Design Assistance Customised Pack Sizes / Qtys Assembly Assistance Support for all industry recognised supply formats: Die handling consultancy Hi-Rel die qualification Hot & Cold die probing Electrical test & trimming o Waffle Pack o Gel Pak o Tape & Reel Onsite storage, stockholding & scheduling 100% Visual Inspection o MIL-STD 883 Condition A o MIL-STD 883 Condition A On-site failure analysis Bespoke 24 Hour monitored storage systems for secure long term product support On-site failure analysis Contact [email protected] For price, delivery and to place orders HMC464 www.analog.com www.micross.com Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK HMC464 v04.0308 LINEAR & POWER AMPLIFIERS - CHIP 3 GaAs PHEMT MMIC POWER AMPLIFIER, 2 - 20 GHz Typical Applications Features The HMC464 wideband driver is ideal for: P1dB Output Power: +26 dBm • Telecom Infrastructure Gain: 16 dB • Microwave Radio & VSAT Output IP3: +30 dBm • Military & Space Supply Voltage: +8.0V @ 290 mA • Test Instrumentation 50 Ohm Matched Input/Output • Fiber Optics Die Size: 3.12 x 1.63 x 0.1 mm Functional Diagram General Description The HMC464 is a GaAs MMIC PHEMT Distributed Power Amplifier die which operates between 2 and 20 GHz. The amplifier provides 16 dB of gain, +30 dBm Output IP3 and +26 dBm of output power at 1 dB gain compression while requiring 290 mA from a +8V supply. Gain flatness is excellent from 2 - 18 GHz making the HMC464 ideal for EW, ECM and radar driver amplifier applications. The HMC464 amplifier I/O’s are internally matched to 50 Ohms facilitating easy integration into Multi-Chip-Modules (MCMs). All data is with the chip in a 50 Ohm test fixture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils). Electrical Specifi cations, TA = +25° C, Vdd= 8V, Vgg2= 3V, Idd= 290 mA* Parameter Min. Frequency Range Gain Typ. Max. Min. 2.0 - 6.0 14 Gain Flatness 16 13 ±0.25 Gain Variation Over Temperature 0.02 Typ. Max. Min. 6.0 - 18.0 16 11 ±0.5 0.03 0.02 Typ. Max. GHz 14 dB ±0.75 0.03 0.03 dB 0.04 dB/ °C Input Return Loss 15 17 13 Output Return Loss 14 12 11 dB 22 dBm 24.5 dBm Output Power for 1 dB Compression (P1dB) Saturated Output Power (Psat) 23.5 26.5 28 22 26 27.5 19 dB Output Third Order Intercept (IP3) 32 30 24 dBm Noise Figure 4.0 4.0 6.0 dB Supply Current (Idd) (Vdd= 8V, Vgg1= -0.5V Typ.) 290 290 290 mA * Adjust Vgg1 between -2 to 0V to achieve Idd= 290 mA typical. 3 - 36 Units 18.0 - 20.0 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC464 v04.0308 GaAs PHEMT MMIC POWER AMPLIFIER, 2 - 20 GHz Gain vs. Temperature 20 10 16 S21 S11 S22 0 -10 -20 3 12 +25C +85C -55C 8 4 -30 0 0 4 8 12 16 20 24 0 2 4 6 FREQUENCY (GHz) Input Return Loss vs. Temperature 12 14 16 18 20 22 0 -5 +25C +85C -55C -10 +25C +85C -55C -5 RETURN LOSS (dB) RETURN LOSS (dB) 10 Output Return Loss vs. Temperature 0 -15 -20 -10 -15 -20 -25 -25 -30 0 2 4 6 8 10 12 14 16 18 20 22 0 2 4 6 8 10 12 14 16 18 20 22 18 20 22 FREQUENCY (GHz) FREQUENCY (GHz) Noise Figure vs. Temperature Reverse Isolation vs. Temperature 0 10 -10 +25C +85C -55C -20 +25C +85C -55C 8 NOISE FIGURE (dB) REVERSE ISOLATION (dB) 8 FREQUENCY (GHz) -30 -40 -50 LINEAR & POWER AMPLIFIERS - CHIP 20 GAIN (dB) RESPONSE (dB) Gain & Return Loss 6 4 2 -60 0 -70 0 2 4 6 8 10 12 14 FREQUENCY (GHz) 16 18 20 22 0 2 4 6 8 10 12 14 16 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 37 HMC464 v04.0308 GaAs PHEMT MMIC POWER AMPLIFIER, 2 - 20 GHz Output P1dB vs. Temperature Output Psat vs. Temperature 30 30 28 26 26 Psat (dBm) P1dB (dBm) 22 20 +25C 18 +85C 16 -55C 22 +25C +85C -55C 18 14 14 12 10 10 0 2 4 6 8 10 12 14 16 18 20 0 22 2 4 6 32 28 +25C +85C -55C 20 16 2 4 6 8 10 12 14 16 18 20 22 GAIN (dB), P1dB (dBm), Psat (dBm), IP3 (dBm) 36 0 10 12 14 16 18 20 22 Gain, Power & Output IP3 vs. Supply Voltage @ 10 GHz, Fixed Vgg Output IP3 vs. Temperature 24 8 FREQUENCY (GHz) FREQUENCY (GHz) IP3 (dBm) LINEAR & POWER AMPLIFIERS - CHIP 3 24 32 30 28 26 24 22 Gain P1dB Psat IP3 20 18 16 14 12 10 7.5 8 FREQUENCY (GHz) Absolute Maximum Ratings Drain Bias Voltage (Vdd) +9 Vdc Gate Bias Voltage (Vgg1) -2 to 0 Vdc 8.5 Vdd SUPPLY VOLTAGE (V) Typical Supply Current vs. Vdd Vdd (V) Idd (mA) +7.5 292 Gate Bias Voltage (Vgg2) (Vdd -8) Vdc to Vdd +8.0 290 RF Input Power (RFIN)(Vdd = +8 Vdc) +20 dBm +8.5 288 Channel Temperature 175 °C Continuous Pdiss (T= 85 °C) (derate 51.5 mW/°C above 85 °C) 4.64 W Thermal Resistance (channel to die bottom) 19.4 °C/W Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C ESD Sensitivity (HBM) Class 1A ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Die Packaging Information [1] Standard Alternate GP-1 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. 3 - 38 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC464 v04.0308 GaAs PHEMT MMIC POWER AMPLIFIER, 2 - 20 GHz Outline Drawing NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] 2. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 3. DIE THICKNESS IS 0.004 (0.100) 4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE 5. BACKSIDE METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND 7. BOND PAD METALIZATION: GOLD Pad Descriptions Pad Number Function Description 1 RFIN This pad is AC coupled and matched to 50 Ohms. 2 Vgg2 Gate Control 2 for amplifier. +3V should be applied to Vgg2 for nominal operation. 3 RFOUT & Vdd RF output for amplifier. Connect the DC bias (Vdd) network to provide drain current (Idd). See application circuit herein. 4 Vgg1 Gate Control 1 for amplifier. Adjust between -2 to 0V to achieve Idd= 290 mA. Die Bottom GND Die bottom must be connected to RF/DC ground. Interface Schematic For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com LINEAR & POWER AMPLIFIERS - CHIP 3 3 - 39 HMC464 v04.0308 GaAs PHEMT MMIC POWER AMPLIFIER, 2 - 20 GHz Assembly Diagram LINEAR & POWER AMPLIFIERS - CHIP 3 Application Circuit NOTE 1: Drain Bias (Vdd) must be applied through a broadband bias tee or external bias network. 3 - 40 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC464 v04.0308 GaAs PHEMT MMIC POWER AMPLIFIER, 2 - 20 GHz Mounting & Bonding Techniques for Millimeterwave GaAs MMICs 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 3 0.076mm (0.003”) RF Ground Plane Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: strikes. 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane Follow ESD precautions to protect against ESD Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. 0.150mm (0.005”) Thick Moly Tab 0.254mm (0.010”) Thick Alumina Thin Film Substrate Figure 2. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. LINEAR & POWER AMPLIFIERS - CHIP The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils). For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 41