M29W800DT M29W800DB 8 Mbit (1Mb x8 or 512Kb x16, Boot Block) 3V Supply Flash Memory FEATURES SUMMARY ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ SUPPLY VOLTAGE – VCC = 2.7V to 3.6V for Program, Erase and Read ACCESS TIMES: 45, 70, 90ns PROGRAMMING TIME – 10µs per Byte/Word typical 19 MEMORY BLOCKS – 1 Boot Block (Top or Bottom Location) – 2 Parameter and 16 Main Blocks PROGRAM/ERASE CONTROLLER – Embedded Byte/Word Program algorithms ERASE SUSPEND and RESUME MODES – Read and Program another Block during Erase Suspend UNLOCK BYPASS PROGRAM COMMAND – Faster Production/Batch Programming TEMPORARY BLOCK UNPROTECTION MODE COMMON FLASH INTERFACE – 64 bit Security Code LOW POWER CONSUMPTION – Standby and Automatic Standby 100,000 PROGRAM/ERASE CYCLES per BLOCK ELECTRONIC SIGNATURE – Manufacturer Code: 0020h – Top Device Code M29W800DT: 22D7h – Bottom Device Code M29W800DB: 225Bh September 2004 Figure 1. Packages SO44 (M) TSOP48 (N) 12 x 20mm FBGA TFBGA48 (ZA) 6 x 9 mm FBGA TFBGA48 (ZE) 6 x 8mm 1/42 M29W800DT, M29W800DB TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Table 1. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 SO Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 TFBGA Connections (Top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Block Addresses (x8). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Block Addresses (x16). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 SIGNAL DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Address Inputs (A0-A18). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Data Inputs/Outputs (DQ0-DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Data Inputs/Outputs (DQ8-DQ14). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Data Input/Output or Address Input (DQ15A-1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Chip Enable (E). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Output Enable (G). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Write Enable (W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Reset/Block Temporary Unprotect (RP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Ready/Busy Output (RB). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Byte/Word Organization Select (BYTE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 VCC Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 VSS Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 BUS OPERATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Bus Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Bus Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Output Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Automatic Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Special Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Electronic Signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Block Protection and Blocks Unprotection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 2. Bus Operations, BYTE = VIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 3. Bus Operations, BYTE = VIH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 COMMAND INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Read/Reset Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Auto Select Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Unlock Bypass Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2/42 M29W800DT, M29W800DB Unlock Bypass Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Unlock Bypass Reset Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Chip Erase Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Block Erase Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Erase Suspend Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Erase Resume Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read CFI Query Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Block Protect and Chip Unprotect Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 4. Commands, 16-bit mode, BYTE = VIH. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 5. Commands, 8-bit mode, BYTE = VIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 6. Program, Erase Times and Program, Erase Endurance Cycles . . . . . . . . . . . . . . . . . . . 16 STATUS REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Data Polling Bit (DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Toggle Bit (DQ6).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Error Bit (DQ5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Erase Timer Bit (DQ3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Alternative Toggle Bit (DQ2).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 7. Status Register Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 8. Data Polling Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 9. Data Toggle Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 8. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 9. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 10.AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 11.AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 10. Device Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 11. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 12.Read Mode AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 12. Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 13.Write AC Waveforms, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 13. Write AC Characteristics, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 14.Write AC Waveforms, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 14. Write AC Characteristics, Chip Enable Controlled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 15.Reset/Block Temporary Unprotect AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 15. Reset/Block Temporary Unprotect AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 25 PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 16.SO44 – 44 lead Plastic Small Outline, 525 mils body width, Package Outline . . . . . . . . 26 Table 16. SO44 – 44 lead Plastic Small Outline, 525 mils body width, Package Mechanical Data 26 Figure 17.TSOP48 – 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Outline. . . . . . . . . 27 Table 17. TSOP48 – 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Mechanical Data . 27 Figure 18.TFBGA48 6x9mm – 6x8 ball array – 0.80mm pitch, Bottom View Package Outline . . . . 28 3/42 M29W800DT, M29W800DB Table 18. TFBGA48 6x9mm – 6x8 active ball array – 0.80mm pitch, Package Mechanical Data. . 28 Figure 19.TFBGA48 6x8mm – 6x8 ball array – 0.80mm pitch, Bottom View Package Outline . . . . 29 Table 19. TFBGA48 6x8mm – 6x8 active ball array – 0.80mm pitch, Package Mechanical Data. . 29 PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Table 20. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 APPENDIX A.BLOCK ADDRESS TABLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Table 21. Top Boot Block Addresses, M29W800DT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Table 22. Bottom Boot Block Addresses, M29W800DB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 APPENDIX B.COMMON FLASH INTERFACE (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 23. Query Structure Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 24. CFI Query Identification String. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 25. CFI Query System Interface Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Table 26. Device Geometry Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 27. Primary Algorithm-Specific Extended Query Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Table 28. Security Code Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 APPENDIX C.BLOCK PROTECTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Programmer Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 In-System Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Table 29. Programmer Technique Bus Operations, BYTE = VIH or VIL . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Figure 20.Programmer Equipment Block Protect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 21.Programmer Equipment Chip Unprotect Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Figure 22.In-System Equipment Block Protect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Figure 23.In-System Equipment Chip Unprotect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 30. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 4/42 M29W800DT, M29W800DB SUMMARY DESCRIPTION The M29W800D is a 8 Mbit (1Mb x8 or 512Kb x16) non-volatile memory that can be read, erased and reprogrammed. These operations can be performed using a single low voltage (2.7 to 3.6V) supply. On power-up the memory defaults to its Read mode where it can be read in the same way as a ROM or EPROM. The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased. Each block can be protected independently to prevent accidental Program or Erase commands from modifying the memory. Program and Erase commands are written to the Command Interface of the memory. An on-chip Program/Erase Controller simplifies the process of programming or erasing the memory by taking care of all of the special operations that are required to update the memory contents. The end of a program or erase operation can be detected and any error conditions identified. The command set required to control the memory is consistent with JEDEC standards. The blocks in the memory are asymmetrically arranged, see Figures 6 and 7, Block Addresses. The first or last 64 Kbytes have been divided into four additional blocks. The 16 Kbyte Boot Block can be used for small initialization code to start the microprocessor, the two 8 Kbyte Parameter Blocks can be used for parameter storage and the remaining 32K is a small Main Block where the application may be stored. Chip Enable, Output Enable and Write Enable signals control the bus operation of the memory. They allow simple connection to most microprocessors, often without additional logic. The memory is offered in SO44, TSOP48 (12 x 20mm), TFBGA48 6 x 9mm (0.8mm pitch) and TFBGA48 6 x 8mm (0.8mm pitch) packages. The memory is supplied with all the bits erased (set to ’1’). Figure 2. Logic Diagram Table 1. Signal Names VCC 19 15 A0-A18 DQ0-DQ14 DQ15A–1 W E M29W800DT M29W800DB G RB RP A0-A18 Address Inputs DQ0-DQ7 Data Inputs/Outputs DQ8-DQ14 Data Inputs/Outputs DQ15A–1 Data Input/Output or Address Input E Chip Enable G Output Enable W Write Enable RP Reset/Block Temporary Unprotect RB Ready/Busy Output (not available on SO44 package) BYTE Byte/Word Organization Select VCC Supply Voltage VSS Ground NC Not Connected Internally BYTE VSS AI05470B 5/42 M29W800DT, M29W800DB Figure 3. SO Connections RP A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 E VSS G DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11 1 44 43 2 3 42 4 41 5 40 6 39 7 38 8 37 9 36 10 35 11 M29W800DT 34 12 M29W800DB 33 13 32 14 31 15 30 16 29 28 17 27 18 26 19 25 20 21 24 22 23 Figure 4. TSOP Connections W NC A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE VSS DQ15A–1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC AI05462b 6/42 A15 A14 A13 A12 A11 A10 A9 A8 NC NC W RP NC NC RB A18 A17 A7 A6 A5 A4 A3 A2 A1 1 48 12 M29W800DT 37 13 M29W800DB 36 24 25 AI05461 A16 BYTE VSS DQ15A–1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 G VSS E A0 M29W800DT, M29W800DB Figure 5. TFBGA Connections (Top view through package) 1 2 3 4 5 6 A A3 A7 RB W A9 A13 B A4 A17 NC RP A8 A12 C A2 A6 A18 NC A10 A14 D A1 A5 NC NC A11 A15 E A0 DQ0 DQ2 DQ5 DQ7 A16 F E DQ8 DQ10 DQ12 DQ14 BYTE G G DQ9 DQ11 VCC DQ13 DQ15 A–1 H VSS DQ1 DQ3 DQ4 DQ6 VSS AI00656 7/42 M29W800DT, M29W800DB Figure 6. Block Addresses (x8) M29W800DT Top Boot Block Addresses (x8) M29W800DB Bottom Boot Block Addresses (x8) FFFFFh FFFFFh 16 KByte 64 KByte FC000h FBFFFh F0000h EFFFFh 8 KByte 64 KByte FA000h F9FFFh E0000h Total of 15 64 KByte Blocks 8 KByte F8000h F7FFFh 32 KByte F0000h EFFFFh 1FFFFh 64 KByte 64 KByte E0000h 10000h 0FFFFh 32 KByte Total of 15 64 KByte Blocks 1FFFFh 08000h 07FFFh 8 KByte 06000h 05FFFh 64 KByte 10000h 0FFFFh 8 KByte 04000h 03FFFh 64 KByte 00000h 16 KByte 00000h AI05463 Note: Also see APPENDIX A., Tables 21 and 22 for a full listing of the Block Addresses. 8/42 M29W800DT, M29W800DB Figure 7. Block Addresses (x16) M29W800DT Top Boot Block Addresses (x16) M29W800DB Bottom Boot Block Addresses (x16) 7FFFFh 7FFFFh 8 KWord 32 KWord 7E000h 7DFFFh 78000h 77FFFh 4 KWord 32 KWord 7D000h 7CFFFh 70000h Total of 15 32 KWord Blocks 4 KWord 7C000h 7BFFFh 16 KWord 78000h 77FFFh 0FFFFh 32 KWord 32 KWord 70000h 08000h 07FFFh 16 KWord Total of 15 32 KWord Blocks 0FFFFh 04000h 03FFFh 4 KWord 03000h 02FFFh 32 KWord 08000h 07FFFh 4 KWord 02000h 01FFFh 32 KWord 00000h 8 KWord 00000h AI05464 Note: Also see APPENDIX A., Tables 21 and 22 for a full listing of the Block Addresses. 9/42 M29W800DT, M29W800DB SIGNAL DESCRIPTIONS See Figure 2., Logic Diagram, and Table 1., Signal Names, for a brief overview of the signals connected to this device. Address Inputs (A0-A18). The Address Inputs select the cells in the memory array to access during Bus Read operations. During Bus Write operations they control the commands sent to the Command Interface of the internal state machine. Data Inputs/Outputs (DQ0-DQ7). The Data Inputs/Outputs output the data stored at the selected address during a Bus Read operation. During Bus Write operations they represent the commands sent to the Command Interface of the internal state machine. Data Inputs/Outputs (DQ8-DQ14). The Data Inputs/Outputs output the data stored at the selected address during a Bus Read operation when BYTE is High, VIH. When BYTE is Low, VIL, these pins are not used and are high impedance. During Bus Write operations the Command Register does not use these bits. When reading the Status Register these bits should be ignored. Data Input/Output or Address Input (DQ15A1). When BYTE is High, VIH, this pin behaves as a Data Input/Output pin (as DQ8-DQ14). When BYTE is Low, VIL, this pin behaves as an address pin; DQ15A–1 Low will select the LSB of the Word on the other addresses, DQ15A–1 High will select the MSB. Throughout the text consider references to the Data Input/Output to include this pin when BYTE is High and references to the Address Inputs to include this pin when BYTE is Low except when stated explicitly otherwise. Chip Enable (E). The Chip Enable, E, activates the memory, allowing Bus Read and Bus Write operations to be performed. When Chip Enable is High, VIH, all other pins are ignored. Output Enable (G). The Output Enable, G, controls the Bus Read operation of the memory. Write Enable (W). The Write Enable, W, controls the Bus Write operation of the memory’s Command Interface. Reset/Block Temporary Unprotect (RP). The Reset/Block Temporary Unprotect pin can be used to apply a Hardware Reset to the memory or to temporarily unprotect all Blocks that have been protected. A Hardware Reset is achieved by holding Reset/ Block Temporary Unprotect Low, VIL, for at least tPLPX. After Reset/Block Temporary Unprotect goes High, VIH, the memory will be ready for Bus Read and Bus Write operations after tPHEL or 10/42 tRHEL, whichever occurs last. See the Ready/Busy Output section, Table 15. and Figure 15., Reset/ Block Temporary Unprotect AC Waveforms, for more details. Holding RP at VID will temporarily unprotect the protected Blocks in the memory. Program and Erase operations on all blocks will be possible. The transition from VIH to VID must be slower than tPHPHH. Ready/Busy Output (RB). The Ready/Busy pin is an open-drain output that can be used to identify when the device is performing a Program or Erase operation. During Program or Erase operations Ready/Busy is Low, VOL. Ready/Busy is high-impedance during Read mode, Auto Select mode and Erase Suspend mode. After a Hardware Reset, Bus Read and Bus Write operations cannot begin until Ready/Busy becomes high-impedance. See Table 15., Reset/ Block Temporary Unprotect AC Characteristics and Figure 15., Reset/Block Temporary Unprotect AC Waveforms. The use of an open-drain output allows the Ready/ Busy pins from several memories to be connected to a single pull-up resistor. A Low will then indicate that one, or more, of the memories is busy. Byte/Word Organization Select (BYTE). The Byte/Word Organization Select pin is used to switch between the 8-bit and 16-bit Bus modes of the memory. When Byte/Word Organization Select is Low, VIL, the memory is in 8-bit mode, when it is High, VIH, the memory is in 16-bit mode. VCC Supply Voltage. The VCC Supply Voltage supplies the power for all operations (Read, Program, Erase etc.). The Command Interface is disabled when the VCC Supply Voltage is less than the Lockout Voltage, VLKO. This prevents Bus Write operations from accidentally damaging the data during power up, power down and power surges. If the Program/ Erase Controller is programming or erasing during this time then the operation aborts and the memory contents being altered will be invalid. A 0.1µF capacitor should be connected between the VCC Supply Voltage pin and the VSS Ground pin to decouple the current surges from the power supply. The PCB track widths must be sufficient to carry the currents required during program and erase operations, ICC3. VSS Ground. The VSS Ground is the reference for all voltage measurements. M29W800DT, M29W800DB BUS OPERATIONS There are five standard bus operations that control the device. These are Bus Read, Bus Write, Output Disable, Standby and Automatic Standby. See Tables 2 and 3, Bus Operations, for a summary. Typically glitches of less than 5ns on Chip Enable or Write Enable are ignored by the memory and do not affect bus operations. Bus Read. Bus Read operations read from the memory cells, or specific registers in the Command Interface. A valid Bus Read operation involves setting the desired address on the Address Inputs, applying a Low signal, VIL, to Chip Enable and Output Enable and keeping Write Enable High, VIH. The Data Inputs/Outputs will output the value, see Figure 12., Read Mode AC Waveforms, and Table 12., Read AC Characteristics for details of when the output becomes valid. Bus Write. Bus Write operations write to the Command Interface. A valid Bus Write operation begins by setting the desired address on the Address Inputs. The Address Inputs are latched by the Command Interface on the falling edge of Chip Enable or Write Enable, whichever occurs last. The Data Inputs/Outputs are latched by the Command Interface on the rising edge of Chip Enable or Write Enable, whichever occurs first. Output Enable must remain High, VIH, during the whole Bus Write operation. See Figures 13 and 14, Write AC Waveforms, and Tables 13 and 14, Write AC Characteristics, for details of the timing requirements. Output Disable. The Data Inputs/Outputs are in the high impedance state when Output Enable is High, VIH. Standby. When Chip Enable is High, VIH, the memory enters Standby mode and the Data Inputs/Outputs pins are placed in the high-imped- ance state. To reduce the Supply Current to the Standby Supply Current, ICC2, Chip Enable should be held within VCC ± 0.2V. For the Standby current level see Table 11., DC Characteristics. During program or erase operations the memory will continue to use the Program/Erase Supply Current, ICC3, for Program or Erase operations until the operation completes. Automatic Standby. If CMOS levels (VCC ± 0.2V) are used to drive the bus and the bus is inactive for 150ns or more the memory enters Automatic Standby where the internal Supply Current is reduced to the Standby Supply Current, ICC2. The Data Inputs/Outputs will still output data if a Bus Read operation is in progress. Special Bus Operations. Additional bus operations can be performed to read the Electronic Signature and also to apply and remove Block Protection. These bus operations are intended for use by programming equipment and are not usually used in applications. They require VID to be applied to some pins. Electronic Signature. The memory has two codes, the manufacturer code and the device code, that can be read to identify the memory. These codes can be read by applying the signals listed in Tables 2 and 3, Bus Operations. Block Protection and Blocks Unprotection. Each block can be separately protected against accidental Program or Erase. Protected blocks can be unprotected to allow data to be changed. There are two methods available for protecting and unprotecting the blocks, one for use on programming equipment and the other for in-system use. Block Protect and Chip Unprotect operations are described in APPENDIX C. Table 2. Bus Operations, BYTE = VIL Operation E G Address Inputs DQ15A–1, A0-A18 W Data Inputs/Outputs DQ14-DQ8 DQ7-DQ0 Bus Read VIL VIL VIH Cell Address Hi-Z Data Output Bus Write VIL VIH VIL Command Address Hi-Z Data Input X VIH VIH X Hi-Z Hi-Z Standby VIH X X X Hi-Z Hi-Z Read Manufacturer Code VIL VIL VIH A0 = VIL, A1 = VIL, A9 = VID, Others VIL or VIH Hi-Z 20h Read Device Code VIL VIL VIH A0 = VIH, A1 = VIL, A9 = VID, Others VIL or VIH Hi-Z D7h (M29W800DT) 5Bh (M29W800DB) Output Disable Note: X = VIL or VIH. 11/42 M29W800DT, M29W800DB Table 3. Bus Operations, BYTE = VIH Operation Address Inputs A0-A18 Data Inputs/Outputs DQ15A–1, DQ14-DQ0 E G W Bus Read VIL VIL VIH Cell Address Bus Write VIL VIH VIL Command Address X VIH VIH X Hi-Z Standby VIH X X X Hi-Z Read Manufacturer Code VIL VIL VIH A0 = VIL, A1 = VIL, A9 = VID, Others VIL or VIH 0020h Read Device Code VIL VIL VIH A0 = VIH, A1 = VIL, A9 = VID, Others VIL or VIH 22D7h (M29W800DT) 225Bh (M29W800DB) Output Disable Data Output Data Input Note: X = VIL or VIH. COMMAND INTERFACE All Bus Write operations to the memory are interpreted by the Command Interface. Commands consist of one or more sequential Bus Write operations. Failure to observe a valid sequence of Bus Write operations will result in the memory returning to Read mode. The long command sequences are imposed to maximize data security. The address used for the commands changes depending on whether the memory is in 16-bit or 8bit mode. See either Table 4, or 5, depending on the configuration that is being used, for a summary of the commands. Read/Reset Command. The Read/Reset command returns the memory to its Read mode where it behaves like a ROM or EPROM, unless otherwise stated. It also resets the errors in the Status Register. Either one or three Bus Write operations can be used to issue the Read/Reset command. The Read/Reset Command can be issued, between Bus Write cycles before the start of a program or erase operation, to return the device to read mode. Once the program or erase operation has started the Read/Reset command is no longer accepted. The Read/Reset command will not abort an Erase operation when issued while in Erase Suspend. Auto Select Command. The Auto Select command is used to read the Manufacturer Code, the Device Code and the Block Protection Status. Three consecutive Bus Write operations are required to issue the Auto Select command. Once the Auto Select command is issued the memory remains in Auto Select mode until a Read/Reset command is issued. Read CFI Query and Read/ Reset commands are accepted in Auto Select mode, all other commands are ignored. 12/42 From the Auto Select mode the Manufacturer Code can be read using a Bus Read operation with A0 = VIL and A1 = VIL. The other address bits may be set to either VIL or VIH. The Manufacturer Code for STMicroelectronics is 0020h. The Device Code can be read using a Bus Read operation with A0 = VIH and A1 = VIL. The other address bits may be set to either VIL or VIH. The Device Code for the M29W800DT is 22D7h and for the M29W800DB is 225Bh. The Block Protection Status of each block can be read using a Bus Read operation with A0 = VIL, A1 = VIH, and A12-A18 specifying the address of the block. The other address bits may be set to either VIL or VIH. If the addressed block is protected then 01h is output on Data Inputs/Outputs DQ0DQ7, otherwise 00h is output. Program Command. The Program command can be used to program a value to one address in the memory array at a time. The command requires four Bus Write operations, the final write operation latches the address and data in the internal state machine and starts the Program/Erase Controller. If the address falls in a protected block then the Program command is ignored, the data remains unchanged. The Status Register is never read and no error condition is given. During the program operation the memory will ignore all commands. It is not possible to issue any command to abort or pause the operation. Typical