NL27WZ126 Dual Buffer with 3-State Outputs The NL27WZ126 is a high performance dual noninverting buffer operating from a 2.3 V to 5.5 V supply. • • • • • • • • • • Extremely High Speed: tPD 2.6 ns (typical) at VCC = 5 V Designed for 2.3 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs and Outputs LVTTL Compatible – Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements 3–State OE Input is Active–High Replacement for NC7WZ126 Chip Complexity = 72 FETs http://onsemi.com MARKING DIAGRAM 8 8 1 M2 US8 US SUFFIX CASE 493–01 D 1 D = Date Code Figure 1. ORDERING INFORMATION OE1 1 8 VCC A1 2 7 OE2 Y2 3 6 Y1 See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. A1 GND 5 4 A2 1 OE1 Y1 EN A2 OE2 Figure 1. Pinout (Top View) Y2 Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin Function 1 OE 2 A1 OEn An Yn 3 Y2 H H H 4 GND H L L 5 A2 L X Z 6 Y1 7 OE2 8 VCC Semiconductor Components Industries, LLC, 2002 July, 2002 – Rev. 2 Input Output X = Don’t Care n = 1, 2 1 Publication Order Number: NL27WZ126/D NL27WZ126 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage 0.5 to 7.0 V VI DC Input Voltage 0.5 to 7.0 V VO DC Output Voltage 0.5 to 7.0 V IIK DC Input Diode Current VI < GND 50 mA IOK DC Output Diode Current VO < GND 50 mA IO DC Output Sink Current 50 mA ICC DC Supply Current per Supply Pin 100 mA IGND DC Ground Current per Ground Pin 100 mA TSTG Storage Temperature Range 65 to 150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias JA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage (Note 1) 260 °C 150 °C 250 °C/W 250 mW Level 1 Oxygen Index: 28 to 34 UL 94 V–0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm–by–1 inch, 2–ounce copper trace with no air flow. 2. Tested to EIA/JESD22–A114–A. 3. Tested to EIA/JESD22–A115–A. 4. Tested to JESD22–C101–A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free–Air Temperature t/V Input Transition Rise or Fall Rate Min Max Unit 2.3 1.5 5.5 5.5 V (Note 5) 0 5.5 V (HIGH or LOW State) 0 5.5 V 40 85 °C 0 0 0 20 10 5 ns/V Operating Data Retention Only VCC = 2.5 V 0.2 V VCC = 3.0 V 0.3 V VCC = 5.0 V 0.5 V 5. Unused inputs may not be left open. All inputs must be tied to a high– or low–logic input voltage level. http://onsemi.com 2 NL27WZ126 DC ELECTRICAL CHARACTERISTICS VCC Symbol Parameter VIH High–Level Input Voltage VIL Low–Level Input Voltage VOH High–Level Output Voltage VIN = VIH VOL Low–Level Output Voltage VIN = VIH or VIL Condition 40C TA 85C TA = 25C (V) Min Typ 2.3 to 5.5 0.7 VCC Max Min Max 0.7 VCC 2.3 to 5.5 0.3 VCC V 0.3 VCC IOH = 100 A 2.3 to 5.5 VCC – 0.1 VCC VCC – 0.1 IOH = –8 mA 2.3 1.9 2.1 1.9 IOH = –12 mA 2.7 2.2 2.4 2.2 IOH = –16 mA 3.0 2.4 2.7 2.4 IOH = –24 mA 3.0 2.3 2.5 2.3 IOH = –32 mA 4.5 3.8 4.0 3.8 IOL = 100 A 2.3 to 5.5 Unit V V 0.1 0.1 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 0 to 5.5 0.1 1.0 A 0 1 10 A IIN Input Leakage Current VIN = VCC or GND IOFF Power Off–Output Leakage Current VOUT = 5.5 V ICC Quiescent Supply Current VIN = VCC or GND IOZ 3–State Output Leakage VIN = VIL or VIH 0 V VOUT 5.5 V V 5.5 1 10 A 2.3 to 5.5 0.5 5 A AC ELECTRICAL CHARACTERISTICS (tR = tF = 3.0 ns) VCC Symbol tPLH tPHL Parameter Propagation Delay AN to YN (Figures 3 and 4, T bl 1)) Table Condition 40C TA 85C TA = 25C (V) Min Max Min Max Unit RL = 1 M CL = 15 pF 2.5 0.2 1.0 7.5 1.0 8 ns RL = 1 M CL = 15 pF 3.3 0.3 0.8 5.2 0.8 5.5 RL = 500 CL = 50 pF 1.2 5.7 1.2 6.0 RL = 1 M CL = 15 pF 0.5 4.5 0.5 4.8 RL = 500 CL = 50 pF 0.8 5.0 0.8 5.3 5.0 0.5 Typ tOSLH tOSHL Output to Output Skew (Note 6) RL = 500 CL = 50 pF 3.3 0.3 1.0 1.0 RL = 500 CL = 50 pF 5.0 0.5 0.8 0.8 tPZH tPZL Output Enable Time (Figures 5, 6 and 7, Table 1) RL = 250 CL = 50 pF 2.5 0.2 1.8 8.5 1.8 9.0 3.3 0.3 1.2 6.2 1.2 6.5 5.0 0.5 0.8 5.5 0.8 5.8 2.5 0.2 1.5 8.0 1.5 8.5 3.3 0.3 0.8 5.7 0.8 6.0 5.0 0.5 0.3 4.7 0.3 5.0 tPHZ tPLZ Output Enable Time (Figures 5, 6 and 7, Table 1) RL and R1= 500 CL = 50 pF ns ns ns 6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. This specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter guaranteed by design. http://onsemi.com 3 NL27WZ126 CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (N (Note 7)) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 9 pF 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 11 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no–load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. tf = 3 ns tf = 3 ns 90% INPUT A and B Vmi OE = GND VCC 90% INPUT Vmi 10% 10% tPHL OUTPUT CL * GND RL tPLH VOH OUTPUT Y Vmo Vmo *Includes all probe and jig capacitance. A 1 MHz square input wave is recommended for propagation delay tests. VOL Figure 3. Switching Waveform Figure 4. TPLH or TPHL 2.7 V Vmi Vmi OE 0V tPHZ tPZH VCC VOH – 0.3 V Vmo On ≈0V tPZL tPLZ ≈ 3.0 V Vmo On VOL + 0.3 V GND Figure 5. AC Output Enable and Disable Waveform Table 1. Output Enable and Disable Times tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VCC Symbol 3.3 V 0.3 V 2.7 V 2.5 V 0.2 V Vmi 1.5 V 1.5 V VCC/2 Vmo 1.5 V 1.5 V VCC/2 http://onsemi.com 4 NL27WZ126 2 VCC INPUT INPUT R1 = 500 VCC OUTPUT OUTPUT RL = 500 CL = 50 pF CL = 50 pF RL = 250 A 1 MHz square input wave is recommended for propagation delay tests. A 1 MHz square input wave is recommended for propagation delay tests. Figure 6. TPZL or TPLZ Figure 7. TPZH or TPHZ DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number NL27WZ126US Logic Circuit Indicator No. of Gates per Package Temp Range Identifier Technology Device Function Package Suffix Package Type Tape and Reel Size NL 2 7 WZ 126 US US8 178 mm, 3000 Units http://onsemi.com 5 NL27WZ126 CAVITY TAPE TOP TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN COMPONENTS TAPE LEADER NO COMPONENTS 400 mm MIN DIRECTION OF FEED Figure 8. Tape Ends for Finished Goods TAPE DIMENSIONS mm 4.00 1.50 TYP 4.00 2.00 1.75 3.50 0.25 0.30 8.00 + – 0.10 1 1.00 ± 0.25 TYP DIRECTION OF FEED Figure 9. US8 Reel Configuration/Orientation http://onsemi.com 6 NL27WZ126 t MAX 1.5 mm MIN (0.06 in) A 13.0 mm 0.2 mm (0.512 in 0.008 in) 50 mm MIN (1.969 in) 20.2 mm MIN (0.795 in) FULL RADIUS G Figure 10. Reel Dimensions REEL DIMENSIONS Tape Size T and R Suffix A Max G t Max 8 mm US 178 mm (7 in) 8.4 mm, + 1.5 mm, –0.0 (0.33 in + 0.059 in, –0.00) 14.4 mm (0.56 in) DIRECTION OF FEED BARCODE LABEL POCKET Figure 11. Reel Winding Direction http://onsemi.com 7 HOLE NL27WZ126 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493–01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION A" DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055") PER SIDE. 4. DIMENSION B" DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSION. INTER-LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055") PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076-0. 0203 MM. (300-800 INCH). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002"). –X– A 8 J –Y– 5 DETAIL E B L 1 4 R S G P U C –T– SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M T X Y R 0.10 TYP V M F DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0 6 5 10 0.28 0.44 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0 6 5 10 0.011 0.017 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC DETAIL E 3.8 0.5 TYP ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 1.8 TYP ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 1.0 0.3 TYP (mm) ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: [email protected] JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: [email protected] ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800–282–9855 Toll Free USA/Canada http://onsemi.com 8 NL27WZ126/D