TI OPA347SA3KG4 Micropower, rail-to-rail operational amplifier Datasheet

OPA
347
OPA
OPA
®
347
OPA347
OPA2347
OPA4347
347
OPA
434
7
OPA
234
7
SBOS167D – NOVEMBER 2000– REVISED JULY 2007
microPower,
Rail-to-Rail
Operational Amplifiers
FEATURES
DESCRIPTION
● LOW IQ: 20µA
● microSIZE PACKAGES: WCSP-8, SC70-5
SOT23-5, SOT23-8, and TSSOP-14
● HIGH SPEED/POWER RATIO WITH
BANDWIDTH: 350kHz
● RAIL-TO-RAIL INPUT AND OUTPUT
● SINGLE SUPPLY: 2.3V to 5.5V
The OPA347 is a microPower, low-cost operational amplifier
available in micropackages. The OPA347 (single version) is
available in the SC-70 and SOT23-5 packages. The OPA2347
(dual version) is available in the SOT23-8 and WCSP-8
packages. Both are also available in the SO-8. The OPA347
is also available in the DIP-8. The OPA4347 (quad) is
available in the SO-14 and the TSSOP-14.
The small size and low power consumption (34µA per channel maximum) of the OPA347 make it ideal for portable and
battery-powered applications. The input range of the OPA347
extends 200mV beyond the rails, and the output range is
within 5mV of the rails. The OPA347 also features an
excellent speed/power ratio with a bandwidth of 350kHz.
APPLICATIONS
●
●
●
●
●
PORTABLE EQUIPMENT
BATTERY-POWERED EQUIPMENT
2-WIRE TRANSMITTERS
SMOKE DETECTORS
CO DETECTORS
The OPA347 can be operated with a single or dual power
supply from 2.3V to 5.5V. All models are specified for
operation from –55°C to +125°C.
OPA347
OPA347
OPA2347
(bump side down)
Not to Scale
Out
1
V–
2
+In
3
5
V+
+In 1
4
–In 3
–In
1
Out A
1
8
V+
–In A
2
7
Out B
+In A
3
6
–In B
V–
4
5
+In B
WCSP-8
(top view)
OPA4347
5 V+
V– 2
4 Out
SC70-5
OPA2347
NC
1
8
NC
Out A
1
–In
2
7
V+
–In A
2
+In
3
6
Out
+In A
3
V–
4
5
NC
V–
4
SO-8, DIP-8
A
B
1
8
V+
7
Out B
6
–In B
5
+In B
14
Out D
–In A
2
13
–In D
+In A
3
12
+In D
V+
4
11
V–
+In B
5
10
+In C
A
SOT23-5
OPA347
Out A
B
D
C
–In B
6
9
–In C
Out B
7
8
Out C
TSSOP-14, SO-14
SOT23-8, SO-8
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 2000-2007, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage, V+ to V– ................................................................... 7.5V
Signal Input Terminals, Voltage(2) .................. (V–) – 0.5V to (V+) + 0.5V
Current(2) .................................................... 10mA
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature .................................................. –65°C to +150°C
Storage Temperature ..................................................... –65°C to +150°C
Junction Temperature ...................................................................... 150°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only. Functional operation of the device at these conditions, or beyond the specified operating
conditions, is not implied. (2) Input terminals are diode-clamped to the
power-supply rails. Input signals that can swing more than 0.5V beyond the
supply rails should be current-limited to 10mA or less. (3) Short-circuit to
ground, one amplifier per package.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper
handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
PACKAGE/LEAD
PACKAGE
DESIGNATOR
PACKAGE
MARKING
OPA347NA
SOT23-5
DBV
A47
"
"
"
"
OPA347PA
OPA347UA
DIP-8
SO-8
P
D
OPA347PA
OPA347UA
"
"
"
"
OPA347SA
SC-70
DCK
S47
"
"
"
"
OPA2347EA
SOT23-8
DCN
B47
"
"
"
"
OPA2347UA
SO-8
D
OPA2347UA
"
"
"
"
OPA2347YED
WCSP-8
YED
YMD CCS
"
"
"
"
OPA2347YZDR
Lead-Free WCSP-8
YZD
A9
OPA4347EA
TSSOP-14
PW
OPA4347EA
"
"
"
"
OPA4347UA
SO-14
D
OPA4347UA
"
"
"
"
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web site at www.ti.com.
