Mitsubishi CM200DY-34A High power switching use insulated type Datasheet

< IGBT MODULES >
CM200DY-34A
HIGH POWER SWITCHING USE
INSULATED TYPE
Collector current I C .............….......................…
200A
Collector-emitter voltage V CES ......................… 1 7 0 0 V
Maximum junction temperature T j m a x ..............
1 5 0 °C
●Flat base Type
●Copper base plate
●RoHS Directive compliant
●UL Recognized under UL1557, File E323585
Dual (Half-Bridge)
APPLICATION
AC Motor Control, Motion/Servo Control, Power supply, etc.
OUTLINE DRAWING & INTERNAL CONNECTION
Dimension in mm
INTERNAL CONNECTION
Tolerance
0.5
to
3
±0.2
over
3
to
6
±0.3
over
6
to
30
±0.5
over 30
to 120
±0.8
over 120
to 400
±1.2
Di1
C2E1
Tr2
E2
Di2
Publication Date : June.2011
1
Tr1
C1
G1 E1
(Es1)
Division of Dimension
E2 G2
(Es2)
Tolerance otherwise specified
< IGBT MODULES >
CM200DY-34A
HIGH POWER SWITCHING USE
INSULATED TYPE
ABSOLUTE MAXIMUM RATINGS (Tj=25 °C, unless otherwise specified)
Rating
Unit
VCES
Symbol
Collector-emitter voltage
G-E short-circuited
1700
V
VGES
Gate-emitter voltage
C-E short-circuited
±20
V
IC
Item
Conditions
DC, TC=109 °C
Collector current
ICRM
Ptot
IE
IERM
(Note.1)
200
(Note.3)
400
Pulse, Repetitive
Total power dissipation
(Note.1)
(Note.2, 4)
Emitter current
TC=25 °C
(Note.2, 4)
TC=25 °C
(Note.2, 4)
Pulse, Repetitive
A
1980
W
200
(Note.3)
A
400
Tj
Junction temperature
-
-40 ~ +150
Tstg
Storage temperature
-
-40 ~ +125
Visol
Isolation voltage
Terminals to base plate, RMS, f=60 Hz, AC 1 min
3500
°C
V
ELECTRICAL CHARACTERISTICS (T j =25 °C, unless otherwise specified)
Symbol
Item
Limits
Conditions
Min.
Typ.
Max.
Unit
ICES
Collector-emitter cut-off current
VCE=VCES, G-E short-circuited
-
-
1.0
mA
IGES
Gate-emitter leakage current
VGE=VGES, C-E short-circuited
-
-
2.0
μA
VGE(th)
Gate-emitter threshold voltage
IC=20 mA, VCE=10 V
V
VCEsat
Collector-emitter saturation voltage
Cies
Input capacitance
Coes
Output capacitance
Cres
Reverse transfer capacitance
QG
Gate charge
td(on)
Turn-on delay time
tr
Rise time
td(off)
Turn-off delay time
tf
Fall time
IC=200 A
(Note.5)
,
VGE=15 V
5.5
7.0
8.5
T j =25 °C
-
2.2
2.8
T j =125 °C
-
2.45
-
-
-
49.4
VCE=10 V, G-E short-circuited
-
-
5.6
-
-
1.06
VCC=1000 V, IC=200 A, VGE=15 V
-
1330
-
-
-
550
VCC=1000 V, IC=200 A, VGE=±15 V,
RG=2.4 Ω, Inductive load
-
-
190
-
-
750
-
-
350
V
nF
nC
ns
VEC
(Note.1)
Emitter-collector voltage
IE=200 A
-
2.3
3.0
V
trr
(Note.1)
Reverse recovery time
VCC=1000 V, IE=200 A, VGE=±15 V,
-
-
450
ns
Qrr
(Note.1)
μC
(Note.5)
, G-E short-circuited
Reverse recovery charge
RG=2.4 Ω, Inductive load
-
20
-
Eon
Turn-on switching energy per pulse
VCC=1000 V, IC=IE=200 A,
-
94.5
-
Eoff
Turn-off switching energy per pulse
VGE=±15 V, RG=2.4 Ω, T j =125 °C,
-
58.7
-
Reverse recovery energy per pulse
Inductive load
-
50.7
-
mJ
Internal gate resistance
Per switch, T c =25 °C
-
3.0
-
Ω
Err
(Note.1)
rg
mJ
THERMAL RESISTANCE CHARACTERISTICS
Symbol
Rth(j-c)Q
Rth(j-c)D
Rth(c-s)
Item
Thermal resistance
(Note.2)
Contact thermal resistance
Limits
Conditions
(Note.2)
Min.
