TI1 CDCE937 Programmable 3-pll vcxo clock synthesizer Datasheet

CDCE937-Q1
CDCEL937-Q1
www.ti.com
SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
PROGRAMMABLE 3-PLL VCXO CLOCK SYNTHESIZER
WITH 1.8-V, 2.5-V, AND 3.3-V LVCMOS OUTPUTS
Check for Samples: CDCE937-Q1, CDCEL937-Q1
FEATURES
1
•
•
•
•
•
•
•
Qualified for Automotive Applications
Member of Programmable Clock Generator
Family
– CDCE913/CDCEL913: 1-PLL, 3 Outputs
– CDCE925/CDCEL925: 2-PLL, 5 Outputs
– CDCE937/CDCEL937: 3-PLL, 7 Outputs
– CDCE949/CDCEL949: 4-PLL, 9 Outputs
In-System Programmability and EEPROM
– Serial Programmable Volatile Register
– Nonvolatile EEPROM to Store Customer
Setting
Flexible Input Clocking Concept
– External Crystal: 8 MHz to 32 MHz
– On-Chip VCXO: Pull Range ±150 ppm
– Single-Ended LVCMOS up to 160 MHz
Selectable Output Frequency up to 230 MHz
Low-Noise PLL Core
– Integrated PLL Loop Filter Components
– Low Period Jitter (Typ 60 ps)
Separate Output Supply Pins
– CDCE937: 3.3 V and 2.5 V
– CDCEL937: 1.8 V
VDD
•
•
•
•
•
•
1.8-V Device Power Supply
Flexible Clock Driver
– Three User-Definable Control Inputs
[S0/S1/S2]; e.g., SSC Selection, Frequency
Switching, Output Enable or Power Down
– Generates Highly Accurate Clocks for
Video, Audio, USB, IEEE1394, RFID,
Bluetooth™, WLAN, Ethernet™, and GPS
– Generates Common Clock Frequencies
Used With TI DaVinci™, OMAP™, DSPs
– Programmable SSC Modulation
– Enables 0-PPM Clock Generation
Latch-Up Performance Meets 100 mA
Per JESD 78, Class I
Wide Temperature Range –40° C to 125° C
Packaged in TSSOP
Development and Programming Kit for Easy
PLL Design and Programming (TI Pro-Clock™)
APPLICATIONS
•
D-TV, HD-TV, STB, IP-STB, DVD-Player,
DVD-Recorder, Printer
Vddout
GND
Crystal or
Clock Input
Vctr
S2/S1/S0 or
SDA/SCL
VCXO
LV
CMOS
Y1
LV
CMOS
Y2
LV
CMOS
Y3
LV
CMOS
Y4
LV
CMOS
Y5
LV
CMOS
Y6
LV
CMOS
Y7
XO
LVCMOS
3
EEPROM
PLL1
with SSC
Programming
and
Control Register
PLL2
with SSC
Divider
and
Output
Control
Xin/Clk
S0
Vdd
Vctr
GND
Vddout
Y4
Y5
GND
Vddout
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
Xout
S1/SDA
S2/SCL
Y1
GND
Y2
Y3
Vddout
Y6
Y7
PLL3
with SSC
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
CDCE937-Q1
CDCEL937-Q1
SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION
The CDCE937 and CDCEL937 are modular PLL-based low-cost high-performance programmable clock
synthesizers, multipliers, and dividers. It generates up to seven output clocks from a single input frequency. Each
output can be programmed in-system for any clock frequency up to 230 MHz, using up to three independent
configurable PLLs.
The CDCx937 has separate output supply pins, VDDOUT, which is 1.8 V for CDCEL937 and to 2.5 V to 3.3 V for
CDCE937.
The input accepts an external crystal or LVCMOS clock signal. If an external crystal is used, an on-chip load
capacitor is adequate for most applications. The value of the load capacitor is programmable from 0 to 20 pF.
Additionally, an on-chip VCXO is selectable which allows synchronization of the output frequency to an external
control signal, that is, PWM signal.
The deep M/N divider ratio allows the generation of zero ppm audio/video, networking (WLAN, BlueTooth,
Ethernet, GPS) or Interface (USB, IEEE1394, Memory Stick) clocks from a reference input frequency such as
27 MHz.
All PLLs supports SSC (Spread-Spectrum Clocking). SSC can be Center-Spread or Down-Spread clocking which
is a common technique to reduce electro-magnetic interference (EMI).
Based on the PLL frequency and the divider settings, the internal loop filter components are automatically
adjusted to achieve high stability and optimized jitter transfer characteristic of each PLL.
The device supports non-volatile EEPROM programming for ease-customized application. It is preset to a factory
default configuration (see the Default Device Configuration section). It can be reprogrammed to a different
application configuration before PCB assembly, or reprogrammed by in-system programming. All device settings
are programmable through SDA/SCL bus, a 2-wire serial interface.
Three programmable control inputs, S0, S1 and S2, can be used to control various aspects of operation including
frequency selection changing the SSC parameters to lower EMI, PLL bypass, power down, and choosing
between low level or 3-state for output-disable function.
The CDCEx937 operates in 1.8-V environment. It is characterized for operation from –40°C to 125°C.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 125°C
(1)
(2)
2
TSSOP – PW
Reel of 2000
ORDERABLE PART NUMBER
TOP-SIDE MARKING
CDCE937QPWRQ1
CDCE937Q
CDCEL937QPWRQ1
CEL937Q
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
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SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
Terminal Functions
NAME
PIN TSSOP24
TYPE
Y1, Y2, ...
Y7
17, 15, 14, 7,
8, 12, 11
DESCRIPTION
O
LVCMOS outputs
Xin/CLK
1
I
Crystal oscillator input or LVCMOS clock input (selectable via SDA/SCL bus)
Xout
20
O
Crystal oscillator output (leave open or pull up (~500k) when not used)
VCtrl
4
I
VCXO control voltage (leave open or pull up (~500k) when not used)
VDD
3
Power
Vddout
6, 10, 13
Power
GND
5, 9, 16
Ground
S0
2
I
SDA/S1
19
I/O or I
SCL/S2
18
I
1.8-V power supply for the device
CDCEL937: 1.8-V supply for all outputs
CDCE937: 3.3-V or 2.5-V supply for all outputs
Ground
User-programmable control input S0; LVCMOS inputs; Internal pullup 500k
SDA: Bidirectional serial data input/output (default configuration). LVCMOS; Internal pullup
500k; or
S1: User-programmable control input; LVCMOS inputs; Internal pullup 500k
SCL: Serial clock input(default configuration), LVCMOS; Internal pullup 500k; or
S2: User-programmable control input; LVCMOS inputs; Internal pullup 500k
FUNCTIONAL BLOCK DIAGRAM
VDD
Vddout
GND
Input Clock
LV
CMOS
Y1
M2
LV
CMOS
Y2
M3
LV
CMOS
Y3
M4
LV
CMOS
Y4
M5
Pdiv1
LV
CMOS
Y5
M6
Xin/CLK
LV
CMOS
Y6
M7
M1
Vctr
LV
CMOS
Y7
10-Bit
VCXO
XO
EEPROM
S0
S1/SDA
S2/SCL
Programming
and
SDA/SCL
Register
Pdiv2
MUX1
Xout
PLL1
with SSC
7-Bit
Pdiv3
PLL Bypass
7-Bit
PLL 2
Pdiv4
with SSC
7-Bit
MUX2
LVCMOS
Pdiv6
MUX3
PLL 3
with SSC
Pdiv5
7-Bit
PLL Bypass
PLL Bypass
7-Bit
Pdiv7
7-Bit
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SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VALUE
UNIT
–0.5 to 2.5
V
–0.5 to VDD + 0.5
V
–0.5 to Vddout + 0.5
V
Input current (VI < 0, VI > VDD)
20
mA
Continuous output current
50
mA
Storage temperature range
–65 to 150
°C
VDD
Supply voltage range
VI
Input voltage range (2)
VO
Output voltage range (2)
II
IO
Tstg
(1)
(2)
(3)
(3)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
SDA and SCL can go up to 3.6 V as stated in the Recommended Operating Conditions table.