2
OPA347, 2347, 4347
www.ti.com
SBOS167D
ELECTRICAL CHARACTERISTICS: VS = 2.5V to 5.5V
Boldface limits apply over the specified temperature range, TA = –55°C to +125°C.
At TA = +25°C, RL = 100kΩ connected to VS/2 and VOUT = VS/2, unless otherwise noted.
OPA347NA, UA, PA, SA
OPA2347EA, UA, YED
OPA4347EA, UA
PARAMETER
CONDITION
OFFSET VOLTAGE
Input Offset Voltage
over Temperature
Drift
vs Power Supply
over Temperature
Channel Separation, DC
VOS
dVOS/dT
PSRR
MIN
VS = 5.5V, VCM = (V–) + 0.8V
VS = 2.5V to 5.5V, VCM < (V+) – 1.7V
VS = 2.5V to 5.5V, VCM < (V+) – 1.7V
VCM
CMRR
over Temperature
INPUT BIAS CURRENT(1)
Input Bias Current
Input Offset Current
VS = 5.5V, (V–) – 0.2V < VCM < (V+) – 1.7V
VS = 5.5V, V– < VCM < (V+) – 1.7V
Vs = 5.5V, (V–) – 0.2V < VCM < (V+) + 0.2V
Vs = 5.5V, V– < VCM < V+
(V–) – 0.2
70
66
54
48
INPUT IMPEDANCE
Differential
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
over Temperature
en
in
over Temperature
AOL (SC-70 only)
OUTPUT
Voltage Output Swing from Rail
over Temperature
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Settling Time, 0.1%
0.01%
Overload Recovery Time
POWER SUPPLY
Specified Voltage Range
Minimum Operating Voltage
Minimum Operating Voltage (OPA347SA)
Quiescent Current (per amplifier)
over Temperature
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
SOT23-5 Surface-Mount
SOT23-8 Surface-Mount
SO-8 Surface-Mount
SO-14 Surface-Mount
TSSOP-14 Surface-Mount
DIP-8
SC70-5 Surface-Mount
WCSP
2
2
3
60
6
7
mV
mV
µV/°C
µV/V
µV/V
µV/V
dB
175
300
(V+) + 0.2
V
dB
dB
dB
dB
±10
±10
pA
pA
80
70
1013 || 3
1013 || 6
Ω || pF
Ω || pF
12
60
0.7
µVPP
nV/√Hz
fA/√Hz
115
dB
dB
dB
dB
dB
VCM < (V+) – 1.7V
AOL
over Temperature
Short-Circuit Current
Capacitive Load Drive
UNITS
±0.5
±0.5
Ib
IOS
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz
Input Voltage Noise Density, f = 1kHz
Input Current Noise Density, f = 1kHz
MAX
0.3
128
f = 1kHz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
over Temperature
TYP
VS = 5.5V, RL = 100kΩ, 0.015V < VO < 5.485V
VS = 5.5V, RL = 100kΩ, 0.015V < VO < 5.485V
VS = 5.5V, RL = 5kΩ, 0.125V < VO < 5.375V
VS = 5.5V, RL = 5kΩ, 0.125V < VO < 5.375V
VS = 5.5V, RL = 5kΩ 0.125V < VO < 5.375V
100
88
100
88
96
RL = 100kΩ, AOL > 100dB
RL = 100kΩ, AOL > 88dB
RL = 5kΩ, AOL > 100dB
RL = 5kΩ, AOL > 88dB
115
115
5
90
15
15
125
125
±17
See Typical Characteristics
ISC
CLOAD
mV
mV
mV
mV
mA
CL = 100pF
GBW
SR
tS
VS
IQ
350
0.17
21
27
23
G = +1
VS = 5V, 2V Step, G = +1
VS = 5V, 2V Step, G = +1
VIN × Gain = VS
2.5
5.5
2.3
2.4
20
IO = 0
kHz
V/µs
µs
µs
µs
–55
–65
–65
34
38
V
V
V
µA
µA
125
150
150
°C
°C
°C
θJA
200
150
150
100
100
100
250
250
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
NOTE: (1) Input bias current for the OPA2347YED package is specified in the absence of light. See the Photosensitivity section for further detail.