Typ.
Max.
Unit
Junction to case, per IGBT
-
-
0.063
K/W
Junction to case, per FWDi
-
-
0.11
K/W
-
0.02
-
K/W
Case to heat sink, per 1/2 module,
Thermal grease applied
(Note.6)
MECHANICAL CHARACTERISTICS
Symbol
Mt
Ms
m
ec
Item
Mounting torque
Weight
Flatness of base plate
Limits
Conditions
Min.
Typ.
Max.
Unit
Main terminals
M 6 screw
3.5
4.0
4.5
N·m
Mounting to heat sink
M 6 screw
3.5
4.0
4.5
N·m
-
400
-
g
-100
-
+100
μm
On the centerline X, Y
Publication Date : June.2011
2
(Note.7)
< IGBT MODULES >
CM200DY-34A
HIGH POWER SWITCHING USE
INSULATED TYPE
-:Concave
+:Convex
Note1. Represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi).
2. Case temperature (TC) and heat sink temperature (T s ) are defined on the each surface (mounting side) of base plate and heat sink just under
the chips. Refer to the figure of chip location.
The heat sink thermal resistance should measure just under the chips.
3. Pulse width and repetition rate should be such that the device junction temperature (T j ) dose not exceed T j m a x rating.
4. Junction temperature (T j ) should not increase beyond T j m a x rating.
5. Pulse width and repetition rate should be such as to cause negligible temperature rise. Refer to the figure of test circuit.
6. Typical value is measured by using thermally conductive grease of λ=0.9 W/(m·K).
7. Base plate (mounting side) flatness measurement points (X, Y) are as follows of the following figure.
X
3 mm
mounting
side
Y
-:Concave
mounting
side
mounting side
+:Convex
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Item
(DC) Supply voltage
Conditions
Applied across C1-E2
Limits
Min.
Typ.
Max.
-
1000
1100
Unit
V
VGEon
Gate (-emitter drive) voltage
Applied across G1-Es1/G2-Es2
13.5
15.0
16.5
V
RG
External gate resistance
Per switch
2.4
-
24
Ω
CHIP LOCATION (Top view)
Dimension in mm, tolerance: ±1 mm
Tr1/Tr2: IGBT, Di1/Di2: FWDi
Publication Date : June.2011
3
< IGBT MODULES >
CM200DY-34A
HIGH POWER SWITCHING USE
INSULATED TYPE
TEST CIRCUIT AND WAVEFORMS
C1
VGE=15 V
IC
G1
V
Es1
VGE =15 V
Tr1
Shortcircuited
IE
E2
Es2
E2
Di1
Di2
V C E s a t test circuit
VEC test circuit
~
vGE
iE
90 %
Q rr =0.5×I rr ×t r r
iE
0V
0
t
Load
t rr
IE
+
VCC
iC
t
0A
~
-V GE
C2E1
G2
Es2
Tr2
V
Es1
G2
E2
Es2
E2
Es2
G1
C2E1
Shortcircuited
IC
G2
G2
IE
Es1
V
C2E1
C1
Shortcircuited
G1
C2E1
Shortcircuited
C1
Shortcircuited
G1
Es1
V
C1
Shortcircuited
90 %
RG
+V GE
VGE
0V
Irr
VCE
iC
-V GE
0A
tr
t d (o n )
tf
t d( o ff)
t
Switching characteristics test circuit and waveforms
t r r , Q r r test waveform
iE
vCE
iC
iC
ICM
0.5×I r r
10%
VCC
ICM
VCC
IEM
vEC
vCE
t
0A
0
0.1×ICM
0.1×VCC
t
0
0.1×VCC
0.02×ICM
ti
ti
IGBT Turn-on switching energy
IGBT Turn-off switching energy
t
VCC
0V
t
ti
FWDi Reverse recovery energy
Turn-on / Turn-off switching energy and Reverse recovery energy test waveforms (Integral time instruction drawing)
Publication Date : June.2011
4
< IGBT MODULES >
CM200DY-34A
HIGH POWER SWITCHING USE
INSULATED TYPE
PERFORMANCE CURVES
