the
typical turn-on junction temperature of 130°C. If the
power dissipation is low enough, the device will
continue to cool and operate normally. If the power
dissipation remains high, the thermal shutdown
protection circuitry will again turn off the LDO,
protecting it from catastrophic failure.
Overcurrent
The MCP1703 internal circuitry monitors the amount of
current flowing through the P-Channel pass transistor.
In the event of a short-circuit or excessive output
current, the MCP1703 will turn off the P-Channel
device for a short period, after which the LDO will
attempt to restart. If the excessive current remains, the
cycle will repeat itself.
MCP1703
VOUT
VIN
Error Amplifier
+VIN
Voltage
Reference
+
Overcurrent
Overtemperature
GND
FIGURE 4-1:
Block Diagram.
© 2007 Microchip Technology Inc.
DS22049A-page 11
MCP1703
5.0
FUNCTIONAL DESCRIPTION
The MCP1703 CMOS low dropout linear regulator is
intended for applications that need the lowest current
consumption while maintaining output voltage
regulation. The operating continuous load range of the
MCP1703 is from 0 mA to 250 mA (VR ≥ 2.5V). The
input operating voltage range is from 2.7V to 16.0V,
making it capable of operating from two or more alkaline cells or single and multiple Li-Ion cell batteries.
5.1
Input
The input of the MCP1703 is connected to the source
of the P-Channel PMOS pass transistor. As with all
LDO circuits, a relatively low source impedance (10Ω)
is needed to prevent the input impedance from causing
the LDO to become unstable. The size and type of the
capacitor needed depends heavily on the input source
type (battery, power supply) and the output current
range of the application. For most applications (up to
100 mA), a 1 µF ceramic capacitor will be sufficient to
ensure circuit stability. Larger values can be used to
improve circuit AC performance.
DS22049A-page 12
5.2
Output
The maximum rated continuous output current for the
MCP1703 is 250 mA (VR ≥ 2.5V). For applications
where VR < 2.5V, the maximum output current is
200 mA.
A minimum output capacitance of 1.0 µF is required for
small signal stability in applications that have up to
250 mA output current capability. The capacitor type
can be ceramic, tantalum or aluminum electrolytic. The
esr range on the output capacitor can range from 0Ω to
2.0Ω.
5.3
Output Rise time
When powering up the internal reference output, the
typical output rise time of 1000 µs is controlled to
prevent overshoot of the output voltage.
© 2007 Microchip Technology Inc.
MCP1703
6.0
APPLICATION CIRCUITS &
ISSUES
6.1
The MCP1703 is most commonly used as a voltage
regulator. Its low quiescent current and low dropout
voltage make it ideal for many battery-powered
applications.
MCP1703
GND
VIN
COUT
1 µF Ceramic
FIGURE 6-1:
6.1.1
VIN
2.7V to 4.8V
VOUT
IOUT
50 mA
T J ( MAX ) = P TOTAL × Rθ JA + T AMAX
Where:
Typical Application
VOUT
1.8V
EQUATION 6-2:
CIN
1 µF Ceramic
Typical Application Circuit.
TJ(MAX)
=
Maximum continuous junction
temperature
PTOTAL
=
Total device power dissipation
RθJA
=
Thermal resistance from junctionto-ambient
TAMAX
=
Maximum ambient temperature
The maximum power dissipation capability for a
package can be calculated given the junction-toambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package maximum
internal power dissipation.
EQUATION 6-3:
APPLICATION INPUT CONDITIONS
( T J ( MAX ) – T A ( MAX ) )
P D ( MAX ) = --------------------------------------------------Rθ JA
Package Type = SOT-23A
Input Voltage Range = 2.7V to 4.8V
VIN maximum = 4.8V
VOUT typical = 1.8V
IOUT = 50 mA maximum
6.2
Power Calculations
6.2.1
Where:
PD(MAX)
=
Maximum device power dissipation
TJ(MAX)
=
Maximum continuous junction
temperature
TA(MAX)
=
Maximum ambient temperature
RθJA
=
Thermal resistance from junctionto-ambient
POWER DISSIPATION
The internal power dissipation of the MCP1703 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(2.0 µA x VIN). The following equation can be used to
calculate the internal power dissipation of the LDO.
