2016-03-31 Silicon PIN Photodiode with Daylight Filter; in SMT Version 1.4 BPW 34 FAS Features: • Especially suitable for the wavelength range of 730 nm to 1100 nm • Short switching time (typ. 20 ns) • DIL plastic package with high packing density • Suitable for reflow soldering • The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. Applications • Photointerrupters • IR remote control of hi-fi and TV sets, dimmers, remote controls of various equipment Ordering Information Type: Photocurrent Ordering Code IP [µA] λ = 870 nm, Ee = 1 mW/cm2, VR =5V BPW 34 FAS 2016-03-31 50 (≥ 40) Q65110A3121 1 Version 1.4 BPW 34 FAS Maximum Ratings (TA = 25 °C) Parameter Symbol Values Unit Operating and storage temperature range Top; Tstg -40 ... 100 °C Reverse voltage VR 16 V Reverse voltage (t < 2 min) VR 32 V Total Power dissipation Ptot 150 mW ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2000 V Characteristics (TA = 25 °C) Parameter Symbol Values Unit Photocurrent (VR = 5 V, λ = 870 nm, Ee=1 mW/cm2) (typ (min)) IP Wavelength of max. sensitivity (typ) λS max Spectral range of sensitivity (typ) λ10% Radiant sensitive area (typ) A Dimensions of radiant sensitive area (typ) LxW Half angle (typ) ϕ Dark current (VR = 10 V) (typ (max)) IR Spectral sensitivity of the chip (λ = 870 nm) (typ) Sλ typ 0.65 A/W Quantum yield of the chip (λ = 870 nm) (typ) η 0.93 Electro ns /Photon Open-circuit voltage (Ee = 0.5 mW/cm2, λ = 870 nm) (typ (min)) VO 320 (≥ 250) mV Short-circuit current (Ee = 0.5 mW/cm2, λ = 870 nm) (typ) ISC 23 µA Rise and fall time (VR = 5 V, RL = 50 Ω, λ = 850 nm, IP = 800 µA) (typ) tr, tf 0.02 µs Forward voltage (IF = 100 mA, E = 0) (typ) VF 1.3 V Capacitance (VR = 0 V, f = 1 MHz, E = 0) (typ) C0 72 pF Temperature coefficient of VO (typ) TCV 2016-03-31 2 50 (≥ 40) µA 880 nm (typ) 730 ... 1100 nm 7.02 mm2 2.65 x 2.65 mm x mm ± 60 2 (≤ 30) -2.6 ° nA mV / K Version 1.4 BPW 34 FAS Parameter Symbol Values Unit Temperature coefficient of ISC (λ = 870 nm) (typ) TCI 0.03 %/K Noise equivalent power (VR = 10 V, λ = 870 nm) (typ) NEP 0.039 pW / Hz½ Detection limit (VR = 10 V, λ = 870 nm) (typ) D* 6.8e12 cm x Hz½ / W Relative Spectral Sensitivity 1) page 12 Srel = f(λ) Photocurrent / Open-Circuit Voltage 1) page 12 IP (VR = 5 V) / VO = f(Ee) OHF01430 100 Srel % ΙP OHF01428 10 3 µA 10 4 mV VO 80 10 2 70 10 3 VO 60 10 1 50 10 2 40 ΙP 30 10 0 10 1 10 -1 10 0 10 0 20 10 0 400 2016-03-31 600 800 1000 nm 1200 λ 10 1 10 2 µW/cm 2 Ee 3 10 4 Version 1.4 BPW 34 FAS Dark Current 1) page 12 IR = f(VR), E = 0 Power Consumption Ptot = f(TA) OHF00394 160 mW Ptot 140 OHF00080 4000 ΙR 120 pA 3000 100 80 2000 60 40 1000 20 0 0 20 40 60 0 80 ˚C 100 TA Capacitance 1) page 12 C = f(VR), f = 1 MHz, E = 0 0 5 10 15 V VR 20 Dark Current 1) page 12 IR = f(TA), VR = 10 V, E = 0 OHF05717 104 OHF00081 100 nA C pF IR 103 80 70 102 60 50 101 40 30 100 20 10 0 -2 10 10 -1 10 0 10 1 10-1 V 10 2 VR 2016-03-31 0 20 40 60 80 ˚C 100 TA 4 Version 1.4 BPW 34 FAS Directional Characteristics 1) page 12 Srel = f(ϕ) 40 30 20 10 ϕ 0 OHF01402 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 0.8 0.6 0.4 0 20 40 Package Outline 0.3 (0.012) 1.1 (0.043) 0.9 (0.035) 6.7 (0.264) 6.2 (0.244) 4.5 (0.177) 4.3 (0.169) 0...5 ˚ 0.2 (0.008) 0.1 (0.004) 1.2 (0.047) 1.1 (0.043) 0...0.1 (0...0.004) Chip position 0.9 (0.035) 0.7 (0.028) 1.7 (0.067) 1.5 (0.059) 4.0 (0.157) 3.7 (0.146) 1.8 (0.071) ±0.2 (0.008) Photosensitive area Cathode lead 2.65 (0.104) x 2.65 (0.104) GEOY6863 Dimensions in mm (inch). Package SMT DIL, Epoxy 2016-03-31 5 60 80 100 120 Version 1.4 BPW 34 FAS Approximate Weight: 43 mg Recommended Solder Pad Dimensions in mm (inch). 2016-03-31 6 Version 1.4 BPW 34 FAS Reflow Soldering Profile Product complies to MSL Level 4 acc. to JEDEC J-STD-020D.01 OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 s 300 250 t OHA04612 Profile Feature Profil-Charakteristik Symbol Symbol Pb-Free (SnAgCu) Assembly Minimum Ramp-up rate to preheat*) 25 °C to 150 °C Time tS TSmin to TSmax tS 60 Ramp-up rate to peak*) TSmax to TP Recommendation Maximum 2 3 100 120 2 3 Unit Einheit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 s 3 6 K/s 10 Ramp-down rate* TP to 100 °C 480 Time 25 °C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 2016-03-31 °C 7 s Version 1.4 BPW 34 FAS Taping 0.8 (0.031) 4.1 (0.161) 12 (0.472) 2 (0.079) 6.9 (0.272) 1.5 (0.059) 5.5 (0.217) 4 (0.157) 1.75 (0.069) Cathode/Collector Side OHAY2287 Dimensions in mm (inch). Tape and Reel 12 mm tape with 1500 pcs. on ∅ 180 mm reel W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 2016-03-31 8 Version 1.4 BPW 34 FAS Tape dimensions [mm] Tape dim ensions in m m W P0 12 + 0.3 / - 0.1 4 ± 0.1 P1 P2 D0 E F 4 ± 0.1 or 8 ± 0.1 2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 Reel dimensions [mm] Reel dim ensions in m m A W Nmin W1 W2max 180 12 60 12.4 + 2 18.4 Barcode-Product-Label (BPL) OSRAM Opto EX A RoHS Compliant (6P) BATCH NO: 1234567890 (1T) LOT NO: 1234567890 BIN1: XX-XX-X-XXX-X LX XXXX Semiconductors MP ML Temp ST X XXX °C X (9D) D/C: 1234 Pack: RXX LE DEMY XXX X_X123_1234.1234 X (X) PROD NO: 123456789(Q)QTY: 9999 (G) GROUP: XX-XX-X-X OHA04563 Dry Packing Process and Materials Moisture-sensitive label or print L VE el LE . see lab e If ve ati nk, bla cod bar y H) (R . dit mi hu e ed ag RH % /60 Barcode label ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe TIO or d , cte itio U g coSEND an bje ing ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < tor ll pro SE _ < urs ). urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ). 23 wi nt tim e or l wi fac ˚C Flo tim at or ca at re. Flo d tha ale el or nth nti Flo uiv du if: rea es l 4 5 Flo lab mo ide ce eq low g, l ve vic is be or de 24 tin en l 5a6 pro ve Le de , e te co , g: ve l un wh Le ke r se da ure ba ed low ba Le ve mo % ba e al d ure Le ist en ref e e 10 tim ure se for ist ale op se for > , Mo se 3 ist ure is or . , is ha se Mo nk be ist nk g rd -03 Mo in n Flo r-p RH g, bla Mo ba TD po If blathi % kin Ca life s (if ar t. wi 10 ba tor J-S thi, va p. elf Ye ar ks _ < e icat me , C 1 Ye ee urs Sh terlow tem ted at ed uir > 1 W no un DE Ho Af Ind 1. d e 4 8 uir ref dy reqy is 2. JE bo e Mo ore tim 16 req : C/ e es dit2b a) St tim or mi IP ed or g is tim e vic b) or e Hu Flo en tim or De 2a kin nc te Flo a) op or 3. b) baere Flo da e l 1 2 Flo If al ref tim ve l 4. se d l 2a3 ve Le g an ve l Le Ba te ure Le ve ure Le ist Da ure ist Mo ist ure Mo ist Mo Mo MO TO OP s at t M RA OS Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 AM OSR Desiccant OHA00539 Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC. 2016-03-31 9 Version 1.4 BPW 34 FAS Transportation Packing and Materials Barcode label D/ 8 Y M DE R 18 -1 P -1 + Q C: 99 D/ 21 00 (9 D) 21 : 20 00 : 14 2 5 (Q )Q TY O H 12 34 S S em R ic AM on du O p ct to or H NO s TC 3G BA (6 P) NO : 12 11 00 LO T (1 T) NO : TY : 20 (Q )Q : NO M RA OS (X ) PR O D 5 14 2 110 0 Packing Sealing label Dimensions of transportation box in mm Width Length Height 195 ± 5 195 ± 5 30 ± 5 2016-03-31 OD PR ) (X (G ) G RO UP : P -1 + Q -1 R 18 DE M Y Bi n2 : Pn3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: M u L lt S iT Y O T P 67 L 6 E Bi D Bi n1 00 C: 01 44 Muster O ct pto o rs u M (9 D) d A n o : 34 ic S R NO O BA TC H 3G H (1 T) LO T NO (6 P) S 8 12 2199 : 12 em 2100 01 44 el OU P: L GR E V LE see . lab e H) nk, cod (R bla r If ty ba . idi RH m hu 0% e /6 ive d ˚C re ag lat ra ck re 30 _ < inf pa % k s of to 90 ea ur s d ). < ns (p or ur s d Ho de , cteg itio ur s Ho an bje co ˚C 72 sin nd Ho ur 5 te 48 ˚C su es e Ho co ± 24 6 da e 40 be oc ry tim ˚C e r th < ll pr tim cto ). r OI oo 23 wi nt tim e at l wi fa r M TO Fl oo tim s at at ale ˚C at e. ica Fl th oo r th ur el OP nt Fl oo on es uiv if: read ed l 4 5 Fl , lab m ide eq low l oc ve vic is en ing be or de 24 l 5a6 pr ve Le de nt wh e te co , w, g: ve l Le ke r re ou se da ba ed flo Le ve tu re m % ba e ba al d Le r en re tu re e re 10 ois tim se fo tu re ale op se fo > , M r se ois 3 is , is ha se M ois tu nk be oo . 03 nk rd g M ois in r-p bla in Fl RH g, DM ba po If blath % kin Ca life is (if . ar ST p. wi 10 baator et Jelf r th va Ye ar ks s m _ < m ed 1 Ye ee ur d, C iredic t Sh te w, te at nt > 1 W Ho Af flody qu In no ire DE 1. e 4 8 ou re ed is re qu ty 2. JE bo e M or tim 16 re C/ : e es idi 2b r a) St tim mor is IP ed r oo tim e vic b) g e r Hu Fl en oo tim De 2a kin nc te Fl oo r a) op 3. b) ba re Fl oo da e fe l 1 2 Fl If al re tim ve l 4. se d l 2a3 ve Le g an ve l Le re Ba te Le ve tu re Le tu Da ois re tu re M ois M ois tu M ois M Nns IVEORS ai IT ntNS CT TIO DU U g EcoSE ON A ba IC UR M CThisSTSE (G ) M u L lt S iT Y O T67 P L 6 Muster E Bi D Bi n1 Bi n2 : Pn3 : Q- 1: 1- 20 M 20 2 L Te 2a 22 m 3 24 0 p ST Ad 26 0 C R 0 C R0 dit ion C R PA 77 al RT CK TE VA XT R: Barcode label 10 OHA02044 Version 1.4 BPW 34 FAS Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2016-03-31 11 Version 1.4 BPW 34 FAS Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2016-03-31 12 Version 1.4 BPW 34 FAS Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 2016-03-31 13