TI1 LM3279 Buck-boost converter Datasheet

Sample &
Buy
Product
Folder
Technical
Documents
Support &
Community
Tools &
Software
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
LM3279 Buck-Boost Converter With MIPI® RFFE Interface
for 3G And 4G RF Power Amplifiers
1 Features
•
•
1
•
•
•
•
•
•
•
•
•
•
3 Description
®
MIPI RFFE Digital Control Interface
High-Efficiency PFM and PWM Modes with
Internal Seamless Transition
Operates from a Single Li-Ion Cell: 2.7 V to 5.5 V
Adjustable Output Voltage:
– RFFE Digital Control: 0.4 V to 4.2 V
– Analog Control: 0.5 V to 4.2 V
1-A Maximum Load Capability for VBATT ≥ 3.2 V,
VOUT = 3.6 V
2.4-MHz (typ.) Switching Frequency
Seamless Buck-Boost Mode Transition
Fast Output Voltage Transition: 0.8 V to 4 V in 20
µs
High-Efficiency: 95% typ. at VBATT = 3.7 V,
VOUT = 3.3 V, at 300 mA
Input Overcurrent Limit
Output Overvoltage Clamp
Internal Compensation
2 Applications
•
•
•
•
3G/4G Smartphones
RF PC Cards
Tablets, eBooks Readers
Battery-Powered RF Devices
The LM3279 is a buck-boost DC/DC converter
designed to generate output voltages above or below
a given input voltage and is particularly suitable for
Power Amplifiers operating from single-cell Li-Ion
batteries in portable applications.
The LM3279 has four modes of operation: Pulse
Width Modulation (PWM), Pulse Frequency
Modulation (PFM), standby, and shutdown. During
normal conditions, the LM3279 operates in full
synchronous PWM mode at 2.4-MHz typical switching
frequency, providing seamless transitions between
buck and boost operating regimes. Energy-saving
PFM mode increases efficiencies and current savings
during low-power RF transmission modes. For hightransmit power, the device operates in PWM buck or
boost mode, whereas the device can transition
between PWM and PFM modes during low-power
transmit. The LM3279 can be controlled either via an
included MIPI RFFE Digital Control Interface or by
using an analog control from an external MCU,
offering design flexibility.
The power converter topology enables minimum total
solution size by using one small footprint and case
size inductor and two surface mount capacitors.
The LM3279 is internally compensated for buck and
boost modes of operation thus providing an optimal
transient response.
Device Information(1)
PART NUMBER
PACKAGE
LM3279
DSBGA (16)
BODY SIZE (MAX)
2.529 mm x 2.146 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
PWM Efficiency (VOUT = 2.4 V)
1.5 ÛH
100
SW2
VBATT: 2.7V to 5.5V
PVIN
VOUT
SVIN
FB
X
LM3279
VCON
EN
RF PA(s)
10 ÛF
10 ÛF
VIO
GPO0
SDATA
GPO1
SCLK
DGND
SGND
90
VOUT: 0.4V to 4.2V
2 x 0.47 ÛF
(PA decoupling caps)
EFFICIENCY (%)
SW1
80
70
60
PVIN = 2.7V
PVIN = 3.0V
PVIN = 3.6V
PVIN = 4.2V
50
PGND
40
RF Control
Bits
BB or
RFIC
0
100 200 300 400 500 600 700
OUTPUT LOAD (mA)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
Absolute Maximum Ratings ...................................... 4
Handling Ratings ...................................................... 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 5
Electrical Characteristics........................................... 5
System Characteristics ............................................ 6
System Characteristics Recommended Capacitance
Specifications ............................................................. 7
6.8 Typical Performance Characteristics ....................... 9
7
Detailed Description ............................................ 12
7.1
7.2
7.3
7.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
12
13
13
15
7.5 Programming........................................................... 16
7.6 Registers ................................................................. 19
8
Application and Implementation ........................ 21
8.1 Application Information............................................ 21
8.2 Typical Application ................................................. 21
9 Power Supply Recommendations...................... 24
10 Layout................................................................... 25
10.1
10.2
10.3
10.4
Layout Guidelines .................................................
Layout Examples...................................................
DSBGA Package Assembly And Use ...................
Manufacturing Considerations ..............................
25
26
30
30
11 Device and Documentation Support ................. 31
11.1
11.2
11.3
11.4
11.5
Device Support ....................................................
Documentation Support .......................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
31
31
31
31
31
12 Mechanical, Packaging, and Orderable
Information ........................................................... 31
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (November 2013) to Revision C
•
Page
Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application
and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and
Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section .............. 1
Changes from Revision A (May 2013) to Revision B
Page
•
Changed Analog control 0.6V to 0.5V .................................................................................................................................... 1
•
Changed 0.2V ≤ VCON ≤ 1.4V to 0.167V ≤ VCON ≤ 1.4V .................................................................................................... 6
•
Changed 0.2 V to 0.167 V ...................................................................................................................................................... 6
•
Changed 0.6 V to 3.4 V to 1.6 V to 3.4 V............................................................................................................................... 7
•
Changed 200 from max. to typ. .............................................................................................................................................. 7
•
Changed 0.2V (min.) to 1.4V (max. typ.) to 0.167V (min.) to 1.4V (max. typ.); from 0.6V to 4.2V output to from 0.5V
to 4.2V output ....................................................................................................................................................................... 14
•
Added (default) ..................................................................................................................................................................... 19
•
Added (default) ..................................................................................................................................................................... 19
2
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
5 Pin Configuration and Functions
DSBGA
16 Pins
1
2
3
4
A
SCLK
GPO0
GPO1
SVIN
B
SDATA
VCON
EN
PVIN
C
VIO
FB
SGND
SW1
D
GND
VOUT
SW2
PGND
Top View (Bumps Down)
Pin Functions
PIN
TYPE
DESCRIPTION
NUMBER
NAME
A1
SCLK
IN
Digital control interface (DCON) RFFE Bus clock input. Typically connected to RFFE master
on RF or Baseband IC. SCLK must be held low when VIO is not applied.
B1
SDATA
I/O
Digital control interface (DCON) RFFE Bus data input/output. Typically connected to RFFE
master on RF or Baseband IC. SDATA must be held low when VIO is not applied.
Digital control interface (DCON) 1.8-V supply input. VIO functions as the RFFE interface
reference voltage. VIO also functions as a reset and enable input to LM3279. Bypass
capacitor should be connected between VIO and GND. Typically connected to voltage
regulator controlled by RF or Baseband IC. When VIO = HIGH, EN shall be connected to
GND.
C1
VIO
IN
D1
GND
Ground
A2
GPO0
I/O
Multipurpose GPIO. When VIO = HIGH, GPO0 is a general purpose output for configuring RF
front end circuitry. When the GPO0 control bit in Register 02 is set to 1, the output is driven
to a 1.8-V (VIO) high logic level. The output is pulled to a low logic level when the GPO0
control bit is set to 0. (Input has an internal pull-up resistor.)
B2
VCON
IN
Voltage Control Analog input. When EN = HIGH, VCON controls the output voltage in PWM
and PFM modes. When in Digital control, VCON can be left as no connect or connected to
system ground.
C2
FB
Ground
D2
VOUT
PWR
A3
GPO1
I/O
Multipurpose GPIO. When VIO = HIGH, GPO1 is a general purpose output for configuring RF
front end circuitry. When the GPO1 control bit in Register 02 is set to 1, the output is driven
to a 1.8-V (VIO) high logic level. The output is pulled to a low logic level when the GPO1
control bit is set to 0. (Input has an internal pull-up resistor.)
B3
EN
IN
Enable Pin. Pulling this pin higher than 1.2 V enables part to function in analog control mode.
VIO must be tied to ground.
C3
SGND
Ground
D3
SW2
PWR
Switch pin for Internal Power Switches M3 and M4. Connect inductor between SW1 and
SW2.
A4
SVIN
PWR
SVIN is no connect. Analog supply is internally connected to PVIN.
B4
PVIN
PWR
Power MOSFET input and power current input pin. Optional low-pass filtering may help
reduce radiated EMI and noise during buck and buck-boost modes.