PACKAGE THERMAL RESISTANCE (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TJA
AIRFLOW
(lfm)
°C/W
Thermal resistance, junction to ambient
0
89
150
75
200
74
250
74
500
69
31
TJC
Thermal resistance, junction to case
—
TJB
Thermal resistance, junction to board
—
55
RqJT
Thermal resistance, junction to top
—
0.8
RqJB
Thermal resistance, junction to bottom
—
49
(1)
The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
RECOMMENDED OPERATING CONDITIONS
VDD
Device supply voltage
Output Yx supply voltage, Vddout
VO
VIL
Low-level input voltage LVCMOS
VIH
High-level input voltage LVCMOS
VI(thresh)
Input voltage threshold LVCMOS
VIS
VI(CLK)
MIN
NOM
MAX
1.7
1.8
UNIT
1.9
V
CDCE937
2.3
3.6
V
CDCEL937
1.7
1.9
0.3 VDD
0.7 VDD
V
V
0.5 VDD
V
Input voltage range S0
0
1.9
Input voltage range S1, S2, SDA, SCL; VI(thresh) = 0.5 VDD
0
3.6
Input voltage range CLK
0
1.9
V
V
Output current (Vddout = 3.3 V)
±12
Output current (Vddout = 2.5 V)
±10
Output current (Vddout = 1.8 V)
±8
CL
Output load LVCMOS
10
pF
TA
Ambient temperature
125
°C
IOH /IOL
4
–40
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mA
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): CDCE937-Q1
CDCE937-Q1
CDCEL937-Q1
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SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
RECOMMENDED CRYSTAL/VCXO SPECIFICATIONS (1)
fXtal
Crystal input frequency range (fundamental mode)
ESR
Effective series resistance
Pulling range (0 V ≤ Vctrl ≤ 1.8 V)
fPR
(2)
MIN
NOM
MAX
UNIT
8
27
32
MHz
100
Ω
±120
Frequency control voltage, Vctrl
C0/C1
Pullability ratio
CL
On-chip load capacitance at Xin and Xout
(1)
(2)
±150
ppm
0
VDD
V
220
0
20
pF
For more information about VCXO configuration, and crystal recommendation, see application report (SCAA085).
Pulling range depends on crystal-type, on-chip crystal load capacitance and PCB stray capacitance; pulling range of min ±120 ppm
applies for crystal listed in the application report (SCAA085).
EEPROM SPECIFICATION
MIN
EEcyc
Programming cycles of EEPROM
EEret
Data retention
TYP
MAX
UNIT
1000
cycles
10
years
CLK_IN TIMING REQUIREMENTS
over recommended ranges of supply voltage, load, and operating ambient temperature
MIN
NOM
MAX
PLL bypass mode
0
160
PLL mode
8
160
fCLK
LVCMOS clock input frequency
tr / tf
Rise and fall time CLK signal (20% to 80%)
dutyCLK
Duty cycle CLK at VDD/2
3
40%
UNIT
MHz
ns
60%
SDA/SCL TIMING REQUIREMENTS
see Figure 12
STANDARD
MODE
fSCL
SCL clock frequency
tsu(START)
START setup time (SCL high before SDA low)
th(START)
START hold time (SCL low after SDA low)
tw(SCLL)
SCL low-pulse duration
tw(SCLH)
SCL high-pulse duration
th(SDA)
SDA hold time (SDA valid after SCL low)
tsu(SDA)
SDA setup time
tr
SCL/SDA input rise time
tf
SCL/SDA input fall time
tsu(STOP)
STOP setup time
tBUS
Bus free time between a STOP and START condition
FAST
MODE
UNIT
MIN
MAX
MIN
MAX
0
100
0
400
4.7
0.6
ms
4
0.6
ms
4.7
1.3
ms
4
0.6
ms
0
3.45
250
0
0.9
100
1000
300
ns
ns
4
0.6
ms
4.7
1.3
ms
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ms
ns
300
300
Copyright © 2010, Texas Instruments Incorporated
kHz
5
CDCE937-Q1
CDCEL937-Q1
SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
www.ti.com
DEVICE CHARACTERISTICS
over recommended operating ambient temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
OVERALL PARAMETER
IDD
IDDOUT
Supply current (see Figure 3)
All outputs off, f(CLK) = 27 MHz, All PLLS on
f(VCO) = 135 MHz
Per PLL
Output supply current (see Figure 4)
No load, all outputs on,
fOUT = 27 MHz
IDD(PD)
Power-down current. Every circuit powered
down except SDA/SCL.
V(PUC)
Supply voltage Vdd threshold for power-up
control circuit
f(VCO)
VCO frequency range of PLL
fOUT
LVCMOS output frequency
fIN = 0 MHz,
29
mA
9
CDCE937,
VDDOUT = 3.3 V
3.1
CDCEL937,
VDDOUT = 1.8 V
1.5
VDD = 1.9 V
50
mA
mA
0.85
1.45
V
80
230
MHz
Vddout = 3.3 V
230
Vddout = 1.8 V
230
MHz
LVCMOS PARAMETER
VIK
LVCMOS input voltage
VDD = 1.7 V; II = –18 mA
II
LVCMOS Input current
VI = 0 V or VDD; VDD = 1.9 V
IIH
LVCMOS Input current for S0/S1/S2
IIL
LVCMOS Input current for S0/S1/S2
Input capacitance at Xin/Clk
VI(Clk) = 0 V or VDD
6
Input capacitance at Xout
VI(Xout) = 0 V or VDD
2
Input capacitance at S0/S1/S2
VIS = 0 V or VDD
3
CI
–1.2
V
±5
mA
VI = VDD; VDD = 1.9 V
5
mA
VI = 0 V; VDD = 1.9 V
–6
mA
pF
LVCMOS PARAMETER FOR Vddout = 3.3 V (CDCE937)
VOH
LVCMOS high-level output voltage
VOL
LVCMOS low-level output voltage
tPLH,
tPHL
Propagation delay
tr/tf
Rise and fall time
(2) (3)
tjit(cc)
Cycle-to-cycle jitter
tjit(per)
Peak-to-peak period jitter (3)
tsk(o)
Output skew
odc
Output duty cycle
(1)
(2)
(3)
(4)
(5)
6
(4)
, See Table 2
(5)
Vddout = 3 V, IOH = –0.1 mA
2.9
Vddout = 3 V, IOH = –8 mA
2.4
Vddout = 3 V, IOH = –12 mA
2.2
V
Vddout = 3 V, IOL = 0.1 mA
0.1
Vddout = 3 V, IOL = 8 mA
0.5
Vddout = 3 V, IOL = 12 mA
0.8
All PLL bypass
3.2
Vddout= 3.3 V (20%–80%)
0.6
1 PLL switching, Y2-to-Y3
60
90
3 PLL switching, Y2-to-Y7
100
150
1 PLL switching, Y2-to-Y3
70
100
3 PLL switching, Y2-to-Y7
120
180
ns
ns
fOUT = 50 MHz; Y1-to-Y3
60
fOUT = 50 MHz; Y2-to-Y5
160
fVCO = 100 MHz; Pdiv = 1
45%
V
ps
ps
ps
55%
All typical values are at respective nominal VDD.