OPA347, 2347, 4347
SBOS167D
www.ti.com
3
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +5V, and RL = 100kΩ connected to VS/2, unless otherwise noted.
POWER-SUPPLY AND COMMON-MODE
REJECTION vs FREQUENCY
OPEN-LOOP GAIN/PHASE vs FREQUENCY
0
100
80
–30
60
–60
40
–90
20
–120
0
–150
20
–180
0
–20
100
10
1k
10k
100k
PSRR, CMRR (dB)
80
Phase (°)
Open-Loop Gain (dB)
100
60
PSRR
40
1M
10
100
1k
Frequency (Hz)
10k
100k
1M
Frequency (Hz)
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
6
CMRR
CHANNEL SEPARATION vs FREQUENCY
140
VS = 5.5V
Channel Separation (dB)
Output Voltage (Vp-p)
5
VS = 5.0V
4
3
VS = 2.5V
2
1
120
100
80
60
0
1k
10k
100k
100
10
1M
1k
QUIESCENT AND SHORT-CIRCUIT CURRENT
vs SUPPLY VOLTAGE
20
15
IQ
15
10
Output Voltage (V)
20
Short-Circuit Current (mA)
Quiescent Current (µA)
(V+) – 1
25
ISC
10
3.5
4.0
4.5
5.0
(V+) – 2
–55°C
125°C
25°C
–55°C
2
Sinking
1
0
5.5
5
10
15
20
25
Output Current (±mA)
Supply Voltage (V)
4
Sourcing
0
5
3.0
1M
V+
25
2.5
100k
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
30
2.0
10k
Frequency (Hz)
Frequency (Hz)
OPA347, 2347, 4347
www.ti.com
SBOS167D
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, and RL = 100kΩ connected to VS/2, unless otherwise noted.
OPEN-LOOP GAIN AND POWER-SUPPLY
REJECTION vs TEMPERATURE
COMMON-MODE REJECTION vs TEMPERATURE
130
90
120
V– < VCM < (V+) – 1.7V
AOL
80
AOL, PSRR (dB)
Common-Mode Rejection (dB)
100
70
V– < VCM < V+
60
50
110
100
90
PSRR
80
40
70
–50
–75
–25
0
25
50
75
100
125
150
–75
–50
–25
0
Temperature (°C)
QUIESCENT AND SHORT-CIRCUIT CURRENT
vs TEMPERATURE
20
15
IQ
10
10
–25
25
0
50
75
100
125
Input Bias Current (pA)
20
Short-Circuit Current (mA)
Quiescent Current (µA)
ISC
25
–50
100
125
150
1k
100
10
1
0.1
5
150
–50
–75
–25
25
0
50
100
75
Temperature (°C)
Temperature (°C)
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
OFFSET VOLTAGE DRIFT MAGNITUDE
PRODUCTION DISTRIBUTION
125
150
11
12
25
18
14
Percentage of Amplifiers (%)
Typical production
distribution of
packaged units.