C4
SW1
PWR
Switch pin for Internal Power Switches M1 and M2. Connect inductor between SW1 and
SW2.
D4
PGND
Ground
Digital Ground.
Feedback input to inverting input of error amplifier. Connect output voltage directly to this
node at load point.
Regulated output voltage of LM3279. Connect this to a 10-µF ceramic output filter capacitor
to GND.
Signal Ground for analog circuits and control circuitry.
Power Ground for Power MOSFETs and gate drive circuitry.
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
3
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
PVIN, VOUT to GND
MIN
MAX
−0.2
6
PGND −0.2
0.2
VIO, SDATA, SCLK, EN, VCON, GPO1/GPO0 to SGND, GND
−0.2
6
FB to PGND
−0.2
6
(PGND −0.2V)
6
PGND to SGND, GND
SW1, SW2
Continuous power dissipation
(3)
150
Maximum lead temperature (soldering)
(2)
(3)
(4)
V
Internally limited
Maximum operating junction temperature (TJ-MAX)
(1)
UNIT
See
°C
(4)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the potential at the GND pins.
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and
disengages at TJ = 125°C (typ.).
For detailed soldering specifications and information, please refer to Texas Instruments Application Note 1112: DSBGA Wafer Level
Chip Scale Package (SNVA009).
6.2 Handling Ratings
Tstg
Storage temperature range
V(ESD)
(1)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
all pins (1)
MIN
MAX
UNIT
–45
150
°C
0
1000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
NOM
MAX
UNIT
Input voltage
2.7
5.5
Output voltage (digital control)
0.4
4.212
0
1000
mA
–30
85
°C
Recommended current load
Operating ambient temperature (TA) (3)
(1)
(2)
(3)
4
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the potential at the GND pins.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
6.4 Thermal Information
DSBGA
THERMAL METRIC (1)
YZR
UNIT
16 PINS
RθJA
Junction-to-ambient thermal resistance
70.1
RθJC(top)
Junction-to-case (top) thermal resistance
14.4
RθJB
Junction-to-board thermal resistance
10
ψJT
Junction-to-top characterization parameter
1.7
ψJB
Junction-to-board characterization parameter
10
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
(1)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics (1)
Limits are for TA = TJ = 25°C, and specifications apply to the LM3279 Typical Application Circuits with: PVIN = 3.8 V, VIO or
EN = 1.8 V, unless otherwise specified.
PARAMETER
VFB,MIN
VFB,MAX
Minimum FB voltage
Maximum FB voltage
TEST CONDITIONS
VSET = 0Bh
VCON = 0.167 V
VSET = 75h
VCON = 1.4 V
MIN
TYP
MAX
0.35
0.40
0.45
0.43
0.5
0.570
4.122
4.212
4.302
4.11
4.2
4.29
UNIT
V
(2)
IQ_PWM
DC bias current in PVIN, SVIN
No switching
FB = HIGH
Max limits = −30°C ≤ TJ = TA ≤ 85°C
1.4
2
mA
ISHDN
Shutdown supply current
VIO = EN = 0 V, VCON = 0 V,
SW1 = SW2 = VOUT = 0 V
Max limits = −30°C ≤ TJ = TA ≤ 85°C
0.2
2
µA
IQ
Standby supply current
VIO = 1.8 V, VSET_CTRL = 02h,
SW1 = SW2 = VOUT = 0 V
1.2
STBY
ILIM_L
Input current limit (large)
Open Loop
(3)
ILIM_S
Input current limit (small)
Open Loop
(3)
ƒOSC_PWM
Internal oscillator frequency
PWM
Min and Max limits = −30°C ≤ TJ = TA ≤ 85°C
fSCLK
SCLK clock frequency
IVIO-IN
VIO voltage average input current
ISDATA
IIL
ISCLK
ISDATA
IIH
ISCLK
Input high-level threshold EN, GPO0,
GPO1
VIH
Input low-level threshold EN, GPO0,
GPO1
VIL
VIH-SDATA,
VCON = 1.2 V
1500
1700
VCON = 0.2 V
700
850
2.1
2.4
0.032
VIN = 0.8*VIO
mA
2.7
1.25
−2
−1
1
−2
10
−1
10
V
0.6
0.7*VIO
Input low-level threshold SDATA,
SCLK
0.3*VIO
0.6*VIO
SCLK
VOH-SDATA
Output high-level threshold SDATA
ISDATA = −2 mA
0.8*VIO
VIO + 0.01
VOL-SDATA
Output low-level threshold SDATA
ISDATA = 2 mA
VOH-GPO
Output high-level threshold GPO
IOUT = ±200 µA
VIO−0.15V
VIO+0.1V
VOL-GPO
Output low-level threshold GPO
IOUT = ±200 µA
−0.4
0.3
VSET-LSB
Output voltage LSB
VSET_CTRL = 40h to 41h
IEN
EN pin pulldown current
VIO = 0 V
(1)
(2)
(3)
µA
1.2
Min and Max limits = −30°C ≤ TJ = TA ≤ 85°C
0.4*VIO
VIL-SDATA,
mA
1
Input high-level threshold SDATA,
SCLK
SCLK
MHz
26
VIO = 1.8 V, Average during 26-MHz write
VIN = 0.2*VIO
mA
V
0.2*VIO
36
5
V
mV
10
µA
Min and Max limits are specified by design, test, or statistical analysis.
IQ specified here is when the part is not switching.
The parameters in the electrical characteristics table are tested under open loop conditions at PVIN = 3.8 V. For performance over the
input voltage range and closed loop results refer to the datasheet curves.
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
5
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
Electrical Characteristics(1) (continued)
Limits are for TA = TJ = 25°C, and specifications apply to the LM3279 Typical Application Circuits with: PVIN = 3.8 V, VIO or
EN = 1.8 V, unless otherwise specified.
PARAMETER
(4)
TEST CONDITIONS
Internal gain
ICON
VCON pin input leakage
EN = 3.8 V
IOUT_LEAKAGE
Leakage into VOUT pin of the buckboost
EN = 0, VOUT ≤ 4.2 V, VBATT ≤ 5.5 V
Max limits = −30°C ≤ TJ = TA ≤ 85°C
(4)
MIN
TYP
0.167 V ≤ VCON ≤ 1.4 V
Gain
MAX
UNIT
3
V/V
–1
1
µA
5
When using analog control (EN = HIGH) to calculate VOUT, use the following equation: VOUT = VCON × 3.
6.6 System Characteristics
The following spec table entries are specified by design and verifications, providing the component values in the typical
application circuits are used: L = 1.5 µH, DFE201610C-1R5M (2016)/TOKO; CIN and COUT each = 10 µF 6.3 V,
C105A106MQ5NUNC (0402)/Samsung; PA decoupling cap emulation = 0.47 µF, GRM033R60J474ME90 (0201)/Murata.
These parameters are not verified by production testing. Typical limits are TA = 25°C. Min and Max limits apply over the
full ambient temperature range (−30°C ≤ TA ≤ 85°C) and over the VIN range = 2.7 V to 5.5 V, unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
VBATT = 3.8 V, VIO = 1.8 V, RFFE write VSET = 3.42
V (VSET_CTRL = 5Fh), IOUT = 0mA
TYP
MAX
35
50
TON
Turn-on time (time for output
to reach 0V→90% × 3.4 V)
IOUT_MAX
Max output current
DMAX
Maximum duty cycle
FOSC_PFM
Internal oscillator frequency
PFM: VOUT = 0.6V, PVIN = 3.7 V
IOUT = 13 mA
CL
Load capacitance
Half speed readback SCLK = 13 MHz, not including
LM3279 capacitance.
TA = 25°C
CVCON
VCON input capacitance
VCON = 1V, Test frequency = 100 kHz, TA = 25°C
VCON_LIN
VCON linearity
0.167 V ≤ VCON ≤ 1.4 V
VIO
VIO I/O voltage level
1.8V Bus, TA = 25°C
Ripple voltage
VBATT ≥ 3.2 V, 0.6 ≤ VOUT ≤ 4.2 V,
0 mA ≤ IOUT ≤ 430 mA, TA = 25°C
15
PFM ripple
VOUT = 0.6 V, IOUT = 5mA
40
Ripple voltage in mode
transition
VBATT = 3 V to 5 V, Tr = Tf = 30s
3.3 V ≤ VOUT ≤ 4.2 V
50
Line regulation
VBATT = 3.2 V to 4.9 V, VOUT = 3.5 V,
PWM Operation
10
Load regulation
IOUT = 0 mA to 500 mA, VBATT = 3.2 V to 4.9 V,
PWM Operation
20
VO_RIPPLE
ΔVOUT
Line_tr
Line transient response
Load_tr
6
Load transient response
EN = L to H, VBATT = 3.8 V, VCON = 1.14 V,
IOUT = 0 mA
VBATT ≥ 3 V, VOUT = 3.8 V
750
VBATT ≥ 3.2 V, VOUT = 4.2 V
650
µs
mA
Boost (% M4 on)
50%
Buck (% M1 on)
100%
63
kHz
10
50
pF
10
pF
–2.5%
2.5%
1.65
1.8
1.95 V
50
mV
mV
VBATT = 3.6 V to 4.2 V, Tr = Tf = 10 µs,
VOUT = 3.5 V, RLOAD = 11.4 Ω, PWM
–100
100
VBATT = 3.6 V to 4.2 V, Tr = Tf = 10 µs,
VOUT = 0.8 V, RLOAD = 20 Ω, PFM
–5
5
IOUT = 1 mA to 200 mA, Tr = Tf = 1 µs,
VBATT = 4.2 V, VOUT = 3.5 V, PWM
–100
100
IOUT = 10 mA to 90 mA, Tr = Tf = 1 µs,
VBATT = 4.2 V, VOUT = 0.8 V, PFM
–10
10
Submit Documentation Feedback
UNIT
mV
mV
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
System Characteristics (continued)
The following spec table entries are specified by design and verifications, providing the component values in the typical
application circuits are used: L = 1.5 µH, DFE201610C-1R5M (2016)/TOKO; CIN and COUT each = 10 µF 6.3 V,
C105A106MQ5NUNC (0402)/Samsung; PA decoupling cap emulation = 0.47 µF, GRM033R60J474ME90 (0201)/Murata.
These parameters are not verified by production testing. Typical limits are TA = 25°C. Min and Max limits apply over the
full ambient temperature range (−30°C ≤ TA ≤ 85°C) and over the VIN range = 2.7 V to 5.5 V, unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
VOUT transient response
overshoot
VOUT_TR
TYP
MAX
200
VOUT transient response rise
time
mV
VBATT = 3.2 V to 4.2 V,
VOUT = 1.6 V to 3.4 V, Tr = Tf = 1 µs,
RLOAD = 5 Ω
20
µs
VOUT transient response fall
time
η
Efficiency
TS
Data setup time
TH
Data hold time
50
VBATT = 3 V, VOUT = 1.9 V,
IOUT = 20 mA (PWM)
77%
VBATT = 3 V, VOUT = 2.41 V,
IOUT = 60 mA (PWM)
91%
VBATT = 3 V, VOUT = 2.71 V,
IOUT = 200 mA (PWM)
94%
VBATT = 3 V, VOUT = 3.31 V,
IOUT = 480 mA (PWM)
93%
VBATT = 3.8 V, VOUT = 0.60 V,
IOUT = 10 mA (PFM)
57%
VBATT = 3.8 V, VOUT = 1 V,
IOUT = 20 mA (PFM)
75%
VBATT = 3.8 V, VOUT = 1.9 V,
IOUT = 20 mA (PWM)
68%
VBATT = 3.8 V, VOUT = 2.41 V,
IOUT = 70 mA (PWM)
88%
VBATT = 3.8 V, VOUT = 2.71 V,
IOUT = 200 mA (PWM)
94%
VBATT = 3.8 V, VOUT = 3.31 V,
IOUT = 480 mA (PWM)
94%
VBATT = 3 V, VOUT = 3.6 V,
IOUT = 200 mA (PWM)
94%
TA = 25°C
1
5
TSDATAOTR SDATA output transition time
(rise/fall time)
UNIT
VIO range = 1.65 V to 1.95 V, TA = 25°C
ns
2.1
6.5
6.7 System Characteristics Recommended Capacitance Specifications
BUS
MIN (µF)
TYP (µF)
MAX (µF)
VBATT
4.7
10
—
VOUT
3.0
13
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
7
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
VBATT
120 ns (min)
5 Ps (min)
SSC
50 Ps max
25 Ps max
RFFE write
VOUT = 3.42V
(REG03h
VSET_CTRL = 5Fh)
VBATT applied, VIO = 0V.
t0 LM3279 in Shutdown.
VIO applied.
t1 LM3279 in Low Power.
Low Power
Shutdown
Initialization
VOUT Settling
t2
VOUT programmed. LM3279 initializes
and powers up internal circuit blocks.
t3 Switcher is active in normal mode.
VIO
t4 Buck-Boost output settled (90%).
SDATA
Hi Z
3.42V
VOUT discharges
VOUT
SW
t0
t1
t2
t3
t4
Figure 1. Cold Power-Up
25 µs max
5 µs max
VBATT
> 2.7V
t0
Standby
VIO
Init
VOUT Settling
1.8V (typ)
LM3279 in Standby.
VBATT > 2.7V = VIO = 1.8V (typ)
VOUT programmed LM3279. Initializes and powers up
t1 internal circuit blocks. (Register set to default value.)
RFFE write
VOUT = 3.40V
(REG03h, VSET_CTRL= 5Fh)
t2 Switcher is active in normal mode
t3 Buck-Boost output settled (90%)
SDATA
3.40V
Hi Z
VOUT
SW
t0
t1
t2
t3
Figure 2. Standby To Active
8
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
6.8 Typical Performance Characteristics
(PVIN = EN = 3.6 V and TA = 25°C, unless otherwise noted)
VCON = VOUT = SW1 = SW2 = EN = 0 V
VOUT = 3.5 V
Figure 4. Switching Frequency vs Temperature
100
100
90
90
80
80
EFFICIENCY (%)
EFFICIENCY (%)
Figure 3. Shutdown Current vs Temperature
70
60
50
40
PVIN = 2.7V
PVIN = 3.0V
PVIN = 3.6V
PVIN = 4.2V
PVIN = 4.8V
30
20
10
70
60
50
40
PVIN = 2.7V
PVIN = 3.0V
PVIN = 3.6V
PVIN = 4.2V
PVIN = 4.8V
30
20
10
0
0
0
20
40
60
80
100
OUTPUT LOAD (mA)
0
120
VOUT = 1 V
90
90
EFFICIENCY (%)
100
80
70
PVIN = 2.7V
PVIN = 3.0V
PVIN = 3.6V
PVIN = 4.2V
50
40
60
80
100
OUTPUT LOAD (mA)
120
Figure 6. PFM Efficiency
100
60
20
VOUT = 1.4 V
Figure 5. PFM Efficiency
EFFICIENCY (%)
IOUT = 300 mA
80
70
60
PVIN = 2.7V
PVIN = 3.0V
PVIN = 3.6V
PVIN = 4.2V
50
40
40
0
100 200 300 400 500 600 700
OUTPUT LOAD (mA)
VOUT = 2.4 V
0
100 200 300 400 500 600 700
OUTPUT LOAD (mA)
VOUT = 3.6 V
Figure 7. PWM Efficiency
Figure 8. PWM Efficiency
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
9
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
Typical Performance Characteristics (continued)
(PVIN = EN = 3.6 V and TA = 25°C, unless otherwise noted)
No Load, RFFE Digital Control Mode
VOUT = 1.5 V
Figure 9. VSET_CTRL Voltage vs Output Voltage
VOUT = 2.5 V
Figure 10. Auto Efficiency Mode
VOUT = 3.4 V
Figure 11. Auto Efficiency Mode
Figure 12. Auto Efficiency Mode
SW1
2V/DIV
SW2
2V/DIV
20 mV/DIV
AC_Vout
400 ns/DIV
VOUT = 0.8 ↔ 2 V
PVIN = 3.8 V
RLOAD = 20 Ω
VOUT = 3.45 V
LOAD = 500 mA
Figure 14. Boost Mode Operation
Figure 13. VOUT Transient
10
PVIN = 3.37 V
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
Typical Performance Characteristics (continued)
(PVIN = EN = 3.6 V and TA = 25°C, unless otherwise noted)
SW1
2V/DIV
2V/DIV
EN
SW2
2V/DIV
VOUT
2V/DIV
1A/DIV
20 mV/DIV
AC_Vout
IL
20 s/DIV
400 ns/DIV
VOUT = 3.6 V
PVIN = 3.8 V
LOAD = 600 mA
VOUT = 3.45 V
PVIN = 3.6 V
LOAD = 350 mA
Figure 16. Start-Up
Figure 15. Buck-Boost Operation
20 µs/DIV
VOUT = 3 V
PVIN Step = 3.6 V ↔ 4.2 V
LOAD = 3200 mA
VOUT = 3.5 V
VSET_CTRL = 0x5F
Figure 17. Line Transient For DC/DC
PVIN = 4.2 V
VIO = 1.8 V
Figure 18. Standby-To-Active Mode
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
11
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
7 Detailed Description
7.1 Overview
The LM3279 buck-boost converter provides high-efficiency, low-noise power for RF power amplifiers (PAs) in
mobile phones, portable communicators and similar battery powered RF devices. It is designed to allow the RF
PA to operate at maximum efficiency for a wide range of power levels from a single Li-Ion battery cell. The
capability of LM3279 to provide an output voltage lower than as well as higher than the input battery voltage
enables the PA to operate with high linearity for a wide range of battery voltages, thereby extending the usable
voltage range of the battery. The converter feedback loop is internally compensated for both buck and boost
operation, and the architecture is such that it provides seamless transition between buck and boost mode of
operation. The LM3279 operates in energy-saving Pulse Frequency Modulation (PFM) mode for increased
efficiencies and current savings during low-power RF transmission modes. The output voltage is dynamically
programmable from 0.4 V to 4.2 V by either programming the VSET value in register 00h, or adjusting the
voltage on the control pin VCON. The fast output voltage transient response of LM3279 makes it suitable for
adaptively adjusting the PA supply voltage depending on its transmitting power which improves systems
efficiency and prolongs battery life
Additional features include current-overload protection, output overvoltage clamp, and thermal-overload
shutdown.
