SPECIFICATION FOR APPROVAL PAGE: 1 REF : 20080424-A PROD. ABC'S DWG NO. THIN FILM CHIP INDUCTOR NAME AL1608□□□□L□-□□□ ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： A D C H D G I B I ( PCB Pattern ) Unit : m/m Series A B C D G H I AL1608 1.60±0.10 0.80±0.10 0.45±0.10 0.30±0.20 0.9 0.9 0.6 Ⅱ﹒SCHEMATIC DIAGRAM： Ⅲ﹒MATERIALS： a b c a﹒Body：Ceramic b﹒Internal conductor：Cu c﹒Terminal electrode：Cu/Ni/Sn d﹒Remark：Products comply with RoHS' requirements Ⅳ﹒GENERAL SPECIFICATION： a﹒Storage temp.：-40℃ ---- +105℃ b﹒Operating temp.：-55℃ ---- +125℃ Peak Temp：260℃ max. Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max. c﹒Terminal strength： F Type F ( kgf ) Time ( sec ) Temperature Rising Area Preheat Area +4.0℃ / sec max. 150 ~ 200 ℃ / 60 ~ 120sec Reflow Area +2.0 ~ 4.0℃ / sec max. Forced Cooling Area -(1.0 ~ 5.0)℃ / sec max. Peak Temperature: 260℃ 250 AL1608 0.5 30±5 d﹒Solderability： Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5℃ Flux : Rosin Dip time : 4±1 seconds AR-001A Temperature ( ℃ ) 50sec max. 230℃ 200 150 70sec max. 100 50 0 50 100 150 Time ( seconds ) 200 250 SPECIFICATION FOR APPROVAL REF : 20080424-A PAGE: 2 PROD. NAME ABC'S DWG NO. THIN FILM CHIP INDUCTOR AL1608□□□□L□-□□□ ABC'S ITEM NO. Ⅴ﹒ELECTRICAL CHARACTERISITCS： DWG No. AL16081N0DL□-□□□ AL16081N2DL□-□□□ AL16081N5DL□-□□□ AL16081N8DL□-□□□ AL16082N2DL□-□□□ AL16082N7DL□-□□□ AL16083N3DL□-□□□ AL16083N9DL□-□□□ AL16084N7DL□-□□□ AL16085N6DL□-□□□ AL16086N8DL□-□□□ AL16088N2DL□-□□□ AL160810NJL□-□□□ AL160812NJL□-□□□ AL160815NJL□-□□□ AL160818NJL□-□□□ AL160822NJL□-□□□ AL160827NJL□-□□□ AL160833NJL□-□□□ AL160839NJL□-□□□ AL160847NJL□-□□□ AL160856NJL□-□□□ AL160868NJL□-□□□ AL1608R10JL□-□□□ Inductance Q Test Freq. ( nH ) 1.0±0.3 1.2±0.3 1.5±0.3 1.8±0.3 2.2±0.3 2.7±0.3 3.3±0.3 3.9±0.3 4.7±0.3 5.6±0.3 6.8±0.3 8.2±0.3 10.0±5 % 12.0±5 % 15.0±5 % 18.0±5 % 22.0±5 % 27.0±5 % 33.0±5 % 39.0±5 % 47.0±5 % 56.0±5 % 68.0±5 % 100.0±5 % min 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 ( MHz ) 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 1). □：Packaging Information… A：Bulk B：Taping Reel 2)."":Reference code 3). Tolerance：B：±0.1 C±0.2 D：±0.3 G：±2% J：±5% □□□ AR-001A SRF ( GHz ) min 13.0 13.0 10.0 10.0 8.0 6.0 6.0 6.0 5.0 5.0 5.0 4.0 4.0 3.0 3.0 2.0 2.0 2.0 1.5 1.5 1.5 1.0 1.0 1.0 DC Resistance (Ω) max 0.35 0.35 0.35 0.35 0.35 0.45 0.45 0.45 0.55 0.65 0.75 0.95 0.95 1.05 1.35 1.65 1.95 2.35 2.75 3.00 3.00 5.00 5.00 7.50 Rated Current ( mA ) max 800 800 800 300 300 300 300 300 300 300 300 300 300 300 300 300 250 250 250 200 200 150 150 100 SPECIFICATION FOR APPROVAL REF : 20080424-A PAGE: 3 PROD. ABC'S DWG NO. THIN FILM CHIP INDUCTOR NAME AL1608□□□□L□-□□□ ABC'S ITEM NO. Ⅵ﹒PACKAGING INFORMATION： ( 1 ) Configuration T Cover Tape N A B 2.0±0.5 ∮C ∮C D G Emobossed Carrier ※Carrier tape width : D P:4 m/m 4 m/m End Start Leader no component 200 m/m min. Trailer no component 400 m/m min. Components User direction of feed Unit:m/m ( 2 ) Dimensions Style A 07 - 08 178 B 21±0.8 C D 13 8 G 10 +0 N 50 -0 T 12.5 ( 3 ) Q'TY & G.W. Per pcakage Inner : Reel Series AL1608 AR-001A Outer : Carton Q'TY (pcs) G.W. (gw) Style Q'TY (pcs) G.W. (Kg) Size (cm) 5,000 90 07 - 08 250,000 7.0 41 x 39 x 22 SPECIFICATION FOR APPROVAL REF : 20080424-A PAGE: 4 PROD. ABC'S DWG NO. THIN FILM CHIP INDUCTOR NAME AL1608□□□□L□-□□□ ABC'S ITEM NO. Ⅶ﹒DWGING NUMBER EXPRESSION： A L 1 6 0 8 Reference code Appendix code 2 : Package Appendix code 1 : Classification Tolerance code Electrical code Dimension code Type code Appendix code 1：Product Classification L：Lead Free Standard products comply with RoHS' requirements 1 ~ 9：Lead Free Special products comply with RoHS' requirements Appendix code 2：Package Information Code AR-001A Inner package Inner package Q'TY A T.B.D. T.B.D. B T / R ( Reel package ) 5000 pcs Remark SPECIFICATION FOR APPROVAL REF : 20080424-A PAGE: 5 PROD. ABC'S DWG No. THIN FILM CHIP INDUCTOR NAME AL1608□□□□L□-□□□ ABC'S ITEM No. Ⅷ﹒RELIABILITY TEST： Test item Solderability Thermal shock test ( Temp. cycle ) Specification Test condition More than 95% of the terminal electrode Shall be covered With fresh solder. Preheat : 155℃ / 4 hours. Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 235±5℃ Flux : Rosin Dip time : 5±0.5 seconds Electrical oharacteristics shall not change more than ±20% Room temp. 15 minutes -55 ℃ 30 minutes Room temp. 15 minutes +125 ℃ Total : 50 cycles Humidity Test Temperature : 40±2℃ Humidity : 90±5% Time : 1000 hours High temp. Resistance test Temperature : 125±5℃ Applied current : Per spec. Time : 96 hours AR-001A 30 minutes