AD HMC520A Radio frequency (rf) range: 6 ghz to 10 ghz Datasheet

6 GHz to 10 GHz,
GaAs, MMIC, I/Q Mixer
HMC520A
Data Sheet
20 NIC
19 NIC
21 NIC
22 NIC
23 NIC
24 NIC
FUNCTIONAL BLOCK DIAGRAM
HMC520A
NIC 1
18 NIC
90° HYBRID
NIC 2
GND 3
17 NIC
16 GND
GND 12
13 NIC
NIC 10
IF2 11
14 GND
NIC 6
IF1 9
GND 5
PACKAGE
BASE
GND
13605-001
15 LO
RF 4
NIC 8
Radio frequency (RF) range: 6 GHz to 10 GHz
Local oscillator (LO) input frequency range: 6 GHz to 10 GHz
Conversion loss: 8 dB typical at 6 GHz to 10 GHz
Image rejection: 23 dBc typical at 6 GHz to 10 GHz
LO to RF isolation: 43 dB typical
LO to intermediate frequency (IF) isolation: 25 dB typical
Input third-order intercept (IP3): 19 dBm typical
Input power for 1 dB compression (P1dB): 10 dBm typical at
7.1 GHz to 8.5 GHz
Wide IF frequency range: DC to 3.5 GHz
24-terminal, 4 mm × 4 mm, ceramic leadless chip carrier
NIC 7
FEATURES
Figure 1.
APPLICATIONS
Point to point microwave radios
Point to multipoint radios
Video satellites (VSATs)
Digital radios
Instrumentation
Automatic test equipment (ATE)
GENERAL DESCRIPTION
The HMC520A is a compact gallium arsenide (GaAs),
monolithic microwave integrated circuit (MMIC), in-phase
quadrature (I/Q) mixer in a 24-terminal, RoHS compliant,
ceramic leadless chip carrier (LCC) package. The device can
be used as either an image reject mixer or a single sideband
upconverter. The mixer uses two standard double balanced
Rev. 0
mixer cells and a 90° hybrid fabricated in a GaAs, metal
semiconductor field effect transistor (MESFET) process. The
HMC520A is a much smaller alternative to a hybrid style image
reject mixer and a single sideband upconverter assembly. The
HMC520A eliminates the need for wire bonding, allowing the
use of surface-mount manufacturing techniques.
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HMC520A
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance: IF = 100 MHz, Lower Sideband
(High-Side LO) ............................................................................. 6
Downconverter Performance: IF = 3500 MHz, Lower
Sideband (High-Side LO) .......................................................... 14
Downconverter Performance: IF = 3500 MHz, Upper
Sideband (Low-Side LO) ........................................................... 16
Upconverter Performance: IFIN = 100 MHz, Lower Sideband
(High-Side LO) ........................................................................... 18
Amplitude/Phase Balance Downconverter: IF = 100 MHz,
Lower Sideband (High-Side LO) .............................................. 19
Amplitude/Phase Balance Downconverter: IF = 1500 MHz,
Lower Sideband (High-Side LO) .............................................. 20
Amplitude/Phase Balance Downconverter: IF = 3500 MHz,
Lower Sideband (High-Side LO) .............................................. 21
IF Bandwidth, Downconverter Performance ......................... 22
Isolation and Return Loss ......................................................... 23
Spurious and Harmonics Performance ................................... 24
Downconverter Performance: IF = 100 MHz, Upper
Sideband (Low-Side LO) ............................................................. 8
Theory of Operation ...................................................................... 25
Downconverter Performance: IF = 1500 MHz, Lower
Sideband (High-Side LO) .......................................................... 10
Evaluation Board Information ................................................. 27
Downconverter Performance: IF = 1500 MHz, Upper
Sideband (Low-Side LO) ........................................................... 12
Applications Information .............................................................. 26
Outline Dimensions ....................................................................... 28
Ordering Guide .......................................................................... 28
REVISION HISTORY
1/2017—Revision 0: Initial Version
Rev. 0 | Page 2 of 28
Data Sheet
HMC520A
SPECIFICATIONS
LO = 15 dBm, IF = 100 MHz, RF = −10 dBm, TA = 25°C, unless otherwise noted. All measurements were made as a downconverter with
the lower sideband selected (high-side LO) and an external 90° IF hybrid at the IF ports, unless otherwise noted.
Table 1.