program times are given in Table 6. Bus Read operations during the program operation will output the Status Register on the Data Inputs/Outputs. See the section on the Status Register for more details. M29W800DT, M29W800DB After the program operation has completed the memory will return to the Read mode, unless an error has occurred. When an error occurs the memory will continue to output the Status Register. A Read/Reset command must be issued to reset the error condition and return to Read mode. Note that the Program command cannot change a bit set at ’0’ back to ’1’. One of the Erase Commands must be used to set all the bits in a block or in the whole memory from ’0’ to ’1’. Unlock Bypass Command. The Unlock Bypass command is used in conjunction with the Unlock Bypass Program command to program the memory. When the access time to the device is long (as with some EPROM programmers) considerable time saving can be made by using these commands. Three Bus Write operations are required to issue the Unlock Bypass command. Once the Unlock Bypass command has been issued the memory will only accept the Unlock Bypass Program command and the Unlock Bypass Reset command. The memory can be read as if in Read mode. Unlock Bypass Program Command. The Unlock Bypass Program command can be used to program one address in memory at a time. The command requires two Bus Write operations, the final write operation latches the address and data in the internal state machine and starts the Program/Erase Controller. The Program operation using the Unlock Bypass Program command behaves identically to the Program operation using the Program command. A protected block cannot be programmed; the operation cannot be aborted and the Status Register is read. Errors must be reset using the Read/Reset command, which leaves the device in Unlock Bypass Mode. See the Program command for details on the behavior. Unlock Bypass Reset Command. The Unlock Bypass Reset command can be used to return to Read/Reset mode from Unlock Bypass Mode. Two Bus Write operations are required to issue the Unlock Bypass Reset command. Read/Reset command does not exit from Unlock Bypass Mode. Chip Erase Command. The Chip Erase command can be used to erase the entire chip. Six Bus Write operations are required to issue the Chip Erase Command and start the Program/Erase Controller. If any blocks are protected then these are ignored and all the other blocks are erased. If all of the blocks are protected the Chip Erase operation appears to start but will terminate within about 100µs, leaving the data unchanged. No error condition is given when protected blocks are ignored. During the erase operation the memory will ignore all commands. It is not possible to issue any command to abort the operation. Typical chip erase times are given in Table 6. All Bus Read operations during the Chip Erase operation will output the Status Register on the Data Inputs/Outputs. See the section on the Status Register for more details. After the Chip Erase operation has completed the memory will return to the Read Mode, unless an error has occurred. When an error occurs the memory will continue to output the Status Register. A Read/Reset command must be issued to reset the error condition and return to Read Mode. The Chip Erase Command sets all of the bits in unprotected blocks of the memory to ’1’. All previous data is lost. Block Erase Command. The Block Erase command can be used to erase a list of one or more blocks. Six Bus Write operations are required to select the first block in the list. Each additional block in the list can be selected by repeating the sixth Bus Write operation using the address of the additional block. The Block Erase operation starts the Program/Erase Controller about 50µs after the last Bus Write operation. Once the Program/Erase Controller starts it is not possible to select any more blocks. Each additional block must therefore be selected within 50µs of the last block. The 50µs timer restarts when an additional block is selected. The Status Register can be read after the sixth Bus Write operation. See the Status Register for details on how to identify if the Program/Erase Controller has started the Block Erase operation. If any selected blocks are protected then these are ignored and all the other selected blocks are erased. If all of the selected blocks are protected the Block Erase operation appears to start but will terminate within about 100µs, leaving the data unchanged. No error condition is given when protected blocks are ignored. During the Block Erase operation the memory will ignore all commands except the Erase Suspend command. Typical block erase times are given in Table 6. All Bus Read operations during the Block Erase operation will output the Status Register on the Data Inputs/Outputs. See the section on the Status Register for more details. After the Block Erase operation has completed the memory will return to the Read Mode, unless an error has occurred. When an error occurs the memory will continue to output the Status Register. A Read/Reset command must be issued to reset the error condition and return to Read mode. The Block Erase Command sets all of the bits in the unprotected selected blocks to ’1’. All previous data in the selected blocks is lost. 13/42 M29W800DT, M29W800DB Erase Suspend Command. The Erase Suspend Command may be used to temporarily suspend a Block Erase operation and return the memory to Read mode. The command requires one Bus Write operation. The Program/Erase Controller will suspend within the Erase Suspend Latency Time (refer to Table 6. for value) of the Erase Suspend Command being issued. Once the Program/Erase Controller has stopped the memory will be set to Read mode and the Erase will be suspended. If the Erase Suspend command is issued during the period when the memory is waiting for an additional block (before the Program/Erase Controller starts) then the Erase is suspended immediately and will start immediately when the Erase Resume Command is issued. It is not possible to select any further blocks to erase after the Erase Resume. During Erase Suspend it is possible to Read and Program cells in blocks that are not being erased; both Read and Program operations behave as normal on these blocks. If any attempt is made to program in a protected block or in the suspended block then the Program command is ignored and the data remains unchanged. The Status Register is not read and no error condition is given. Reading from blocks that are being erased will output the Status Register. It is also possible to issue the Auto Select, Read CFI Query and Unlock Bypass commands during an Erase Suspend. The Read/Reset command must be issued to return the device to Read Array 14/42 mode before the Resume command will be accepted. Erase Resume Command. The Erase Resume command must be used to restart the Program/ Erase Controller from Erase Suspend. An erase can be suspended and resumed more than once. Read CFI Query Command. The Read CFI Query Command is used to read data from the Common Flash Interface (CFI) Memory Area. This command is valid when the device is in the Read Array mode, or when the device is in Auto Select mode. One Bus Write cycle is required to issue the Read CFI Query Command. Once the command is issued subsequent Bus Read operations read from the Common Flash Interface Memory Area. The Read/Reset command must be issued to return the device to the previous mode (the Read Array mode or Auto Select mode). A second Read/ Reset command would be needed if the device is to be put in the Read Array mode from Auto Select mode. See APPENDIX B., Tables 23, 24, 25, 26, 27 and 28 for details on the information contained in the Common Flash Interface (CFI) memory area. Block Protect and Chip Unprotect Commands. Each block can be separately protected against accidental Program or Erase. The whole chip can be unprotected to allow the data inside the blocks to be changed. Block Protect and Chip Unprotect operations are described in APPENDIX C. M29W800DT, M29W800DB Command Length Table 4. Commands, 16-bit mode, BYTE = VIH Bus Write Operations 1st 2nd Addr Data 1 X F0 3 555 Auto Select 3 Program 3rd 4th Addr Data Addr Data AA 2AA 55 X F0 555 AA 2AA 55 555 90 4 555 AA 2AA 55 555 A0 Unlock Bypass 3 555 AA 2AA 55 555 20 Unlock Bypass Program 2 X A0 PA PD Unlock Bypass Reset 2 X 90 X 00 Chip Erase 6 555 AA 2AA 55 555 Block Erase 6+ 555 AA 2AA 55 555 Erase Suspend 1 X B0 Erase Resume 1 X 30 Read CFI Query 1 55 98 5th Addr Data PA PD 80 555 80 555 6th Addr Data Addr Data AA 2AA 55 555 10 AA 2AA 55 BA 30 Read/Reset Note: X Don’t Care, PA Program Address, PD Program Data, BA Any address in the Block. All values in the table are in hexadecimal. The Command Interface only uses A–1, A0-A10 and DQ0-DQ7 to verify the commands; A11-A18, DQ8-DQ14 and DQ15 are Don’t Care. DQ15A–1 is A–1 when BYTE is VIL or DQ15 when BYTE is VIH. 15/42 M29W800DT, M29W800DB Command Length Table 5. Commands, 8-bit mode, BYTE = VIL Bus Write Operations 1st 2nd Addr Data 1 X F0 3 AAA Auto Select 3 Program 3rd 4th Addr Data Addr Data AA 555 55 X F0 AAA AA 555 55 AAA 90 4 AAA AA 555 55 AAA A0 Unlock Bypass 3 AAA AA 555 55 AAA 20 Unlock Bypass Program 2 X A0 PA PD Unlock Bypass Reset 2 X 90 X 00 Chip Erase 6 AAA AA 555 55 AAA Block Erase 6+ AAA AA 555 55 AAA Erase Suspend 1 X B0 Erase Resume 1 X 30 Read CFI Query 1 AA 98 5th Addr Data PA PD 80 AAA 80 AAA 6th Addr Data Addr Data AA 555 55 AAA 10 AA 555 55 BA 30 Read/Reset Note: X Don’t Care, PA Program Address, PD Program Data, BA Any address in the Block. All values in the table are in hexadecimal. The Command Interface only uses A–1, A0-A10 and DQ0-DQ7 to verify the commands; A11-A18, DQ8-DQ14 and DQ15 are Don’t Care. DQ15A–1 is A–1 when BYTE is VIL or DQ15 when BYTE is VIH. Table 6. Program, Erase Times and Program, Erase Endurance Cycles Typ (1, 2) Max(2) Unit Chip Erase 12 60(3) s Block Erase (64 Kbytes) 0.8 6(4) s Erase Suspend Latency Time 15 25(3) µs Program (Byte or Word) 10 200(3) µs Chip Program (Byte by Byte) 12 60(3) s Chip Program (Word by Word) 6 30(4) s Parameter Program/Erase Cycles (per Block) Data Retention Note: 1. 2. 3. 4. 16/42 Min 100,000 cycles 20 years Typical values measured at room temperature and nominal voltages. Sampled, but not 100% tested. Maximum value measured at worst case conditions for both temperature and VCC after 100,00 program/erase cycles. Maximum value measured at worst case conditions for both temperature and VCC. M29W800DT, M29W800DB STATUS REGISTER Bus Read operations from any address always read the Status Register during Program and Erase operations. It is also read during Erase Suspend when an address within a block being erased is accessed. The bits in the Status Register are summarized in Table 7., Status Register Bits. Data Polling Bit (DQ7). The Data Polling Bit can be used to identify whether the Program/Erase Controller has successfully completed its operation or if it has responded to an Erase Suspend. The Data Polling Bit is output on DQ7 when the Status Register is read. During Program operations the Data Polling Bit outputs the complement of the bit being programmed to DQ7. After successful completion of the Program operation the memory returns to Read mode and Bus Read operations from the address just programmed output DQ7, not its complement. During Erase operations the Data Polling Bit outputs ’0’, the complement of the erased state of DQ7. After successful completion of the Erase operation the memory returns to Read Mode. In Erase Suspend mode the Data Polling Bit will output a ’1’ during a Bus Read operation within a block being erased. The Data Polling Bit will change from a ’0’ to a ’1’ when the Program/Erase Controller has suspended the Erase operation. Figure 8., Data Polling Flowchart, gives an example of how to use the Data Polling Bit. A Valid Address is the address being programmed or an address within the block being erased. Toggle Bit (DQ6). The Toggle Bit can be used to identify whether the Program/Erase Controller has successfully completed its operation or if it has responded to an Erase Suspend. The Toggle Bit is output on DQ6 when the Status Register is read. During Program and Erase operations the Toggle Bit changes from ’0’ to ’1’ to ’0’, etc., with successive Bus Read operations at any address. After successful completion of the operation the memory returns to Read mode. During Erase Suspend mode the Toggle Bit will output when addressing a cell within a block being erased. The Toggle Bit will stop toggling when the Program/Erase Controller has suspended the Erase operation. If any attempt is made to erase a protected block, the operation is aborted, no error is signalled and DQ6 toggles for approximately 100µs. If any attempt is made to program a protected block or a suspended block, the operation is aborted, no er- ror is signalled and DQ6 toggles for approximately 1µs. Figure 9., Data Toggle Flowchart, gives an example of how to use the Data Toggle Bit. Error Bit (DQ5). The Error Bit can be used to identify errors detected by the Program/Erase Controller. The Error Bit is set to ’1’ when a Program, Block Erase or Chip Erase operation fails to write the correct data to the memory. If the Error Bit is set a Read/Reset command must be issued before other commands are issued. The Error bit is output on DQ5 when the Status Register is read. Note that the Program command cannot change a bit set to ’0’ back to ’1’ and attempting to do so will set DQ5 to ‘1’. A Bus Read operation to that address will show the bit is still ‘0’. One of the Erase commands must be used to set all the bits in a block or in the whole memory from ’0’ to ’1’ Erase Timer Bit (DQ3). The Erase Timer Bit can be used to identify the start of Program/Erase Controller operation during a Block Erase command. Once the Program/Erase Controller starts erasing the Erase Timer Bit is set to ’1’. Before the Program/Erase Controller starts the Erase Timer Bit is set to ’0’ and additional blocks to be erased may be written to the Command Interface. The Erase Timer Bit is output on DQ3 when the Status Register is read. Alternative Toggle Bit (DQ2). The Alternative Toggle Bit can be used to monitor the Program/ Erase controller during Erase operations. The Alternative Toggle Bit is output on DQ2 when the Status Register is read. During Chip Erase and Block Erase operations the Toggle Bit changes from ’0’ to ’1’ to ’0’, etc., with successive Bus Read operations from addresses within the blocks being erased. A protected block is treated the same as a block not being erased. Once the operation completes the memory returns to Read mode. During Erase Suspend the Alternative Toggle Bit changes from ’0’ to ’1’ to ’0’, etc. with successive Bus Read operations from addresses within the blocks being erased. Bus Read operations to addresses within blocks not being erased will output the memory cell data as if in Read mode. After an Erase operation that causes the Error Bit to be set the Alternative Toggle Bit can be used to identify which block or blocks have caused the error. The Alternative Toggle Bit changes from ’0’ to ’1’ to ’0’, etc. with successive Bus Read Operations from addresses within blocks that have not erased correctly. The Alternative Toggle Bit does not change if the addressed block has erased correctly. 17/42 M29W800DT, M29W800DB Table 7. Status Register Bits Operation Address DQ7 DQ6 DQ5 DQ3 DQ2 RB Program Any Address DQ7 Toggle 0 – – 0 Program During Erase Suspend Any Address DQ7 Toggle 0 – – 0 Program Error Any Address DQ7 Toggle 1 – – 0 Chip Erase Any Address 0 Toggle 0 1 Toggle 0 Block Erase before timeout Erasing Block 0 Toggle 0 0 Toggle 0 Non-Erasing Block 0 Toggle 0 0 No Toggle 0 Erasing Block 0 Toggle 0 1 Toggle 0 Non-Erasing Block 0 Toggle 0 1 No Toggle 0 Erasing Block 1 No Toggle 0 – Toggle 1 Block Erase Erase Suspend Non-Erasing Block Data read as normal 1 Good Block Address 0 Toggle 1 1 No Toggle 0 Faulty Block Address 0 Toggle 1 1 Toggle 0 Erase Error Note: Unspecified data bits should be ignored. Figure 8. Data Polling Flowchart Figure 9. Data Toggle Flowchart START START READ DQ6 READ DQ5 & DQ7 at VALID ADDRESS DQ7 = DATA READ DQ5 & DQ6 YES DQ6 = TOGGLE NO NO YES NO DQ5 =1 NO YES DQ5 =1 YES READ DQ7 at VALID ADDRESS READ DQ6 TWICE DQ7 = DATA YES DQ6 = TOGGLE NO FAIL PASS AI03598 NO YES FAIL PASS AI01370C 18/42 M29W800DT, M29W800DB MAXIMUM RATING Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 8. Absolute Maximum Ratings Symbol Parameter Min Max Unit TBIAS Temperature Under Bias –50 125 °C TSTG Storage Temperature –65 150 °C VIO Input or Output Voltage (1,2) –0.6 VCC +0.6 V VCC Supply Voltage –0.6 4 V VID Identification Voltage –0.6 13.5 V Note: 1. Minimum voltage may undershoot to –2V during transition and for less than 20ns during transitions. 2. Maximum voltage may overshoot to VCC +2V during transition and for less than 20ns during transitions. 19/42 M29W800DT, M29W800DB DC AND AC PARAMETERS Conditions summarized in Table 9., Operating and AC Measurement Conditions. Designers should check that the operating conditions in their circuit match the operating conditions when relying on the quoted parameters. This section summarizes the operating measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC characteristics Tables that follow, are derived from tests performed under the Measurement Table 9. Operating and AC Measurement Conditions M29W800D Parameter 45 70 90 Unit Min Max Min Max Min Max VCC Supply Voltage 3.0 3.6 2.7 3.6 2.7 3.6 Ambient Operating Temperature (range 6) –40 85 –40 85 –40 85 Ambient Operating Temperature (range 1) 0 70 0 70 0 70 V °C Load Capacitance (CL) 30 Input Rise and Fall Times 30 10 Input Pulse Voltages Input and Output Timing Ref. Voltages Figure 10. AC Measurement I/O Waveform 100 10 pF 10 ns 0 to VCC 0 to VCC 0 to VCC V VCC/2 VCC/2 VCC/2 V Figure 11. AC Measurement Load Circuit VCC VCC VCC VCC/2 25kΩ 0V DEVICE UNDER TEST AI04498 0.1µF CL 25kΩ AI04499 CL includes JIG capacitance Table 10. Device Capacitance Symbol CIN COUT Parameter Input Capacitance Output Capacitance Note: Sampled only, not 100% tested. 20/42 Test Condition Min Max Unit VIN = 0V 6 pF VOUT = 0V 12 pF M29W800DT, M29W800DB Table 11. DC Characteristics Symbol Parameter Test Condition Min Max Unit 0V ≤ VIN ≤ VCC ±1 µA ILI Input Leakage Current ILO Output Leakage Current 0V ≤ VOUT ≤ VCC ±1 µA ICC1 Supply Current (Read) E = VIL, G = VIH, f = 6MHz 10 mA ICC2 Supply Current (Standby) E = VCC ±0.2V, RP = VCC ±0.2V 100 µA Supply Current (Program/Erase) Program/Erase Controller active 20 mA ICC3 (1) VIL Input Low Voltage –0.5 0.8 V VIH Input High Voltage 0.7VCC VCC +0.3 V VOL Output Low Voltage IOL = 1.8mA 0.45 V VOH Output High Voltage IOH = –100µA VID Identification Voltage IID Identification Current VLKO VCC –0.4 11.5 V 12.5 V 100 µA 2.3 V A9 = VID Program/Erase Lockout Supply Voltage 1.8 Note: 1. Sampled only, not 100% tested. Figure 12. Read Mode AC Waveforms tAVAV A0-A18/ A–1 VALID tAVQV tAXQX E tELQV tEHQX tELQX tEHQZ G tGLQX tGHQX tGHQZ tGLQV DQ0-DQ7/ DQ8-DQ15 VALID tBHQV BYTE tELBL/tELBH tBLQZ AI05448 21/42 M29W800DT, M29W800DB Table 12. Read AC Characteristics M29W800D Symbol Alt Parameter Test Condition Unit 45 70 90 tAVAV tRC Address Valid to Next Address Valid E = VIL, G = VIL Min 45 70 90 ns tAVQV tACC Address Valid to Output Valid E = VIL, G = VIL Max 45 70 90 ns tELQX (1) tLZ Chip Enable Low to Output Transition G = VIL Min 0 0 0 ns tELQV tCE Chip Enable Low to Output Valid G = VIL Max 45 70 90 ns tGLQX (1) tOLZ Output Enable Low to Output Transition E = VIL Min 0 0 0 ns tGLQV tOE Output Enable Low to Output Valid E = VIL Max 25 30 35 ns tEHQZ (1) tHZ Chip Enable High to Output Hi-Z G = VIL Max 20 25 30 ns tGHQZ (1) tDF Output Enable High to Output Hi-Z E = VIL Max 20 25 30 ns tEHQX tGHQX tAXQX tOH Chip Enable, Output Enable or Address Transition to Output Transition Min 0 0 0 ns tELBL tELBH tELFL tELFH Chip Enable to BYTE Low or High Max 5 5 5 ns tBLQZ tFLQZ BYTE Low to Output Hi-Z Max 25 25 30 ns tBHQV tFHQV BYTE High to Output Valid Max 30 30 40 ns Note: 1. Sampled only, not 100% tested. 22/42 M29W800DT, M29W800DB Figure 13. Write AC Waveforms, Write Enable Controlled tAVAV A0-A18/ A–1 VALID tWLAX tAVWL tWHEH E tELWL tWHGL G tGHWL tWLWH W tWHWL tDVWH DQ0-DQ7/ DQ8-DQ15 tWHDX VALID VCC tVCHEL RB tWHRL AI05449 Table 13. Write AC Characteristics, Write Enable Controlled M29W800D Symbol Alt Parameter Unit 45 70 90 tAVAV tWC Address Valid to Next Address Valid Min 45 70 90 ns tELWL tCS Chip Enable Low to Write Enable Low Min 0 0 0 ns tWLWH tWP Write Enable Low to Write Enable High Min 30 45 50 ns tDVWH tDS Input Valid to Write Enable High Min 25 45 50 ns tWHDX tDH Write Enable High to Input Transition Min 0 0 0 ns tWHEH tCH Write Enable High to Chip Enable High Min 0 0 0 ns tWHWL tWPH Write Enable High to Write Enable Low Min 30 30 30 ns tAVWL tAS Address Valid to Write Enable Low Min 0 0 0 ns tWLAX tAH Write Enable Low to Address Transition Min 40 45 50 ns Output Enable High to Write Enable Low Min 0 0 0 ns tGHWL tWHGL tOEH Write Enable High to Output Enable Low Min 0 0 0 ns tWHRL (1) tBUSY Program/Erase Valid to RB Low Max 30 30 35 ns tVCHEL tVCS VCC High to Chip Enable Low Min 50 50 50 µs Note: 1. Sampled only, not 100% tested. 23/42 M29W800DT, M29W800DB Figure 14. Write AC Waveforms, Chip Enable Controlled tAVAV A0-A18/ A–1 VALID tELAX tAVEL tEHWH W tWLEL tEHGL G tGHEL tELEH E tEHEL tDVEH DQ0-DQ7/ DQ8-DQ15 tEHDX VALID VCC tVCHWL RB tEHRL AI05450 Table 14. Write AC Characteristics, Chip Enable Controlled M29W800D Symbol Alt Parameter Unit 45 70 90 tAVAV tWC Address Valid to Next Address Valid Min 45 70 90 ns tWLEL tWS Write Enable Low to Chip Enable Low Min 0 0 0 ns tELEH tCP Chip Enable Low to Chip Enable High Min 30 45 50 ns tDVEH tDS Input Valid to Chip Enable High Min 25 45 50 ns tEHDX tDH Chip Enable High to Input Transition Min 0 0 0 ns tEHWH tWH Chip Enable High to Write Enable High Min 0 0 0 ns tEHEL tCPH Chip Enable High to Chip Enable Low Min 30 30 30 ns tAVEL tAS Address Valid to Chip Enable Low Min 0 0 0 ns tELAX tAH Chip Enable Low to Address Transition Min 40 45 50 ns Output Enable High Chip Enable Low Min 0 0 0 ns tGHEL tEHGL tOEH Chip Enable High to Output Enable Low Min 0 0 0 ns tEHRL (1) tBUSY Program/Erase Valid to RB Low Max 30 30 35 ns tVCHWL tVCS VCC High to Write Enable Low Min 50 50 50 µs Note: 1. Sampled only, not 100% tested. 24/42 M29W800DT, M29W800DB Figure 15. Reset/Block Temporary Unprotect AC Waveforms W, E, G tPHWL, tPHEL, tPHGL RB tRHWL, tRHEL, tRHGL tPLPX RP tPHPHH tPLYH AI06870 Table 15. Reset/Block Temporary Unprotect AC Characteristics M29W800D Symbol tPHWL (1) tPHEL Alt Parameter Unit 45 70 90 tRH RP High to Write Enable Low, Chip Enable Low, Output Enable Low Min 50 50 50 ns tRB RB High to Write Enable Low, Chip Enable Low, Output Enable Low Min 0 0 0 ns tPLPX tRP RP Pulse Width Min 500 500 500 ns tPLYH (1) tREADY RP Low to Read Mode Max 10 10 10 µs tPHPHH (1) tVIDR RP Rise Time to VID Min 500 500 500 ns tPHGL (1) tRHWL (1) tRHEL (1) tRHGL (1) Note: 1. Sampled only, not 100% tested. 25/42 M29W800DT, M29W800DB PACKAGE MECHANICAL Figure 16. SO44 – 44 lead Plastic Small Outline, 525 mils body width, Package Outline A A2 C b e CP D N E EH 1 A1 α L SO-d Note: Drawing is not to scale. Table 16. SO44 – 44 lead Plastic Small Outline, 525 mils body width, Package Mechanical Data millimeters inches Symbol Typ Min A Max Typ Min 2.80 A1 Max 0.1102 0.10 0.0039 A2 2.30 2.20 2.40 0.0906 0.0866 0.0945 b 0.40 0.35 0.50 0.0157 0.0138 0.0197 C 0.15 0.10 0.20 0.0059 0.0039 0.0079 CP 0.08 0.0030 D 28.20 28.00 28.40 1.1102 1.1024 1.1181 E 13.30 13.20 13.50 0.5236 0.5197 0.5315 EH 16.00 15.75 16.25 0.6299 0.6201 0.6398 e 1.27 – – 0.0500 – – L 0.80 0.0315 α N 26/42 8° 44 8° 44 M29W800DT, M29W800DB Figure 17. TSOP48 – 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Outline 1 48 e D1 B 24 L1 25 A2 E1 E A α A1 DIE L C CP TSOP-G Note: Drawing is not to scale. Table 17. TSOP48 – 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Mechanical Data millimeters inches Symbol Typ Min A Max Typ Min 1.200 Max 0.0472 A1 0.100 0.050 0.150 0.0039 0.0020 0.0059 A2 1.000 0.950 1.050 0.0394 0.0374 0.0413 B 0.220 0.170 0.270 0.0087 0.0067 0.0106 0.100 0.210 0.0039 0.0083 C CP 0.080 0.0031 D1 12.000 11.900 12.100 0.4724 0.4685 0.4764 E 20.000 19.800 20.200 0.7874 0.7795 0.7953 E1 18.400 18.300 18.500 0.7244 0.7205 0.7283 e 0.500 – – 0.0197 – – L 0.600 0.500 0.700 0.0236 0.0197 0.0276 L1 0.800 α 3° 0° 5° 0.0315 0° 5° 3° 27/42 M29W800DT, M29W800DB Figure 18. TFBGA48 6x9mm – 6x8 ball array – 0.80mm pitch, Bottom View Package Outline D D1 FD FE SD SE BALL "A1" E E1 ddd e e b A A2 A1 BGA-Z00 Note: Drawing is not to scale. Table 18. TFBGA48 6x9mm – 6x8 active ball array – 0.80mm pitch, Package Mechanical Data millimeters inches Symbol Typ Min A Typ Min 1.200 A1 Max 0.0472 0.200 A2 0.0079 1.000 0.0394 b 0.400 0.350 0.450 0.0157 0.0138 0.0177 D 6.000 5.900 6.100 0.2362 0.2323 0.2402 D1 4.000 – – 0.1575 – – ddd 28/42 Max 0.100 0.0039 E 9.000 8.900 9.100 0.3543 0.3504 0.3583 e 0.800 – – 0.0315 – – E1 5.600 – – 0.2205 – – FD 1.000 – – 0.0394 – – FE 1.700 – – 0.0669 – – SD 0.400 – – 0.0157 – – SE 0.400 – – 0.0157 – – M29W800DT, M29W800DB Figure 19. TFBGA48 6x8mm – 6x8 ball array – 0.80mm pitch, Bottom View Package Outline D D1 FD FE SD SE E E1 BALL "A1" ddd e e b A A2 A1 BGA-Z32 Note: Drawing is not to scale. Table 19. TFBGA48 6x8mm – 6x8 active ball array – 0.80mm pitch, Package Mechanical Data millimeters inches Symbol Typ Min A Max Typ Min 1.200 A1 0.0472 0.260 A2 0.0102 0.900 b Max 0.350 0.450 0.0354 0.0138 0.0177 D 6.000 5.900 6.100 0.2362 0.2323 0.2402 D1 4.000 – – 0.1575 – – ddd 0.100 0.0039 E 8.000 7.900 8.100 0.3150 0.3110 0.3189 E1 5.600 – – 0.2205 – – e 0.800 – – 0.0315 – – FD 1.000 – – 0.0394 – – FE 1.200 – – 0.0472 – – SD 0.400 – – 0.0157 – – SE 0.400 – – 0.0157 – – 29/42 M29W800DT, M29W800DB PART NUMBERING Table 20. Ordering Information Scheme Example: M29W800DB 90 N 6 T Device Type M29 Operating Voltage W = VCC = 2.7 to 3.6V Device Function 800D = 8 Mbit (x8/x16), Boot Block Array Matrix T = Top Boot B = Bottom Boot Speed 45 = 45ns 70 = 70 ns 90 = 90 ns Package M = SO44 N = TSOP48: 12 x 20 mm ZA = TFBGA48: 6x9mm, 0.80mm pitch ZE = TFBGA48: 6x8mm, 0.80mm pitch Temperature Range 6 = –40 to 85 °C 1 = 0 to 70 °C Option T = Tape & Reel Packing E = Lead-free Package, Standard Packing F = Lead-free Package, Tape & Reel Packing Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available options (Speed, Package, etc.) or for further information on any aspect of this device, please contact your nearest ST Sales Office. 30/42 M29W800DT, M29W800DB APPENDIX A. BLOCK ADDRESS TABLE Table 21. Top Boot Block Addresses, M29W800DT # Size (Kbytes) Address Range (x8) 18 16 17 8 16 Table 22. Bottom Boot Block Addresses, M29W800DB Address Range (x16) # FC000h-FFFFFh 7E000h-7FFFFh 18 FA000h-FBFFFh 7D000h-7DFFFh 17 8 F8000h-F9FFFh 7C000h-7CFFFh 16 15 32 F0000h-F7FFFh 78000h-7BFFFh 14 64 E0000h-EFFFFh 13 64 12 Size (Kbytes) Address Range (x8) Address Range (x16) 64 F0000h-FFFFFh 78000h-7FFFFh 64 E0000h-EFFFFh 70000h-77FFFh 64 D0000h-DFFFFh 68000h-6FFFFh 15 64 C0000h-CFFFFh 60000h-67FFFh 70000h-77FFFh 14 64 B0000h-BFFFFh 58000h-5FFFFh D0000h-DFFFFh 68000h-6FFFFh 13 64 A0000h-AFFFFh 50000h-57FFFh 64 C0000h-CFFFFh 60000h-67FFFh 12 64 90000h-9FFFFh 48000h-4FFFFh 11 64 B0000h-BFFFFh 58000h-5FFFFh 11 64 80000h-8FFFFh 40000h-47FFFh 10 64 A0000h-AFFFFh 50000h-57FFFh 10 64 70000h-7FFFFh 38000h-3FFFFh 9 64 90000h-9FFFFh 48000h-4FFFFh 9 64 60000h-6FFFFh 30000h-37FFFh 8 64 80000h-8FFFFh 40000h-47FFFh 8 64 50000h-5FFFFh 28000h-2FFFFh 7 64 70000h-7FFFFh 38000h-3FFFFh 7 64 40000h-4FFFFh 20000h-27FFFh 6 64 60000h-6FFFFh 30000h-37FFFh 6 64 30000h-3FFFFh 18000h-1FFFFh 5 64 50000h-5FFFFh 28000h-2FFFFh 5 64 20000h-2FFFFh 10000h-17FFFh 4 64 40000h-4FFFFh 20000h-27FFFh 4 64 10000h-1FFFFh 08000h-0FFFFh 3 64 30000h-3FFFFh 18000h-1FFFFh 3 32 08000h-0FFFFh 04000h-07FFFh 2 64 20000h-2FFFFh 10000h-17FFFh 2 8 06000h-07FFFh 03000h-03FFFh 1 64 10000h-1FFFFh 08000h-0FFFFh 1 8 04000h-05FFFh 02000h-02FFFh 0 64 00000h-0FFFFh 00000h-07FFFh 0 16 00000h-03FFFh 00000h-01FFFh 31/42 M29W800DT, M29W800DB APPENDIX B. COMMON FLASH INTERFACE (CFI) The Common Flash Interface is a JEDEC approved, standardized data structure that can be read from the Flash memory device. It allows a system software to query the device to determine various electrical and timing parameters, density information and functions supported by the memory. The system can interface easily with the device, enabling the software to upgrade itself when necessary. When the CFI Query Command is issued the device enters CFI Query mode and the data structure is read from the memory. Tables 23, 24, 25, 26, 27 and 28 show the addresses used to retrieve the data. The CFI data structure also contains a security area where a 64 bit unique security number is written (see Table 28., Security Code Area). This area can be accessed only in Read mode by the final user. It is impossible to change the security number after it has been written by ST. Issue a Read command to return to Read mode. Table 23. Query Structure Overview Address Sub-section Name Description x16 x8 10h 20h CFI Query Identification String Command set ID and algorithm data offset 1Bh 36h System Interface Information Device timing & voltage information 27h 4Eh Device Geometry Definition Flash device layout 40h 80h Primary Algorithm-specific Extended Query table Additional information specific to the Primary Algorithm (optional) 61h C2h Security Code Area 64 bit unique device number Note: Query data are always presented on the lowest order data outputs. Table 24. CFI Query Identification String Address Data Description x16 x8 10h 20h 0051h 11h 22h 0052h 12h 24h 0059h 13h 26h 0002h 14h 28h 0000h 15h 2Ah 0040h 16h 2Ch 0000h 17h 2Eh 0000h 18h 30h 0000h Alternate Vendor Command Set and Control Interface ID Code second vendor - specified algorithm supported 19h 32h 0000h Address for Alternate Algorithm extended Query table 1Ah 34h 0000h "Q" Query Unique ASCII String "QRY" "R" "Y" Primary Algorithm Command Set and Control Interface ID code 16 bit ID code defining a specific algorithm AMD Compatible Address for Primary Algorithm extended Query table (see Table 27.) P = 40h Note: Query data are always presented on the lowest order data outputs (DQ7-DQ0) only. DQ8-DQ15 are ‘0’. 32/42 Value NA NA M29W800DT, M29W800DB Table 25. CFI Query System Interface Information Address Data Description Value x16 x8 1Bh 36h 0027h VCC Logic Supply Minimum Program/Erase voltage bit 7 to 4 BCD value in volts bit 3 to 0 BCD value in 100 mV 2.7V 1Ch 38h 0036h VCC Logic Supply Maximum Program/Erase voltage bit 7 to 4 BCD value in volts bit 3 to 0 BCD value in 100 mV 3.6V 1Dh 3Ah 0000h VPP [Programming] Supply Minimum Program/Erase voltage NA 1Eh 3Ch 0000h VPP [Programming] Supply Maximum Program/Erase voltage NA 1Fh 3Eh 0004h Typical timeout per single byte/word program = 2n µs 20h 40h 0000h Typical timeout for minimum size write buffer program = 2n µs NA 21h 42h 000Ah Typical timeout per individual block erase = 2n ms 1s 22h 44h 0000h Typical timeout for full chip erase = 2n ms 23h 46h 0004h Maximum timeout for byte/word program = 2n times typical 256µs 24h 48h 0000h Maximum timeout for write buffer program = 2n times typical NA 25h 4Ah 0003h Maximum timeout per individual block erase = 2n times typical 8s 26h 4Ch 0000h Maximum timeout for chip erase = 2n times typical 16µs see note (1) see note (1) Note: 1. Not supported in the CFI 33/42 M29W800DT, M29W800DB Table 26. Device Geometry Definition Address Data Description Value x16 x8 27h 4Eh 0014h Device Size = 2n in number of bytes 1 MByte 28h 29h 50h 52h 0002h 0000h Flash Device Interface Code description x8, x16 Async. 2Ah 2Bh 54h 56h 0000h 0000h Maximum number of bytes in multi-byte program or page = 2n NA 2Ch 58h 0004h Number of Erase Block Regions within the device. It specifies the number of regions within the device containing contiguous Erase Blocks of the same size. 4 2Dh 2Eh 5Ah 5Ch 0000h 0000h Region 1 Information Number of identical size erase block = 0000h+1 1 2Fh 30h 5Eh 60h 0040h 0000h Region 1 Information Block size in Region 1 = 0040h * 256 byte 31h 32h 62h 64h 0001h 0000h Region 2 Information Number of identical size erase block = 0001h+1 33h 34h 66h 68h 0020h 0000h Region 2 Information Block size in Region 2 = 0020h * 256 byte 35h 36h 6Ah 6Ch 0000h 0000h Region 3 Information Number of identical size erase block = 0000h+1 37h 38h 6Eh 70h 0080h 0000h Region 3 Information Block size in Region 3 = 0080h * 256 byte 39h 3Ah 72h 74h 000Eh 0000h Region 4 Information Number of identical-size erase block = 000Eh+1 3Bh 3Ch 76h 78h 0000h 0001h Region 4 Information Block size in Region 4 = 0100h * 256 byte 34/42 16 Kbyte 2 8 Kbyte 1 32 Kbyte 15 64 Kbyte M29W800DT, M29W800DB Table 27. Primary Algorithm-Specific Extended Query Table Address Data Description Value x16 x8 40h 80h 0050h 41h 82h 0052h 42h 84h 0049h 43h 86h 0031h Major version number, ASCII "1" 44h 88h 0030h Minor version number, ASCII "0" 45h 8Ah 0000h Address Sensitive Unlock (bits 1 to 0) 00 = required, 01= not required Silicon Revision Number (bits 7 to 2) Yes 46h 8Ch 0002h Erase Suspend 00 = not supported, 01 = Read only, 02 = Read and Write 2 47h 8Eh 0001h Block Protection 00 = not supported, x = number of sectors in per group 1 48h 90h 0001h Temporary Block Unprotect 00 = not supported, 01 = supported 49h 92h 0004h Block Protect /Unprotect 04 = M29W400B 4Ah 94h 0000h Simultaneous Operations, 00 = not supported No 4Bh 96h 0000h Burst Mode, 00 = not supported, 01 = supported No 4Ch 98h 0000h Page Mode, 00 = not supported, 01 = 4 page word, 02 = 8 page word No "P" Primary Algorithm extended Query table unique ASCII string “PRI” "R" "I" Yes 4 Table 28. Security Code Area Address Data x16 x8 61h C3h, C2h XXXX 62h C5h, C4h XXXX 63h C7h, C6h XXXX 64h C9h, C8h XXXX Description 64 bit: unique device number 35/42 M29W800DT, M29W800DB APPENDIX C. BLOCK PROTECTION Block protection can be used to prevent any operation from modifying the data stored in the Flash. Each Block can be protected individually. Once protected, Program and Erase operations on the block fail to change the data. There are three techniques that can be used to control Block Protection, these are the Programmer technique, the In-System technique and Temporary Unprotection. Temporary Unprotection is controlled by the Reset/Block Temporary Unprotection pin, RP; this is described in the Signal Descriptions section. Unlike the Command Interface of the Program/ Erase Controller, the techniques for protecting and unprotecting blocks change between different Flash memory suppliers. For example, the techniques for AMD parts will not work on STMicroelectronics parts. Care should be taken when changing drivers for one part to work on another. Programmer Technique The Programmer technique uses high (VID) voltage levels on some of the bus pins. These cannot be achieved using a standard microprocessor bus, therefore the technique is recommended only for use in Programming Equipment. To protect a block follow the flowchart in Figure 20., Programmer Equipment Block Protect Flowchart, To unprotect the whole chip it is necessary to protect all of the blocks first, then all blocks can be unprotected at the same time. To unprotect the chip follow Figure 21., Programmer Equipment Chip Unprotect Flowchart. Table 29., Programmer Technique Bus Operations, BYTE = VIH or VIL, gives a summary of each operation. The timing on these flowcharts is critical. Care should be taken to ensure that, where a pause is specified, it is followed as closely as possible. Do not abort the procedure before reaching the end. Chip Unprotect can take several seconds and a user message should be provided to show that the operation is progressing. In-System Technique The In-System technique requires a high voltage level on the Reset/Blocks Temporary Unprotect pin, RP. This can be achieved without violating the maximum ratings of the components on the microprocessor bus, therefore this technique is suitable for use after the Flash has been fitted to the system. To protect a block follow the flowchart in Figure 22., In-System Equipment Block Protect Flowchart. To unprotect the whole chip it is necessary to protect all of the blocks first, then all the blocks can be unprotected at the same time. To unprotect the chip follow Figure 23., In-System Equipment Chip Unprotect Flowchart. The timing on these flowcharts is critical. Care should be taken to ensure that, where a pause is specified, it is followed as closely as possible. Do not allow the microprocessor to service interrupts that will upset the timing and do not abort the procedure before reaching the end. Chip Unprotect can take several seconds and a user message should be provided to show that the operation is progressing. Table 29. Programmer Technique Bus Operations, BYTE = VIH or VIL E G W Address Inputs A0-A18 Data Inputs/Outputs DQ15A–1, DQ14-DQ0 Block Protect VIL VID VIL Pulse A9 = VID, A12-A18 Block Address Others = X X Chip Unprotect VID VID VIL Pulse A9 = VID, A12 = VIH, A15 = VIH Others = X X Block Protection Verify VIL VIL VIH A0 = VIL, A1 = VIH, A6 = VIL, A9 = VID, A12-A18 Block Address Others = X Pass = XX01h Retry = XX00h Block Unprotection Verify VIL VIL VIH A0 = VIL, A1 = VIH, A6 = VIH, A9 = VID, A12-A18 Block Address Others = X Retry = XX01h Pass = XX00h Operation 36/42 M29W800DT, M29W800DB Figure 20. Programmer Equipment Block Protect Flowchart START Set-up ADDRESS = BLOCK ADDRESS W = VIH n=0 G, A9 = VID, E = VIL Protect Wait 4µs W = VIL Wait 100µs W = VIH E, G = VIH, A0, A6 = VIL, A1 = VIH E = VIL Verify Wait 4µs G = VIL Wait 60ns Read DATA DATA NO = 01h YES A9 = VIH E, G = VIH ++n = 25 NO End YES PASS A9 = VIH E, G = VIH FAIL AI03469 37/42 M29W800DT, M29W800DB Figure 21. Programmer Equipment Chip Unprotect Flowchart START Set-up PROTECT ALL BLOCKS n=0 CURRENT BLOCK = 0 A6, A12, A15 = VIH(1) E, G, A9 = VID Unprotect Wait 4µs W = VIL Wait 10ms W = VIH E, G = VIH ADDRESS = CURRENT BLOCK ADDRESS A0 = VIL, A1, A6 = VIH E = VIL Wait 4µs G = VIL INCREMENT CURRENT BLOCK Verify Wait 60ns Read DATA NO End NO 38/42 ++n = 1000 DATA = 00h YES LAST BLOCK YES YES A9 = VIH E, G = VIH A9 = VIH E, G = VIH FAIL PASS NO AI03470 M29W800DT, M29W800DB Figure 22. In-System Equipment Block Protect Flowchart Set-up START n=0 RP = VID Protect WRITE 60h ADDRESS = BLOCK ADDRESS A0 = VIL, A1 = VIH, A6 = VIL WRITE 60h ADDRESS = BLOCK ADDRESS A0 = VIL, A1 = VIH, A6 = VIL Wait 100µs Verify WRITE 40h ADDRESS = BLOCK ADDRESS A0 = VIL, A1 = VIH, A6 = VIL Wait 4µs READ DATA ADDRESS = BLOCK ADDRESS A0 = VIL, A1 = VIH, A6 = VIL DATA NO = 01h YES End RP = VIH ISSUE READ/RESET COMMAND PASS ++n = 25 NO YES RP = VIH ISSUE READ/RESET COMMAND FAIL AI03471 39/42 M29W800DT, M29W800DB Figure 23. In-System Equipment Chip Unprotect Flowchart START Set-up PROTECT ALL BLOCKS n=0 CURRENT BLOCK = 0 RP = VID WRITE 60h ANY ADDRESS WITH A0 = VIL, A1 = VIH, A6 = VIH Unprotect WRITE 60h ANY ADDRESS WITH A0 = VIL, A1 = VIH, A6 = VIH Wait 10ms Verify WRITE 40h ADDRESS = CURRENT BLOCK ADDRESS A0 = VIL, A1 = VIH, A6 = VIH Wait 4µs READ DATA ADDRESS = CURRENT BLOCK ADDRESS A0 = VIL, A1 = VIH, A6 = VIH NO End NO ++n = 1000 YES DATA = 00h INCREMENT CURRENT BLOCK YES LAST BLOCK NO YES RP = VIH RP = VIH ISSUE READ/RESET COMMAND ISSUE READ/RESET COMMAND FAIL PASS AI03472 40/42 M29W800DT, M29W800DB REVISION HISTORY Table 30. Document Revision History Date Version Revision Details August 2001 1.0 First Issue 03-Dec-2001 2.0 Block Protection Appendix added, SO44 drawing and package mechanical data updated, CFI Table 26, address 39h/72h data clarified, Read/Reset operation during Erase Suspend clarified 01-Mar-2002 3.0 Description of Ready/Busy signal clarified (and Figure 15. modified) Clarified allowable commands during block erase Clarified the mode the device returns to in the CFI Read Query command section 11-Apr-2002 4.0 Temperature range 1 added Document promoted from Preliminary Data to full Data Sheet 31-Mar-2003 4.1 Erase Suspend Latency Time (typical and maximum) and Data Retention parameters added to Table Table 6., Program, Erase Times and Program, Erase Endurance Cycles, and Typical after 100k W/E Cycles column removed. Minimum voltage corrected for 70ns Speed Class in Table 9., Operating and AC Measurement Conditions. Logic Diagram and Data Toggle Flowchart corrected. Lead-free package options E and F added to Table 20., Ordering Information Scheme. 13-Feb-2004 5.0 TSOP48 package Outline and Mechanical Data updated. TFBGA48 6x8mm – 6x8 active ball array – 0.80mm pitch added. Table 9.Operating and AC Measurement Conditions updated for 70ns speed option. 23-Apr-2004 6.0 Figure 3., SO Connections updated. 16-Sep-2004 7.0 45ns speed class added. 41/42 M29W800DT, M29W800DB Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 42/42