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
OUTPUT CHARACTERISTICS
(TYPICAL)
T j =25 °C
400
VGE=15 V
VGE=20 V
4
13 V
12 V
COLLECTOR-EMITTER
SATURATION VOLTAGE VCEsat (V)
COLLECTOR CURRENT
IC (A)
15 V
300
11 V
200
10 V
100
T j =125 °C
3
T j =25 °C
2
1
9V
8V
0
0
0
2
4
6
8
COLLECTOR-EMITTER VOLTAGE
10
0
VCE (V)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
200
300
400
IC (A)
FREE WHEELING DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
T j =25 °C
G-E short-circuited
10
1000
IC=400 A
IC=200 A
IE (A)
T j =125 °C
IC=80 A
EMITTER CURRENT
8
COLLECTOR-EMITTER
SATURATION VOLTAGE VCEsat (V)
100
COLLECTOR CURRENT
6
4
100
T j =25 °C
2
0
5
10
15
GATE-EMITTER VOLTAGE
10
0.5
20
VGE (V)
1.0
1.5
2.0
2.5
3.0
EMITTER-COLLECTOR VOLTAGE
Publication Date : June.2011
5
3.5
VEC (V)
4.0
< IGBT MODULES >
CM200DY-34A
HIGH POWER SWITCHING USE
INSULATED TYPE
PERFORMANCE CURVES
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL)
VCC=1000 V, VGE=±15 V, RG=2.4 Ω,
T j =125 °C, INDUCTIVE LOAD
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL)
VCC=1000 V, IC=200 A, VGE=±15 V,
T j =125 °C, INDUCTIVE LOAD
1000
10000
tf
td(off)
SWITCHING TIME
SWITCHING TIME
(ns)
(ns)
td(on)
100
tr
10
td(off)
td(on)
1000
tr
tf
100
10
100
1000
COLLECTOR CURRENT
1
IC (A)
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL)
VCC=1000 V, VGE=±15 V, RG=2.4 Ω, T j =125 °C
INDUCTIVE LOAD, PER PULSE
100
10
EXTERNAL GATE RESISTANCE
100
RG (Ω)
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL)
VCC=1000 V, IC/IE=200 A, VGE=±15 V, T j =125 °C
INDUCTIVE LOAD, PER PULSE
1000
1000
Eon
100
Err
1
100
Eon
100
Eoff
Err
10
10
10
SWITCHING ENERGY (mJ)
REVERSE RECOVERY ENERGY (mJ)
10
REVERSE RECOVERY ENERGY (mJ)
SWITCHING ENERGY (mJ)
Eoff
1
1000
10
EXTERNAL GATE RESISTANCE
COLLECTOR CURRENT IC (A)
EMITTER CURRENT IE (A)
Publication Date : June.2011
6
100
RG (Ω)
< IGBT MODULES >
CM200DY-34A
HIGH POWER SWITCHING USE
INSULATED TYPE
PERFORMANCE CURVES
FREE WHEELING DIODE
REVERSE RECOVERY CHARACTERISTICS
(TYPICAL)
VCC=1000 V, VGE=±15 V, RG=2.4 Ω,
T j =25 °C, INDUCTIVE LOAD
CAPACITANCE CHARACTERISTICS
(TYPICAL)
G-E short-circuited, T j =25 °C
100
1000
Cies
CAPACITANCE (nF)
10
t r r (ns), I r r (A)
trr
Coes
100
Irr
1
Cres
0.1
10
0.1
1
10
100
COLLECTOR-EMITTER VOLTAGE
10
EMITTER CURRENT
TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS
(MAXIMUM)
IC=200 A, T j =25 °C
Single pulse, TC=25°C
R t h ( j - c ) Q =0.063 K/W, R t h ( j - c ) D =0.11 K/W
1
Zth(j-c)
NORMALIZED TRANSIENT THERMAL IMPEDANCE
VCC=1000 V
VGE (V)
1000
IE (A)
GATE CHARGE CHARACTERISTICS
(TYPICAL)
20
GATE-EMITTER VOLTAGE
100
VCE (V)
15
VCC=800 V
10
5
0
0
500
1000
GATE CHARGE
1500
2000
QG (nC)
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
TIME (S)
Publication Date : June.2011
7
0.1
1
10
< IGBT MODULES >
CM200DY-34A
HIGH POWER SWITCHING USE
INSULATED TYPE
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Publication Date : June.2011
8
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