Parameter
RF RANGE
LO INPUT FREQUENCY RANGE
IF FREQUENCY RANGE
LO AMPLITUDE
6 GHz to 10 GHz PERFORMANCE
Conversion Loss
Noise Figure
Input Third-Order Intercept (IP3)
Input Power for 1dB Compression (P1dB)
Image Rejection
LO to RF Isolation
LO to IF Isolation
Phase Balance
Amplitude Balance
7.1 GHz to 8.5 GHz PERFORMANCE
Conversion Loss
Noise Figure
Input Third-Order Intercept (IP3)
Input Power for 1dB Compression (P1dB)
Image Rejection
LO to RF Isolation
LO to IF Isolation
Phase Balance
Amplitude Balance
Test Conditions/Comments
Min
6
6
DC
Typ
Max
10
10
3.5
Unit
GHz
GHz
GHz
dBm
8
8.5
19
10.5
23
43
25
5
0.3
10
dB
dB
dBm
dBm
dBc
dB
dB
Degree
dB
7.7
8
19
10
25
43
25
4
0.3
9.5
dB
dB
dBm
dBm
dBc
dB
dB
Degree
dB
15
Taken without external 90° IF hybrid
Taken without external 90° IF hybrid
Taken without external 90° IF hybrid
Taken without external 90° IF hybrid
Taken without external 90° IF hybrid
Taken without external 90° IF hybrid
Taken without external 90° IF hybrid
Taken without external 90° IF hybrid
Rev. 0 | Page 3 of 28
19
38
21
38
HMC520A
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Parameter
RF Input Power
LO Input Power
IF1 and IF2 Input Power
IF DC Current
Maximum Peak Reflow Temperature1
Continuous Power Dissipation, PDISS (TA = 85°C,
Derate 4.44 mW/°C Above 85°C)
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering 60 sec)
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model (FICDM)
1
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Rating
20 dBm
27 dBm
20 dBm
12 mA
260°C
400 mW
Table 3. Thermal Resistance
Package Type
E-24-12
1
2
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
θJA
175°C
θJC1
225
Unit
°C/W
θJC is the thermal resistance, junction to case (°C/W).
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
750 V (Class 1B)
1250 V (Class C3)
See the Ordering Guide section.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. 0 | Page 4 of 28
Data Sheet
HMC520A
19 NIC
20 NIC
21 NIC
22 NIC
23 NIC
24 NIC
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NIC 1
18 NIC
17 NIC
HMC520A
GND 3
16 GND
TOP VIEW
(Not to Scale)
RF 4
15 LO
GND 12
NIC 10
IF2 11
IF1 9
13 NIC
NIC 8
14 GND
NIC 6
NIC 7
GND 5
NOTES
1. NIC = NOT INTERNALY CONNECTED.
2. EXPOSED PAD. THE EXPOSED PAD
MUST BE CONNECTED TO PIN GND.
13605-002
NIC 2
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
1, 2, 6 to 8, 10, 13,
17 to 24
3, 5, 12, 14, 16
4
9, 11
Mnemonic
NIC
Description
Not Internally Connected.
GND
RF
IF1, IF2
15
LO
Ground. See Figure 7 for the GND interface schematic.
RF Port. This pin is ac-coupled internally and matched to 50 Ω. See Figure 3 for the RF interface schematic.
First and Second Quadrature Intermediate Frequency Input Pins. For applications that do not require
operation to dc, use an off-chip dc blocking capacitor. For applications that require operation to dc,
these pins must not source or sink more than 12 mA of current because the device may not function
or possible device failure may result. See Figure 5 and Figure 6 for the IF1 and IF2 interface schematics.
Local Oscillator Port. This pin is dc-coupled and matched to 50 Ω. See Figure 4 for the LO interface
schematic.
Exposed Pad. The exposed pad must be connected to pin GND.
EPAD
IF2
13605-006
RF
13605-003
INTERFACE SCHEMATICS
Figure 6. IF2 Interface Schematic
Figure 3. RF Interface Schematic
GND
13605-007
13605-004
LO
Figure 7. GND Interface Schematic
Figure 4. LO Interface Schematic
13605-005
IF1
Figure 5. IF1 Interface Schematic
Rev. 0 | Page 5 of 28
HMC520A
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE: IF = 100 MHz, LOWER SIDEBAND (HIGH-SIDE LO)
0
0
–5
–5
–10
–15
–10
LO
LO
LO
LO
–15
TA = +85°C
TA = +25°C
TA = –40°C
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 8. Conversion Gain vs. RF Frequency at Various Temperatures
5
6
7
8
9
50
40
40
30
20
10
30
20
LO
LO
LO
LO
10
TA = +85°C
TA = +25°C
TA = –40°C
6
7
8
9
10
11
RF FREQUENCY (GHz)
5
20
INPUT IP3 (dBm)
20
15
10
TA = +85°C
TA = +25°C
TA = –40°C
0
7
8
9
10
8
9
11
RF FREQUENCY (GHz)
10
11
15
10
LO
LO
LO
LO
5
13605-010
INPUT IP3 (dBm)
25
6
7
Figure 12. Image Rejection vs. RF Frequency at Various LO Powers,
TA = 25°C
25
5
6
RF FREQUENCY (GHz)
Figure 9. Image Rejection vs. RF Frequency at Various Temperatures
5
= 19dBm
= 17dBm
= 15dBm
= 13dBm
0
13605-009
5
11
Figure 11. Conversion Gain vs. RF Frequency at Various LO Powers, TA = 25°C
50
0
10
RF FREQUENCY (GHz)
IMAGE REJECTION (dBc)
IMAGE REJECTION (dBc)
–20
13605-012
6
Figure 10. Input IP3 vs. RF Frequency at Various Temperatures
= 19dBm
= 17dBm
= 15dBm
= 13dBm
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 13. Input IP3 vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 6 of 28
13605-013
5
13605-008
–20
= 19dBm
= 17dBm
= 15dBm
= 13dBm
13605-011
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
Data taken as an image reject mixer with external 90° hybrid at the IF ports, LO = 15 dBm, unless otherwise noted.
HMC520A
20
15
15
10
TA = +85°C
TA = +25°C
TA = –40°C
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
5
6
7
8
9
16
INPUT P1dB (dBm)
16
12
8
4
12
8
LO = 17dBm
LO = 15dBm
LO = 13dBm
4
7
8
9
10
11
RF FREQUENCY (GHz)
13605-015
TA = +85°C
TA = +25°C
TA = –40°C
6
11
Figure 16. Noise Figure vs. RF Frequency at Various LO Powers,
TA = 25°C
20
5
10
RF FREQUENCY (GHz)
20
0
= 19dBm
= 17dBm
= 15dBm
= 13dBm
0
Figure 14. Noise Figure vs. RF Frequency at Various Temperatures
INPUT P1dB (dBm)
LO
LO
LO
LO
5
Figure 15. Input P1dB vs. RF Frequency at Various Temperatures
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 17. Input P1dB vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 7 of 28
13605-017
5
10
13605-016
NOISE FIGURE (dB)
20
13605-014
NOISE FIGURE (dB)
Data Sheet
HMC520A
Data Sheet
DOWNCONVERTER PERFORMANCE: IF = 100 MHz, UPPER SIDEBAND (LOW-SIDE LO)
0
–5
–5
TA = +85°C
TA = +25°C
TA = –40°C
–20
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
5
40
IMAGE REJECTION (dBc)
40
TA = +85°C
TA = +25°C
TA = –40°C
10
6
7
8
9
10
11
RF FREQUENCY (GHz)
INPUT IP3 (dBm)
TA = +85°C
TA = +25°C
TA = –40°C
10
7
8
9
11
RF FREQUENCY (GHz)
10
11
15
10
LO
LO
LO
LO
5
13605-020
INPUT IP3 (dBm)
10
9
6
Figure 22. Image Rejection vs. RF Frequency at Various LO Powers,
TA = 25°C
15
8
= 19dBm
= 17dBm
= 15dBm
= 13dBm
RF FREQUENCY (GHz)
20
7
LO
LO
LO
LO
5
20
6
11
20
25
0
10
30
25
5
9
0
Figure 19. Image Rejection vs. RF Frequency at Various Temperatures
5
8
10
0
5
7
Figure 21. Conversion Gain vs. RF Frequency at Various LO Powers, TA = 25°C
50
20
6
RF FREQUENCY (GHz)
50
30
= 19dBm
= 17dBm
= 15dBm
= 13dBm
–20
13605-019
IMAGE REJECTION (dBc)
Figure 18. Conversion Gain vs. RF Frequency at Various Temperatures
LO
LO
LO
LO
–15
Figure 20. Input IP3 vs. RF Frequency at Various Temperatures
= 19dBm
= 17dBm
= 15dBm
= 13dBm
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 23. Input IP3 vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 8 of 28
13605-023
–15
–10
13605-022
–10
13605-021
CONVERSION GAIN (dB)
0
13605-018
CONVERSION GAIN (dB)
Data taken as an image reject mixer with external 90° hybrid at the IF ports, LO = 15 dBm, unless otherwise noted.
HMC520A
20
15
15
10
TA = +85°C
TA = +25°C
TA = –40°C
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
5
INPUT P1dB (dBm)
16
12
8
+85°C
+25°C
–40°C
7
8
9
10
8
9
11
RF FREQUENCY (GHz)
10
11
12
8
LO = 17dBm
LO = 15dBm
LO = 13dBm
4
13605-025
INPUT P1dB (dBm)
16
6
7
Figure 26. Noise Figure vs. RF Frequency at Various LO Powers,
TA = 25°C
20
5
6
RF FREQUENCY (GHz)
20
0
= 19dBm
= 17dBm
= 15dBm
= 13dBm
0
Figure 24. Noise Figure vs. RF Frequency at Various Temperatures
4
LO
LO
LO
LO
5
Figure 25. Input P1dB vs. RF Frequency at Various Temperatures
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 27. Input P1dB vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 9 of 28
13605-027
5
10
13605-026
NOISE FIGURE (dB)
20
13605-024
NOISE FIGURE (dB)
Data Sheet
HMC520A
Data Sheet
DOWNCONVERTER PERFORMANCE: IF = 1500 MHz, LOWER SIDEBAND (HIGH-SIDE LO)
0
0
–5
–5
LO
LO
LO
LO
–15
TA = +85°C
TA = +25°C
TA = –40°C
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 28. Conversion Gain vs. RF Frequency at Various Temperatures
5
50
40
40
20
7
8
9
10
20
LO
LO
LO
LO
10
6
7
8
9
10
11
RF FREQUENCY (GHz)
5
20
20
INPUT IP3 (dBm)
25
5
8
9
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
11
10
LO
LO
LO
LO
TA = +85°C
TA = +25°C
TA = –40°C
0
10
15
5
13605-030
INPUT IP3 (dBm)
7
Figure 32. Image Rejection vs. RF Frequency at Various LO Powers,
TA = 25°C
25
10
6
RF FREQUENCY (GHz)
Figure 29. Image Rejection vs. RF Frequency at Various Temperatures
15
= 19dBm
= 17dBm
= 15dBm
= 13dBm
0
13605-029
5
11
30
TA = +85°C
TA = +25°C
TA = –40°C
0
10
Figure 31. Conversion Gain vs. RF Frequency at Various LO Powers, TA = 25°C
50
30
6
RF FREQUENCY (GHz)
IMAGE REJECTION (dBc)
IMAGE REJECTION (dBc)
–20
13605-028
–20
= 19dBm
= 17dBm
= 15dBm
= 13dBm
13605-032
–15
–10
Figure 30. Input IP3 vs. RF Frequency at Various Temperatures
= 19dBm
= 17dBm
= 15dBm
= 13dBm
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 33. Input IP3 vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 10 of 28
13605-033
–10
13605-031
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
Data taken as an image reject mixer with external 90° hybrid at the IF ports, LO = 15 dBm, unless otherwise noted.