16
Percent of Amplifiers (%)
75
10k
25
–75
50
INPUT BIAS CURRENT vs TEMPERATURE
30
15
25
Temperature (°C)
12
10
8
6
4
20
15
10
5
2
0
0
–6
–5
–4
–3
–2
–1
0
1
2
3
4
5
1
6
Offset Voltage (mV)
3
4
5
6
7
8
9
10
Offset Voltage Drift (µV/°C)
OPA347, 2347, 4347
SBOS167D
2
www.ti.com
5
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, and RL = 100kΩ connected to VS/2, unless otherwise noted.
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
50
G = –1V/V
RFB = 100kΩ
50
40
Small-Signal Overshoot (%)
G = +1V/V
RL = 100kΩ
30
20
G = –1V/V
RFB = 5kΩ
10
0
G = ±5V/V
RFB = 100kΩ
40
30
20
10
0
100
1k
10
10k
100
1k
10k
Load Capacitance (pF)
SMALL-SIGNAL STEP RESPONSE
SMALL-SIGNAL STEP RESPONSE
G = +1V/V, RL = 100kΩ, CL = 100pF
G = +1V/V, RL = 5kΩ, CL = 100pF
20mV/div
Load Capacitance (pF)
20mV/div
10
10µs/div
10µs/div
LARGE-SIGNAL STEP RESPONSE
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
500mV/div
Voltage Noise (nV/√Hz)
G = +1V/V, RL = 100kΩ, CL = 100pF
10k
100
1k
10
100
1.0
10
20µs/div
0.1
1
10
100
1k
10k
100k
Frequency (Hz)
6
OPA347, 2347, 4347
www.ti.com
SBOS167D
Current Noise (fA√Hz)
Small-Signal Overshoot (%)
60
APPLICATIONS INFORMATION
The OPA347 series op amps are unity-gain stable and can
operate on a single supply, making them highly versatile and
easy to use.
Rail-to-rail input and output swing significantly increases dynamic range, especially in low supply applications. Figure 1
shows the input and output waveforms for the OPA347 in
unity-gain configuration. Operation is from VS = +5V with a
100kΩ load connected to VS/2. The input is a 5VPP sinusoid.
Output voltage is approximately 4.995VPP.
Power-supply pins should be bypassed with 0.01µF ceramic
capacitors.
G = +1, VS = +5V
Input
5V
1V/div
0V
Output (inverted on scope)
20µs/div
OPERATING VOLTAGE
The OPA347 series op amps are fully specified and ensured from 2.5V to 5.5V. In addition, many specifications
apply from –55°C to +125°C. Parameters that vary significantly with operating voltages or temperature are shown in
the Typical Characteristics.
RAIL-TO-RAIL INPUT
The input common-mode voltage range of the OPA347
series extends 200mV beyond the supply rails. This is
achieved with a complementary input stage—an N-channel
input differential pair in parallel with a P-channel differential
pair, as shown in Figure 2. The N-channel pair is active for
input voltages close to the positive rail, typically (V+) – 1.3V
to 200mV above the positive supply, while the P-channel pair
is on for inputs from 200mV below the negative supply to
approximately (V+) – 1.3V. There is a small transition region,
typically (V+) – 1.5V to (V+) – 1.1V, in which both pairs are
on. This 400mV transition region can vary 300mV with
process variation. Thus, the transition region (both stages
on) can range from (V+) – 1.65V to (V+) – 1.25V on the low
end, up to (V+) – 1.35V to (V+) – 0.95V on the high end.
Within the 400mV transition region PSRR, CMRR, offset
voltage, and offset drift may be degraded compared to
operation outside this region. For more information on designing with rail-to-rail input op amps, see Figure 3, Design
Optimization with Rail-to-Rail Input Op Amps.
FIGURE 1. Rail-to-Rail Input and Output.
V+
Reference
Current
VIN+
VIN–
VBIAS1
Class AB
Control
Circuitry
VO
VBIAS2
V–
(Ground)
FIGURE 2. Simplified Schematic.
OPA347, 2347, 4347
SBOS167D
www.ti.com
7
DESIGN OPTIMIZATION WITH RAIL-TO-RAIL INPUT OP AMPS
With a unity-gain buffer, for example, signals will traverse
this transition at approximately 1.3V below the V+ supply
and may exhibit a small discontinuity at this point.
Rail-to-rail op amps can be used in virtually any op amp
configuration. To achieve optimum performance, however, applications using these special double-input-stage
op amps may benefit from consideration of their special
behavior.
The common-mode voltage of the noninverting amplifier
is equal to the input voltage. If the input signal always
remains less than the transition voltage, no discontinuity
will be created. The closed-loop gain of this configuration
can still produce a rail-to-rail output.
In many applications, operation remains within the common-mode range of only one differential input pair. However, some applications exercise the amplifier through the
transition region of both differential input stages. A small
discontinuity may occur in this transition. Careful selection
of the circuit configuration, signal levels, and biasing can
often avoid this transition region.
Unity-Gain Buffer
Inverting amplifiers have a constant common-mode voltage equal to VB. If this bias voltage is constant, no
discontinuity will be created. The bias voltage can generally be chosen to avoid the transition region.
Noninverting Amplifier
V+
Inverting Amplifier
V+
VB
VO
VIN
V+
VIN
VO
VO
VIN
VB
VCM = VIN = VO
VCM = VIN
VCM = VB
FIGURE 3. Design Optimization with Rail-to-Rail Input Op Amps.
COMMON-MODE REJECTION
The CMRR for the OPA347 is specified in several ways so
the best match for a given application may be used. First, the
CMRR of the device in the common-mode range below the
transition region (VCM < (V+) – 1.7V) is given. This specification is the best indicator of the capability of the device when
the application requires use of one of the differential input
pairs. Second, the CMRR at VS = 5.5V over the entire
common-mode range is specified.
5.5V
0V
–0.5V
INPUT VOLTAGE
The input common-mode range extends from (V–) – 0.2V to
(V+) + 0.2V. For normal operation, inputs should be limited
to this range. The absolute maximum input voltage is 500mV
beyond the supplies. Inputs greater than the input
common-mode range but less than the maximum input
voltage, while not valid, will not cause any damage to the op
amp. Furthermore, if input current is limited the inputs may go
beyond the power supplies without phase inversion, as
shown in Figure 4, unlike some other op amps.
Normally, input currents are 0.4pA. However, large inputs
(greater than 500mV beyond the supply rails) can cause
excessive current to flow in or out of the input pins. Therefore, as well as keeping the input voltage below the maximum rating, it is also important to limit the input current to
less than 10mA. This is easily accomplished with an input
resistor, as shown in Figure 5.
8
200µs/div
FIGURE 4. OPA347—No Phase Inversion with Inputs Greater
than the Power-Supply Voltage.
+5V
IOVERLOAD
10mA max
VOUT
OPA347
VIN
5kΩ
FIGURE 5. Input Current Protection for Voltages Exceeding
the Supply Voltage.
OPA347, 2347, 4347
www.ti.com
SBOS167D
RAIL-TO-RAIL OUTPUT
A class AB output stage with common-source transistors is
used to achieve rail-to-rail output. This output stage is capable of driving 5kΩ loads connected to any potential between V+ and ground. For light resistive loads (> 100kΩ), the
output voltage can typically swing to within 5mV from supply
rail. With moderate resistive loads (10kΩ to 50kΩ), the output
can swing to within a few tens of millivolts from the supply
rails while maintaining high open-loop gain (see the typical
characteristic Output Voltage Swing vs Output Current).
load, reducing the resistor values from 100kΩ to 5kΩ decreases overshoot from 40% to 8% (see the characteristic
curve Small-Signal Overshoot vs Load Capacitance). However, when large-valued resistors can not be avoided, a
small (4pF to 6pF) capacitor, CFB, can be inserted in the
feedback, as shown in Figure 7. This significantly reduces
overshoot by compensating the effect of capacitance, CIN,
which includes the amplifier input capacitance and PC board
parasitic capacitance.
CFB
CAPACITIVE LOAD AND STABILITY
The OPA347 in a unity-gain configuration can directly drive
up to 250pF pure capacitive load. Increasing the gain enhances the amplifier’s ability to drive greater capacitive loads
(see the characteristic curve Small-Signal Overshoot vs
Capacitive Load). In unity-gain configurations, capacitive
load drive can be improved by inserting a small (10Ω to 20Ω)
resistor, RS, in series with the output, as shown in Figure 6.
This significantly reduces ringing while maintaining Direct
Current (DC) performance for purely capacitive loads. However, if there is a resistive load in parallel with the capacitive
load, a voltage divider is created, introducing a DC error at
the output and slightly reducing the output swing. The error
introduced is proportional to the ratio RS /RL, and is generally
negligible.
RF
RI
VIN
VOUT
OPA347
CIN
CL
FIGURE 7. Adding a Feedback Capacitor In the Unity-Gain
Inverter Configuration Improves Capacitative
Load.
DRIVING ADCs
The OPA347 series op amps are optimized for driving
medium-speed sampling Analog-to-Digital Converters (ADCs).
The OPA347 op amps buffer the ADC’s input capacitance
and resulting charge injection while providing signal gain.
V+
RS
VOUT
OPA347
FIGURE 6. Series Resistor in Unity-Gain Buffer Configuration Improves Capacitive Load Drive.
See Figure 8 for the OPA347 in a basic noninverting configuration driving the ADS7822. The ADS7822 is a 12-bit,
microPower sampling converter in the MSOP-8 package.
When used with the low-power, miniature packages of the
OPA347, the combination is ideal for space-limited, lowpower applications. In this configuration, an RC network at
the ADC input can be used to provide for anti-aliasing filter
and charge injection current.
In unity-gain inverter configuration, phase margin can be
reduced by the reaction between the capacitance at the op
amp input, and the gain setting resistors, thus degrading
capacitive load drive. Best performance is achieved by using
small valued resistors. For example, when driving a 500pF
See Figure 9 for the OPA2347 driving an ADS7822 in a
speech bandpass filtered data acquisition system. This small,
low-cost solution provides the necessary amplification and
signal conditioning to interface directly with an electret microphone. This circuit will operate with VS = 2.7V to 5V with less
than 250µA typical quiescent current.
10Ω to
20Ω
VIN
RL
CL
OPA347, 2347, 4347
SBOS167D
www.ti.com
9
+5V
0.1µF
0.1µF
1 VREF
8 V+
DCLOCK
500Ω
+In
OPA347
ADS7822
12-Bit ADC
2
VIN
–In
CS/SHDN
3
3300pF
DOUT
7
6
Serial
Interface
5
GND 4
VIN = 0V to 5V for
0V to 5V output.
NOTE: ADC Input = 0V to VREF
RC network filters high-frequency noise.
FIGURE 8. OPA347 in Noninverting Configuration Driving ADS7822.
V+ = +2.7V to 5V
Passband 300Hz to 3kHz
R9
510kΩ
R1
1.5kΩ
R2
1MΩ
R4
20kΩ
C3
33pF
C1
1000pF
1/2
OPA2347
Electret
Microphone(1)
R3
1MΩ
R7
51kΩ
R8
150kΩ
VREF 1
8 V+
7
C2
1000pF
R6
100kΩ
1/2
OPA2347
+IN
ADS7822 6
12-Bit A/D
5
2
–IN
DCLOCK
DOUT
CS/SHDN
Serial
Interface
3
4
NOTE: (1) Electret microphone
powered by R1.
R5
20kΩ
G = 100
GND
FIGURE 9. Speech Bandpass Filtered Data Acquisition System.
10
OPA347, 2347, 4347
www.ti.com
SBOS167D
OPA2347 WCSP PACKAGE
OPA2347YED
Top View
1
YMDCCS
The OPA2347YED and OPA2347YZDR are die-level packages using bump-on-pad technology. The OPA2347YED device has tin-lead balls; the OPA2347YZDR has lead-free
balls. Unlike devices that are in plastic packages, these
devices have no molding compound, lead frame, wire bonds,
or leads. Using standard surface-mount assembly procedures,
the WCSP can be mounted to a printed circuit board without
additional under fill. Figures 10 and 11 detail pinout and
package marking.
Actual Size:
Exact Size:
1.008mm x 2.100mm
Package Marking Code:
YMD = year/month/day
CC = indicates OPA2347YED
A9 = indicates OPA2347YZD
S = for engineering purposes only
(bump side down)
FIGURE 11. Top View Package Marking.
PHOTOSENSITIVITY
OPA2347
(bump side down)
Not to Scale
1
Although the OPA2347YED/YZD package has a protective
backside coating that reduces the amount of light exposure
on the die, unless fully shielded, ambient light will still reach
the active region of the device. Input bias current for the
OPA2347YED/YZD package is specified in the absence of
light. Depending on the amount of light exposure in a given
application, an increase in bias current, and possible increases in offset voltage should be expected. In circuit board
tests under ambient light conditions, a typical increase in bias
current reached 100pA. Flourescent lighting may introduce
noise or hum due to their time varying light output. Best
practice should include end-product packaging that provides
shielding from possible light souces during operation.
Out A
1
8
V+
–In A
2
7
Out B
+In A
3
6
–In B
V–
4
5
+In B
WCSP-8
(top view)
FIGURE 10. Pin Description.
RELIABILITY TESTING
To ensure reliability, the OPA2347YED and OPA2347YZDR
devices have been verified to successfully pass a series of
reliability stress tests. A summary of JEDEC standard reliability tests is shown in Table I.
TEST
CONDITION
ACCEPT CRITERIA (ACTUAL)
SAMPLE SIZE
–40°C to 125°C, 1 Cycle/hr, 15 Minute Ramp(1)
10 Minute Dwell
500 (1600) Cycles, R < 1.2X from R0
36
50cm
10 (129) Drops, R < 1.2X from R0
8
Key Push
100 Cycles/min,
1300 µε, Displacement = 2.7mm Max
5K (6.23K) Cycles, R < 1.2X from R0
8
3 Point Bend
Strain Rate 5 mm/min, 85 mm Span
R < 1.2X from R0
8
Temperature Cycle
Drop
NOTE: (1) Per IPC9701.
TABLE I. Reliability Test Results.
OPA347, 2347, 4347
SBOS167D
www.ti.com
11
LAND PATTERNS AND ASSEMBLY
The recommended land pattern for the OPA2347YED package is detailed in Figure 12 with specifications listed in Table
II. The maximum amount of force during assembly should be
limited to 30 grams of force per bump.
FIGURE 12. Recommended Land Area.
SOLDER PAD
DEFINITION
COPPER PAD
SOLDER MASK
OPENING
COPPER
THICKNESS
STENCIL OPENING
STENCIL THICKNESS
Non-Solder Mask
Defined (NSMD)
275µm
(+0.0, –25µm)
375µm
(+0.0, –25µm)
1 oz max
275µm X 275µm, sq
125µm Thick
NOTES: (1) Circuit traces from NSMD-defined PWB lands should be less tham 100µm (preferrably = 75µm) wide in the exposed area inside the solder mask
opening. Wider trace widths will reduce device stand off and impact reliability. (2) Recommended solder paste is type 3 or type 4. (3) Best reliability results are
achieved when the PWB laminate glass transistion temperature is above the operating range of the intended application. (4) For PWB using an Ni/Au surface
finish, the gold thickness should be less than 0.5um to avoid solder embrittlement and a reduction in thermal fatigue performance. (5) Solder mask thickness
should be less than 20um on top of the copper circuit pattern. (6) Best solder stencil performance will be achieved using laser-cut stencils with electro polishing.
Use of chemically etched stencils results in inferior solder paste volume control. (7) Trace routing away from the WLCSP device should be balanced in X and
Y directions to avoid unintentional component movement due to solder wetting forces.
TABLE II. Recommended Land Pattern.
12
OPA347, 2347, 4347
www.ti.com
SBOS167D
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
OPA2347EA/250
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
B47
OPA2347EA/250G4
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
B47
OPA2347EA/3K
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
B47
OPA2347EA/3KG4
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
B47
OPA2347UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
2347UA
OPA2347UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
2347UA
OPA2347UA/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
2347UA
OPA2347UA/2K5Q1
OBSOLETE
SOIC
D
8
TBD
Call TI
Call TI
OPA2347UAG4
ACTIVE
SOIC
D
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
2347UA
OPA2347YEDR
OBSOLETE
DSBGA
YED
8
TBD
Call TI
Call TI
-55 to 125
-55 to 125
75
OPA2347YEDT
OBSOLETE
DSBGA
YED
8
TBD
Call TI
Call TI
OPA2347YZDR
ACTIVE
DSBGA
YZD
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
OPA2347YZDT
ACTIVE
DSBGA
YZD
8
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-55 to 125
OPA2347
OPA347NA/250
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
A47
OPA347NA/250G4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
A47
OPA347NA/3K
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
A47
OPA347NA/3KG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
A47
OPA347PA
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-55 to 125
OPA347PA
Addendum-Page 1
(A9 ~ OPA2347)
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status
(1)
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
OPA347PAG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-55 to 125
OPA347PA
OPA347SA/250
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
S47
OPA347SA/250G4
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
S47
OPA347SA/3K
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
S47
OPA347SA/3KG4
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
S47
OPA347UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
347UA
OPA347UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
347UA
OPA347UA/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
347UA
OPA347UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
347UA
OPA4347EA/250
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
4347EA
OPA4347EA/250G4
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
4347EA
OPA4347EA/2K5
ACTIVE
TSSOP
PW
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
4347EA
OPA4347EA/2K5G4
ACTIVE
TSSOP
PW
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
4347EA
OPA4347UA
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA4347UA
OPA4347UA/2K5
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA4347UA
OPA4347UA/2K5G4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA4347UA
OPA4347UAG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA4347UA
The marketing status values are defined as follows:
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jun-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
OPA2347EA/250
SOT-23
DCN
8
250
179.0
8.4
OPA2347EA/3K
SOT-23
DCN
8
3000
179.0
OPA347SA/250
SC70
DCK
5
250
178.0
OPA347SA/250
SC70
DCK
5
250
OPA347SA/3K
SC70
DCK
5
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
9.0
2.4
2.5
1.2
4.0
8.0
Q3
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
OPA347SA/3K
SC70
DCK
5
3000
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
OPA347UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA4347EA/250
TSSOP
PW
14
250
180.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
OPA4347EA/2K5
TSSOP
PW
14
2500
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
OPA4347UA/2K5
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jun-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA2347EA/250
SOT-23
DCN
OPA2347EA/3K
SOT-23
DCN
8
250
203.0
203.0
35.0
8
3000
203.0
203.0
35.0
OPA347SA/250
SC70
OPA347SA/250
SC70
DCK
5
250
180.0
180.0
18.0
DCK
5
250
203.0
203.0
OPA347SA/3K
35.0
SC70
DCK
5
3000
180.0
180.0
18.0
OPA347SA/3K
SC70
DCK
5
3000
203.0
203.0
35.0
OPA347UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA4347EA/250
TSSOP
PW
14
250
210.0
185.0
35.0
OPA4347EA/2K5
TSSOP
PW
14
2500
367.0
367.0
35.0
OPA4347UA/2K5
SOIC
D
14
2500
367.0
367.0
38.0
Pack Materials-Page 2
D: Max = 2.092 mm, Min =2.031 mm
E: Max = 0.999 mm, Min =0.938 mm
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated