WJ ECP053D-PCB2600 1/2 watt, high linearity ingap hbt amplifier Datasheet

ECP053
The Communications Edge TM
½ Watt, High Linearity InGaP HBT Amplifier
• Single Positive Supply (+5V)
• Available in SOIC-8 or 16pin
4mm QFN package
Applications
•
•
•
•
W-LAN
RFID
DMB
Fixed Wireless
The ECP053 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity and medium
power is required. An internal active bias allows the
ECP053 to maintain high linearity over temperature and
operate directly off a single +5V supply.
This
combination makes the device an excellent candidate for
driver amplifier stages in wireless-LAN, digital
multimedia broadcast, or fixed wireless applications. The
device can also be used in next generation RFID readers.
N/C
N/C
15
14
13
12 N/C
N/C 2
11 RF OUT
RF IN 3
10 RF OUT
9 N/C
N/C 4
5
6
7
8
N/C
• 13 dB Gain @ 2450 MHz
16
Vref 1
N/C
• +43 dBm Output IP3
Vbias
• +28 dBm P1dB
The ECP053 is a high dynamic range driver amplifier in
a low-cost surface mount package. The InGaP/GaAs
HBT is able to achieve high performance for various
narrowband-tuned application circuits with up to +43
dBm OIP3 and +28 dBm of compressed 1dB power. It is
housed in an industry standard SOIC-8 or 16-pin 4x4mm
QFN SMT package. All devices are 100% RF and DC
tested.
N/C
• 2300 – 2700 MHz
Functional Diagram
N/C
Product Description
N/C
Product Features
Product Information
ECP053D
Vref 1
8
Vbias
N/C 2
7
RF OUT
RF IN 3
6
RF OUT
N/C 4
5
N/C
ECP053G
Specifications (1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Operating Current Range, Icc (3)
Device Voltage, Vcc
Units Min
MHz
MHz
dB
dB
dB
dBm
dBm
dB
MHz
dB
dB
dB
dBm
dBm
mA
V
Typ
2300
200
Max
2700
2450
13
20
8
+27
+42
5.3
2600
12
23
8
+27
+42
250
+5
300
Test conditions unless otherwise noted.
1. T = 25ºC, Vsupply = +5 V, Frequency = 2650 MHz, in tuned application circuit.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. It is expected that the current can increase by an additional 50 mA at P1dB. Pin 1 is used as a
reference voltage for the internal biasing circuitry. It is expected that Pin 1 will pull 12mA of current when used with a series bias resistor of R1=100Ω. (ie. total device current typically will be 262 mA.)
Absolute Maximum Rating
Parameters
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Voltage
Device Current
Device Power
Rating
-40 to +85 °C
-65 to +150 °C
+28 dBm
+8 V
400 mA
2W
Ordering Information
Part No.
Description
ECP053D
ECP053G
ECP053D-PCB2450
ECP053D-PCB2600
ECP053G-PCB2450
ECP053G-PCB2600
½ Watt InGaP HBT Amplifier (16p 4mm Pkg)
½ Watt InGaP HBT Amplifier (Soic-8 Pkg)
2450 MHz Evaluation Board
2600 MHz Evaluation Board
2450 MHz Evaluation Board
2600 MHz Evaluation Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
August 2004
ECP053
The Communications Edge TM
1/2 Watt, High Linearity InGaP HBT Amplifier
Product Information
ECP053G (SOIC-8 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“ECP053G” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235° C convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Diagram
Land Pattern
1
8
2
7
3
6
4
5
Function
Vref
Input
Output
Vbias
GND
N/C or GND
Pin No.
1
3
6, 7
8
Backside Paddle
2, 4, 5
Mounting Config. Notes
1.
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85° C
62° C / W
162° C
Notes:
1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85° C. Tjc is a function
of the voltage at pins 6 and 7 and the current applied to
pins 6, 7, and 8 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
250 mA at an 85° C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247° C.
2.
MTTF vs. GND Tab Temperature
100000
MTTF (million hrs)
Thermal Specifications
3.
4.
10000
5.
1000
6.
7.
8
100
60
70
80
90
100
110
A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
All dimensions are in millimeters (inches). Angles are in
degree
120
Tab Temperature (°C)
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
August 2004
ECP053
The Communications Edge TM
1/2 Watt, High Linearity InGaP HBT Amplifier
Product Information
ECP053D (16-pin 4x4mm Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“ECP053D” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
DEVICE GROUND PAD
2.0mm X 2.0mm
RECOMMENDED PAD
0.76mm X 0.34mm
Notes:
1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85° C. Tjc is a function
of the voltage at pins 10 and 11 and the current applied
to pins 10, 11, and 16 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
250 mA at an 85° C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247° C.
13
12 N/C
N/C 2
11 RF OUT
RF IN 3
10 RF OUT
9 N/C
7
8
N/C
6
N/C
5
Pin No.
1
3
10, 11
16
Backside Paddle
2, 4-9, 12-15
MTTF vs. GND Tab Temperature
100000
MTTF (million hrs)
Rating
-40 to +85° C
62° C / W
162° C
14
Function
Vref
RF Input
RF Output
Vbias
GND
N/C or GND
16L 4.0mm X 4.0mm PACKAGE
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
15
N/C
SOLDERMASK SWELL TO BE 0.5mm
FROM OUTSIDE EDGE OF ALL PADS
Parameter
16
Vref 1
N/C 4
TYP.
4.00mm
Thermal Specifications
N/C
GROUND PLANE AREA FOR VIAS
2.23mm X 2.23mm
N/C
Functional Diagram
N/C
0.65mm
TYP.
MSL Rating: Level 3 at +235° C convection reflow
Standard:
JEDEC Standard J-STD-020
Vbias
0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE
ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO
BOTTOM, AND INTERNAL GROUIND PLANES IN ORDE
MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MA
VIA BARREL PLATTING TO BE MIN. 0.0014 THICK. VIA
PLUGGED WITH EITHER CONDUCTIVE OR NON-COND
EPOXY TO PREVENT SOLDER. DRAINS THROUGH VI
REFLOW PROCESS
N/C
Land Pattern
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Mounting Config. Notes
10000
1.
2.
1000
3.
100
60
70
80
90
100
110
120
4.
Tab Temperature (°C)
5.
6.
7.
8
A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
August 2004
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