Data Sheet
HMC520A
20
20
16
INPUT P1dB (dBm)
10
= 19dBm
= 17dBm
= 15dBm
= 13dBm
6
7
8
9
10
8
4
TA = +85°C
TA = +25°C
TA = –40°C
0
5
12
11
RF FREQUENCY (GHz)
Figure 34. Noise Figure vs. RF Frequency at Various LO Powers,
TA = 25°C
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 35. Input P1dB vs. RF Frequency at Various Temperatures
Rev. 0 | Page 11 of 28
13605-035
LO
LO
LO
LO
5
13605-034
NOISE FIGURE (dB)
15
HMC520A
Data Sheet
DOWNCONVERTER PERFORMANCE: IF = 1500 MHz, UPPER SIDEBAND (LOW-SIDE LO)
0
–5
–5
–20
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
5
40
IMAGE REJECTION (dBc)
40
TA = +85°C
TA = +25°C
TA = –40°C
10
6
7
8
9
10
11
RF FREQUENCY (GHz)
INPUT IP3 (dBm)
TA = +85°C
TA = +25°C
TA = –40°C
8
9
10
7
8
9
11
RF FREQUENCY (GHz)
10
11
15
10
LO
LO
LO
LO
5
13605-038
INPUT IP3 (dBm)
20
7
6
Figure 40. Image Rejection vs. RF Frequency at Various LO Powers
20
0
= 19dBm
= 17dBm
= 15dBm
= 13dBm
RF FREQUENCY (GHz)
25
6
LO
LO
LO
LO
5
25
10
11
20
30
15
10
30
30
5
9
0
Figure 37. Image Rejection vs. RF Frequency at Various Temperatures
5
8
10
0
5
7
Figure 39. Conversion Gain vs. RF Frequency at Various LO Powers, TA = 25°C
50
20
6
RF FREQUENCY (GHz)
50
30
= 19dBm
= 17dBm
= 15dBm
= 13dBm
–20
13605-037
IMAGE REJECTION (dBc)
Figure 36. Conversion Gain vs. RF Frequency at Various Temperatures
LO
LO
LO
LO
–15
13605-040
TA = +85°C
TA = +25°C
TA = –40°C
–15
–10
Figure 38. Input IP3 vs. RF Frequency at Various Temperatures
= 19dBm
= 17dBm
= 15dBm
= 13dBm
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 41. Input IP3 vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 12 of 28
13605-041
–10
13605-039
CONVERSION GAIN (dB)
0
13605-036
CONVERSION GAIN (dB)
Data taken as an image reject mixer with external 90° hybrid at the IF ports, LO = 15 dBm, unless otherwise noted.
Data Sheet
HMC520A
20
20
16
INPUT P1dB (dBm)
10
= 19dBm
= 17dBm
= 15dBm
= 13dBm
6
7
8
9
10
8
4
TA = +85°C
TA = +25°C
TA = –40°C
0
5
12
11
RF FREQUENCY (GHz)
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 43. Input P1dB vs. RF Frequency at Various Temperatures
Figure 42. Noise Figure vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 13 of 28
13605-043
LO
LO
LO
LO
5
13605-042
NOISE FIGURE (dB)
15
HMC520A
Data Sheet
DOWNCONVERTER PERFORMANCE: IF = 3500 MHz, LOWER SIDEBAND (HIGH-SIDE LO)
Data taken as an image reject mixer with external 90° hybrid at the IF ports, LO = 15 dBm, unless otherwise noted.