EQUATION 6-4:
T J ( RISE ) = P D ( MAX ) × Rθ JA
Where:
TJ(RISE)
=
Rise in device junction temperature
over the ambient temperature
PTOTAL
=
Maximum device power dissipation
RθJA
=
Thermal resistance from junction to
ambient
EQUATION 6-1:
P LDO = ( V IN ( MAX ) ) – V OUT ( MIN ) ) × I OUT ( MAX ) )
PLDO = LDO Pass device internal power dissipation
VIN(MAX) = Maximum input voltage
VOUT(MIN) = LDO minimum output voltage
The maximum continuous operating junction
temperature specified for the MCP1703 is +125°C. To
estimate the internal junction temperature of the
MCP1703, the total internal power dissipation is
multiplied by the thermal resistance from junction to
ambient (RθJA). The thermal resistance from junction to
ambient for the SOT-23A pin package is estimated at
336°C/W.
© 2007 Microchip Technology Inc.
EQUATION 6-5:
T J = T J ( RISE ) + T A
Where:
TJ
=
Junction Temperature
TJ(RISE)
=
Rise in device junction temperature
over the ambient temperature
TA
=
Ambient temperature
DS22049A-page 13
MCP1703
6.3
Voltage Regulator
Internal power dissipation, junction temperature rise,
junction temperature and maximum power dissipation
are calculated in the following example. The power
dissipation, as a result of ground current, is small
enough to be neglected.
6.3.1
TJ = TJRISE + TA(MAX)
TJ = 91.3°C
Maximum Package Power Dissipation at +40°C
Ambient Temperature
SOT-23A (336.0°C/Watt = RθJA)
PD(MAX) = (125°C - 40°C) / 336°C/W
POWER DISSIPATION EXAMPLE
Package
Package Type = SOT-23A
PD(MAX) = 253 milli-Watts
SOT-89 (75°C/Watt = RθJA)
PD(MAX) = (125°C - 40°C) / 75°C/W
Input Voltage
VIN = 2.7V to 4.8V
LDO Output Voltages and Currents
PD(MAX) = 1.133 Watts
SOT-223 (62.9°C/Watt = RθJA)
PD(MAX) = (125°C - 40°C) / 62.9°C/W
VOUT = 1.8V
PD(MAX) = 1.35 Watts
IOUT = 50 mA
Maximum Ambient Temperature
TA(MAX) = +40°C
Internal Power Dissipation
Internal Power dissipation is the product of the LDO
output current times the voltage across the LDO
(VIN to VOUT).
PLDO(MAX) = (VIN(MAX) - VOUT(MIN)) x IOUT(MAX)
PLDO = (4.8V - (0.97 x 1.8V)) x 50 mA
PLDO = 152.7 milli-Watts
Device Junction Temperature Rise
The internal junction temperature rise is a function of
internal power dissipation and the thermal resistance
from junction to ambient for the application. The thermal
resistance from junction to ambient (RθJA) is derived
from an EIA/JEDEC standard for measuring thermal
resistance for small surface mount packages. The EIA/
JEDEC specification is JESD51-7, “High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages”. The standard describes the test method
and board specifications for measuring the thermal
resistance from junction to ambient. The actual thermal
resistance for a particular application can vary depending on many factors, such as copper area and thickness. Refer to AN792, “A Method to Determine How
Much Power a SOT23 Can Dissipate in an Application”,
(DS00792), for more information regarding this
subject.
TJ(RISE) = PTOTAL x RqJA
TJRISE = 152.7 milli-Watts x 336.0°C/Watt
TJRISE = 51.3°C
Junction Temperature Estimate
To estimate the internal junction temperature, the
calculated temperature rise is added to the ambient or
offset temperature. For this example, the worst-case
junction temperature is estimated below.
DS22049A-page 14
6.4
Voltage Reference
The MCP1703 can be used not only as a regulator, but
also as a low quiescent current voltage reference. In
many microcontroller applications, the initial accuracy
of the reference can be calibrated using production test
equipment or by using a ratio measurement. When the
initial accuracy is calibrated, the thermal stability and
line regulation tolerance are the only errors introduced
by the MCP1703 LDO. The low-cost, low quiescent
current and small ceramic output capacitor are all
advantages when using the MCP1703 as a voltage
reference.
Ratio Metric Reference
2 µA Bias
CIN
1 µF
PIC®
Microcontroller
MCP1703
VIN
VOUT
GND
COUT
1 µF
VREF
ADO
AD1
Bridge Sensor
FIGURE 6-2: Using the MCP1703 as a
Voltage Reference.
6.5
Pulsed Load Applications
For some applications, there are pulsed load current
events that may exceed the specified 250 mA
maximum specification of the MCP1703. The internal
current limit of the MCP1703 will prevent high peak
load demands from causing non-recoverable damage.
The 250 mA rating is a maximum average continuous
rating. As long as the average current does not exceed
250 mA, pulsed higher load currents can be applied to
the MCP1703. The typical current limit for the
MCP1703 is 500 mA (TA +25°C).
© 2007 Microchip Technology Inc.
MCP1703
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
3-Pin SOT-23A
Example:
Standard Options for SOT-23A and SOT-89
XXNN
Extended Temp
Symbol
Voltage *
Symbol
Voltage *
HM
1.2
HT
3.0
HP
1.5
HU
3.3
HQ
1.8
HV
4.0
HR
2.5
HW
5.0
HS
2.8
—
—
* Custom output voltages available upon request.
Contact your local Microchip sales office for more
information.
3-Lead SOT-89
XXXYYWW
NNN
HWNN
3-Lead SOT-223
Example
HM0719
256
Example:
Tab is GND
Tab is GND
Standard Options for SOT-223
XXXXXXX
XXXYYWW
NNN
1
2
Extended Temp
Symbol
Symbol
Voltage *
12
1.2
30
3.0
15
1.5
33
3.3
18
1.8
40
4.0
25
2.5
50
5.0
28
2.8
—
—
* Custom output voltages available upon request.
Contact your local Microchip sales office for more
information.
3
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Voltage *
MCP1703
15E0719
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2007 Microchip Technology Inc.
DS22049A-page 15
MCP1703
3-Lead Plastic Small Outline Transistor (CB) [SOT-23A]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e1
e
2
1
E
E1
N
b
A
c
A2
φ
L
A1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
NOM
MAX
N
3
Lead Pitch
e
0.95 BSC
Outside Lead Pitch
e1
Overall Height
A
0.89
–
Molded Package Thickness
A2
0.90
–
1.30
Standoff
A1
0.00
–
0.15
Overall Width
E
2.10
–
3.00
Molded Package Width
E1
1.20
–
1.80
Overall Length
D
2.70
–
3.10
Foot Length
L
0.15
–
0.60
Foot Angle
φ
0°
–
30°
Lead Thickness
c
0.09
–
0.26
1.90 BSC
1.45
Lead Width
b
0.30
–
0.51
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-130B
DS22049A-page 16
© 2007 Microchip Technology Inc.
MCP1703
3-Lead Plastic Small Outline Transistor Header (MB) [SOT-89]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
H
L
1
N
2
b
b1
b1
e
E1
e1
A
C
Units
Dimension Limits
Number of Leads
MILLIMETERS
MIN
N
MAX
3
Pitch
e
1.50 BSC
Outside Lead Pitch
e1
3.00 BSC
Overall Height
A
1.40
1.60
Overall Width
H
3.94
4.25
Molded Package Width at Base
E
2.29
2.60
Molded Package Width at Top
E1
2.13
2.29
Overall Length
D
4.39
4.60
Tab Length
D1
1.40
1.83
Foot Length
L
0.79
1.20
Lead Thickness
c
0.35
0.44
Lead 2 Width
b
0.41
0.56
Leads 1 & 3 Width
b1
0.36
0.48
Notes:
1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-029B
© 2007 Microchip Technology Inc.
DS22049A-page 17
MCP1703
3-Lead Plastic Small Outline Transistor (DB) [SOT-223]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
b2
E1
E
3
2
1
e
e1
A2
A
b
c
φ
L
A1
Units
Dimension Limits
Number of Leads
MILLIMETERS
MIN
NOM
MAX
N
3
Lead Pitch
e
2.30 BSC
Outside Lead Pitch
e1
Overall Height
A
–
–
1.80
Standoff
A1
0.02
–
0.10
Molded Package Height
A2
1.50
1.60
1.70
Overall Width
E
6.70
7.00
7.30
Molded Package Width
E1
3.30
3.50
3.70
Overall Length
D
6.30
6.50
6.70
Lead Thickness
c
0.23
0.30
0.35
Lead Width
b
0.60
0.76
0.84
Tab Lead Width
b2
2.90
3.00
3.10
Foot Length
L
0.75
–
–
Lead Angle
φ
0°
–
10°
4.60 BSC
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-032B
DS22049A-page 18
© 2007 Microchip Technology Inc.
MCP1703
APPENDIX A:
REVISION HISTORY
Revision A (June 2007)
• Original Release of this Document.
© 2007 Microchip Technology Inc.
DS22049A-page 19
MCP1703
NOTES:
DS22049A-page 20
© 2007 Microchip Technology Inc.
MCP1703
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X-
XX
X
X
X/
XX
Tape
Output Feature Tolerance Temp. Package
and Reel Voltage Code
Device:
MCP1703: 250 mA, 16V Low Quiescent Current LDO
Tape and Reel:
T
Output Voltage *:
12 = 1.2V “Standard”
15 = 1.5V “Standard”
18 = 1.8V “Standard”
25 = 2.5V “Standard”
28 = 2.8V “Standard”
30 = 3.0V “Standard”
33 = 3.3V “Standard”
40 = 4.0V “Standard”
50 = 5.0V “Standard”
*Contact factory for other output voltage options.
= Tape and Reel
Extra Feature Code:
0
= Fixed
Tolerance:
2
= 2.0% (Standard)
Temperature:
E
= -40°C to +125°C
Package Type:
CB = Plastic Small Outline Transistor (SOT-23A) 3-lead,
DB = Plastic Small Outline Transistor (SOT-223) 3-lead,
MB = Plastic Small Outline Transistor (SOT-89) 3-lead,
© 2007 Microchip Technology Inc.
Examples:
a)
MCP1703T-1202E/XX: Tape and Reel, 1.2V
b)
MCP1703T-1502E/XX: Tape and Reel, 1.5V
c)
MCP1703T-1802E/XX: Tape and Reel, 1.8V
d)
MCP1703T-2502E/XX: Tape and Reel, 2.5V
e)
MCP1703T-2802E/XX: Tape and Reel, 2.8V
f)
MCP1703T-3002E/XX: Tape and Reel, 3.0V
g)
MCP1703T-3302E/XX: Tape and Reel, 3.3V
h)
MCP1703T-3602E/XX: Tape and Reel, 3.6V
i)
MCP1703T-4002E/XX: Tape and Reel, 4.0V
j)
MCP1703T-5002E/XX: Tape and Reel, 5.0V
XX =
=
=
CB for 3LD SOT-23A package
DB for 3LD SOT-223 package
MB for 3LD SOT-89 package
DS22049A-page 21
MCP1703
NOTES:
DS22049A-page 22
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The
Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the
U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS22049A-page 23
WORLDWIDE SALES AND SERVICE
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Technical Support:
http://support.microchip.com
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Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS22049A-page 24
© 2007 Microchip Technology Inc.