Hynix H57V1262GTR-50X 128mb synchronous dram based on 2m x 4bank x16 i/o Datasheet

128Mb Synchronous DRAM based on 2M x 4Bank x16 I/O
Document Title
4Bank x 2M x 16bits Synchronous DRAM
Revision History
Revision No.
History
Draft Date
Remark
Preliminary
0.1
Initial Draft
Jul. 2009
1.0
Release
Aug. 2009
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 1.0 / Aug. 2009
1
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
H57V1262GTRDESCRIPTION
The Hynix H57V1262GTR series is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the memory applications which require wide data I/O and high bandwidth. H57V1262GTR series is organized as 4banks of 2,097,152 x 16.
H57V1262GTR is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs
are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high
bandwidth. All input and output voltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write
cycles initiated by a single control command (Burst length of 1,2,4,8 or full page), and the burst count sequence(sequential or interleave). A burst of read or write cycles in progress can be terminated by a burst terminate command or
can be interrupted and replaced by a new burst read or write command on any cycle. (This pipelined design is not restricted by a '2N' rule)
FEATURES
•
Programmable Burst Length and Burst Type
•
Voltage: VDD, VDDQ 3.3V supply voltage
•
All device pins are compatible with LVTTL interface
- 1, 2, 4, 8 or full page for Sequential Burst
•
54 Pin TSOPII (Lead Free Package)
- 1, 2, 4 or 8 for Interleave Burst
•
All inputs and outputs referenced to positive edge of
system clock
•
Data mask function by UDQM, LDQM
•
Internal four banks operation
•
Auto refresh and self refresh
•
4096 Refresh cycles / 64ms
•
Programmable CAS Latency; 2, 3 Clocks
•
Burst Read Single Write operation
•
Operating Temperature
- Commercial Temperature (0oC to 70oC)
- Industrial Temperature (-40oC to 85oC)
● This product is in compliance with the directive pertaining of RoHS.
ORDERING INFORMATION
Part No.
Clock Frequency
H57V1262GTR-50X
200MHz
H57V1262GTR-60X
166MHz
H57V1262GTR-70X
143MHz
H57V1262GTR-75X
133MHz
Organization
Interface
Package
4Banks x 2Mbits x16
LVTTL
54 Pin TSOPII
Note:
1. H57V1262GTR-XXC Series: Normal power, Commercial Temp.(0oC to 70oC)
2. H57V1262GTR-XXI Series: Normal power, Industrial Temp. (-40oC to 85oC)
3. H57V1262GTR-XXL Series: Low power, Commercial Temp.(0oC to 70oC)
4. H57V1262GTR-XXJ Series: Low power, Industrial Temp. (-40oC to 85oC)
Rev. 1.0 / Aug. 2009
2
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
PIN ASSIGNMENTS
VDD
1
54
VSS
DQ0
2
53
DQ15
VDDQ
3
52
VSSQ
DQ1
4
51
DQ14
DQ2
5
50
DQ13
VSSQ
6
49
VDDQ
DQ3
7
48
DQ12
DQ4
8
47
DQ11
VDDQ
9
46
VSSQ
DQ5
10
45
DQ10
DQ6
11
44
DQ9
VSSQ
12
43
VDDQ
DQ7
13
42
DQ8
VDD
14
41
VSS
LDQM
15
40
NC
/WE
16
39
UDQM
/CAS
17
38
CLK
/RAS
18
37
CKE
/CS
19
36
NC
BA0
20
35
A11
BA1
21
34
A9
A10/AP
22
33
A8
A0
23
32
A7
A1
24
31
A6
A2
25
30
A5
A3
26
29
A4
VDD
27
28
VSS
Rev. 1.0 / Aug. 2009
54 Pin TSOPII
400mil x 875mil
0.8mm pin pitch
3
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
PIN DESCRIPTION
SYMBOL
TYPE
DESCRIPTION
CLK
Clock
The system clock input. All other inputs are registered to the SDRAM
on the rising edge of CLK
CKE
Clock Enable
Controls internal clock signal and when deactivated, the SDRAM will
be one of the states among power down, suspend or self refresh
CS
Chip Select
BA0, BA1
Bank Address
A0 ~ A11
Address
RAS, CAS, WE
Row Address Strobe,
Column Address Strobe,
Write Enable
RAS, CAS and WE define the operation
Refer function truth table for details
UDQM, LDQM
Data Input/Output Mask
Controls output buffers in read mode and masks input data in write
mode
DQ0 ~ DQ15
Data Input/Output
VDD/VSS
Power Supply/Ground
VDDQ/VSSQ
Enables or disables all inputs except CLK, CKE, UDQM and LDQM
Selects bank to be activated during RAS activity
Selects bank to be read/written during CAS activity
Row Address: RA0 ~ RA11, Column Address: CA0 ~ CA8
Auto-precharge flag: A10
Multiplexed data input / output pin
Power supply for internal circuits and input buffers
Data Output Power/Ground Power supply for output buffers
NC
Rev. 1.0 / Aug. 2009
No Connection
No connection
4
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
FUNCTIONAL BLOCK DIAGRAM
2Mbit x 4banks x 16 I/O Synchronous DRAM
Internal Row
Counter
Self refresh
logic & timer
2Mx16 BANK 3
CLK
CAS
Column
Active
U/LDQM
A0
Address Buffers
BA1
DQ0
DQ15
Y-Decoder
Column Add
Counter
Bank Select
A11
Memory
Cell
Array
Column
Pre
Decoder
WE
A1
2Mx16 BANK 0
I/O Buffer & Logic
Refresh
2Mx16 BANK 1
Sense AMP & I/O Gate
State Machine
RAS
2Mx16 BANK 2
X-Decoder
X-Decoder
X-Decoder
X-Decoder
CKE
CS
Row
Pre
Decoder
Row Active
Address
Register
Mode Register
Burst
Counter
CAS Latency
Data Out Control
Pipe Line
Control
BA0
Rev. 1.0 / Aug. 2009
5
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
BASIC FUNCTIONAL DESCRIPTION
Mode Register
BA1
BA0
A11
A10
A9
A8
A7
0
0
0
0
OP Code
0
0
A6
A5
A4
CAS Latency
A3
A2
BT
A1
A0
Burst Length
OP Code
A9
Write Mode
0
Burst Read and Burst Write
1
Burst Read and Single Write
Burst Type
A3
Burst Type
0
Sequential
1
Interleave
CAS Latency
A6
A5
A4
CAS Latency
0
0
0
Reserved
0
0
1
Reserved
0
1
0
2
0
1
1
1
0
1
Burst Length
A2
A1
A0
3
0
0
0
Reserved
0
0
1
Reserved
1
1
0
1
1
1
Rev. 1.0 / Aug. 2009
Burst Length
A3 = 0
A3=1
0
1
1
0
1
2
2
0
1
0
4
4
Reserved
0
1
1
8
8
Reserved
1
0
0
Reserved
Reserved
1
0
1
Reserved
Reserved
1
1
0
Reserved
Reserved
1
1
1
Full Page
Reserved
6
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
ABSOLUTE MAXIMUM RATING
Parameter
Symbol
Commercial Temperature
Ambient Temperature
Unit
0 ~ 70
TA
Industrial Temperature
Storage Temperature
Rating
o
C
-40 ~ 85
TSTG
-55 ~ 125
Voltage on Any Pin relative to VSS
VIN, VOUT
-1.0 ~ 4.6
V
Voltage on VDD relative to VSS
VDD, VDDQ
-1.0 ~ 4.6
V
Short Circuit Output Current
IOS
50
mA
Power Dissipation
PD
1
W
TSOLDER
260 / 10
Soldering Temperature / Time
o
C
oC
/ Sec
DC OPERATING CONDITION (Commercial: TA = 0oC to 70oC, Industrial: TA = -40oC to 85oC)
Parameter
Symbol
Min.
Typ
Max
Unit
Note
VDD, VDDQ
3.0
3.3
3.6
V
1
Input High Voltage
VIH
2.0
3.0
VDDQ + 0.3
V
1, 2
Input Low Voltage
VIL
-0.3
-
0.8
V
1, 3
Power Supply Voltage
Note:
1. All voltages are referenced to VSS = 0V
2. VIH(max) is acceptable 5.6V AC pulse width with <=3ns of duration.
3. VIL(min) is acceptable -2.0V AC pulse width with <=3ns of duration
AC OPERATING TEST CONDITION
(Commercial: TA = 0oC to 70oC, Industrial: TA = -40oC to 85oC, VDD=3.3±0.3V, VSS=0V)
Parameter
Symbol
Value
Unit
VIH / VIL
2.4 / 0.4
V
Vtrip
1.4
V
Input Rise / Fall Time
tR / tF
1
ns
Output Timing Measurement Reference Level Voltage
Voutref
1.4
V
CL
50
pF
AC Input High / Low Level Voltage
Input Timing Measurement Reference Level Voltage
Output Load Capacitance for Access Time Measurement
Vtt = 1.4V
Vtt = 1.4V
RT = 50Ω
RT = 500 Ω
Output
Output
Z0 = 50Ω
50pF
DC Output Load Circuit
Rev. 1.0 / Aug. 2009
Note
50pF
AC Output Load Circuit
7
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
CAPACITANCE (Commercial: TA = 0oC to 70oC, Industrial: TA = -40oC to 85oC, f=1MHz, VDD=3.3V)
Parameter
Input capacitance
Pin
Symbol
Min
Max
Unit
CLK
CI1
2.0
4.0
pF
A0 ~ A11, BA0, BA1, CKE, CS, RAS, CAS, WE,
LDQM, UDQM
CI2
2.5
5.0
pF
CI/O
3.0
5.5
pF
Data input / output capacitance DQ0 ~ DQ15
DC CHARACTERISTICS I (Commercial: TA = 0oC to 70oC, Industrial: TA = -40oC to 85oC)
Parameter
Symbol
Min
Max
Unit
Note
Input Leakage Current
ILI
-1
1
uA
1
Output Leakage Current
ILO
-1
1
uA
2
Output High Voltage
VOH
2.4
-
V
IOH = -2mA
Output Low Voltage
VOL
-
0.4
V
IOL = +2mA
Note: 1. VIN = 0 to 3.3V, All other balls are not tested under VIN =0V
2. DOUT is disabled, VOUT=0 to 3.6
Rev. 1.0 / Aug. 2009
8
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
DC CHARACTERISTICS II
Parameter
Operating Current
(Commercial: TA = 0oC to 70oC, Industrial: TA = -40oC to 85oC)
Symbol
IDD1
Test Condition
Burst length=1, One bank active
tRC ≥ tRC(min), IOL=0mA
Speed (MHz)
200 166 143 133
100
80
70
CKE ≤ VIL(max), tCK = 15ns
Precharge Standby Current IDD2P
in Power Down Mode
IDD2PS CKE ≤ VIL(max), tCK = ∞
Precharge Standby
Current in Non Power
Down Mode
Active Standby Current
in Power Down Mode
Active Standby Current
in Non Power Down Mode
mA
2
mA
18
IDD2NS
CKE ≥ VIH(min), tCK = ∞
Input signals are stable.
15
IDD3P
CKE ≤ VIL(max), tCK = 15ns
5
IDD3NS
1
mA
IDD3PS CKE ≤ VIL(max), tCK = ∞
IDD3N
mA
2
CKE ≥ VIH(min), CS ≥ VIH(min), tCK =
15ns
Input signals are changed one time during 2clks.
All other pins ≥ VDD-0.2V or ≤ 0.2V
IDD2N
70
Unit Note
mA
5
CKE ≥ VIH(min), CS ≥ VIH(min), tCK =
15ns
Input signals are changed one time during 2clks.
All other pins ≥ VDD-0.2V or ≤ 0.2V
40
CKE ≥ VIH(min), tCK = ∞
Input signals are stable.
35
mA
Burst Mode Operating CurIDD4
rent
tCK ≥ tCK(min), IOL=0mA
All banks active
120
100
100
100
mA
1
Auto Refresh Current
IDD5
tRC ≥ tRC(min), All banks active
210
200
190
190
mA
2
Self Refresh Current
IDD6
CKE ≤ 0.2V
Normal
2
mA
Low power
800
uA
3
Note:
1. IDD1 and IDD4 depend on output loading and cycle rates. Specified values are measured with the output open
2. Min. of tRRC (Refresh RAS cycle time) is shown at AC CHARACTERISTICS II
3. H57V1262GTR-XXC Series: Normal Power
H57V1262GTR-XXL Series: Low Power
Rev. 1.0 / Aug. 2009
9
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
AC CHARACTERISTICS I (AC operating conditions unless otherwise noted)
Speed
(MHz)
Parameter
200
166
143
133
Min Max Min Max Min Max Min Max
CL = 3
tCK3
5.0
6.0
7.0
CL = 2
tCK2
-
Clock High Pulse Width
tCHW
1.75
-
2.0
-
2.0
-
Clock Low Pulse Width
tCLW
1.75
-
2.0
-
2.0
CL = 3
tAC3
-
4.5
-
5.4
CL = 2
tAC2
-
-
-
Data-out Hold Time
tOH
2.0
-
Data-Input Setup Time
tDS
1.5
Data-Input Hold Time
tDH
Address Setup Time
7.5
Unit Note
100
0
ns
2.5
-
ns
1
-
2.5
-
ns
1
-
5.4
-
5.4
ns
-
-
-
-
6.0
ns
2.0
-
2.5
-
2.7
-
ns
-
1.5
-
1.5
-
1.5
-
ns
1
0.8
-
0.8
-
0.8
-
0.8
-
ns
1
tAS
1.5
-
1.5
-
1.5
-
1.5
-
ns
1
Address Hold Time
tAH
0.8
-
0.8
-
0.8
-
0.8
-
ns
1
CKE Setup Time
tCKS
1.5
-
1.5
-
1.5
-
1.5
-
ns
1
CKE Hold Time
tCKH
0.8
-
0.8
-
0.8
-
0.8
-
ns
1
Command Setup Time
tCS
1.5
-
1.5
-
1.5
-
1.5
-
ns
1
Command Hold Time
tCH
0.8
-
0.8
-
0.8
-
0.8
-
ns
1
CLK to Data Output in Low-Z Time
tOLZ
1.0
-
1.0
-
1.5
-
1.5
-
ns
System Clock Cycle Time
Access Time From Clock
CLK to Data Output in
High-Z Time
1000
-
1000
-
1000
10
ns
CL = 3
tOHZ3
-
4.5
-
5.4
-
5.4
-
5.4
ns
CL = 2
tOHZ2
-
-
-
-
-
-
-
6.0
ns
2
Note:
1. Assume tR / tF (input rise and fall time) is 1ns. If tR & tF > 1ns, then [(tR+tF)/2-1]ns should be added to
the parameter.
2. Access time to be measured with input signals of 1V/ns edge rate, from 0.8V to 2.0V. If tR > 1ns, then (tR/2-0.5)ns
should be added to the parameter.
Rev. 1.0 / Aug. 2009
10
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
AC CHARACTERISTICS II (AC operating conditions unless otherwise noted)
Parameter
Speed
(MHz)
200
166
143
Min
Max
Min
Max
Min
133
Max Min Max
Unit Note
RAS Cycle Time
Operation
tRC
55
-
60
-
63
-
63
-
ns
RAS Cycle Time
Auto
Refresh
tRRC
55
-
60
-
63
-
63
-
ns
RAS to CAS Delay
tRCD
15
-
18
-
20
-
20
-
ns
RAS Active Time
tRAS
42
100K
42
100K
42
120
K
ns
RAS Precharge Time
tRP
15
-
18
-
20
-
20
-
ns
RAS to RAS Bank Active Delay
tRRD
10
-
12
-
14
-
15
-
ns
CAS to CAS Delay
tCCD
1
-
1
-
1
-
1
-
CLK
Write Command to
Data-In Delay
tWTL
0
-
0
-
0
-
0
-
CLK
Data-in to Precharge Command
tDPL
2
-
2
-
2
-
2
-
CLK
Data-In to Active Command
tDAL
DQM to Data-Out Hi-Z
tDQZ
2
-
2
-
2
-
2
-
CLK
DQM to Data-In Mask
tDQM
0
-
0
-
0
-
0
-
CLK
MRS to New Command
tMRD
2
-
2
-
2
-
2
-
CLK
CL = 3
tPROZ3
3
-
3
-
3
-
3
-
CLK
CL = 2
tPROZ2
-
-
-
-
-
-
2
-
CLK
Power Down Exit Time
tDPE
1
-
1
-
1
-
1
-
CLK
Self Refresh Exit Time
tSRE
1
-
1
-
1
-
1
-
CLK
Refresh Time
tREF
-
64
-
64
-
64
-
64
ms
Precharge to
Data Output High-Z
38.7 100K
tDPL + tRP
1
Note:
1. A new command can be given tRRC after self refresh exit.
Rev. 1.0 / Aug. 2009
11
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
COMMAND TRUTH TABLE
Command
CKEn-1
CKEn
CS
RAS
CAS
WE
DQM
ADDR
Mode Register Set
H
X
L
L
L
L
X
OP code
No Operation
H
X
H
X
X
X
L
H
H
H
X
X
Bank Active
H
X
L
L
H
H
X
RA
Read
Read with
charge
A10/AP
BA
V
L
Autopre-
H
X
L
H
L
H
X
CA
Write
H
V
L
H
X
L
H
L
L
X
CA
H
X
L
L
H
L
X
X
Burst Stop
H
X
L
H
H
L
X
X
DQM
H
V
X
Auto Refresh
H
H
L
L
L
H
X
X
Burst-Read-SingleWRITE
H
X
L
L
L
L
X
A9 ball High
(Other balls OP code)
Entry
H
L
L
L
L
H
X
Exit
L
H
H
X
X
X
L
H
H
H
Entry
H
L
H
X
X
X
L
H
H
H
H
X
X
X
L
H
H
H
H
X
X
X
L
V
V
V
Write with
charge
Autopre-
Precharge All Banks
Precharge selected Bank
Self Refresh
X
Precharge
power down
Clock Suspend
Note
Exit
L
H
Entry
H
L
Exit
L
H
Rev. 1.0 / Aug. 2009
X
X
H
V
H
X
L
V
MRS
Mode
X
X
X
X
X
X
X
12
Synchronous DRAM Memory 128Mbit (8Mx16bit)
H57V1262GTR Series
PACKAGE INFORMATION
400mil 54pin Thin Small Outline Package
UNIT : mm(inch)
11.938(0.4700)
11.735(0.4620)
22.327(0.8790)
22.149(0.8720)
10.262(0.4040)
10.058(0.3960)
0.150(0.0059)
0.050(0.0020)
0.80(0.0315)BSC
Rev. 1.0 / Aug. 2009
0.400(0.016)
0.300(0.012)
1.194(0.0470)
0.991(0.0390)
5deg
0deg
0.597(0.0235)
0.406(0.0160)
0.210(0.0083)
0.120(0.0047)
13
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