0
0
–10
–15
–20
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 44. Conversion Gain vs. RF Frequency at Various Temperatures
LO
LO
LO
LO
–5
= 19dBm
= 17dBm
= 15dBm
= 13dBm
–10
–15
–20
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
13605-047
CONVERSION GAIN (dB)
–5
13605-044
CONVERSION GAIN (dB)
TA = +85°C
TA = +25°C
TA = –40°C
Figure 47. Conversion Gain vs. RF Frequency at Various LO Powers, TA = 25°C
50
50
TA = +85°C
TA = +25°C
TA = –40°C
40
30
20
10
20
LO
LO
LO
LO
10
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
= 19dBm
= 17dBm
= 15dBm
= 13dBm
0
13605-045
0
5
7
6
8
9
10
11
RF FREQUENCY (GHz)
Figure 45. Image Rejection vs. RF Frequency at Various Temperatures
Figure 48. Image Rejection vs. RF Frequency at Various LO Powers,
TA = 25°C
30
30
TA = +85°C
TA = +25°C
TA = –40°C
25
INPUT IP3 (dBm)
20
15
10
5
20
15
10
LO
LO
LO
LO
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
13605-046
5
Figure 46. Input IP3 vs. RF Frequency at Various Temperatures
= 19dBm
= 17dBm
= 15dBm
= 13dBm
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 49. Input IP3 vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 14 of 28
13605-049
25
INPUT IP3 (dBm)
30
13605-048
IMAGE REJECTION (dBc)
IMAGE REJECTION (dBc)
40
Data Sheet
HMC520A
20
35
30
INPUT P1dB (dBm)
20
15
5
= 19dBm
= 17dBm
= 15dBm
= 13dBm
6
7
8
9
10
8
4
TA = +85°C
TA = +25°C
TA = –40°C
0
5
12
11
RF FREQUENCY (GHz)
Figure 50. Noise Figure vs. RF Frequency at Various LO Powers,
TA = 25°C
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 51. Input P1dB vs. RF Frequency at Various Temperatures
Rev. 0 | Page 15 of 28
13605-051
LO
LO
LO
LO
10
13605-050
NOISE FIGURE (dB)
16
25
HMC520A
Data Sheet
DOWNCONVERTER PERFORMANCE: IF = 3500 MHz, UPPER SIDEBAND (LOW-SIDE LO)
Data taken as an image reject mixer with external 90° hybrid at the IF ports, LO = 15 dBm, unless otherwise noted.
0
TA = +85°C
TA = +25°C
TA = –40°C
–20
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
5
90
80
80
IMAGE REJECTION (dBc)
100
60
50
40
30
TA = +85°C
TA = +25°C
TA = –40°C
10
6
7
8
9
10
11
60
50
40
30
20
INPUT IP3 (dBm)
20
10
11
RF FREQUENCY (GHz)
13605-054
9
8
9
10
11
15
10
LO
LO
LO
LO
0
–5
8
7
5
TA = +85°C
TA = +25°C
TA = –40°C
7
6
Figure 56. Image Rejection vs. RF Frequency at Various LO Powers
25
6
= 19dBm
= 17dBm
= 15dBm
= 13dBm
RF FREQUENCY (GHz)
25
5
LO
LO
LO
LO
5
30
10
11
70
30
15
10
0
Figure 53. Image Rejection vs. RF Frequency at Various Temperatures
0
9
10
RF FREQUENCY (GHz)
5
8
20
0
5
7
Figure 55. Conversion Gain vs. RF Frequency at Various LO Powers, TA = 25°C
90
70
6
RF FREQUENCY (GHz)
100
20
INPUT IP3 (dBm)
–15
–20
13605-053
IMAGE REJECTION (dBc)
Figure 52. Conversion Gain vs. RF Frequency at Various Temperatures
–10
Figure 54. Input IP3 vs. RF Frequency at Various Temperatures
= 19dBm
= 17dBm
= 15dBm
= 13dBm
–5
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 57. Input IP3 vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 16 of 28
13605-057
–15
–5
= 19dBm
= 17dBm
= 15dBm
= 13dBm
13605-056
–10
LO
LO
LO
LO
13605-055
CONVERSION GAIN (dB)
–5
13605-052
CONVERSION GAIN (dB)
0
Data Sheet
HMC520A
20
12
8
4
0
TA = +85°C
TA = +25°C
TA = –40°C
–4
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
13605-058
INPUT P1dB (dBm)
16
Figure 58. Input P1dB vs. RF Frequency at Various Temperatures
Rev. 0 | Page 17 of 28
HMC520A
Data Sheet
UPCONVERTER PERFORMANCE: IFIN = 100 MHz, LOWER SIDEBAND (HIGH-SIDE LO)
0
–5
–5
–10
TA = +85°C
TA = +25°C
TA = –40°C
–15
–20
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
5
–10
SIDEBAND REJECTION (dBc)
–10
–40
6
7
8
9
10
11
Figure 62. Conversion Gain vs. RF Frequency at Various LO Powers,
TA = 25°C
0
–30
= 19dBm
= 17dBm
= 15dBm
= 13dBm
RF FREQUENCY (GHz)
0
–20
LO
LO
LO
LO
–15
–20
Figure 59. Conversion Gain vs. RF Frequency at Various Temperatures
SIDEBAND REJECTION (dBc)
–10
13605-062
CONVERSION GAIN (dB)
0
13605-059
CONVERSION GAIN (dB)
Data taken as single sideband upconverter with external 90° hybrid at the IF ports, LO = 15 dBm, unless otherwise noted.
