MC10H350 PECL* to TTL Translator (+5 Vdc Power Supply Only) Description The MC10H350 is a member of the 10H family of high performance ECL logic. It consists of 4 translators with differential inputs and TTL outputs. The 3−state outputs can be disabled by applying a HIGH TTL logic level on the common OE input. The MC10H350 is designed to be used primarily in systems incorporating both ECL and TTL logic operating off a common power supply. The separate VCC power pins are not connected internally and thus isolate the noisy TTL VCC runs from the relatively quiet ECL VCC runs on the printed circuit board. The differential inputs allow the MC10H350 to be used as an inverting or noninverting translator, or a differential line receiver. The MC10H350 can also drive CMOS with the addition of a pullup resistor. http://onsemi.com MARKING DIAGRAMS* 16 MC10H350L AWLYYWW 1 CDIP−16 L SUFFIX CASE 620A Features • Propagation Delay, 3.5 ns Typical • MECL 10K™ Compatible • Pb−Free Packages are Available* 16 MC10H350P AWLYYWWG 16 1 PDIP−16 P SUFFIX CASE 648 1 10H350 ALYWG SOEIAJ−16 CASE 966 1 20 10H350G AWLYYWW 20 1 PLLC−20 FN SUFFIX CASE 775 A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 8 1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Publication Order Number: MC10H350/D MC10H350 9 3 4 2 5 6 7 11 12 10 13 14 15 VCC (+5.0 VDC) = PINS 1 AND 16 GND = PIN 8 ECL VCC 1 16 TTL VCC AOUT 2 15 COUT AIN 3 14 CIN AIN 4 13 CIN BIN 5 12 DIN BIN 6 11 DIN BOUT 7 10 DOUT GND 8 9 OE Pin assignment is for Dual−in−Line Package. Figure 2. Dip Pin Assignment Figure 1. Logic Diagram Table 1. MAXIMUM RATINGS Symbol VCC Characteristic Power Supply (VEE = GND) TA Operating Temperature Range Tstg Storage Temperature Range − Plastic − Ceramic Rating Unit 7.0 Vdc 0 to +75 °C −55 to +150 −55 to +165 °C °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. http://onsemi.com 2 MC10H350 Table 2. ELECTRICAL CHARACTERISTICS (VCC = 5.0 V ±5%) (Note 1) TA = 0°C to 75°C Symbol Characteristic Min Max Unit TTL ECL − − 20 12 mA ICC Power Supply Current IIH IINH Input Current High Pin 9 Others − − 20 50 mA IIL IINL Input Current Low Pin 9 Others − − −0.6 50 mA mA VIH Input Voltage High Pin 9 2.0 − Vdc VIL Input Voltage Low Pin 9 − 0.8 Vdc VDIFF Differential Input Voltage (Note 1) Pins 3−6, 11−14 (1) 350 − mV VCM Voltage Common Mode Pins 3−6, 11−14 2.8 VCC Vdc VOH Output Voltage High IOH = 3.0 mA 2.7 − Vdc VOL Output Voltage Low IOL = 20 mA − 0.5 Vdc IOS Short Circuit Current VOUT = 0 V −60 −150 mA IOZH Output Disable Current High VOUT = 2.7 V − 50 mA IOZL Output Disable Current Low VOUT = 0.5 V − −50 mA *Positive Emitter Coupled Logic 1. Common mode input voltage to pins 3−4, 5−6, 11−12, 13−14 must be between the values of 2.8 V and 5.0 V. This common mode input voltage range includes the differential input swing. 2. For single−ended use, apply 3.75 V (VBB) to either input depending on output polarity required. Signal level range to other input is 3.3 V to 4.2 V. 3. Any unused gates should have the inverting inputs tied to VCC and the noninverting inputs tied to ground to prevent output glitching. Table 3. AC PARAMETERS (CL = 50 pF) (VCC = 5.0 ± 5%) (TA = 0°C to 75°C) TA = 0°C to 75°C Symbol Min Max Unit Propagation Delay Data (50% to 1.5 V) 1.5 5.0 ns tr Rise Time (Note 4) 0.3 1.6 ns tf Fall Time (Note 4) 0.3 1.6 ns tpdLZ tpdHZ Output Disable Time 2.0 2.0 6.0 6.0 ns tpdZL tpdZH Output Enable Time 2.0 2.0 8.0 8.0 ns tpd Characteristic NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. 1.0 V to 2.0 V w/50 pF into 500 W. http://onsemi.com 3 MC10H350 3−STATE OUTPUT LOW ENABLE AND DISABLE TIMES OE 1.5 V 3−STATE OUTPUT HIGH ENABLE AND DISABLE TIMES OE 1.5 V TPZL VOUT 1.5 V TPLZ 1.5 V TPZH 1.5 V QVOH ≈ 3.5 V 1.5 V VOUT VOL TPHZ 0.3 V 0.3 V Figure 3. 3−State Switching Waveforms +7.0 V OPEN TPZL, TPLZ, O, C, ALL OTHER 500 W D.U.T . 500 W 50 PF *INCLUDES JIG AND PROBE CAPACITANCE Application Note: Pin 9 is an OE and the MC10H350 is disabled when OE is at VIH or higher. Figure 4. Test Load ORDERING INFORMATION Package Shipping † MC10H350FN PLLC−20 46 Units / Rail MC10H350FNG PLLC−20 (Pb−Free) 46 Units / Rail MC10H350FNR2 PLLC−20 500 / Tape & Reel MC10H350FNR2G PLLC−20 (Pb−Free) 500 / Tape & Reel MC10H350L CDIP−16 25 Unit / Rail MC10H350M SOEIAJ−16 50 Unit / Rail MC10H350MG SOEIAJ−16 (Pb−Free) 50 Unit / Rail MC10H350MEL SOEIAJ−16 2000 / Tape & Reel MC10H350MELG SOEIAJ−16 (Pb−Free) 2000 / Tape & Reel MC10H350P PDIP−16 25 Unit / Rail MC10H350PG PDIP−16 (Pb−Free) 25 Unit / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MC10H350 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE E 0.007 (0.180) M T L−M B Y BRK −N− U N S 0.007 (0.180) M T L−M S S N S D −L− −M− Z W 20 D 1 V 0.007 (0.180) M T L−M S N S R 0.007 (0.180) M T L−M S N S Z T L−M S N H J 0.007 (0.180) M T L−M S −T− VIEW S SEATING PLANE F 0.007 (0.180) M T L−M S VIEW S N S N S K 0.004 (0.100) G S S K1 E G1 0.010 (0.250) S T L−M S VIEW D−D A C 0.010 (0.250) G1 X NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 5 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− N S MC10H350 PACKAGE DIMENSIONS SOEIAJ−16 CASE 966−01 ISSUE A 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c 0.10 (0.004) M CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A−01 ISSUE O B A A 16 9 1 8 B M L 16X 0.25 (0.010) E F C K T N SEATING PLANE G 16X 0.25 (0.010) M D T A http://onsemi.com 6 M J T B MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 −−− 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 −−− 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 MC10H350 PACKAGE DIMENSIONS PDIP−16 P SUFFIX PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 B F C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. L S −T− H SEATING PLANE K G D M J 16 PL 0.25 (0.010) M T A M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MECL 10K is a trademark of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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