10000 cycles.
Jitter depends on configuration. Data is taken under the following conditions: 1-PLL : fIN = 27MHz, Y2/3 = 27 MHz, (measured at Y2),
3-PLL: fIN = 27 MHz, Y2/3 = 27 MHz (measured at Y2), Y4/5 = 16.384 MHz, Y6/7 = 74.25 MHz
The tsk(o) specification is only valid for equal loading of each bank of outputs, and outputs are generated from the same divider; data
taking on rising edge (tr).
odc depends on output rise and fall time (tr/tf).
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CDCEL937-Q1
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SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
DEVICE CHARACTERISTICS (continued)
over recommended operating ambient temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
LVCMOS PARAMETER for Vddout = 2.5 V (CDCE937)
VOH
VOL
LVCMOS high-level output voltage
LVCMOS low-level output voltage
Vddout = 2.3 V, IOH = –0.1 mA
2.2
Vddout = 2.3 V, IOH = –6 mA
1.7
Vddout = 2.3 V, IOH = –10 mA
1.6
V
Vddout = 2.3 V, IOL = 0.1 mA
0.1
Vddout = 2.3 V, IOL = 6 mA
0.5
Vddout = 2.3 V, IOL = 10 mA
0.7
tPLH,
tPHL
Propagation delay
All PLL bypass
3.4
tr/tf
Rise and fall time
Vddout = 2.5 V (20%–80%)
0.8
1 PLL switching, Y2-to-Y3
60
90
3 PLL switching, Y2-to-Y7
100
150
1 PLL switching, Y2-to-Y3
70
100
3 PLL switching, Y2-to-Y7
120
180
tjit(cc)
Cycle-to-cycle jitter (6)
(7)
tjit(per)
Peak-to-peak period jitter (8)
tsk(o)
Output skew (8), See Table 2
odc
Output duty cycle (9)
ns
ns
fOUT = 50 MHz; Y1-to-Y3
60
fOUT = 50 MHz; Y2-to-Y5
160
f(VCO) = 100 MHz; Pdiv = 1
45%
V
ps
ps
ps
55%
LVCMOS PARAMETER for Vddout = 1.8 V (CDCEL937)
VOH
VOL
LVCMOS high-level output voltage
LVCMOS low-level output voltage
Vddout = 1.7 V, IOH = –0.1 mA
1.6
Vddout = 1.7 V, IOH = –4 mA
1.4
Vddout = 1.7 V, IOH = –8 mA
1.1
V
Vddout = 1.7 V, IOL = 0.1 mA
0.1
Vddout = 1.7 V, IOL = 4 mA
0.3
Vddout = 1.7 V, IOL = 8 mA
0.6
tPLH,
tPHL
Propagation delay
All PLL bypass
2.6
tr/tf
Rise and fall time
Vddout= 1.8 V (20%–80%)
0.7
1 PLL switching, Y2-to-Y3
70
120
3 PLL switching, Y2-to-Y7
100
150
1 PLL switching, Y2-to-Y3
90
140
3 PLL switching, Y2-to-Y7
120
190
tjit(cc)
Cycle-to-cycle jitter (6)
(7)
tjit(per)
Peak-to-peak period jitter (7)
tsk(o)
Output skew (8), See Table 2
odc
Output duty cycle (9)
ns
ns
fOUT = 50 MHz; Y1-to-Y3
60
fOUT = 50 MHz; Y2-to-Y5
160
f(VCO) = 100 MHz; Pdiv = 1
45%
V
ps
ps
ps
55%
SDA/SCL PARAMETER
VIK
SCL and SDA input clamp voltage
VDD = 1.7 V; II = –18 mA
–1.2
V
IIH
SCL and SDA input current
VI = VDD; VDD = 1.9 V
±10
mA
VIH
SDA/SCL input high voltage (10)
VIL
SDA/SCL input low voltage (10)
VOL
SDA low-level output voltage
IOL = 3 mA, VDD = 1.7 V
CI
SCL/SDA Input capacitance
VI = 0 V or VDD
0.7 VDD
V
0.3 VDD
3
V
0.2 VDD
V
10
pF
(6)
(7)
10000 cycles.
Jitter depends on configuration. Data is taken under the following conditions: 1-PLL : fIN = 27MHz, Y2/3 = 27 MHz, (measured at Y2),
3-PLL: fIN = 27 MHz, Y2/3 = 27 MHz (measured at Y2), Y4/5 = 16.384 MHz, Y6/7 = 74.25 MHz
(8) The tsk(o) specification is only valid for equal loading of each bank of outputs, and outputs are generated from the same divider; data
taking on rising edge (tr).
(9) odc depends on output rise and fall time (tr/tf).
(10) SDA and SCL pins are 3.3 V tolerant.
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PARAMETER MEASUREMENT INFORMATION
CDCE937
CDCEL937
1 kW
LVCMOS
1 kW
10 pF
Figure 1. Test Load
CDCE937
CDCEL937
LVCMOS
Typical Driver
Impedance
~ 32 W
LVCMOS
Series
Termination
~ 18 W
Line Impedance
Zo = 50 W
Figure 2. Test Load for 50-Ω Board Environment
8
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TYPICAL CHARACTERISTICS
CDCE937, CDCEL937
SUPPLY CURRENT
vs
PLL FREQUENCY
CDCE937
OUTPUT CURRENT
vs
OUTPUT FREQUENCY
30
80
VDD = 1.8 V
70
25
7 Outputs on
60
20
2 PLL on
50
IDDOUT - mA
IDD - Supply Current - mA
3 PLL on
VDD = 1.8 V,
VDDOUT = 3.3 V,
No Load
40
30
1 PLL on
5 Outputs on
15
1 Output on
10
3 Outputs on
20
all PLL off
5
10
0
10
60
110
160
fVCO - Frequency - MHz
All Outputs off
0
10
210
30
50 70 90 110 130 150 170 190 210 230
fOUT - Output Frequency - MHz
Figure 3.
Figure 4.
CDCEL937
OUTPUT CURRENT
vs
OUTPUT FREQUENCY
12
10
VDD = 1.8 V,
VDDOUT = 1.8 V,
No Load
7 Outputs
IDDOUT - mA
8
5 Outputs on
6
3 Output on
4
1 Output on
2
0
10
all Outputs
30
50
70
90 110 130 150 170 190 210 230
fOUT - Output Frequency - MHz
Figure 5.
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APPLICATION INFORMATION
CONTROL TERMINAL SETTING
The CDCE937/CDCEL937 has three user-definable control terminals (S0, S1, and S2) that allow external control
of device settings. They can be programmed to any of the following setting:
• Spread spectrum clocking selection → spread type and spread amount selection
• Frequency selection → switching between any of two user-defined frequencies
• Output state selection → output configuration and power down control
The user can predefine up to eight different control settings. Table 1 and Table 2 explain these settings.
Table 1. Control Terminal Definition
External
Control
Bits
Control
Function
PLL1 Setting
PLL
Frequency
Selection
PLL2 Setting
Output
Y2/Y3
Selection
SSC
Selection
PLL
Frequency
Selection
SSC
Selection
PLL3 Setting
Output
Y4/Y5
Selection
PLL
Frequency
Selection
SSC
Selection
Y1 Setting
Output
Y6/Y7
Selection
Output Y1 and
Power-Down
Selection
Table 2. PLLx Setting (can be selected for each PLL individual) (1)
SSC Selection (Center/Down)
Center
Down
0
SSCx [3-bits]
0
0
0% (off)
0% (off)
0
0
1
±0.25%
–0.25%
0
1
0
±0.5%
–0.5%
0
1
1
±0.75%
–0.75%
1
0
0
±1.0%
–1.0%
1
0
1
±1.25%
–1.25%
1
1
0
±1.5%
–1.5%
1
1
1
±2.0%
–2.0%
FREQUENCY SELECTION (2)
FSx
FUNCTION
0
Frequency0
1
Frequency1
OUTPUT SELECTION
(1)
(2)
(3)
(3)
(Y2 ... Y7)
YxYx
FUNCTION
0
State0
1
State1
Center/Down-Spread, Frequency0/1 and State0/1 are user-definable in PLLx Configuration Register;
Frequency0 and Frequency1 can be any frequency within the specified fVCO range.
State0/1 selection is valid for both outputs of the corresponding PLL module and can be power down,
3-state, low or active
Table 3. Y1 Setting (1)
Y1 SELECTION
(1)
10
Y1
FUNCTION
0
State 0
1
State 1
State0 and State1 are user definable in Generic Configuration
Register and can be power down, 3-state, low, or active.
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S1/SDA and S2/SCL pins of the CDCE937/CDCEL937 are dual function pins. In default configuration they are
defined as SDA/SCL for the serial interface. They can be programmed as control-pins (S1/S2) by setting the
relevant bits in the EEPROM. Note that the changes to the Control register (Bit [6] of Byte [02]) have no effect
until they are written into the EEPROM.
Once they are set as control pins, the serial programming interface is no longer available. However, if VDDOUT is
forced to GND, the two control-pins, S1 and S2, temporally act as serial programming pins (SDA/SCL).
S0 is not a multi-use pin, it is a control pin only.
DEFAULT DEVICE SETTING
The internal EEPROM of CDCE937/CDCEL937 is preconfigured as shown in Figure 6. (The input frequency is
passed through to the output as a default). This allows the device to operate in default mode without the extra
production step of program it. The default setting appears after power is supplied or after power-down/up
sequence until it is re-programmed by the user to a different application configuration. A new register setting is
programmed via the serial SDA/SCL Interface.
VDD
Vddout
GND
SCL
M2
Programming Bus
LV
CMOS
Y3 = 27 MHz
LV
CMOS
Y4 = 27 MHz
LV
CMOS
Y5 = 27 MHz
LV
CMOS
Y6 = 27 MHz
LV
CMOS
Y7 = 27 MHz
MUX1
PLL 2
Pdiv4 = 1
power down
MUX2
SDA
M3
Programming
and
SDA/SCA
Register
S0
“0” = outputs 3-State
Pdiv3 = 1
PLL Bypass
EEPROM
M4
Pdiv2 = 1
Xout
“1” = outputs enabled
Y2 = 27 MHz
M5
PLL1
LV
CMOS
Pdiv1 =1
X-tal
power down
Y1 = 27MHz
M6
27 MHz
Crystal
LV
CMOS
M7
M1
Input Clock
Xin
Pdiv5 = 1
PLL Bypass
PLL3
Pdiv6 = 1
MUX3
power down
Pdiv7 = 1
PLL Bypass
Figure 6. Default Device Setting
Table 4 shows the factory default setting for the Control Terminal Register (external control pins). In normal
operation, all 8 register settings are available, but in the default configuration only the first two settings (0 and 1)
can be selected with S0, as S1 and S2 configured as programming pins in default mode.
Table 4. Factory Default Setting for Control Terminal Register (1)
Y1
Output
Selection
External Control Pins
PLL1 Settings
Frequency
Selection
SSC
Selection
PLL2 Settings
Output
Selection
Frequenc
y
Selection
SSC
Selection
PLL3 Settings
Output
Selection
Frequenc
y
Selection
SSC
Selection
Output
Selection
S2
S1
S0
Y1
FS1
SSC1
Y2Y3
FS2
SSC2
Y4Y5
FS3
SSC3
Y6Y7
SCL (I2C)
SDA (I2C)
0
3-state
fVCO1_0
off
3-state
fVCO2_0
off
3-state
fVCO1_0
off
3-state
SCL (I2C)
SDA (I2C)
1
enabled
fVCO1_0
off
enabled
fVCO2_0
off
enabled
fVCO1_0
off
enabled
(1)
In default mode or when programmed respectively, S1 and S2 act as serial programming interface, SDA/SCL. They do not have any
control-pin function but they are internally interpreted as if S1=0 and S2=0. S0, however, is a control-pin which in the default mode
switches all outputs ON or OFF (as previously predefined).
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SDA/SCL SERIAL INTERFACE
The CDCE937/CDCEL937 operates as a slave device of the 2-wire serial SDA/SCL bus, compatible with the
popular SMBus or I2C specification. It operates in the standard-mode transfer (up to 100kbit/s) and fast-mode
transfer (up to 400kbit/s) and supports 7-bit addressing.
The S1/SDA and S2/SCL pins of the CDC9xx are dual function pins. In the default configuration they are used as
SDA/SCL serial programming interface. They can be re-programmed as general purpose control pins, S1 and
S2, by changing the corresponding EEPROM setting, Byte 02, Bit [6].
DATA PROTOCOL
The device supports Byte Write and Byte Read and Block Write and Block Read operations.
For Byte Write/Read operations, the system controller can individually access addressed bytes.
For Block Write/Read operations, the bytes are accessed in sequential order from lowest to highest byte (with
most significant bit first) with the ability to stop after any complete byte has been transferred. The numbers of
Bytes read-out are defined by Byte Count in the Generic Configuration Register. At Block Read instruction all
bytes defined in the Byte Count has to be readout to correctly finish the read cycle.
Once a byte has been sent, it is written into the internal register and is effective immediately. This applies to
each transferred byte independent of whether this is a Byte Write or a Block Write sequence.
If the EEPROM Write Cycle is initiated, the internal SDA register contents are written into the EEPROM. During
this write cycle, data is not accepted at the SDA/SCL bus until the write cycle is completed. However, data can
be read during the programming sequence (Byte Read or Block Read). The programming status can be
monitored by reading EEPIP, Byte 01–Bit [6].
The offset of the indexed byte is encoded in the command code, as described in Table 5.
Table 5. Slave Receiver Address (7 Bits)
A6
A5
A4
A3
A2
A1 (1)
A0 (1)
R/W
CDCE913/CDCEL913
1
1
0
0
1
0
1
1/0
CDCE925/CDCEL925
1
1
0
0
1
0
0
1/0
CDCE937/CDCEL937
1
1
0
1
1
0
1
1/0
CDCE949/CDCEL949
1
1
0
1
1
0
0
1/0
DEVICE
(1)
Address bits A0 and A1 are programmable via the SDA/SCL bus (Byte 01, Bit [1:0]). This allows addressing up to 4 devices connected
to the same SDA/SCL bus. The least-significant bit of the address byte designates a write or read operation.
COMMAND CODE DEFINITION
Table 6. Command Code Definition
BIT
DESCRIPTION
0 = Block Read or Block Write operation
1 = Byte Read or Byte Write operation
7
(6:0)
12
Byte Offset for Byte Read, Block Read, Byte Write and Block Write operation.
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Generic Programming Sequence
1
S
7
Slave Address
1
R/W
MSB
LSB
S
Start Condition
Sr
Repeated Start Condition
1
A
8
Data Byte
1
A
MSB
1
P
LSB
1 = Read (Rd) From CDCE9xx Device; 0 = Write (Wr) to CDCE9xxx
R/W
A
Acknowledge (ACK = 0 and NACK =1)
P
Stop Condition
Master-to-Slave Transmission
Slave-to-Master Transmission
Figure 7. Generic Programming Sequence
Byte Write Programming Sequence
1
S
7
Slave Address
1
Wr
1
A
8
CommandCode
1
A
8
Data Byte
1
A
1
P
7
Slave Address
1
Rd
1
A
1
A
1
P
Figure 8. Byte Write Protocol
Byte Read Programming Sequence
1
S
7
Slave Address
1
Wr
1
A
8
Data Byte
1
A
1
P
8
CommandCode
1
A
1
S
Figure 9. Byte Read Protocol
Block Write Programming Sequence
1
S
(1)
7
Slave Address
1
Wr
8
Data Byte 0
1
A
1
A
8
CommandCode
8
Data Byte 1
1
A
1
A
8
Byte Count = N
8
Data Byte N-1
…
1
A
Data byte 0 bits [7:0] is reserved for Revision Code and Vendor Identification. Also, it is used for internal test purpose
and should not be overwritten.
Figure 10. Block Write Protocol
Block Read Programming Sequence
1
S
7
Slave Address
1
Wr
8
Byte Count N
1
A
1
A
8
CommandCode
8
Data Byte 0
1
A
1
A
1
Sr
…
7
Slave Address
1
Rd
1
A
8
Data Byte N-1
1
A
1
P
Figure 11. Block Read Protocol
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Timing Diagram for the SDA/SCL Serial Control Interface
P
S
Bit 7 (MSB)
tw(SCLH)
tw(SCLL)
Bit 6
tr
Bit 0 (LSB)
A
P
tf
VIH
SCL
VIL
tsu(START)
th(START)
tsu(SDA)
th(SDA)
t(BUS)
tsu(STOP)
tf
tr
VIH
SDA
VIL
Figure 12. Timing Diagram for SDA/SCL Serial Control Interface
SDA/SCL HARDWARE INTERFACE
Figure 13 shows how the CDCE937/CDCEL937 clock synthesizer is connected to the SDA/SCL serial interface
bus. Multiple devices can be connected to the bus but the speed may need to be reduced (400 kHz is the
maximum) if many devices are connected.
Note that the pullup resistors (RP) depends on the supply voltage, bus capacitance, and number of connected
devices. The recommended pullup value is 4.7 kΩ. It must meet the minimum sink current of 3 mA at VOLmax =
0.4 V for the output stages (for more details see SMBus or I2C Bus specification).
CDCE937
CDCEL937
RP
RP
Master
Slave
SDA
SCL
CBUS
CBUS
Figure 13. SDA / SCL Hardware Interface
14
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SDA/SCL CONFIGURATION REGISTERS
The clock input, control pins, PLLs, and output stages are user configurable. The following tables and
explanations describe the programmable functions of the CDCE937/CDCEL937. All settings can be manually
written into the device via the SDA/SCL bus or easily programmed by using the TI Pro-Clock™ software. TI
Pro-Clock™ software allows the user to quickly make all settings and automatically calculates the values for
optimized performance at lowest jitter.
Table 7. SDA/SCL Registers
Address Offset
Register Description
Table
00h
Generic Configuration Register
Table 9
10h
PLL1 Configuration Register
Table 10
20h
PLL2 Configuration Register
Table 11
30h
PLL3 Configuration Register
Table 12
The grey-highlighted bits, described in the Configuration Registers tables in the following pages, belong to the
Control Terminal Register. The user can predefine up to eight different control settings. These settings then can
be selected by the external control pins, S0, S1, and S2 (see the Control Terminal Configuration section).
Table 8. Configuration Register, External Control Terminals
Y1
External
Control Pins
S2 S1
Output
Selection
PLL1 Settings
Freq.
Selection
SSC
Selection
PLL2 Settings
Output
Selection
Freq.
Selection
SSC
Selection
PLL3 Settings
Output
Selection
Freq.
Selection
SSC
Selection
Output
Selection
S0
Y1
FS1
SSC1
Y2Y3
FS2
SSC2
Y4Y5
FS3
SSC3
Y6Y7
0
0
0
0
Y1_0
FS1_0
SSC1_0
Y2Y3_0
FS2_0
SSC2_0
Y4Y5_0
FS3_0
SSC3_0
Y6Y7_0
1
0
0
1
Y1_1
FS1_1
SSC1_1
Y2Y3_1
FS2_1
SSC2_1
Y4Y5_1
FS3_1
SSC3_1
Y6Y7_1
2
0
1
0
Y1_2
FS1_2
SSC1_2
Y2Y3_2
FS2_2
SSC2_2
Y4Y5_2
FS3_2
SSC3_2
Y6Y7_2
3
0
1
1
Y1_3
FS1_3
SSC1_3
Y2Y3_3
FS2_3
SSC2_3
Y4Y5_3
FS3_3
SSC3_3
Y6Y7_3
4
1
0
0
Y1_4
FS1_4
SSC1_4
Y2Y3_4
FS2_4
SSC2_4
Y4Y5_4
FS3_4
SSC3_4
Y6Y7_4
5
1
0
1
Y1_5
FS1_5
SSC1_5
Y2Y3_5
FS2_5
SSC2_5
Y4Y5_5
FS3_5
SSC3_5
Y6Y7_5
6
1
1
0
Y1_6
FS1_6
SSC1_6
Y2Y3_6
FS2_6
SSC2_6
Y4Y5_6
FS3_6
SSC3_6
Y6Y7_6
7
1
1
1
Y1_7
FS1_7
SSC1_7
Y2Y3_7
FS2_7
SSC2_7
Y4Y5_7
FS3_7
SSC3_7
Y6Y7_7
04h
13h
10h–12h
15h
23h
20h–22h
25h
33h
30h–32h
35h
Address
Offset (1)
(1)
Address Offset refers to the byte address in the Configuration Register in the following pages.
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Table 9. Generic Configuration Register
Offset
00h
(1)
Bit
(2)
Acronym
Default
(3)
Description
7
E_EL
Xb
Device identification (read-only): 1 is CDCE937 (3.3 V), 0 is CDCEL937 (1.8 V)
6:4
RID
Xb
Revision Identification Number (read only)
3:0
VID
1h
Vendor Identification Number (read only)
7
–
0b
Reserved – always write 0
6
EEPIP
0b
5
EELOCK
0b
4
PWDN
0b
01h
EEPROM Programming Status: (4) (read only)
0 – EEPROM programming is completed
1 – EEPROM is in programming mode
Permanently Lock EEPROM Data (5)
0 – EEPROM is not locked
1 – EEPROM will be permanently locked
Device Power Down (overwrites S0/S1/S2 setting; configuration register settings are unchanged)
Note: PWDN cannot be set to 1 in the EEPROM.
0 – device active (PLL1 and all outputs are enabled)
1 – device power down (PLL1 in power down and all outputs in 3-state)
3:2
INCLK
00b
Input clock selection:
1:0
SLAVE_ADR
01b
Programmable Address Bits A0 and A1 of the Slave Receiver Address
00 – Xtal
01 – VCXO
10 – LVCMOS
7
M1
1b
Clock source selection for output Y1:
0 – input clock
11 – reserved
1 – PLL1 clock
Operation mode selection for pin 18/19 (6)
6
SPICON
0b
5:4
Y1_ST1
11b
3:2
Y1_ST0
01b
1:0
Pdiv1 [9:8]
7:0
Pdiv1 [7:0]
7
Y1_7
0b
6
Y1_6
0b
5
Y1_5
0b
4
Y1_4
0b
3
Y1_3
0b
2
Y1_2
0b
1
Y1_1
1b
0
Y1_0
0b
0 – serial programming interface SDA (pin 19) and SCL (pin 18)
1 – control pins S1 (pin 19) and S2 (pin 18)
02h
Y1-State0/1 Definition
00 – device power down (all PLLs in power down and all outputs in 3-State)
01 – Y1 disabled to 3-state
10-Bit Y1-Output-Divider Pdiv1:
0 – divider reset and stand-by
1-to-1023 – divider value
001h
03h
10 – Y1 disabled to low
11 – Y1 enabled
Y1_ST0/Y1_ST1 State Selection (7)
0 – State0 (predefined by Y1_ST0)
1 – State1 (predefined by Y1_ST1)
04h
00h → 0 pF
01h → 1 pF
02h → 2 pF
:
14h-to-1Fh → 20 pF
Crystal Load Capacitor
Selection (8)
7:3
XCSEL
0Ah
05h
Vctr
Xin
20pF
6pF*
C1
XO
Xout
2pF*
0b
Reserved – do not write other than 0
i.e.
XCSEL = 10pF
C2
* Input Capacitance
2:0
VCXO
20pF
7:1
BCOUNT
40h
7-Bit Byte Count (defines the number of bytes which will be sent from this device at the next Block Read transfer); all bytes have to
be read out to correctly finish the read cycle.)
0
EEWRITE
0b
Initiate EEPROM Write Cycle(4)
06h
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
16
(9)
0– no EEPROM write cycle
1 – start EEPROM write cycle (internal configuration register is saved to the EEPROM)
Writing data beyond ‘40h’ may affect device function.
All data transferred with the MSB first.
Unless customer-specific setting.
During EEPROM programming, no data is allowed to be sent to the device via the SDA/SCL bus until the programming sequence is
completed. Data, however, can be read out during the programming sequence (Byte Read or Block Read).
If this bit is set to high in the EEPROM, the actual data in the EEPROM will be permanently locked. There is no further programming
possible. Data, however can still be written via SDA/SCL bus to the internal register to change device function on the fly. But new data
can no longer be saved to the EEPROM. EELOCK is effective only, if written into the EEPROM!
Selection of “control pins” is effective only if written into the EEPROM. Once written into the EEPROM, the serial programming pins are
no longer available. However, if VDDOUT is forced to GND, the two control pins, S1 and S2, temporally act as serial programming pins
(SDA/SCL), and the two slave receiver address bits are reset to A0=”0” and A1=“0”.
These are the bits of the Control Terminal Register. The user can predefine up to eight different control settings. These settings then
can be selected by the external control pins, S0, S1, and S2.
The internal load capacitor (C1, C2) has to be used to achieve the best clock performance. External capacitors should be used only to
finely adjust CL by a few pF's. The value of CL can be programmed with a resolution of 1 pF for a crystal load range of 0 pF to 20 pF.
For CL > 20 pF, use additional external capacitors. Also, the value of the device input capacitance has to be considered which always
adds 1.5 pF (6 pF//2 pF) to the selected CL. For more information about VCXO configuration and crystal recommendation, see
application report SCAA085.
Note: The EEPROM WRITE bit must be sent last. This ensures that the content of all internal registers are stored in the EEPROM. The
EEWRITE cycle is initiated with the rising edge of the EEWRITE bit. A static level high does not trigger an EEPROM WRITE cycle. The
EEWRITE bit has to be reset to low after the programming is completed. The programming status can be monitored by reading out
EEPIP. If EELOCK is set to high, no EEPROM programming is possible.
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Table 9. Generic Configuration Register (continued)
Offset (1)
Bit (2)
Acronym
Default (3)
—
0h
07h-0Fh
Description
Unused address range
Table 10. PLL1 Configuration Register
OFFSET
10h
11h
12h
13h
14h
15h
(1)
(2)
(3)
(4)
(1)
Acronym
Default (3)
7:5
SSC1_7 [2:0]
000b
4:2
SSC1_6 [2:0]
000b
1:0
SSC1_5 [2:1]
7
SSC1_5 [0]
6:4
SSC1_4 [2:0]
000b
3:1
SSC1_3 [2:0]
000b
0
SSC1_2 [2]
7:6
SSC1_2 [1:0]
5:3
SSC1_1 [2:0]
000b
2:0
SSC1_0 [2:0]
000b
7
FS1_7
0b
6
FS1_6
0b
5
FS1_5
0b
4
FS1_4
0b
3
FS1_3
0b
2
FS1_2
0b
1
FS1_1
0b
0
FS1_0
0b
7
MUX1
1b
PLL1 Multiplexer:
0 – PLL1
1 – PLL1 Bypass (PLL1 is in power down)
6
M2
1b
Output Y2 Multiplexer:
0 – Pdiv1
1 – Pdiv2
5:4
M3
10b
Output Y3 Multiplexer:
00 –
01 –
10 –
11 –
3:2
Y2Y3_ST1
11b
Y2, Y3-State0/1definition:
00 – Y2/Y3 disabled to 3-State (PLL1 is in power down)
01 – Y2/Y3 disabled to 3-State
10–Y2/Y3 disabled to low
11 – Y2/Y3 enabled
Bit
(2)
000b
000b
1:0
Y2Y3_ST0
01b
7
Y2Y3_7
0b
6
Y2Y3_6
0b
5
Y2Y3_5
0b
4
Y2Y3_4
0b
3
Y2Y3_3
0b
2
Y2Y3_2
0b
1
Y2Y3_1
1b
0
Y2Y3_0
0b
DESCRIPTION
SSC1: PLL1 SSC Selection (Modulation Amount) (4)
Down
000 (off)
001 – 0.25%
010 – 0.5%
011 – 0.75%
100 – 1.0%
101 – 1.25%
110 – 1.5%
111 – 2.0%
Center
000 (off)
001 ± 0.25%
010 ± 0.5%
011 ± 0.75%
100 ± 1.0%
101 ± 1.25%
110 ± 1.5%
111 ± 2.0%
FS1_x: PLL1 Frequency Selection(4)
0 – fVCO1_0 (predefined by PLL1_0 – Multiplier/Divider value)
1 – fVCO1_1 (predefined by PLL1_1 – Multiplier/Divider value)
Pdiv1-Divider
Pdiv2-Divider
Pdiv3-Divider
reserved
Y2Y3_x Output State Selection(4)
0 – state0 (predefined by Y2Y3_ST0)
1 – state1 (predefined by Y2Y3_ST1)
Writing data beyond 40h may adversely affect device function.
All data is transferred MSB-first.
Unless a custom setting is used
The user can predefine up to eight different control settings. In normal device operation, these settings can be selected by the external
control pins, S0, S1, and S2.
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): CDCE937-Q1
17
CDCE937-Q1
CDCEL937-Q1
SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
www.ti.com
Table 10. PLL1 Configuration Register (continued)
OFFSET (1)
16h
17h
18h
19h
1Ah
Bit (2)
Acronym
Default (3)
7
SSC1DC
0b
PLL1 SSC down/center selection:
0 – down
6:0
Pdiv2
01h
7-Bit Y2-Output-Divider Pdiv2:
0 – reset and stand-by
7
—
0b
Reserved – do not write others than 0
6:0
Pdiv3
01h
7-Bit Y3-Output-Divider Pdiv3:
7:0
PLL1_0N [11:4]
7:4
PLL1_0N [3:0]
004h
PLL1_0: 30-Bit Multiplier/Divider value for frequency fVCO1_0
(for more information, see paragraph PLL Multiplier/Divider Definition).
3:0
PLL1_0R [8:5]
7:3
PLL1_0R[4:0]
2:0
PLL1_0Q [5:3]
7:5
PLL1_0Q [2:0]
4:2
PLL1_0P [2:0]
010b
1:0
VCO1_0_RANGE
00b
7:0
PLL1_1N [11:4]
7:4
PLL1_1N [3:0]
1Dh
3:0
PLL1_1R [8:5]
7:3
PLL1_1R[4:0]
1Eh
2:0
PLL1_1Q [5:3]
7:5
PLL1_1Q [2:0]
4:2
PLL1_1P [2:0]
010b
1:0
VCO1_1_RANGE
00b
0 – reset and stand-by
1-to-127 is divider value
1-to-127 is divider value
10h
fVCO1_0 range selection:
004h
00 –
01 –
10 –
11 –
fVCO1_0 < 125 MHz
125 MHz ≤ fVCO1_0 < 150 MHz
150 MHz ≤ fVCO1_0 < 175 MHz
fVCO1_0 ≥ 175 MHz
PLL1_1: 30-Bit Multiplier/Divider value for frequency fVCO1_1
(for more information see paragraph PLL Multiplier/Divider Definition)
000h
10h
1Fh
18
1 – center
000h
1Bh
1Ch
DESCRIPTION
fVCO1_1 range selection:
Submit Documentation Feedback
00 –
01 –
10 –
11 –
fVCO1_1 < 125 MHz
125 MHz ≤ fVCO1_1 < 150 MHz
150 MHz ≤ fVCO1_1 < 175 MHz
fVCO1_1 ≥ 175 MHz
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): CDCE937-Q1
CDCE937-Q1
CDCEL937-Q1
www.ti.com
SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
Table 11. PLL2 Configuration Register
OFFSET (1)
20h
21h
22h
23h
24h
25h
(1)
(2)
(3)
(4)
Bit (2)
Acronym
Default (3)
7:5
SSC2_7 [2:0]
000b
4:2
SSC2_6 [2:0]
000b
1:0
SSC2_5 [2:1]
7
SSC2_5 [0]
6:4
SSC2_4 [2:0]
000b
3:1
SSC2_3 [2:0]
000b
0
SSC2_2 [2]
7:6
SSC2_2 [1:0]
5:3
SSC2_1 [2:0]
000b
2:0
SSC2_0 [2:0]
000b
7
FS2_7
0b
6
FS2_6
0b
5
FS2_5
0b
4
FS2_4
0b
3
FS2_3
0b
2
FS2_2
0b
1
FS2_1
0b
0
FS2_0
0b
7
MUX2
1b
6
M4
1b
5:4
M5
10b
3:2
Y4Y5_ST1
11b
1:0
Y4Y5_ST0
01b
7
Y4Y5_7
0b
6
Y4Y5_6
0b
5
Y4Y5_5
0b
4
Y4Y5_4
0b
3
Y4Y5_3
0b
2
Y4Y5_2
0b
1
Y4Y5_1
1b
0
Y4Y5_0
0b
000b
000b
DESCRIPTION
SSC2: PLL2 SSC Selection (Modulation Amount) (4)
Down
000 (off)
001 – 0.25%
010 – 0.5%
011 – 0.75%
100 – 1.0%
101 – 1.25%
110 – 1.5%
111 – 2.0%
Center
000 (off)
001 ± 0.25%
010 ± 0.5%
011 ± 0.75%
100 ± 1.0%
101 ± 1.25%
110 ± 1.5%
111 ± 2.0%
FS2_x: PLL2 Frequency Selection(4)
0 – fVCO2_0 (predefined by PLL2_0 – Multiplier/Divider value)
1 – fVCO2_1 (predefined by PLL2_1 – Multiplier/Divider value)
PLL2 Multiplexer:
0 – PLL2
1 – PLL2 Bypass (PLL2 is in power down)
Output Y4 Multiplexer:
0 – Pdiv2
1 – Pdiv4
Output Y5 Multiplexer:
00 –
01 –
10 –
11 –
Y4,
Y5-State0/1definition:
00 – Y4/Y5 disabled to 3-State (PLL2 is in power down)
01 – Y4/Y5 disabled to 3-State
10–Y4/Y5 disabled to low
11 – Y4/Y5 enabled
Pdiv2-Divider
Pdiv4-Divider
Pdiv5-Divider
reserved
Y4Y5_x Output State Selection(4)
0 – state0 (predefined by Y4Y5_ST0)
1 – state1 (predefined by Y4Y5_ST1)
Writing data beyond 40h may adversely affect device function.
All data is transferred MSB-first.
Unless a custom setting is used
The user can predefine up to eight different control settings. In normal device operation, these settings can be selected by the external
control pins, S0, S1, and S2.
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): CDCE937-Q1
19
CDCE937-Q1
CDCEL937-Q1
SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
www.ti.com
Table 11. PLL2 Configuration Register (continued)
OFFSET (1)
26h
27h
28h
29h
2Ah
Bit (2)
Acronym
Default (3)
2Dh
2Eh
0 – reset and stand-by
SSC2DC
0b
6:0
Pdiv4
01h
7-Bit Y4-Output-Divider Pdiv4:
7
—
0b
Reserved – do not write others than 0
6:0
Pdiv5
01h
7-Bit Y5-Output-Divider Pdiv5:
7:0
PLL2_0N [11:4
7:4
PLL2_0N [3:0]
004h
PLL2_0: 30-Bit Multiplier/Divider value for frequency fVCO2_0
(for more information see paragraph PLL Multiplier/Divider Definition)
3:0
PLL2_0R [8:5]
7:3
PLL2_0R[4:0]
2:0
PLL2_0Q [5:3]
7:5
PLL2_0Q [2:0]
4:2
PLL2_0P [2:0]
010b
1:0
VCO2_0_RANGE
00b
7:0
PLL2_1N [11:4]
7:4
PLL2_1N [3:0]
3:0
PLL2_1R [8:5]
7:3
PLL2_1R[4:0]
2:0
PLL2_1Q [5:3]
7:5
PLL2_1Q [2:0]
4:2
PLL2_1P [2:0]
010b
1:0
VCO2_1_RANGE
00b
0 – reset and stand-by
1-to-127 – divider value
1-to-127 – divider value
000h
10h
fVCO2_0 range selection:
004h
00 –
01 –
10 –
11 –
fVCO2_0 < 125 MHz
125 MHz ≤ fVCO2_0 < 150 MHz
150 MHz ≤ fVCO2_0 < 175 MHz
fVCO2_0 ≥ 175 MHz
PLL2_1: 30-Bit Multiplier/Divider value for frequency fVCO2_1
(for more information see paragraph PLL Multiplier/Divider Definition)
000h
10h
2Fh
20
0 – down
1 – center
7
2Bh
2Ch
DESCRIPTION
PLL2 SSC down/center selection:
fVCO2_1 range selection:
Submit Documentation Feedback
00 –
01 –
10 –
11 –
fVCO2_1 < 125 MHz
125 MHz ≤ fVCO2_1 < 150 MHz
150 MHz ≤ fVCO2_1 < 175 MHz
fVCO2_1 ≥ 175 MHz
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): CDCE937-Q1
CDCE937-Q1
CDCEL937-Q1
www.ti.com
SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
Table 12. PLL3 Configuration Register
OFFSET (1)
30h
31h
32h
33h
34h
35h
(1)
(2)
(3)
(4)
Bit (2)
Acronym
Default (3)
7:5
SSC3_7 [2:0]
000b
4:2
SSC3_6 [2:0]
000b
1:0
SSC3_5 [2:1]
7
SSC3_5 [0]
6:4
SSC3_4 [2:0]
000b
3:1
SSC3_3 [2:0]
000b
0
SSC3_2 [2]
7:6
SSC3_2 [1:0]
5:3
SSC3_1 [2:0]
000b
2:0
SSC3_0 [2:0]
000b
7
FS3_7
0b
6
FS3_6
0b
5
FS3_5
0b
4
FS3_4
0b
3
FS3_3
0b
2
FS3_2
0b
1
FS3_1
0b
0
FS3_0
0b
7
MUX3
1b
PLL3 Multiplexer:
0 – PLL3
1 – PLL3 Bypass (PLL3 is in power down)
6
M6
1b
Output Y6 Multiplexer:
0 – Pdiv4
1 – Pdiv6
5:4
M7
10b
Output Y7 Multiplexer:
00 –
01 –
10 –
11 –
3:2
Y6Y7_ST1
11b
00 – Y6/Y7 disabled to 3-State and PLL3 power down
01 – Y6/Y7 disabled to 3-State
10 –Y6/Y7 disabled to low
11 – Y6/Y7 enabled
000b
000b
DESCRIPTION
SSC3: PLL3 SSC Selection (Modulation Amount) (4)
Down
000 (off)
001 – 0.25%
010 – 0.5%
011 – 0.75%
100 – 1.0%
101 – 1.25%
110 – 1.5%
111 – 2.0%
Center
000 (off)
001 ± 0.25%
010 ± 0.5%
011 ± 0.75%
100 ± 1.0%
101 ± 1.25%
110 ± 1.5%
111 ± 2.0%
FS3_x: PLL3 Frequency Selection(4)
0 – fVCO3_0 (predefined by PLL3_0 – Multiplier/Divider value)
1 – fVCO3_1 (predefined by PLL3_1 – Multiplier/Divider value)
Pdiv4-Divider
Pdiv6-Divider
Pdiv7-Divider
reserved
1:0
Y6Y7_ST0
01b
Y6,
Y7-State0/1definition:
7
Y6Y7_7
0b
Y6Y7_x Output State Selection(4)
6
Y6Y7_6
0b
5
Y6Y7_5
0b
4
Y6Y7_4
0b
3
Y6Y7_3
0b
2
Y6Y7_2
0b
1
Y6Y7_1
1b
0
Y6Y7_0
0b
0 – state0 (predefined by Y6Y7_ST0)
1 – state1 (predefined by Y6Y7_ST1)
Writing data beyond 40h may affect device function.
All data is transferred MSB-first.
Unless a custom setting is used
These are the bits of the Control Terminal Register. The user can pre-define up to eight different control settings. At normal device
operation, these setting can be selected by the external control pins, S0, S1, and S2.
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): CDCE937-Q1
21
CDCE937-Q1
CDCEL937-Q1
SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
www.ti.com
Table 12. PLL3 Configuration Register (continued)
OFFSET (1)
36h
37h
38h
39h
3Ah
Bit (2)
Acronym
Default (3)
7
SSC3DC
0b
PLL3 SSC down/center selection:
0 – down
6:0
Pdiv6
01h
7-Bit Y6-Output-Divider Pdiv6:
0 – reset and stand-by
1-to-127 – divider value
7
—
0b
Reserved – do not write others than 0
6:0
Pdiv7
01h
7-Bit Y7-Output-Divider Pdiv7:
0 – reset and stand-by
1-to-127 – divider value
7:0
PLL3_0N [11:4]
7:4
PLL3_0N [3:0]
004h
PLL3_0: 30-Bit Multiplier/Divider value for frequency fVCO3_0
(for more information see paragraph PLL Multiplier/Divider Definition)
3:0
PLL3_0R [8:5]
7:3
PLL3_0R[4:0]
2:0
PLL3_0Q [5:3]
7:5
PLL3_0Q [2:0]
4:2
PLL3_0P [2:0]
010b
1:0
VCO3_0_RANGE
00b
7:0
PLL3_1N [11:4]
7:4
PLL3_1N [3:0]
3Dh
3:0
PLL3_1R [8:5]
7:3
PLL3_1R[4:0]
3Eh
2:0
PLL3_1Q [5:3]
7:5
PLL3_1Q [2:0]
4:2
PLL3_1P [2:0]
010b
1:0
VCO3_1_RANGE
00b
10h
fVCO3_0 range selection:
004h
00 –
01 –
10 –
11 –
fVCO3_0 < 125 MHz
125 MHz ≤ fVCO3_0 < 150 MHz
150 MHz ≤ fVCO3_0 < 175 MHz
fVCO3_0 ≥ 175 MHz
PLL3_1: 30-Bit Multiplier/Divider value for frequency fVCO3_1
(for more information see paragraph PLL Multiplier/Divider Definition)
000h
10h
3Fh
22
1 – center
000h
3Bh
3Ch
DESCRIPTION
fVCO3_1 range selection:
Submit Documentation Feedback
00 –
01 –
10 –
11 –
fVCO3_1 < 125 MHz
125 MHz ≤ fVCO3_1 < 150 MHz
150 MHz ≤ fVCO3_1 < 175 MHz
fVCO3_1 ≥ 175 MHz
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): CDCE937-Q1
CDCE937-Q1
CDCEL937-Q1
www.ti.com
SCAS892B – FEBRUARY 2010 – REVISED MAY 2010
PLL Multiplier/Divider Definition
At a given input frequency (ƒIN), the output frequency (ƒOUT) of the CDCE937/CDCEL937 can be calculated:
ƒ
N
ƒ OUT + IN
Pdiv M
(1)
where
M (1 to 511) and N (1 to 4095) are the multiplier/divide values of the PLL;
Pdiv (1 to 127) is the output divider.
The target VCO frequency (ƒVCO) of each PLL can be calculated:
N
ƒ VCO + ƒIN
M
(2)
The PLL internally operates as fractional divider and needs the following multiplier/divider settings:
N
ǒlog MN Ǔ [if P t 0 then P + 0]
ǒNȀǓ
Q = int M
2
P = 4 – int
R = N′ – M × Q
where
N′ = N × 2P
N≥M
100 MHz < ƒVCO > 200 MHz
Example:
for ƒIN = 27 MHz; M = 1; N = 4; Pdiv = 2;
for ƒIN = 27 MHz; M = 2; N = 11; Pdiv = 2;
→ fOUT = 54 MHz
→ fOUT = 74.25 MHz
→ fVCO = 108 MHz
→ fVCO = 148.50 MHz
→ P = 4 – int(log24) = 4 – 2 = 2
→ P = 4 – int(log25.5) = 4 – 2 = 2
2
→ N′ = 4 × 2 = 16
→ N′ = 11 × 22 = 44
→ Q = int(16) = 16
→ Q = int(22) = 22
→ R = 16 – 16 = 0
→ R = 44 – 44 = 0
The values for P, Q, R, and N’ is automatically calculated when using TI Pro-Clock™ software.
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): CDCE937-Q1
23
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
CDCE937QPWRQ1
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CDCE937Q
CDCEL937QPWRQ1
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CEL937Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CDCE937-Q1, CDCEL937-Q1 :
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
• Catalog: CDCE937, CDCEL937
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CDCE937QPWRQ1
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
CDCEL937QPWRQ1
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDCE937QPWRQ1
TSSOP
PW
20
2000
367.0
367.0
38.0
CDCEL937QPWRQ1
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
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