–20
–30
LO
LO
LO
LO
–40
= 19dBm
= 17dBm
= 15dBm
= 13dBm
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 60. Sideband Rejection vs. RF Frequency at Various Temperatures
5
20
20
INPUT IP3 (dBm)
25
10
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
9
10
11
10
LO
LO
LO
LO
5
5
8
15
TA = +85°C
TA = +25°C
TA = –40°C
0
7
Figure 63. Sideband Rejection vs. RF Frequency at Various LO Powers,
TA = 25°C
25
15
6
RF FREQUENCY (GHz)
13605-061
INPUT IP3 (dBm)
–50
Figure 61. Input IP3 vs. RF Frequency at Various Temperature
= 19dBm
= 17dBm
= 15dBm
= 13dBm
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 64. Input IP3 vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 18 of 28
13605-064
5
13605-060
–50
13605-063
TA = +85°C
TA = +25°C
TA = –40°C
Data Sheet
HMC520A
AMPLITUDE/PHASE BALANCE DOWNCONVERTER: IF = 100 MHz, LOWER SIDEBAND (HIGH-SIDE LO)
Data taken at LO = 15 dBm, unless otherwise noted.
1.0
1.0
TA = +85°C
TA = +25°C
TA = –40°C
0.6
AMPLITUDE BALANCE (dB)
AMPLITUDE BALANCE (dB)
0.8
0.4
0.2
0
–0.2
–0.4
–0.6
LO
LO
LO
LO
0.6
= 19dBm
= 17dBm
= 15dBm
= 13dBm
0.2
–0.2
–0.6
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
–1.0
13605-065
–1.0
Figure 65. Amplitude Balance vs. RF Frequency at Various Temperatures
5
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 67. Amplitude Balance vs. RF Frequency at Various LO Powers,
TA = 25°C
15
15
TA = +85°C
TA = +25°C
TA = –40°C
10
5
0
–5
0
–5
LO
LO
LO
LO
–10
–15
5
6
7
8
9
RF FREQUENCY (GHz)
10
11
13605-066
–10
5
Figure 66. Phase Balance vs. RF Frequency at Various Temperatures
= 19dBm
= 17dBm
= 15dBm
= 13dBm
–15
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 68. Phase Balance vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 19 of 28
13605-068
PHASE BALANCE (Degrees)
10
PHASE BALANCE (Degrees)
6
13605-067
–0.8
HMC520A
Data Sheet
AMPLITUDE/PHASE BALANCE DOWNCONVERTER: IF = 1500 MHz, LOWER SIDEBAND (HIGH-SIDE LO)
Data taken at LO = 15 dBm, unless otherwise noted.
3
3
TA = +85°C
TA = +25°C
TA = –40°C
1
0
–1
= 19dBm
= 17dBm
= 15dBm
= 13dBm
1
0
–1
–2
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
–3
13605-069
–3
Figure 69. Amplitude Balance vs. RF Frequency at Various Temperatures
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
13605-071
–2
Figure 71. Amplitude Balance vs. RF Frequency at Various LO Powers,
TA = 25°C
15
15
TA = +85°C
TA = +25°C
TA = –40°C
LO
LO
LO
LO
10
PHASE BALANCE (Degrees)
10
5
0
–5
5
0
–5
–10
–15
5
6
7
8
9
RF FREQUENCY (GHz)
10
11
13605-070
–10
= 19dBm
= 17dBm
= 15dBm
= 13dBm
Figure 70. Phase Balance vs. RF Frequency at Various Temperatures
–15
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 72. Phase Balance vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 20 of 28
13605-072
PHASE BALANCE (Degrees)
LO
LO
LO
LO
2
AMPLITUDE BALANCE (dB)
AMPLITUDE BALANCE (dB)
2
Data Sheet
HMC520A
AMPLITUDE/PHASE BALANCE DOWNCONVERTER: IF = 3500 MHz, LOWER SIDEBAND (HIGH-SIDE LO)
Data taken at LO = 15 dBm, unless otherwise noted.
5
5
TA = +85°C
TA = +25°C
TA = –40°C
4
2
1
0
–1
–2
0
–1
–2
–4
–4
7.0
6.5
7.5
8.0
9.0
8.5
9.5
10.0
Figure 73. Amplitude Balance vs. RF Frequency at Various Temperatures
= 19dBm
= 17dBm
= 15dBm
= 13dBm
1
–3
RF FREQUENCY (GHz)
–5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
RF FREQUENCY (GHz)
Figure 75. Amplitude Balance vs. RF Frequency at Various LO Powers,
TA = 25°C
30
30
TA = +85°C
TA = +25°C
TA = –40°C
20
10
0
–10
0
–10
LO
LO
LO
LO
–20
–30
5
6
7
8
9
RF FREQUENCY (GHz)
10
11
13605-074
–20
10
Figure 74. Phase Balance vs. RF Frequency at Various Temperatures
= 19dBm
= 17dBm
= 15dBm
= 13dBm
–30
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 76. Phase Balance vs. RF Frequency at Various LO Powers,
TA = 25°C
Rev. 0 | Page 21 of 28
13605-076
PHASE BALANCE (Degrees)
20
PHASE BALANCE (Degrees)
2
–3
–5
6.0
LO
LO
LO
LO
3
13605-075
AMPLITUDE BALANCE (dB)
3
13605-073
AMPLITUDE BALANCE (dB)
4
HMC520A
Data Sheet
IF BANDWIDTH, DOWNCONVERTER PERFORMANCE
Data taken as an image reject mixer with an external 90° hybrid, and LO = 15 dBm, unless otherwise noted.
0
–10
–15
–20
0.1
0.6
1.1
1.6
2.1
IF FREQUENCY (GHz)
2.6
3.1
3.6
Figure 77. Conversion Gain vs. IF Frequency at Various Temperatures, Lower
Sideband, LO = 10.5 GHz
TA = +85°C
TA = +25°C
TA = –40°C
–5
–10
–15
–20
0.1
0.6
1.1
1.6
2.1
IF FREQUENCY (GHz)
2.6
3.1
3.6
13605-078
CONVERSION GAIN (dB)
TA = +85°C
TA = +25°C
TA = –40°C
–5
13605-077
CONVERSION GAIN (dB)
0
Figure 78. Conversion Gain vs. IF Frequency at Various Temperatures,
Upper Sideband, LO = 8.5 GHz
Rev. 0 | Page 22 of 28
Data Sheet
HMC520A
ISOLATION AND RETURN LOSS
70
0
60
–5
IF RETURN LOSS (dB)
30
20
–15
–20
LO TO RF
LO TO IF1
LO TO IF2
RF TO IF1
RF TO IF2
0
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
–30
0.1
0.6
1.1
1.6
TA = +85°C
TA = +25°C
TA = –40°C
2.1
2.6
3.1
3.6
4.1
IF FREQUENCY (GHz)
Figure 79. Isolation vs. RF Frequency at LO = 15 dBm, TA = 25°C
Figure 81. IF Return Loss vs. IF Frequency at Various Temperatures,
LO = 8.5 GHz at 15 dBm
0
0
TA = +85°C
TA = +25°C
TA = –40°C
–5
RF RETURN LOSS (dB)
–5
LO RETURN LOSS (dB)
IF2
–25
13605-079
10
13605-081
40
IF1
–10
–10
–15
–20
–10
–15
–20
–25
–25
5
6
7
8
9
LO FREQUENCY (GHz)
10
11
–30
13605-080
–30
Figure 80. LO Return Loss vs. LO Frequency at Various Temperatures at
LO = 15 dBm
TA = +85°C
TA = +25°C
TA = –40°C
5
6
7
8
9
RF FREQUENCY (GHz)
10
11
13605-082
ISOLATION (dB)
50
Figure 82. RF Return Loss vs. RF Frequency at Various Temperatures,
LO = 8.5 GHz at 15 dBm
Rev. 0 | Page 23 of 28
HMC520A
Data Sheet
SPURIOUS AND HARMONICS PERFORMANCE
LO harmonic isolation, LO = 15 dBm, all values are in dBc below
the input LO level at the RF port are positive, unless otherwise
noted.
Table 5. NLO Spur at RF Output (RFOUT)
LO Frequency (GHz)
5.5
6.5
7
7.5
8.5
9.5
10.5
1
49
43
43
44
43
42
42
2
33
37
43
55
59
61
72
N × LO
3
52
63
55
52
69
62
56
4
66
52
55
61
62
65
61
RF = 9400 MHz at −10 dBm, LO = 9500 MHz at 15 dBm, data
taken without external hybrid, and all values are in dBc measured
below the IF power level (M × RF) − (N × LO) are positive,
unless otherwise noted.
Table 6. M × N Spurious Output Performance, Downconverter,
Lower Sideband (High-Side LO), IF = 100 MHz, TA = 25°C
0
1
2
3
4
5
M × RF
0
0
+31
+71
+69
+62
+58
1
−13
0
+57
+70
+68
+61
N × LO
2
3
+31
+12
+42
+60
+66
+58
+75
+67
+71
+75
+67
+71
4
+39
+62
+70
+74
+85
+77
5
+56
+50
+60
+71
+74
+85
RFOUT = 7600 MHz, LO = 7500 MHz at 15 dBm, data taken
without external hybrid, and all values are in dBc measured
below the RFOUT power level (M × IFIN) − (N × LO) are positive,
unless otherwise noted.
Table 8. M × N Spurious Output Performance, Upconverter,
Upper Sideband (Low-Side LO), IFIN = 100 MHz at −10 dBm,
TA = 25°C
M × IF
M × RF
0
1
2
3
4
5
N × LO
2
3
+23 +29
+36 +49
+76 +50
+78 +72
+71 +79
+70 +73
4
+46
+68
+75
+78
+87
+77
2
26
24
71
73
71
72
N × LO
3
24
30
67
67
66
68
4
29
56
62
64
64
63
5
42
42
58
60
58
59
Table 9. M × N Spurious Output Performance, Upconverter,
Lower Sideband (High-Side LO), IFIN = 100 MHz at −10 dBm,
TA = 25°C
M × IF
Table 7. M × N Spurious Output Performance, Downconverter,
Upper Sideband (Low-Side LO), IF = 100 MHz, TA = 25°C
1
−10
0
+51
+74
+71
+68
1
6
0
53
65
76
77
RFOUT = 9400 MHz, LO = 9500 MHz at 15 dBm, data taken
without external hybrid, and all values are in dBc measured
below the RFOUT power level (M × IFIN) − (N × LO) are positive,
unless otherwise noted.
RF = 7600 MHz at −10 dBm, LO = 7500 MHz at 15 dBm, data
taken without external hybrid, and all values are in dBc measured
below the IF power level (M × RF) − (N × LO) are positive,
unless otherwise noted.
0
0
+31
+73
+68
+68
+62
0
1
2
3
4
5
0
0
78
89
88
88
86
5
+35
+53
+65
+73
+77
+86
Rev. 0 | Page 24 of 28
0
1
2
3
4
5
0
0
79
87
87
86
86
1
8
0
55
60
77
78
N × LO
2
3
21
17
25
48
47
57
74
72
73
72
74
72
4
26
54
56
68
66
67
5
35
37
59
61
61
60
Data Sheet
HMC520A
THEORY OF OPERATION
The HMC520A is a compact gallium arsenide (GaAs), monolithic
microwave integrated circuit (MMIC), in-phase quadrature (I/Q)
mixer in a 24-terminal, RoHS compliant, ceramic leadless chip
carrier (LCC) package. The device can be used as either an image
reject mixer or a single sideband upconverter. The mixer uses two
standard double balanced mixer cells and a 90° hybrid fabricated in
a GaAs, metal semiconductor field effect transistor (MESFET)
process. This device is a much smaller alternative to a hybrid style
image reject mixer and a single sideband upconverter assembly.
The HMC520A eliminates the need for wire bonding, allowing the
use of the surface-mount manufacturing techniques.
Page 25 of 28
HMC520A
Data Sheet
20
22
19
18
17
14
6
13
LO
12
15
5
11
16
4
9
3
10
PACKAGE
BASE
IF1
IF2
GND
EXTERNAL
90° HYBRID
IF
Figure 83. Typical Application Circuit
Rev. 0 | Page 26 of 28
13605-084
RF
21
24
2
8
To select the upper sideband, connect IF1 to the 90° port of the
hybrid and IF2 to the 0° port of the hybrid. To select the lower
sideband, switch these connections.
90°
HYBRID
1
7
Figure 83 shows the typical application circuit for the HMC520A.
To select the appropriate sideband, an external 90° degree hybrid
is needed. For applications not requiring operation to dc, use
an off-chip dc blocking capacitor.
23
APPLICATIONS INFORMATION
Data Sheet
HMC520A
EVALUATION BOARD INFORMATION
in Figure 84. Use a sufficient number of via holes to connect the
top and bottom ground planes. The evaluation circuit board shown
in Figure 84 is available from Analog Devices, Inc., upon request
13605-085
The EV1HMC520ALC4 evaluation PCB used in the application
must use RF circuit design techniques. Signal lines must have
50 Ω impedance and connect the package ground leads and
exposed pad directly to the ground plane similarly to that shown
Figure 84. EV1HMC520ALC4 Evaluation PCB Top Layer
Table 10. Bill of Materials for the EV1HMC520ALC4 Evaluation PCB
Quantity
1
2
2
1
Reference Designator
109996-1
J1, J2 (RF, LO)
J3, J4 (IF1, IF2)
U1
Description
PCB, EV1HMC520ALC4
2.92 mm SMA connectors, SRI Connector Gage
Gold plated SMA, edge mount with 0.02 inch pin connectors, Johnson SMA connectors
Device under test, HMC520ALC4
Page 27 of 28
Part Number
109996-1
104935
105192
HMC520ALC4
HMC520A
Data Sheet
OUTLINE DIMENSIONS
PIN 1
INDICATOR
4.13
4.00 SQ
3.87
0.36
0.30
0.24
PIN 1
(0.32 × 0.32)
19
24
1
18
0.50
BSC
EXPOSED
PAD
2.50 SQ
13
6
7
12
TOP VIEW
BOTTOM VIEW
SIDE VIEW
3.10 BSC
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PKG-004840
SEATING
PLANE
04-03-2015-A
2.50 REF
1.02 MAX
Figure 85. 24-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
HMC520ALC4
Temperature
Range
−40°C to +85°C
Package Body
Material
Alumina
Ceramic
Lead Finish
Gold over Nickel
MSL Rating2
MSL3
Package
Description
24-Terminal LCC
Package
Option
E-24-1
HMC520ALC4TR
−40°C to +85°C
Alumina
Ceramic
Gold over Nickel
MLS3
24-Terminal LCC
E-24-1
H520A
XXXX
HMC520ALC4TR-R5
−40°C to +85°C
Alumina
Ceramic
Gold over Nickel
MLS3
24-Terminal LCC
E-24-1
H520A
XXXX
EV1HMC520ALC4
Evaluation Board
1
The HMC520ALC4, the HMC520ALC4TR, and the HMC520ALC4TR-R5 are RoHS Compliant Parts.
See the Absolute Maximum Ratings section.
3
The four-digit lot number is XXXX.
2
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13605-0-1/17(0)
Rev. 0 | Page 28 of 28
Branding3
H520A
XXXX