The LM3279 is constructed using a chip-scale 16-bump DSBGA package that offers the smallest possible size
for space-critical applications such as cell phones where board area is an important design consideration. Use of
a high switching frequency (2.4 MHz, typ.) reduces the size of external components. As shown in Figure 24 and
Figure 27, only three external power components are required for circuit operation. Use of a DSBGA package
requires special design considerations for implementation. (See DSBGA Package Assembly And Use in the
Layout section.) Its fine bump-pitch requires careful board design and precision assembly equipment. Use of this
package is best suited for opaque-case applications where its edges are not subjected to high-intensity ambient
red or infrared light. In addition, the system controller should set VIO = LOW (or EN if system implementation
with analog VCON) during power-up and other low supply-voltage conditions.
12
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
7.2 Functional Block Diagram
SVIN
PVIN
SW1
SW2
VOUT
SMALL
FET
LARGE
FET
M6 _G
GATE
DRIVE
CIRCUITS
M1
M2
M6
M3
M5
M4
+
REF
FB
NETWORK
PFM
COMPARATOR
+
1.7A
Error
Amp
CONTROL
LOGIC
-
EN
+
VCON
-
FB
INPUT OVER CURRENT
PROTECTION
EN
ONE SHOT
TIMER
XOR
INTERNAL
LOOP
COMPENSATION
M6_G
CLK
PWM RAMP
7
VSET
DAC
SGND
PGND
RFFE
DGND
VIO
SDATA SCLK
GPO1
GPO0
7.3 Feature Description
7.3.1 Dynamically Adjustable Output Voltage
The LM3279 features a dynamically adjustable output voltage to eliminate the need for external feedback
resistors. The output can be set from 0.4 V to 4.2 V by either programming the VSET value in register 00h, or by
changing the voltage on the analog VCON pin when implementing analog control. This feature is useful in cellphone RF PA applications where peak power is needed only when the handset is far away from the base station
or when data is being transmitted. In other instances, the transmitting power can be reduced. Hence, the supply
voltage to the PA can be reduced, promoting longer battery life. In order to adaptively adjust the supply voltage
to the PA in real time in a cell-phone application, the output-voltage transition should be fast enough in order to
meet the RF transmit signal specifications. The LM3279 offers ultra-fast output-voltage transition without drawing
very large currents from the battery supply. For a current limit of 1700 mA (typ.), the output voltage can transition
from 0.6 V to 3.4 V in less than 20 µs with a load resistance of 5 Ω at VBATT = 3.8 V.
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
13
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
Feature Description (continued)
7.3.2 Seamless Mode Transition
In a typical non-inverting buck-boost converter, all four power switches M1 through M4 are switched every cycle.
This operation increases MOSFET drive losses and lowers the converter efficiency. The LM3279 switches only
two power switches every cycle to improve converter efficiency. Hence, it operates either as buck converter or a
boost converter depending upon the input and output voltage conditions. This creates a boundary between the
buck and boost mode of operation. When the input battery voltage is close to the set output voltage, the
converter automatically switches to a four-switch operation seamlessly such that the output voltage does not see
any perturbations at the mode boundary. The excellent mode-transition capability of the LM3279 enables lownoise output with highest efficiency. Internal feedback loop compensation ensures stable operation in buck,
boost, and buck-boost modes, as well as during mode transitions.
7.3.3 Setting The Output Voltage
The output voltage can be set by two methods: via Analog Control or Digital Control.
In the Analog Control method, the VCON pin is an external analog control input pin. It can be enabled (EN =
HIGH) or disabled (EN = LOW). An analog voltage is provided by an external MCU (either a D/A or averaged
PWM output) to the VCON pin. The range of this signal is 0.167V (min.) to 1.4V (max. typ.) to provide the full
range of the possible output voltage. This signal is internally amplified by a gain of 3 to go from 0.5V to 4.2V
output.
For the Digital Control method, the output voltage is set by writing a 7-bit value to reg 00h, bits 0 through 6.
Programming a value 00h will force the LM3279 into low-power mode where the entire device except the RFFE
interface is turned off. Programming register 00h with the value 02h will place the LM3279 into Standby mode
where the SW pin is tri-stated. Values programmed above 0Bh will determine the output voltage from 0.4 V to
4.212 V in 36 mV (typ.) increments.
The output voltage quickly adjusts to the new output voltage value within 20 microseconds both in the positive
and negative directions. To accomplish this, the LM3279 buck-boost output can both source and sink current. In
the positive direction the buck may assume a 100-percent duty cycle or enter boost mode at up to 50% duty
cycle to provide the required current. In the negative direction, the synchronous rectifier (NFET) will remain on to
sink current from the output capacitor.
7.3.4 General Purpose Outputs
The LM3279 provides two general-purpose outputs to control the RF front-end circuitry. These outputs have a
maximum output voltage of 1.8 V. These bits are set by writing to register 02h bits 6 (GPO1) and bit 7 (GPO0).
7.3.5 VCONON
When EN = HIGH, the output is disabled when VCON is below 125 mV (typ.). It is enabled when VCON is above
150 mV (typ.). The threshold has 25 mV (typ.) of hysteresis.
7.3.6 RDSON Management
The LM3279 has a unique RDSON-management function to improve efficiency in both the low-output voltage and
high-output voltage conditions. For VSET < 2.1 V (typ.) or VCON < 0.7 V (typ.), the device uses only a small part
of the PMOSFET M1 to minimize drive loss of the PMOSFET. When VSET > 2.175 V or VCON > 0.725 V, a
large PMOSFET is also used along with the small PMOSFET. The threshold has a 25 mV of hysteresis. For RF
PAs, the current consumption typically increases with its supply voltage; thus, higher supply voltage for a PA also
means higher power delivered to it. Hence, adding a large PMOSFET for VSET > 2.175 V or VCON > 0.725 V
reduces the conduction losses, thereby achieving high efficiency. The LM3279 can also provide output voltages
higher than the battery voltage. This boost mode of operation is typically used when the battery voltage has
discharged to a low voltage that is not sufficient to provide the required linearity in the PA. A special RDSONmanagement scheme is designed for operation well into boost mode so that an auxiliary PMOSFET switch is
also turned on along with Large and Small PMOSFET switches, effectively reducing the RDSON of M1 to a very
low value in order to keep the efficiency maximum. Since M1 conducts all the time in boost mode, reducing the
RDSON of M1 achieves significant improvement in efficiency.
14
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
Feature Description (continued)
7.3.7 Supply Current Limit
A current limit feature allows the LM3279 to protect itself and external components during overload conditions. In
Pulse Width Modulation (PWM) mode, a 1700 mA (typ.) cycle-by-cycle current limit is normally used when VOUT
is above 2.1 V (typ.) and an 850 mA (typ.) limit is used when VOUT is below 2.1 V (typ.). If an excessive load pulls
the output voltage down to approximately 0.30 V, the device switches to a timed current-limit mode, and the
current limit in this mode is 850 mA (typ.), independent of the set VOUT voltage. In timed current limit mode, the
internal PMOSFET switch M1 is turned off after the current limit is hit, and the beginning of the next cycle is
inhibited for 3.5 μs to force the instantaneous inductor current to ramp down to a safe value.
7.3.8 Reverse Current Limit
Since the LM3279 features a dynamically adjustable output voltage, the inductor current can build up to high
values in either direction depending on the output voltage transient. For a low-to-high output voltage transient,
the inductor current flows from SW1 pin to SW2 pin; this current is limited by the current-limit feature monitoring
of MOSFET M1. For a high-to-low output voltage transient, the inductor current flows from SW2 pin to SW1 pin
and this current needs to be limited to protect the LM3279 as well as the external components. A reverse current
limit feature allows monitoring the reverse inductor current that also flows through MOSFET M2. A −1.2 A (typ.)
cycle-by-cycle current limit is used to limit the reverse current. When the reverse current hits the reverse current
limit during a PWM cycle, MOSFET M2 is turned off, and MOSFET M1 and M4 are turned on, for the rest of that
switching cycle. This allows the inductor to build current in the opposite direction thereby limiting the reverse
current. It should be noted that the power MOSFET switches M3 and M4 do not have their own current limiting
circuits and are dependent on the current-limit operation implemented for power MOSFETs M1 and M2 to protect
them. The implication of this is that any external forcing of voltage/current on SW2 pin or misuse of SW2 pin may
be detrimental to the part and may damage the internal circuits.
7.3.9 VCON Overvoltage Clamp
The LM3279 features an internal clamp on the analog VCON pin voltage to limit the output voltage to a maximum
safe value. The VCON voltage is internally switched to a reference voltage of approximately 1.6 V when the
VCON pin voltage exceeds 1.6 V. This limits the output voltage to approximately 4.8 V and protects the part from
overvoltage stress. When implementing digital control, the VSET inherently limits the output voltage to the
required range.
7.3.10 Thermal Overload Protection
The LM3279 has a thermal overload protection function that operates to protect itself from short-term misuse and
overload conditions. When the junction temperature exceeds around 150°C, the device inhibits operation. All
power MOSFET switches are turned off in PWM mode. When the temperature drops below 125°C, normal
operation resumes. Prolonged operation in thermal overload conditions may damage the device and is
considered bad practice.
7.4 Device Functional Modes
7.4.1 Enable And Shutdown Mode
Setting the VIO and EN digital pins low (< 0.6 V) places the LM3279 in shutdown mode (0.01 μA typ. for VIO or
EN = 0 V). During shutdown, the output of LM3279 is in tri-state mode. Setting VIO or EN high (>1.2 V) enables
normal operation. VIO and EN should be set low to turn off the LM3279 during power-up and undervoltage
conditions when the power supply (VBATT) is less than the 2.7V minimum operating voltage. When VIO is HIGH,
EN must be GND, and when EN = HIGH, VIO must be GND. When EN goes logic low →logic high, for the first
20 μs the dump-switch M6 turns ON to discharge the output capacitor. The duration of M6 being ON is about 20
μs. This enables discharge of (an initially charged) output capacitor to voltages much less than 4.2 V. The
switcher feedback-control loops continues the discharge process (if need be) so that the charge in the output
capacitor is regulated to the correct output voltage value. When VIO is applied, the default values are loaded into
the control registers.
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
15
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
Device Functional Modes (continued)
7.4.2 Low-Power Mode
The low-power mode is a very low current state where the VIO voltage remains at 1.8 V, and the RFFE interface
continues to operate. Here, the current drawn from the VBATT is < 0.1 µA (typ.). This mode can be entered by
writing a value of 00h into register 00h (VSET Control Register) or by programming PWR_MODE[1:0] to 10b (bits
6 and 7 of register 1Ch PM-TRIG Register).
During low power mode, the LM3279 maintains the previous programmable register settings upon resuming
normal operation.
7.4.3 Standby Mode
The standby mode is a mode where the switching is stopped and the power control circuit is off, but the control
and the RFFE interface continue to operate. The VIO voltage remains at 1.8 V. Here, the current drawn from the
VBATT is 1 mA (typ.). This mode can be entered by writing a value of 02h into register 00h (VSET Control
Register) when the PWR_MODE bits are set to normal operation 00b (bits 6 and 7 of register 1Ch PM-TRIG
Register).
In this mode the SW pins are tri-stated.
7.4.4 PFM Mode
The LM3279 enters PFM mode and operates with reduced switching frequency and supply current to maintain
very high efficiencies for light-load operation. The conditions for entering and exiting the PFM and PWM mode
are provided in Table 1. In PFM mode, the LM3279 will support up to 100 mA max. In Analog Control Mode the
PWM/PFM mode transition has a 60 mV VOUT hysteresis.
For STATE_CTRL[1:0] = 10, the PWM/PFM load current threshold has a 30 mA hysteresis.
During output voltage transients, the LM3279 will automatically shift temporarily to PWM mode before settling to
the final output voltage in either PFM or PWM mode depending on the conditions in Table 1.
Table 1. PWM-PFM Operation Truth Table
STATE_CTRL
[1:0] or GPO1,
GPO0
ANALOG CONTROL (EN = HIGH, EXTERNAL DAC
CONNECTED TO VCON)
00
DIGITAL CONTROL (VIO = HIGH, VSET_CTRL IN
REGISTER 00h PROGRAMMED VIA RFFE)
Forced PFM
01
PWM if VCON > 0.5V; PFM if VCON < 0.5V
PWM if VSET_CTRL ≥ 29h; PFM if VSET_CTRL < 29h
10
PWM if VCON > 0.7V OR load >130 mA;
PFM if VCON < 0.7V AND IOUT < 100 mA
PWM if VSET_CTRL ≥ 39h OR load > 130 mA;
PFM if VSET_CTRL < 39h AND IOUT < 100 mA
11
Forced PWM
7.5 Programming
7.5.1 Digital Control Serial Bus Interface
The Digital Control Serial Bus Interface provides MIPI RF Front-End Control Interface-compatible access to the
programmable functions and registers on the device. When VIO voltage supply is applied to the Bus, it enables
the Slave interface and resets the user-defined Slave registers to the default settings. The LM3279 uses a threepin digital interface; two for bidirectional communications between the ICs connected to the Bus, along with an
interface voltage reference VIO that also acts as asynchronous enable and reset. When VIO voltage supply is
applied to the Bus, it enables the Slave interface and resets the user-defined Slave registers to the default
settings. The device can be set to power-down mode via the asynchronous VIO signal or by setting the
appropriate register via Serial Bus Interface. The two communication lines are serial data (SDATA) and clock
(SCLK). SCLK and SDATA must be held low until VIO is present. The LM3279 connects as a slave on a singlemaster Serial Bus Interface.
The SDATA signal is bidirectional, driven by the Master or a Slave. Data is written on the rising edge (transition
from logical level zero to logical level one) of the SCLK signal by both Master and Slaves. Master and Slave both
read the data on the falling edge (transition from logical level one to logical level zero) of the SCLK signal. A
logic-low level applied to VIO signal powers off the digital interface.
16
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
Programming (continued)
Programming the VSET_CTRL register dynamically adjusts the Buck-Boost output voltage. The feedback voltage
changes from VFB,MIN to VFB,MAX depending upon the register value. The digital interface is also used to program
the LM3279 for PWM or into PWM and PFM mode.
7.5.2 Supported Command Sequences
SCLK
SA3
SDATA
SA2
SSC
SA1
SA0
1
D6
D5
D4
D3
Slave Address
D2
D1
P
D0
0
Parity
Data
Bus
Park
Signal driven by Master.
Signal not driven; pull-down only.
For reference only.
Figure 19. Register 0 Write
SCLK
A
SDATA
SA3
SA2
SA1
SA0
0
SSC
1
0
A4
A3
A2
A1
A0
P
Register Write Command Frame
SCLK
A
SDATA
P
D7
D6
D5
D4
D3
D2
Data Frame
D1
D0
P
0
Bus
Park
Signal driven by Master.
Signal not driven; pull-down only.
For reference only.
Figure 20. Register Write
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
17
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
Programming (continued)
SCLK
A
SDATA
SA3
SA2
SA1
SA0
0
SSC
1
1
A4
A3
A2
A1
A0
P
Register Read Command Frame
SCLK
A
SDATA
P
0
D7
D6
D5
D4
D3
D2
D1
Data Frame (from Slave)
Bus
Park
D0
P
0
Bus
Park
Signal driven by Master.
Signal driven by Slave.
Signal not driven; pulldown only.
For reference only.
Figure 21. Register Read
7.5.3 Device Enumeration
The interface component recognizes broadcast Slave Address (SID) of 0000b and is configured, via internal
interface signals, with a Unique SID address (USID) and a Group SID address (GSID). The USID is set to 0101b
and GSID set to 0000b. The register-set component will typically set the USID to a fixed value; however, it is also
possible to construct a register-set component that allows the USID to be programmed via the RFFE bus.
7.5.4 I/O
This RFFE interface supports a 1.8-V VIO supply level. A power-on reset circuit will be included that resets the
RFFE interface and register-set components when VIO is removed.
7.5.5 Control Interface Timing Parameters
TSCLKOTR
TSCLKOTR
TSCLKOH
TSCLKOL
VOHmin
SCLK
VOLmax
Figure 22. Clock Timing
18
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
Programming (continued)
VTPmax
SCLK
VTNmin
TD
TSDATAOTR
TD
TS
TH
TSDATAOTR
TS
TH
VTPmax
SDATA
VTNmin
Figure 23. Setup And Hold Timing
7.6 Registers
7.6.1 Programmable Registers
ADDRESS
REGISTER CONTENTS
00h
VSET_CTRL
Bits
Name
7
Reserved
6:0
VSET_CTRL[6:0]
01h
Description
Reserved bit. Default = 0.
DC-DC voltage control bits. VSET_CTRL = 00h (default)puts the part into
a low power mode. VSET_CTRL = 02h puts the part in a standby mode.
VSET_CTRL = 0Bh corresponds to 0.4 V and 75h corresponds to 4.212 V.
STATE_CTRL
Bits
Name
7:6
STATE_CTRL[1:0]
5:0
Reserved
Bits
Name
7
GPO0
GPO0 control bit.
0b = Output set to low level (default)
1b = Output set to high level
6
GPO1
GPO1 control bit.
0b = Output set to low level (default)
1b = Output set to high level
Bits
Name
02h
Description
PWM and PFM state control bits.
00b = Force PFM
01b = PFM if VOUT < 1.5 (default)
10b = PFM if VOUT < 2.1 and IOUT < 100 mA
11b = Force PWM
GPO_CTRL
03h-1Bh
Description
RESERVED
Description
Reserved registers for configuration, test, and trim.
1Ch
PM_TRIG
Bits
Name
7:6
PWR_MODE[1:0]
5:0
TRIG_REG[5:0]
Description
Power Mode Bits.
00b = Normal operation
01b = Default settings (default)
10b = Low power
11b = Reserved
Reserved for trigger bits.
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
19
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
Registers (continued)
ADDRESS
REGISTER CONTENTS
1Dh
PRODUCT_ID
Bits
Name
7:0
PRODUCT_ID[7:0]
Bits
Name
7:0
MANUFACTURER_ID[7:0]
Bits
Name
Description
7:6
SPARE[1:0]
This is a read-only register that is reserved and yields a value of 00b at
readback. Potentially used in future for extending manufacturer ID field.
5:4
MANUFACTURER_ID[5:4]
3:0
USID[3:0]
1Eh
Product identification bits. Set to A0h.
MANUFACTURER_ID
1Fh
20
Description
Description
Manufacturer identification bits.
7:0 1Eh are LSB for TI.
USID
Manufacturer identification bits.
5:4 01h are MSB for TI.
Unique slave identifier.
Default 0101b.
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM3279 is a high-efficiency buck boost DC-DC converter optimized to power 3G/4G power amplifier in cell
phones, portable communication devices, or other battery-powered RF devices. The device is designed to
operate from an input supply voltage between 2.7 V and 5.5 V with a maximum load current of 1 A. It operates in
PWM mode for medium-to-heavy load conditions and in PFM mode for light load conditions to optimize for best
efficiency, transient performance, and output voltage ripple at varying load conditions. In PWM mode the LM3279
converter operates with nominal switching frequency of 2.4 MHz, thus enabling use of smaller size capacitors
and inductor. The converter operates in PFM mode at lighter load conditions to maintain high efficiency. The
LM3279 switches between PFM and PWM based on load current and /or the output voltage, and Figure 24
shows one of many application configurations for LM3279. A battery-connected system provides input supply to
LM3279 which in turn very efficiently converts this input to a variable output with superior transient response and
output noise, thereby saving the 3G/4G power amplifiers from having to operate from a higher supply voltage,
such as a direct connection to a battery. This results in significant power dissipation savings and consequently
cooler operation and also lower current consumption for the power amplifier without sacrificing its RF
performance. In applications where low voltage battery operation is a significant feature; the buck-boost can
seamlessly transition to boost and power the 3G/4G PA for high peak-to-average ratio signals as well.
To control the output voltage there are two methods in which the LM3279 can be used : Analog Control where an
analog control voltage (VCON) which is equal to VOUT/3 need to feed into the LM3279 from an external DAC. In
the digital mode RFFE signaling is used to control the register address 0x00 to set the output voltage, and the
LM3279 acts as a slave device on the RFFE bus.
8.2 Typical Application
8.2.1 Typical Application Circuit: Digital Control
1.5 ÛH
SW2
SW1
VBATT: 2.7V to 5.5V
PVIN
VOUT
SVIN
FB
X
LM3279
VOUT: 0.4V to 4.2V
VCON
EN
RF PA(s)
10 ÛF
10 ÛF
VIO
GPO0
2 x 0.47 ÛF
(PA decoupling caps)
SDATA
GPO1
SCLK
DGND
SGND
PGND
BB or
RFIC
RF Control
Bits
Figure 24. LM3279 Digital Control
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
21
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
Typical Application (continued)
8.2.1.1 Design Requirements
The LM3279 buck-boost converter has internal loop compensation. Therefore, the external LC filter has to be
selected according to the internal compensation. Nevertheless, it's important to consider, that the effective
inductance, due to inductor tolerance and current derating can vary between 20% and –30%. The same for the
capacitance of the output filter: the effective capacitance can vary between 20% and –50% of the specified
datasheet value, due to capacitor tolerance and bias voltage. For this reason Table 3 and Table 4 show the
typical inductor and capacitor used with the LM3279 device.
8.2.1.2 Detailed Design Procedure
8.2.1.2.1 Output Current Capability
The typical LM3279 load capability vs. input voltage is as shown in Table 2. There are 3 distinct regions of
current capability. In the low output-voltage region, VOUT < 2.1 V (also known as the RDSON-managed region), the
output-current capability is determined by the current capability of the RDSON-managed MOSFET, typically 600
mA. When the output voltage is greater than 2.1 V, and in buck mode, the current capability increases to 1400
mA as determined by the overcurrent limit setting and the magnitude of ripple current. While in boost-mode
operation, the output-current capability is determined by the output-input voltage ratio. It is expected for the
typical RF PA to have an approximate resistive load characteristic. Refer to Table 2 for output current capability.
Table 2. Output Voltage vs Maximum Output Current Derating
VOUT (V)
VIN (V)
MAXIMUM IOUT CAPABILITY (mA)
≤3
450
>3
650
≥ 2.5
500
≥ 2.7
750
≥3
950
≥ 2.5
750
4.2
3.8
≥ 2.7
950
≥3
1100
2.7 to 5
100 (in PFM mode)
3.4
< 1.5
8.2.1.2.2 Recommended External Components
8.2.1.2.2.1 Inductor Selection
A 1.5-µH inductor with a saturation current rating over 1900 mA and low inductance drop at the full DC bias
condition is recommended for almost all applications. An inductor with a DC resistance of less than 0.1 Ω and
smaller ESR should be used to get good efficiency for all output current conditions.
Table 3. Suggested Inductors
MODEL
DFE201610C-1R5M
(1285A5-H-1R5M) (1.5 µH)
TFM201610A-1R5M (1.5 µH)
ELGUEA1R5NA (1.5 μH)
22
VENDOR
DIMENSIONS (mm)
ISAT mA
(30% DROP IN
INDUCTANCE)
DCR (mΩ)
TOKO
2.0 x 1.6 x 1.0
2200
120
TDK
2.0 x 1.6 x 1.0
2000
140
Panasonic
2.0 x 1.6 x 1.0
1900
100
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
If a smaller inductance inductor is used in the application, the VOUT transient response time is affected. If a
winding type inductor is used, the efficiency at light load current condition may not be so good due to bigger
DCR.
8.2.1.2.2.2 Input Capacitor Selection
A ceramic input capacitor of 10 µF, 6.3V, 0402 or higher is sufficient for most applications. Place the input
capacitor as close as possible to the PVIN pin and PGND pin of the device. A larger value of higher voltage
rating may be used to improve input filtering. Use X7R, X5R, or B types; do not use Y5V or F. The input filter
capacitor supplies current to the PFET (high-side) switch in the first half of each cycle and reduces voltage ripple
imposed on the input power source. A ceramic capacitor’s low ESR provides the best noise filtering of the input
voltage spikes due to this rapidly changing current.
8.2.1.2.3 Output Capacitor Selection
Use a 10-µF, 6.3-V, 0402 capacitor for the output capacitor. Use of capacitor types such as X5R, X7R is
recommended for the filter. These provide an optimal balance between small size, cost, reliability, and
performance for cell phones and similar applications. Table 4 lists suggested part numbers and suppliers. DC
bias characteristics of the capacitors must be considered while selecting the voltage rating and case size of the
capacitor. Smaller case sizes for the output capacitor mitigate piezo-electric vibrations of the capacitor when the
output voltage is stepped up and down at fast rates. However, they have a bigger percentage drop in value with
DC bias. A 0402 case size output capacitor is recommended for small solution size. For RF Power Amplifier
applications, the output capacitor loading is combined between the DC-DC converter and the RF Power
Amplifier(s). (10 μF (0402) + PA input cap 3 x 1μF (0402/0201) is recommended.) The optimum capacitance split
is application-dependent. Place all the output capacitors very close to their respective device. If using a 4.7 μF,
0402 as the output capacitor, the total recommended actual capacitance on the VOUT bus should be at least >
6.8 μF (4.7 μF + PA decoupling caps), to take into account the 0402 DC bias degradation and other tolerances.
The minimum capacitance under DC bias conditions should be > 3 μF.
Table 4. Suggested Capacitors
MODEL
VENDOR
CL05A106MQ5NUN (0402)
Samsung
10 µF for CIN = COUT
1.0 µF for PA Decoupling Caps (x 3)
C0603X5R0G105M(0201(0603))
TDK
0.47 µF for PA Decoupling Caps (x 2)
GRM033R60J474ME90 (0201(0603))
Murata
8.2.1.3 Application Curves
VOUT = 3.5 V
PVIN = 3.8 V
VOUT = 0.8 V
Figure 25. Load Transient, Forced PWM Mode
PVIN = 4.2 V
Figure 26. Load Transient, Forced PFM Mode
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
23
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
8.2.2 Typical Application Circuit: Analog Control
1.5 ÛH
SW2
SW1
VOUT: 0.5V to 4.2V
VBATT: 2.7V to 5.5V
PVIN
VOUT
SVIN
FB
X
LM3279
RF PA(s)
VCON
EN
10 ÛF
10 ÛF
VIO
GPO0
2 x 0.47 F
(PA decoupling caps)
SDATA
GPO1
SCLK
DGND
SGND
PGND
BB or
RFIC
DAC
Figure 27. LM3279 Analog Control
8.2.2.1 Design Requirements
See Design Requirements above.
8.2.2.2 Detailed Design Procedure
See Detailed Design Procedure above.
8.2.2.3 Application Curves
See Application Curves above.
9 Power Supply Recommendations
The LM3279 device is designed to operate from an input voltage supply range between 2.7 V and 5.5 V. This
input supply should be well regulated. If the input supply is located more than a few inches from the LM3279
converter additional bulk capacitance may be required in addition to the ceramic bypass capacitors. An
electrolytic or tantalum capacitor with a value of 47 μF is a typical choice.
24
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
10 Layout
10.1 Layout Guidelines
PC board layout is critical to successfully designing a DC-DC converter into a product. As much as a 10-dB
improvement in RX noise floor can be achieved by carefully following recommended layout practices. A properly
planned board layout optimizes the performance of a DC-DC converter and minimizes effects on surrounding
circuitry while also addressing manufacturing issues that can have adverse impacts on board quality and final
product yield.
Poor board layout can disrupt the performance of a DC-DC converter and surrounding circuitry by contributing to
EMI, ground bounce, and resistive voltage loss in the traces. Erroneous signals could be sent to the DC-DC
converter IC, resulting in poor regulation or instability. Poor layout can also result in re-flow problems leading to
poor solder joints between the DSBGA package and board pads. Poor solder joints can result in erratic or
degraded performance of the converter.
10.1.1 PCB
Poor board layout can disrupt the performance of a DC-DC converter and surrounding circuitry by contributing to
EMI, ground bounce, and resistive voltage loss in the traces. Erroneous signals could be sent to the DC-DC
converter IC, resulting in poor regulation or instability. Poor layout can also result in re-flow problems leading to
poor solder joints between the DSBGA package and board pads. Poor solder joints can result in erratic or
degraded performance of the converter.
10.1.1.1 Energy Efficiency
Minimize resistive losses by using wide traces between the power components and doubling up traces on
multiple layers when possible.
10.1.1.2 EMI
By its very nature, any switching converter generates electrical noise. The circuit board designer’s challenge is to
minimize, contain, or attenuate such switcher-generated noise. A high-frequency switching converter, such as the
LM3279, switches Ampere level currents within nanoseconds, and the traces interconnecting the associated
components can act as radiating antennas. The following guidelines are offered to help to ensure that EMI is
maintained within tolerable levels.
To help minimize radiated noise:
• Place the LM3279 switcher, its input capacitor, and output filter inductor and capacitor close together, and
make the interconnecting traces as short as possible.
• Arrange the components so that the switching current loops curl in the same direction. During the first half of
each cycle (buck mode), current flows from the input filter capacitor, through the internal PFET of the LM3279
and the inductor, to the output filter capacitor, then back through ground, forming a current loop. In the
second half of each cycle (buck mode), current is pulled up from ground, through the internal synchronous
NFET of the LM3279 by the inductor, to the output filter capacitor and then back through ground, forming a
second current loop. Routing these loops so the current curls in the same direction prevents magnetic field
reversal between the two half-cycles and reduces radiated noise.
• Make the current loop area(s) as small as possible.
To help minimize conducted noise in the ground-plane:
• Reduce the amount of switching current that circulates through the ground plane: Connect the ground bumps
of the LM3279 and its input/output filter capacitors together using generous component-side copper fill as a
pseudo-ground plane. Then connect this copper fill to the system ground-plane (if one is used) by multiple
vias. These multiple vias help to minimize ground bounce at the LM3279 by giving it a low-impedance ground
connection.
To help minimize coupling to the DC-DC converter's own voltage feedback trace:
• Route noise sensitive traces, such as the voltage feedback path (FB), as directly as possible from the
switcher FB pad to the VOUT pad of the output capacitor, but keep it away from noisy traces between the
power components. If possible, connect FB bump directly to VOUT bump.
To decouple common power supply lines, series impedances may be used to strategically isolate circuits:
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
25
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
Layout Guidelines (continued)
•
•
•
Take advantage of the inherent inductance of circuit traces to reduce coupling among function blocks, by way
of the power supply traces.
Use star connection for separately routing VBATT to PVIN and VBATT_PA (VCC1).
Inserting a single ferrite bead in-line with a power supply trace may offer a favorable tradeoff in terms of
board area, by allowing the use of fewer bypass capacitors.
Use a star connection from VBATT to LM3279 and VBATT to PA VBATT (VCC1) connection. Do not daisy-chain
VBATT connection to LM3279 circuit and then to PA device VBATT connection.
10.2 Layout Examples
1.
2.
3.
4.
5.
Top Layer (Figure 28)
Create a PGND island as shown. PGND pads of C2 (CIN) and C3 (COUT) must be isolated from each other.
This PGND island will connect to the dedicated system ground with many vias.
Each SW (C3) and (D4) bump will have a via in pad and an additional via next to it, to drop down the SW
trace to layer 3.
SGND bump (C2) and GND (D1) will have a via in pad, and directly connecting it to the system ground.
FB (C2) should connect directly to the VOUT bump (D1).
Have PVIN vias next to optional ferrite bead.
Layer 2 (Figure 29)
6. Digital logic signals may be routed on this layer.
7. PVIN for the LM3279 can be routed on this layer.
8. VCC2 can be routed on this layer.
Layer 3 (Figure 30)
9. Each SW trace is routed on this layer. The width of each trace should be 15 mils (0.381 mm) for current
capabilities. Have two vias bring each SW trace up to the inductor pads.
Layer 4 (Figure 31)
10. Connect the PGND, SGND, and high Frequency vias from the top layer on this layer.
26
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
Layout Examples (continued)
Figure 28. Top Layer
Figure 29. Board Layer 2 - Logic And PVIN Routing
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
27
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
Layout Examples (continued)
Figure 30. Board Layer 3 - SW Routing
Figure 31. Board Layer 4 - System GND Plane
28
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
Layout Examples (continued)
10.2.1 LM3279 RF Evaluation Board
1.5 ÛH
SW2
SW1
VBATT: 2.7V to 5.5V
PVIN
VOUT
SVIN
FB
X
LM3279
VOUT: 0.4V to 4.2V
VCON
RF PA(s)
EN
2 x 0.47 ÛF
(PA decoupling caps)
10 ÛF
10 ÛF
VIO
GPO0
SDATA
GPO1
SCLK
SGND
DGND
PGND
BB or
RFIC
RF Control
Bits
Figure 32. Simplified LM3279 RF Evaluation Board Schematic
1.
2.
3.
4.
5.
6.
7.
Input Capacitor C2 should be placed closer to LM3279 than C1.
Optional to add a 100 nF (C1) on input of LM3279 for high frequency filtering.
Bulk Output Capacitor C3 should be placed closer to LM3279 than C4.
Optional to add a 100 nF (C4) on output of LM3279 for high frequency filtering.
Connect both GND terminals of C1 and C4 directly to System RF GND layer of phone board.
Connect bumps SGND (C3) and GND (D1) directly to System GND.
TI has seen improvement in high frequency filtering for small bypass caps (C1 and C4) when they are
connected to System GND instead of same ground as PGND. These capacitors should be 0201 (0603
metric) case size for minimum footprint and best high frequency characteristics.
10.2.2 Component Placement
C1
FB
C2
PGND
SVIN
PVIN
SW1
GPO1
EN
SGND
SW2
GPO0
VCON
FB
VOUT
SCLK
SDATA
VIO
GND
C3
C4
L
Figure 33. LM3279 Recommended Parts Placement (Top View)
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
29
LM3279
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
www.ti.com
10.3 DSBGA Package Assembly And Use
Use of the DSBGA package requires specialized board layout, precision mounting, and careful re-flow
techniques, as detailed in Texas Instruments Application Note 1112 (SNVA009). Refer to the section Surface
Mount Technology (SMD) Assembly Considerations. For best results in assembly, alignment ordinals on the PC
board should be used to facilitate placement of the device. The pad style used with DSBGA package must be the
NSMD (non-solder mask defined) type. This means that the solder-mask opening is larger than the pad size.
This prevents a lip that otherwise forms if the solder-mask and pad overlap from holding the device off the
surface of the board and interfering with mounting. See SNVA009 for specific instructions how to do this.
The 16-bump package used for the LM3279 has 300 micron solder balls and requires 10.82 mil pads for
mounting on the circuit board. The trace to each pad should enter the pad with a 90° entry angle to prevent
debris from being caught in deep corners. Initially, the trace to each pad should be 9 mil wide, for a section
approximately 9 mil long, as a thermal relief. Then each trance should neck up or down to its optimal width. The
important criterion is symmetry. This ensures the solder bumps on the LM3279 re-flow evenly and that the device
solders level to the board. In particular, special attention must be paid to the pads for bumps B4 and D4.
Because PVIN and PGND are typically connected to large copper planes, inadequate thermal relief can result in
late or inadequate re-flow of these bumps.
The DSBGA package is optimized for the smallest possible size in applications with red or infrared opaque
cases. Because the DSBGA package lacks the plastic encapsulation characteristic of larger devices, it is
vulnerable to light. Backside metallization and/or epoxy coating, along with front-side shading by the printed
circuit board, reduce this sensitivity. However, the package has exposed die edges. In particular, DSBGA
devices are sensitive to light (in the red and infrared range) shining on the package's exposed die edges.
10.4 Manufacturing Considerations
The LM3279 package employs a 16-bump (4x4) array of 300 micron solder balls, with a 0.5-mm pad pitch. A few
simple design rules will go a long way to ensuring a good layout.
• Pad size should be 0.265 ± 0.02 mm. Solder mask opening should be 0.375 ± 0.02 mm.
• As a thermal relief, connect to each pad with 9.5 mil wide, 5 mil long traces and incrementally increase each
trace to its optimal width. Symmetry is important to ensure the solder bumps re-flow evenly. Refer to TI
Application Note AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009).
30
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
LM3279
www.ti.com
SNVS970C – MARCH 2013 – REVISED OCTOBER 2014
11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Documentation Support
11.2.1 Related Documentation
See TI Application Note AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009) for general information
about the DSBGA package.
11.3 Trademarks
MIPI is a registered trademark of Mobil Industry Processor Interface Alliance .
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: LM3279
31
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM3279TLE/NOPB
ACTIVE
DSBGA
YZR
16
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-30 to 85
SJ4B
LM3279TLX/NOPB
ACTIVE
DSBGA
YZR
16
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-30 to 85
SJ4B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Sep-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LM3279TLE/NOPB
DSBGA
YZR
16
250
178.0
8.4
LM3279TLX/NOPB
DSBGA
YZR
16
3000
178.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2.18
2.69
0.76
4.0
8.0
Q1
2.18
2.69
0.76
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Sep-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM3279TLE/NOPB
DSBGA
YZR
LM3279TLX/NOPB
DSBGA
YZR
16
250
210.0
185.0
35.0
16
3000
210.0
185.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
YZR0016xxx
D
0.600±0.075
E
TLA16XXX (Rev C)
D: Max = 2.529 mm, Min =2.469 mm
E: Max = 2.146 mm, Min =2.086 mm
4215051/A
NOTES:
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
www.ti.com
12/12
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated