ON NLV27WZ14DFT2G Dual schmitt-trigger inverter Datasheet

NL27WZ14
Dual Schmitt-Trigger
Inverter
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MARKING
DIAGRAMS
6
6
1
MA M G
G
M
The NL27WZ14 is a high performance dual inverter with
Schmitt−Trigger inputs operating from a 1.65 to 5.5 V supply.
Pin configuration and function are the same as the NL27WZ04, but
the inputs have hysteresis and, with its Schmitt trigger function, the
NL27WZ14 can be used as a line receiver which will receive slow
input signals. The NL27WZ14 is capable of transforming slowly
changing input signals into sharply defined, jitter−free output signals.
In addition, it has a greater noise margin than conventional inverters.
The NL27WZ14 has hysteresis between the positive−going and the
negative−going input thresholds (typically 1 V) which is determined
internally by transistor ratios and is essentially insensitive to
temperature and supply voltage variations.
SC−88/SOT−363/SC70−6
DF SUFFIX
CASE 419B
1
Features
• Designed for 1.65 V to 5.5 V VCC Operation
• Over Voltage Tolerant Inputs and Outputs
• LVTTL Compatible − Interface Capability with 5 V TTL Logic
with VCC = 3 V
• LVCMOS Compatible
• 24 mA Balanced Output Sink and Source Capability
• Near Zero Static Supply Current Substantially Reduces System
•
•
•
•
Power Requirements
Current Drive Capability is 24 mA at the Outputs
Chip Complexity: FET = 72
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
IN A1
1
GND
6
2
IN A2
OUT Y1
5
3
VCC
6
6
1
TSOP−6
DT SUFFIX
CASE 318G
MA
M
G
MA M G
G
1
= Device Marking
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
PIN ASSIGNMENT
Pin
Function
1
IN A1
2
GND
3
IN A2
4
OUT Y2
5
VCC
6
OUT Y1
OUT Y2
4
FUNCTION TABLE
Figure 1. Pinout (Top View)
IN A1
1
OUT Y1
IN A2
1
OUT Y2
A Input
Y Output
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2013
August, 2016 − Rev. 14
1
Publication Order Number:
NL27WZ14/D
NL27WZ14
MAXIMUM RATINGS
Symbol
VCC
Characteristics
DC Supply Voltage
Value
Units
−0.5 to +7.0
V
VI
DC Input Voltage
−0.5 ≤ VI ≤ +7.0
V
VO
DC Output Voltage, Output in HIGH or LOW State (Note 1)
−0.5 ≤ VO ≤ +7.0
V
IIK
DC Input Diode Current, VI < GND
−50
mA
IOK
DC Output Diode Current, VO < GND
−50
mA
IO
DC Output Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
PD
Power Dissipation in Still Air; SC−88, TSOP−6
200
mW
qJA
Thermal Resistance; SC−88, TSOP−6
333
°C/W
TL
Lead Temperature, 1 mm from case for 10 s
260
°C
TJ
Junction Temperature under Bias
+150
°C
VESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
ILATCHUP
V
±100
Latchup Performance Above VCC and Below GND at 125°C (Note 5)
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A
3. Tested to EIA/JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
Min
Max
1.65
1.5
5.5
5.5
Units
V
VI
Input Voltage
0
5.5
V
VO
Output Voltage (High or LOW State)
0
5.5
V
TA
Operating Free−Air Temperature
−55
+125
°C
Dt/DV
Input Transition Rise or Fall Rate
VCC = 2.5 V ±0.2 V
VCC =3.0 V ±0.3 V
VCC =5.0 V ±0.5 V
0
0
0
No Limit
No Limit
No Limit
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
ORDERING INFORMATION
Package
Shipping†
SC−88/SOT−363/SC70−6
(Pb−Free)
3000 / Tape & Reel
TSOP−6
(Pb−Free)
3000 / Tape & Reel
Device
NL27WZ14DFT2G
NLV27WZ14DFT2G*
NL27WZ14DTT1G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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NL27WZ14
DC ELECTRICAL CHARACTERISTICS
VCC
Condition
−40°C 3 TA 3 85°C
TA = 25°C
−55°C 3 TA 3 125°C
Symbol
Parameter
(V)
Min
Typ
Max
Min
Max
Min
Max
Units
VT)
Positive Input
Threshold Voltage
2.3
2.7
3.0
4.5
5.5
1.0
1.2
1.3
1.9
2.2
1.5
1.7
1.9
2.7
3.3
1.8
2.0
2.2
3.1
3.6
1.0
1.2
1.3
1.9
2.2
1.8
2.0
2.2
3.1
3.6
1.0
1.2
1.3
1.9
2.2
1.8
2.0
2.2
3.1
3.6
V
VT*
Negative Input
Threshold Voltage
2.3
2.7
3.0
4.5
5.5
0.4
0.5
0.6
1.0
1.2
0.75
0.87
1.0
1.5
1.9
1.15
1.4
1.5
2.0
2.3
0.4
0.5
0.6
1.0
1.2
1.15
1.4
1.5
2.0
2.3
0.4
0.5
0.6
1.0
1.2
1.15
1.4
1.5
2.0
2.3
V
VH
Input Hysteresis
Voltage
2.3
2.7
3.0
4.5
5.5
0.25
0.3
0.4
0.6
0.7
0.75
0.83
0.93
1.2
1.4
1.1
1.15
1.2
1.5
1.7
0.25
0.3
0.4
0.6
0.7
1.1
1.15
1.2
1.5
1.7
0.25
0.3
0.4
0.6
0.7
1.1
1.15
1.2
1.5
1.7
V
VOH
High−Level
Output Voltage
IOH = −100 mA
IOH = *3 mA
IOH = *8 mA
IOH = *12 mA
IOH = *16 mA
IOH = *24 mA
IOH = *32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
VCC
1.52
2.1
2.4
2.7
2.5
4.0
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
VIN = VIH or VIL
VOL
Low−Level
Output Voltage
VIN = VIH or VIL
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
0.08
0.2
0.22
0.28
0.38
0.42
VCC − 0.1
1.29
1.8
2.1
2.3
2.2
3.7
V
0.1
0.24
0.3
0.4
0.4
0.55
0.55
0.1
0.24
0.3
0.4
0.4
0.55
0.55
0.1
0.24
0.4
0.5
0.5
0.55
0.65
V
Input Leakage
Current
VIN = 5.5 V or
GND
0 to 5.5
±0.1
±1.0
±1.0
mA
IOFF
Power Off
Leakage Current
VIN = 5.5 V or
VOUT = 5.5 V
0
1
10
10
mA
ICC
Quiescent Supply
Current
VIN = 5.5 V or
GND
5.5
1
10
10
mA
IIN
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
−40°C 3 TA 3 85°C
TA = 25°C
Symbol
tPLH
tPHL
Condition
VCC (V)
RL = 1 MW, CL = 15 pF
2.5 ± 0.2
1.8
4.3
7.4
1.8
8.1
1.8
9.1
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
3.3 ± 0.3
1.5
1.8
3.3
4.0
5.0
6.0
1.5
1.8
5.5
6.6
1.5
1.8
6.5
7.6
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
5.0 ± 0.5
1.0
1.2
2.7
3.2
4.1
4.9
1.0
1.2
4.5
5.4
1.0
1.2
5.5
6.4
Parameter
Propagation
Delay
Input A to Y
(Figure 3 & 4)
−55°C 3 TA 3 125°C
Min
Typ
Max
Min
Max
Min
Max
Units
ns
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Units
CIN
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
CPD
Power Dissipation Capacitance (Note 6)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.0 V, VI = 0 V or VCC
11
12.5
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin ) ICC VCC.
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3
NL27WZ14
VCC
VCC
A or B
50%
GND
tPLH
Y
PULSE
GENERATOR
DUT
tPHL
RT
CL
RL
50% VCC
RT = CL or equivalent (includes jog and probe capacitance)
RT = ZOUT of pulse generator (typically 50 W)
VT , TYPICAL INPUT THRESHOLD VOLTAGE (VOLTS)
Figure 3. Switching Waveforms
Figure 4. Test Circuit
4
3
(VT))
2
VHtyp
(VT*)
1
2
2.5
3.5
3
VCC, POWER SUPPLY VOLTAGE (VOLTS)
VHtyp = (VT) typ) − (VT* typ)
3.6
Figure 5. Typical Input Threshold, VT), VT* versus Power Supply Voltage
VH
Vin
VCC
VCC
VH
VT)
VT*
VT)
VT*
Vin
GND
GND
VOH
VOH
Vout
Vout
VOL
VOL
(a) A Schmitt−Trigger Squares Up Inputs With
Slow Rise and Fall Times
(b) A Schmitt−Trigger Offers Maximum Noise Immunity
Figure 6. Typical Schmitt−Trigger Applications
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NL27WZ14
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
2X
aaa H D
D
A
D
6
5
GAGE
PLANE
4
L
L2
E1
E
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
H
DETAIL A
3
aaa C
2X
bbb H D
2X 3 TIPS
e
B
6X
ddd
TOP VIEW
DIM
A
A1
A2
b
C
D
E
E1
e
L
L2
aaa
bbb
ccc
ddd
b
A2
M
C A-B D
DETAIL A
A
6X
ccc C
A1
SIDE VIEW
C
SEATING
PLANE
c
MILLIMETERS
MIN
NOM MAX
−−−
−−−
1.10
0.00
−−−
0.10
0.70
0.90
1.00
0.15
0.20
0.25
0.08
0.15
0.22
1.80
2.00
2.20
2.00
2.10
2.20
1.15
1.25
1.35
0.65 BSC
0.26
0.36
0.46
0.15 BSC
0.15
0.30
0.10
0.10
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
6X
6X
0.30
0.66
2.50
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
INCHES
NOM MAX
−−− 0.043
−−− 0.004
0.035 0.039
0.008 0.010
0.006 0.009
0.078 0.086
0.082 0.086
0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.006 BSC
0.006
0.012
0.004
0.004
MIN
−−−
0.000
0.027
0.006
0.003
0.070
0.078
0.045
NL27WZ14
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE V
D
ÉÉÉ
ÉÉÉ
6
E1
1
NOTE 5
5
2
H
4
L2
GAUGE
PLANE
E
3
L
M
b
SEATING
PLANE
DETAIL Z
e
0.05
C
A
c
A1
DETAIL Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
DIM
A
A1
b
c
D
E
E1
e
L
L2
M
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
2.75
3.00
1.50
1.70
0.95
1.05
0.40
0.60
0.25 BSC
−
0°
10°
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
6X
3.20
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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