NSC OPA241UA Single-supply, micropower operational amplifier Datasheet

OPA241
®
OPA2241
OPA4241
OPA
241
OPA
425
OPA
1
OPA251
424
1
OPA
OPA2251
OPA4251
225
1
Single-Supply, MicroPOWER
OPERATIONAL AMPLIFIERS
OPA241 Family optimized for +5V supply.
DESCRIPTION
OPA251 Family optimized for ±15V supply.
The OPA241 series and OPA251 series are specifically
designed for battery powered, portable applications. In addition to very low power consumption (25µA), these amplifiers feature low offset voltage, rail-to-rail output swing, high
common-mode rejection, and high open-loop gain.
The OPA241 series is optimized for operation at low power
supply voltage while the OPA251 series is optimized for
high power supplies. Both can operate from either single
(+2.7V to +36V) or dual supplies (±1.35V to ±18V). The
input common-mode voltage range extends 200mV below
the negative supply—ideal for single-supply applications.
They are unity-gain stable and can drive large capacitive
loads. Special design considerations assure that these products are easy to use. High performance is maintained as the
amplifiers swing to their specified limits. Because the initial
offset voltage (±250µV max) is so low, user adjustment is
usually not required. However, external trim pins are provided for special applications (single versions only).
The OPA241 and OPA251 (single versions) are available
in standard 8-pin DIP and SO-8 surface-mount packages.
The OPA2241 and OPA2251 (dual versions) come in 8-pin
DIP and SO-8 surface-mount packages. The OPA4241 and
OPA4251 (quad versions) are available in 14-pin DIP and
SO-14 surface-mount packages. All are fully specified
from –40°C to +85°C and operate from –55°C to +125°C.
FEATURES
●
●
●
●
●
●
●
●
MicroPOWER: IQ = 25µA
SINGLE-SUPPLY OPERATION
RAIL-TO-RAIL OUTPUT (within 50mV)
WIDE SUPPLY RANGE
Single Supply: +2.7V to +36V
Dual Supply: ±1.35V to ±18V
LOW OFFSET VOLTAGE: ±250µV max
HIGH COMMON-MODE REJECTION: 124dB
HIGH OPEN-LOOP GAIN: 128dB
SINGLE, DUAL, AND QUAD
APPLICATIONS
● BATTERY OPERATED INSTRUMENTS
● PORTABLE DEVICES
● MEDICAL INSTRUMENTS
● TEST EQUIPMENT
OPA241, OPA251
Offset Trim
1
8
NC
Out A
1
–In
2
7
V+
–In A
2
+In
3
6
Output
+In A
3
V–
4
5
Offset Trim
V–
4
8-Pin DIP, SO-8
OPA4241, OPA4251
OPA2241, OPA2251
V+
Out A
1
14
Out D
7
Out B
–In A
2
13
–In D
6
–In B
+In A
3
12
+In D
5
+In B
V+
4
11
V–
+In B
5
10
+In C
8
A
B
8-Pin DIP, SO-8
A
B
D
C
–In B
6
9
–In C
Out B
7
8
Out C
14-Pin DIP, SO-14
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
© 1997 Burr-Brown Corporation
SBOS075
PDS-1406B
1
OPA241, 2241, 4241
Printed in U.S.A. October, 1998
OPA251, 2251,
4251
®
SPECIFICATIONS: VS = 2.7V to 5V
At TA = +25°C, RL = 100kΩ connected to VS/2, unless otherwise noted.
Boldface limits apply over the specified temperature range, TA = –40°C to +85°C.
OPA241UA, PA
OPA2241UA, PA
OPA4241UA, PA
PARAMETER
CONDITION
OFFSET VOLTAGE
Input Offset Voltage
TA = –40°C to +85°C
vs Temperature
vs Power Supply
TA = –40°C to +85°C
Channel Separation (dual, quad)
TA = –40°C to +85°C
VS = 2.7V to 36V
VS = 2.7V to 36V
dVOS/dT
PSRR
POWER SUPPLY
Specified Voltage Range
Operating Voltage Range
Quiescent Current (per amplifier)
TA = –40°C to +85°C
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
8-Pin DIP
SO-8 Surface Mount
14-Pin DIP
SO-14 Surface Mount
3
30
30
✻
±0.1
en
in
1
45
40
VCM
CMRR
VCM = –0.2V to (V+) –0.8V
VCM = 0V to (V+) –0.8V
–0.2
80
80
AOL
RL = 100kΩ, VO = (V–)+100mV to (V+)–100mV
RL = 100kΩ, VO = (V–)+100mV to (V+)–100mV
RL = 10kΩ, VO = (V–)+200mV to (V+)–200mV
RL = 10kΩ, VO = (V–)+200mV to (V+)–200mV
GBW
SR
VO
100
100
100
100
VS = 5V, G = 1
VIN • G = VS
RL = 100kΩ to VS /2, AOL ≥ 70dB
RL = 100kΩ to VS /2, AOL ≥ 100dB
RL = 100kΩ to VS /2, AOL ≥ 100dB
RL = 10kΩ to VS /2, AOL ≥ 100dB
RL = 10kΩ to VS /2, AOL ≥ 100dB
MAX
±100
±130
±0.6
IOS
TA = –40°C to +85°C
TA = –40°C to +85°C
Short-Circuit Current
Single Versions
Dual, Quad Versions
Capacitive Load Drive
±250
TYP(1)
±400
–4
TA = –40°C to +85°C
OUTPUT
Voltage Output Swing from Rail(3)
MIN
±100
±0.4
IB
INPUT IMPEDANCE
Differential
Common-Mode
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Overload Recovery Time
MAX
✻
✻
✻
0.3
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz
Input Voltage Noise Density, f = 1kHz
Current Noise Density, f = 1kHz
OPEN-LOOP GAIN
Open-Loop Voltage Gain
TA = –40°C to +85°C
TYP(1)
±50
VOS
INPUT BIAS CURRENT
Input Bias Current(2)
TA = –40°C to +85°C
Input Offset Current
TA = –40°C to +85°C
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
TA = –40°C to +85°C
MIN
OPA251UA, PA
OPA2251UA, PA
OPA4251UA, PA
✻
–20
–25
±2
±2
UNITS
µV
µV
µV/°C
µV/V
µV/V
µV/V
nA
nA
nA
nA
✻
✻
✻
✻
µVp-p
nV/√Hz
fA/√Hz
106
✻
V
dB
dB
107 || 2
109 || 4
✻
✻
Ω || pF
Ω || pF
120
✻
120
✻
dB
dB
dB
dB
35
0.01
60
✻
✻
✻
kHz
V/µs
µs
✻
✻
mV
mV
mV
mV
mV
(V+) –0.8
50
75
100
100
100
200
200
✻
ISC
CLOAD
VS
IQ
✻
✻
✻
–24/+4
–30/+4
See Typical Curve
✻
+2.7 to +5
TA = –40°C to +85°C
IO = 0
IO = 0
+2.7
±25
–40
–55
–55
+36
±30
±36
✻
+85
+125
+125
✻
✻
✻
✻
✻
✻
✻
✻
θJA
100
150
80
100
mA
mA
✻
✻
✻
✻
V
V
µA
µA
°C
°C
°C
°C/W
°C/W
°C/W
°C/W
✻ Specifications the same as OPA241UA, PA.
NOTES: (1) VS = +5V. (2) The negative sign indicates input bias current flows out of the input terminals. (3) Output voltage swings are measured between the
output and power supply rails.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®
OPA241, 2241, 4241
OPA251, 2251, 4251
2
SPECIFICATIONS: VS = ±15V
At TA = +25°C, RL = 100kΩ connected to ground, unless otherwise noted.
Boldface limits apply over the specified temperature range, TA = –40°C to +85°C.
OPA241UA, PA
OPA2241UA, PA
OPA4241UA, PA
PARAMETER
OFFSET VOLTAGE
Input Offset Voltage
TA = –40°C to +85°C
vs Temperature
vs Power Supply
TA = –40°C to +85°C
Channel Separation (dual, quad)
CONDITION
dVOS/dT
PSRR
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz
Input Voltage Noise Density, f = 1kHz
Current Noise Density, f = 1kHz
TA = –40°C to +85°C
VS = ±1.35V to ±18V
VS = ±1.35V to ±18V
OUTPUT
Voltage Output Swing from Rail(2)
POWER SUPPLY
Specified Voltage Range
Operating Voltage Range
Quiescent Current (per amplifier)
TA = –40°C to +85°C
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
8-Pin DIP
SO-8 Surface Mount
14-Pin DIP
SO-14 Surface Mount
TYP
±50
✻
✻
✻
±0.1
en
in
✻
✻
✻
1
45
40
(V–) –0.2
100
100
✻
✻
AOL
GBW
SR
VO
✻
RL = 100kΩ, VO = –14.75V to +14.75V
RL = 100kΩ, VO = –14.75V to +14.75V
RL = 20kΩ, VO = –14.7V to +14.7V
RL = 20kΩ, VO = –14.7V to +14.7V
100
100
100
100
✻
G=1
VIN • G = VS
RL = 100kΩ, AOL ≥ 70dB
RL = 100kΩ, AOL ≥ 100dB
RL = 100kΩ, AOL ≥ 100dB
RL = 20kΩ, AOL ≥ 100dB
RL = 20kΩ, AOL ≥ 100dB
µV
µV
µV/°C
µV/V
µV/V
µV/V
30
30
IOS
✻
±250
3
–4
VCM = –15.2V to 14.2V
VCM = –15V to 14.2V
UNITS
±300
✻
VCM
CMRR
MAX
±100
±0.5
IB
TA = –40°C to +85°C
TA = –40°C to +85°C
Short-Circuit Current
Single Versions
Dual Versions
Capacitive Load Drive
MIN
0.3
TA = –40°C to +85°C
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Overload Recovery Time
MAX
✻
INPUT IMPEDANCE
Differential
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
TA = –40°C to +85°C
TYP
±100
±150
±0.6
✻
VOS
INPUT BIAS CURRENT
Input Bias Current(1)
TA = –40°C to +85°C
Input Offset Current
TA = –40°C to +85°C
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
TA = –40°C to +85°C
MIN
OPA251UA, PA
OPA2251UA, PA
OPA4251UA, PA
–20
–25
±2
±2
nA
nA
nA
nA
µVp-p
nV/√Hz
fA/√Hz
124
(V+) –0.8
V
dB
dB
107 || 2
109 || 4
Ω || pF
Ω || pF
128
dB
dB
dB
dB
128
✻
✻
✻
35
0.01
60
✻
✻
50
75
✻
100
✻
✻
✻
–21/+4
–50/+4
See Typical Curve
mA
mA
±15
±45
±38
V
V
µA
µA
+85
+125
+125
°C
°C
°C
kHz
V/µs
µs
250
250
300
300
mV
mV
mV
mV
mV
ISC
CLOAD
VS
IQ
TA = –40°C to +85°C
IO = 0
IO = 0
✻
✻
✻
±1.35
✻
✻
✻
✻
✻
✻
✻
±27
–40
–55
–55
θJA
✻
✻
✻
✻
100
150
80
100
±18
°C/W
°C/W
°C/W
°C/W
✻ Specifications the same as OPA251UA, PA.
NOTES: (1) The negative sign indicates input bias current flows out of the input terminals. (2) Output voltage swings are measured between the output and
power supply rails.
3
OPA241, 2241, 4241
OPA251, 2251, 4251
®
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage, V+ to V– .................................................................... 36V
Input Voltage(2) .................................................. (V–) –0.5V to (V+) +0.5V
Output Short Circuit to Ground(3) ............................................ Continuous
Operating Temperature .................................................. –55°C to +125°C
Storage Temperature ..................................................... –55°C to +125°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering, 10s) ................................................. 300°C
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
NOTES: (1) Stresses above these ratings may cause permanent damage.
(2) Input terminals are diode-clamped to the power supply rails. Input signals
that can swing more that 0.5V beyond the supply rails should be currentlimited to 5mA or less. (3) One amplifier per package.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
SPECIFIED
VOLTAGE
OPERATING
VOLTAGE
RANGE
PACKAGE
PACKAGE
DRAWING
NUMBER(1)
SPECIFICATION
TEMPERATURE
RANGE
Single
OPA241PA
OPA241UA
2.7V to 5V
2.7V to 5V
2.7V to 36V
2.7V to 36V
8-Pin DIP
SO-8 Surface Mount
006
182
–40°C to +85°C
–40°C to +85°C
Dual
OPA2241PA
OPA2241UA
2.7V to 5V
2.7V to 5V
2.7V to 36V
2.7V to 36V
8-Pin DIP
SO-8 Surface Mount
006
182
–40°C to +85°C
–40°C to +85°C
Quad
OPA4241PA
OPA4241UA
2.7V to 5V
2.7V to 5V
2.7V to 36V
2.7V to 36V
14-Pin DIP
SO-14 Surface Mount
010
235
–40°C to +85°C
–40°C to +85°C
Single
OPA251PA
OPA251UA
±15V
±15V
2.7V to 36V
2.7V to 36V
8-Pin DIP
SO-8 Surface Mount
006
182
–40°C to +85°C
–40°C to +85°C
Dual
OPA2251PA
OPA2251UA
±15V
±15V
2.7V to 36V
2.7V to 36V
8-Pin DIP
SO-8 Surface Mount
006
182
–40°C to +85°C
–40°C to +85°C
Quad
OPA4251PA
OPA4251UA
±15V
±15V
2.7V to 36V
2.7V to 36V
14-Pin DIP
SO-14 Surface Mount
010
235
–40°C to +85°C
–40°C to +85°C
PRODUCT
OPA241 SERIES
OPA251 SERIES
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
®
OPA241, 2241, 4241
OPA251, 2251, 4251
4
TYPICAL PERFORMANCE CURVES
At TA = +25°C, and RL = 100kΩ connected to VS/2 (ground for VS = ±15V), unless otherwise noted.
Curves apply to OPA241 and OPA251 unless specified.
POWER SUPPLY and COMMON-MODE
REJECTION RATIO vs FREQUENCY
180
140
160
120
140
G
100
120
80
Φ
100
60
80
40
60
20
40
VS = ±15V
VS = +5V
0
–20
0.01
0.1
140
20
1
10
100
1k
10k
Power Supply Rejection Ratio (dB)
160
Phase (°)
Voltage Gain (dB)
OPEN-LOOP GAIN/PHASE vs FREQUENCY
0
100k
VS = ±15V
VS = ±5V
120
CMRR
100
80
+PSRR
60
–PSRR
40
20
0
0.1
1
10
100
1k
10k
Frequency (Hz)
Frequency (Hz)
CHANNEL SEPARATION vs FREQUENCY
INPUT VOLTAGE AND CURRENT
NOISE SPECTRAL DENSITY vs FREQUENCY
140
100k
1k
1k
120
110
Dual and quad devices.
G = 1, all channels.
Quad measured channel
A to D or B to C—other
combinations yield improved
rejection.
100
90
80
70
Current Noise
100
Voltage Noise
10
10
100
1k
10k
10
0.1
100k
1
10
Frequency (Hz)
100
1k
10k
Frequency (Hz)
QUIESCENT CURRENT vs SUPPLY VOLTAGE
QUIESCENT CURRENT vs TEMPERATURE
30
40
Per Amplifier
Per Amplifier
Quiescent Current (µA)
Quiescent Current (µA)
100
28
26
24
22
35
VS = ±15V
30
25
VS = +5V
20
15
0
5
10
15
20
25
30
35
40
–75
Total Supply Voltage (V)
–50
–25
0
25
50
75
100
125
Temperature (°C)
5
OPA241, 2241, 4241
OPA251, 2251, 4251
®
Current Noise (fA/√Hz)
Voltage Noise (nV/÷Hz)
Channel Separation (dB)
130
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, and RL = 100kΩ connected to VS/2 (ground for VS = ±15V), unless otherwise noted.
Curves apply to OPA241 and OPA251 unless specified.
INPUT BIAS CURRENT
vs INPUT COMMON-MODE VOLTAGE
INPUT BIAS CURRENT vs TEMPERATURE
–5
–6
Input Bias Current (nA)
Input Bias Current (nA)
IB
–4
IB
–2
IOS
0
–4
–3
–2
–1
IOS
0
2
0
–75
–50
–25
0
25
50
75
100
5
10
125
15
20
25
30
Common-Mode Voltage (V)
Temperature (°C)
COMMON-MODE REJECTION vs TEMPERATURE
SHORT-CIRCUIT CURRENT vs TEMPERATURE
50
140
Short-Circuit Current (mA)
Common-Mode Rejection (dB)
VS = ±15V
45
–ISC
40
VS = +5V
35
30
25
VS = +5V
20
Single Versions
Dual, Quad Versions
15
10
VS = ±15V
+ISC, VS = +5V, ±15V (all versions)
5
VS = ±15V
120
VS = +2.7V, +5V
100
80
60
40
VCM = (V–) –0.2V to (V+) –0.8V
VCM = (V–) –0.1V to (V+) –0.8V
VCM = (V–) to (V+) –0.8V
20
0
0
–75
–50
–25
0
25
50
75
100
–75
125
–50
–25
Temperature (°C)
0
25
50
75
100
125
Temperature (°C)
OPEN-LOOP GAIN AND POWER
SUPPLY REJECTION vs TEMPERATURE
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
(V+)
140
T = +25°C
RL = 20kΩ, 100kΩ
AOL, PSR (dB)
130
RL = 100kΩ
120
RL = 10kΩ
110
AOL, VS = ±15V
AOL, VS = +5V
Output Voltage Swing (V)
(V+) –0.1V
T = –55°C
T = +125°C
(V+) –0.2V
(V+) –0.3V
(V–) +0.3V
T = +125°C
(V–) +0.2V
T = +25°C, –55°C
(V–) +0.1V
PSRR
(V–)
100
–75
–50
–25
0
25
50
75
100
0.1
125
®
OPA241, 2241, 4241
OPA251, 2251, 4251
±1
Output Current (mA)
Temperature (°C)
6
±10
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, and RL = 100kΩ connected to VS/2 (ground for VS = ±15V), unless otherwise noted.
Curves apply to OPA241 and OPA251 unless specified.
OPEN-LOOP GAIN vs OUTPUT VOLTAGE SWING
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
140
30
Open-Loop Gain (dB)
Maximum Output Voltage (Vp-p)
RL = 20kΩ
VS = ±15V
RL = 100kΩ
130
VS = +5V
120
VS = +2.7V
110
RL = 10kΩ
100
90
80
400
10
VS = +5V
5
VS = 2.7V
300
200
100
0
100
1k
10k
Output Voltage Swing from Rail (mV)
Frequency (Hz)
OPA241 SERIES OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
OPA241 SERIES OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
100k
20
Typical production
distribution of
packaged units.
Singles, duals,
and quads included.
VS = +5V
VS = +5V
18
Percent of Amplifiers (%)
Percent of Amplifiers (%)
20
15
10
30
25
20
0
500
Maximum output
voltage without
slew rate-induced
distortion.
VS = ±15V
25
15
10
5
Typical production distribution
of packaged units. Singles,
duals, and quads included.
16
14
12
10
8
6
4
2
0
–225
–200
–175
–150
–125
–100
–75
–50
–25
0
25
50
75
100
125
150
175
200
225
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
Offset Voltage (µV/°C)
Offset Voltage (µV)
OPA251 SERIES OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
OPA251 SERIES OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
30
18
20
16
15
10
5
14
VS = ±15V
Typical production distribution
of packaged units. Singles,
duals, and quads included.
12
10
8
6
4
2
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
0
–225
–200
–175
–150
–125
–100
–75
–50
–25
0
25
50
75
100
125
150
175
200
225
Percent of Amplifiers (%)
25
Typical production
distribution of
packaged units.
Singles, duals,
and quads included.
Percent of Amplifiers (%)
VS = ±15V
Offset Voltage (µV)
Offset Voltage Drift (µV/°C)
7
OPA241, 2241, 4241
OPA251, 2251, 4251
®
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, and RL = 100kΩ connected to VS/2 (ground for VS ±15V), unless otherwise noted.
Curves apply to OPA241 and OPA251 unless specified.
QUIESCENT CURRENT
PRODUCT DISTRIBUTION
QUIESCENT CURRENT
PRODUCTION DISTRIBUTION
25
35
Typical production
distribution of
packaged units.
Singles, duals,
and quads included.
Per Amplifier
Percent of Amplifiers (%)
20
VS = ±15V
Typical production distribution
of packaged units. Singles,
duals, and quads included.
30
15
10
5
25
20
15
10
Per Amplifier
5
0
Quiescent Current (µA)
Quiescent Current (µA)
OPA241
SMALL-SIGNAL STEP RESPONSE
VS = +5V, G = +1, RL = 100kΩ, CL = 100pF
0.5V/div
50mV/div
OPA241
LARGE-SIGNAL STEP RESPONSE
VS = +5V, G + 1, RL = 100kΩ, CL = 100pF
200µs/div
200µs/div
OPA251
SMALL-SIGNAL STEP RESPONSE
VS = ±15V, G = +1, RL = 100kΩ, CL = 500pF
OPA251
LARGE-SIGNAL STEP RESPONSE
VS = ±15V, G = +1, RL = 100kΩ, CL = 500pF
2V/div
2ms/div
200µs/div
®
OPA241, 2241, 4241
OPA251, 2251, 4251
8
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
21.5
22
22.5
23
23.5
24
24.5
25
25.5
26
26.5
27
27.5
28
28.5
29
29.5
30
0
50mV/div
Percent of Amplifiers (%)
VS = +5V
APPLICATIONS INFORMATION
Figures 2 and 3 show the regions where the OPA241 series
and OPA251 series have the potential for instability. As
shown, the unity gain configuration with low supplies is the
most susceptible to the effects of capacitive load. With VS =
+5V, G = +1, and IOUT = 0, operation remains stable with
load capacitance up to approximately 200pF. Increasing
supply voltage, output current, and/or gain significantly
improves capacitive load drive. For example, increasing the
supplies to ±15V and gain to 10 allows approximately
2700pF to be driven.
One method of improving capacitive load drive in the unity
gain configuration is to insert a resistor inside the feedback
loop as shown in Figure 4. This reduces ringing with large
capacitive loads while maintaining dc accuracy. For example, with VS = ±1.35V and RS = 5kΩ, the OPA241 series
and OPA251 series perform well with capacitive loads in
excess of 1000pF. Without the series resistor, capacitive
load drive is typically 200pF for these conditions. However,
this method will result in a slight reduction of output voltage
swing.
The OPA241 and OPA251 series are unity-gain stable and
suitable for a wide range of general purpose applications.
Power supply pins should be bypassed with 0.01µF ceramic
capacitors.
OPERATING VOLTAGE
The OPA241 series is laser-trimmed for low offset voltage
and drift at low supply voltage (VS = +5V). The OPA251
series is trimmed for ±15V operation. Both products operate
over the full voltage range (+2.7V to +36V or ±1.35V to
±18V) with some compromises in offset voltage and drift
performance. However, all other parameters have similar
performance. Key parameters are guaranteed over the specified temperature range, –40°C to +85°C. Most behavior
remains unchanged throughout the full operating voltage
range. Parameters which vary significantly with operating
voltage or temperature are shown in typical performance
curves.
OFFSET VOLTAGE TRIM
As mentioned previously, offset voltage of the OPA241
series is laser-trimmed at +5V. The OPA251 series is trimmed
at ±15V. Because the initial offset is so low, user adjustment
is usually not required. However, the OPA241 and OPA251
(single op amp versions) provide offset voltage trim connections on pins 1 and 5. Offset voltage can be adjusted by
connecting a potentiometer as shown in Figure 1. This
adjustment should be used only to null the offset of the op
amp, not to adjust system offset or offset produced by the
signal source. Nulling offset could degrade the offset drift
behavior of the op amp. While it is not possible to predict the
exact change in drift, the effect is usually small.
V+
100k
Capacitive Load (pF)
VS = +2.7V
VS = +5V
Operation above
selected gain curve
not recommended
10k
G = 10
1k
G = –1
Sinking
Sourcing
G = +1
100
–1
–0.1
–0.01
0
0.01
0.1
1
Output Current (mA)
FIGURE 2. Stability—Capacitive Load versus Output Current for Low Supply Voltage.
OPA241 and OPA251 (single op amps) only.
0.01µF
Use offset adjust pins only to null
offset voltage of op amp—see text.
7
2
6
3
OPA241
100k
5
VS = ±15V
1
100kΩ
Capacitive Load (pF)
0.01µF 4
Operation above
selected gain curve
not recommended
Trim Range: ±2mV
(V–) = 0V for single-supply operation.
V–
FIGURE 1. OPA241 and OPA251 Offset Voltage Trim
Circuit.
10k
G = 10
G = –1
1k
G = +1
Sinking
Sourcing
100
CAPACITIVE LOAD AND STABILITY
The OPA241 series and OPA251 series can drive a wide
range of capacitive loads. However, all op amps under
certain conditions may be unstable. Op amp configuration,
gain, and load value are just a few of the factors to consider
when determining stability.
–1
–0.1
–0.01
0
0.01
0.1
1
Output Current (mA)
FIGURE 3. Stability—Capacitive Load versus Output Current for ±15V Supplies.
9
OPA241, 2241, 4241
OPA251, 2251, 4251
®
RS
5kΩ
OPA241
VOUT
VIN
CL
FIGURE 4. Series Resistor in Unity Gain Configuration Improves Capacitive Load Drive.
RH
10Ω
To Load
R5
383kΩ
IH
High-Side
Current Sense
R3
38.3kΩ
R1
38.3kΩ
V+
–In
A1
+In OPA241
V+ for A1, A2
R4
20kΩ
R2
19.1kΩ
Out
VO = 10 • IH • RH
V–
+
2.7V to ±15V
R2 and R4 divide down the
common-mode input to A1.
R8
100kΩ
V– for A1, A2
V+
–In
A2
+In OPA241
V–
R7
9.09kΩ
R6
10kΩ
RL
10Ω
Out
VO = 10 • IL • RL
Low-Side
Current Sense
Common-mode range of A2
extends to V– for low-side sensing.
Optional for IB Cancellation
(R7 = R6 II R8)
To Load
IL
NOTE: Low and high-side sensing circuits can be used independently.
FIGURE 5. Low and High-Side Battery Current Sensing.
®
OPA241, 2241, 4241
OPA251, 2251, 4251
10
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
OPA2241PA
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA2241PA
OPA2241PAG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA2241PA
OPA2241UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
2241UA
OPA2241UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
2241UA
OPA2241UA/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
2241UA
OPA2241UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
2241UA
OPA2251PA
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA2251PA
OPA2251PAG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA2251PA
OPA2251UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
2251UA
OPA2251UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
2251UA
OPA2251UA/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
2251UA
OPA2251UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
2251UA
OPA241PA
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA241PA
OPA241PAG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA241PA
OPA241UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
241UA
OPA241UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
241UA
OPA241UA/2K5E4
PREVIEW
SOIC
D
8
TBD
Call TI
Call TI
-40 to 85
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
OPA241UA/2K5G4
ACTIVE
SOIC
D
8
Eco Plan
Lead/Ball Finish
(2)
2500
Green (RoHS
& no Sb/Br)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
CU NIPDAU
(4)
Level-3-260C-168 HR
-40 to 85
OPA
241UA
OPA241UAE4
PREVIEW
SOIC
D
8
TBD
Call TI
Call TI
-40 to 85
OPA241UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA251PA
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA251PA
OPA251PAG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA251PA
OPA251UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
251UA
OPA251UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
251UA
OPA251UA/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
251UA
OPA251UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
251UA
OPA4241PA
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA4241PA
OPA4241PAG4
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA4241PA
OPA4241UA
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA4241UA
OPA4241UA/2K5
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA4241UA
OPA4241UA/2K5G4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA4241UA
OPA4241UAG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA4241UA
OPA4251PA
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA4251PA
OPA4251PAG4
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA4251PA
OPA4251UA
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA4251UA
Addendum-Page 2
OPA
241UA
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
11-Apr-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
OPA4251UA/2K5
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA4251UA
OPA4251UA/2K5G4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA4251UA
OPA4251UAG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA4251UA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
OPA2241UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA2251UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA241UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA251UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA4241UA/2K5
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
OPA4251UA/2K5
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA2241UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA2251UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA241UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA251UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA4241UA/2K5
SOIC
D
14
2500
367.0
367.0
38.0
OPA4251UA/2K5
SOIC
D
14
2500
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Similar pages