NCP3064, NCP3064B, NCV3064 1.5 A, Step-Up/Down/ Inverting Switching Regulator with ON/OFF Function http://onsemi.com MARKING DIAGRAMS The NCP3064 Series is a higher frequency upgrade to the popular MC33063A and MC34063A monolithic DC−DC converters. These devices consist of an internal temperature compensated reference, comparator, controlled duty cycle oscillator with an active current limit circuit, driver and high current output switch. This series was specifically designed to be incorporated in Step−Down and Step−Up and Voltage−Inverting applications with a minimum number of external components. The ON/OFF pin provides a low power shutdown mode. SOIC−8 D SUFFIX CASE 751 8 1 3064x ALYWG G 1 V3064 ALYWG G Features • • • • • • • • • • • Input Voltage Range from 3.0 V to 40 V Logic Level Shutdown Capability Low Power Standby Mode, Typical 100 mA Output Switch Current to 1.5 A Adjustable Output Voltage Range 150 kHz Frequency Operation Precision 2% Reference Internal Thermal Shutdown Protection Cycle−by−Cycle Current Limiting NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes These are Pb−Free Devices 1 NCP3064x AWL YYWWG PDIP−8 P, P1 SUFFIX CASE 626 8 1 NCV3064 AWL YYWWG Applications • Step−Down, Step−Up and Inverting supply applications • High Power LED Lighting • Battery Chargers ON/OFF 8 L1 Rsense VCC Ç Ç Ç Ç Ç SWC Ipk SWE R2 FB GND NCP3064 1 NCP3064 x A L, WL Y, YY W, WW G or G R1 D1 CT VCC CIN ÇÇ ÇÇ ÇÇ ÇÇ ÇÇ ON/OFF VOUT DFN8 MN SUFFIX CASE 488AF CT GND GND = = = = = = = NCP 3064x ALYWG G NCV 3064 ALYWG G Specific Device Code B Assembly Location Wafer Lot Year Work Week Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Figure 1. Typical Buck Application Circuit See detailed ordering and shipping information in the package dimensions section on page 17 of this data sheet. © Semiconductor Components Industries, LLC, 2008 November, 2008 − Rev. 4 1 Publication Order Number: NCP3064/D NCP3064, NCP3064B, NCV3064 SOIC−8/PDIP−8 1 Switch Collector Switch Emitter 2 DFN8 8 ON/OFF 7 Ipk Sense Timing Capacitor 3 6 GND 4 5 ÇÇ ÇÇ ÇÇ ÇÇ Switch Collector Switch Emitter Timing Capacitor VCC GND Comparator Inverting Input (Top View) NOTE: Figure 2. Pin Connections (Top View) ON/OFF Ipk Sense VCC Comparator Inverting Input EP Flag must be tied to GND Pin 4 on PCB Figure 3. Pin Connections 8 TSD ON/OFF ON/OFF EP Flag Ç Ç Ç Ç 1 Switch Collector Bias R S 7 Ipk Sense Q Comparator − + S R 2 Q Switch Emitter 0.2 V Oscillator 6 CT 3 Timing Capacitor VCC Comparator 1.25 V Reference Regulator + − 5 4 GND Comparator Inverting Input Figure 4. Block Diagram PIN DESCRIPTION Pin No. Pin Name Description 1 Switch Collector 2 Switch Emitter 3 Timing Capacitor 4 GND 5 Comparator Inverting Input 6 VCC 7 Ipk Sense Peak Current Sense Input to monitor the voltage drop across an external resistor to limit the peak current through the circuit 8 ON/OFF ON/OFF Pin. Pulling this pin to High level turns the device in Operating. To switch into mode with low current consumption this pin has to be in Low level or floating. Internal Darlington switch collector Internal Darlington switch emitter Timing Capacitor Oscillator Input, Timing Capacitor Ground pin for all internal circuits Inverting input pin of internal comparator Voltage supply http://onsemi.com 2 NCP3064, NCP3064B, NCV3064 MAXIMUM RATINGS (measured vs. Pin 4, unless otherwise noted) RATING SYMBOL VALUE UNIT VCC (Pin 6) VCC −0.3 to 42 V Comparator Inverting Input (Pin 5) VCII −0.3 to VCC V Darlington Switch Emitter (Pin 2) (Transistor OFF) VSWE −0.6 to VCC V Darlington Switch Collector (Pin 1) VSWC −0.3 to 42 V Darlington Switch Collector to Emitter (Pins 1 and 2) VSWCE −0.3 to 42 V Darlington Switch Peak Current ISW 1.5 A Ipk Sense Voltage (Pin 7) VIPK −0.3 to (VCC + 0.3 V) V Timing Capacitor Pin Voltage (Pin 3) VTC −0.2 to +1.4 V Moisture Sensitivity Level MSL 1 Lead Temperature Soldering Reflow (SMD Styles Only), Pb−Free Versions TSLD ON/OFF Pin Voltage VON/OFF 260 (−0.3 to 25) < VCC °C V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTIC Rating Symbol Value Unit PDIP−8 (Note 5) Thermal Resistance Junction−to−Air RqJA 100 °C/W SOIC−8 (Note 5) Thermal Resistance Junction−to−Air RqJA 180 °C/W DFN−8 (Note 5) RqJA RqJA 78 14 °C/W TSTG −65 to +150 °C TJ MAX +150 °C TJ 0 to +70 −40 to +125 °C Thermal Resistance Junction−to−Air Thermal Resistance Junction−to−Case Storage temperature range Maximum junction temperature Operation Junction Temperature Range (Note 3) NCP3064 NCP3064B, NCV3064 1. This device series contains ESD protection and exceeds the following tests: Pins 1 through 8: Human Body Model 2000 V per AEC Q100−002; 003 or JESD22/A114; A115 Machine Model Method 200 V 2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78. 3. The relation between junction temperature, ambient temperature and Total Power dissipated in IC is TJ = TA + RQ @ PD. 4. The pins which are not defined may not be loaded by external signals. 5. 1 oz copper, 1 in2 copper area. http://onsemi.com 3 NCP3064, NCP3064B, NCV3064 ELECTRICAL CHARACTERISTICS (VCC = 5.0 V, −40°C < TJ < +125°C for NCP3064B and NCV3064, 0°C < TJ < +70°C for NCP3064 unless otherwise specified) Characteristic Conditions Min Typ Max Unit Frequency (VPin 5 = 0 V, CT = 2.2 nF, TJ = 25°C) 110 150 190 kHz Discharge to Charge Current Ratio (Pin 7 to VCC, TJ = 25°C) 5.5 6.0 6.5 − Capacitor Charging Current (Pin 7 to VCC, TJ = 25°C) 275 mA Capacitor Discharging Current (Pin 7 to VCC, TJ = 25°C) 1.65 mA Symbol OSCILLATOR fOSC IDISCHG / ICHG IC IDISCH VIPK Current Limit Sense Voltage (TJ = 25°C) 165 200 235 mV (ISW = 1.0 A, TJ = 25°C) (Note 6) 1.0 1.3 V (VCE = 40 V) 1.0 10 mA TJ = 25°C 1.25 OUTPUT SWITCH (Note 6) VSWCE Darlington Switch Collector to Emitter Voltage Drop IC(OFF) Collector Off−State Current COMPARATOR VTH REGLiNE ICII in Threshold Voltage Threshold Voltage Line Regulation Input Bias Current V NCP3064 −1.5 +1.5 % NCP3064B, NCV3064 −1.5 +1.5 % (VCC = 3.0 V to 40 V) −6.0 2.0 6.0 mV (Vin = Vth) −1000 −100 1000 nA ON/OFF FEATURE VIH ON/OFF Pin Logic Input Level High VOUT = Nominal Output Voltage TJ = 25°C TJ = −40°C to +125°C 2.2 2.4 − − − − V VIL ON/OFF Pin Logic Input Level Low VOUT = 0 V TJ = 25°C TJ = −40°C to +125°C − − − − 1.0 0.8 V IIH ON/OFF Pin Input Current ON/OFF Pin = 5 V (ON) TJ = 25°C 15 mA IIL ON/OFF Pin Input Current ON/OFF Pin = 0 V (OFF) TJ = 25°C 1.0 mA TOTAL DEVICE Supply Current (VCC = 5.0 V to 40 V, CT = 2.2 nF, Pin 7 = VCC, VPin 5 > Vth, Pin 2 = GND, remaining pins open) ISTBY Standby Quiescent Current ON/OFF Pin = 0 V (OFF) TJ = 25°C TJ = −40°C to +125°C TSHD Thermal Shutdown Threshold 160 °C Hysteresis 10 °C ICC TSHDHYS 7.0 85 100 100 mA mA 6. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient temperature as possible. 7. The VIPK (Sense) Current Limit Sense Voltage is specified at static conditions. In dynamic operation the sensed current turn−off value depends on comparator response time and di/dt current slope. See the Operating Description section for details. http://onsemi.com 4 NCP3064, NCP3064B, NCV3064 300 CT = 2.2 nF TJ = 25°C 145 FREQUENCY (kHz) 250 200 150 100 140 135 130 125 50 0 VOLTAGE DROP (V) 150 120 0 1 2 3 4 5 6 7 8 9 1011 12131415161718192021 2.3 2.2 2.1 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 −40 0 5 10 30 35 Figure 6. Oscillator Frequency vs. Supply Voltage 40 1.3 1.2 1A 0.75 A 0.5 A 1.25 A ICE = 0.25 A 0.75 A 1.1 −20 0 20 40 60 80 100 120 1.25 A 0.9 0.5 A 0.8 ICE = 0.25 A 0.6 −40 140 −20 1.21 40 60 80 100 120 140 ON/OFF COMP. THRESHOLD VOLTAGE (V) 1.23 20 20 40 60 80 100 120 140 Figure 8. Common Emmitter Configuration Outp Darlington Switch Voltage Drop vs. Temperatur 1.25 0 0 TJ, JUNCTION TEMPERATURE (°C) 1.27 −20 1A 1.0 0.7 1.29 COMP. THRESHOLD VOLTAGE (V) 25 Figure 5. Oscilator Frequency vs. Timing Capacitor CT Figure 7. Emitter Follower Configuration Output Darlington Switch Voltage Drop vs. Temperature −40 20 VCC, SUPPLY VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C) 1.19 15 CT, CAPACITANCE (nF) VOLTAGE DROP (V) OSCILATOR FREQUENCY (kHz) 350 1.6 1.5 1.4 1.3 1.2 1.1 1 −40 TJ, JUNCTION TEMPERATURE (°C) −20 0 20 40 60 80 100 120 TJ, JUNCTION TEMPERATURE (°C) Figure 9. Comparator Threshold Voltage vs. Temperature Figure 10. ON/OFF Comparator Threshold Voltage vs. Temperature http://onsemi.com 5 140 NCP3064, NCP3064B, NCV3064 450 STANDBY SUPPLY CURRENT (mA) Vipk, CURRENT LIMIT SENSE VOLTAGE (V) 0.20 0.19 0.18 0.17 0.16 0.15 −40 −20 0 20 40 60 80 100 120 140 400 350 300 250 200 150 100 50 0 0 5 10 15 20 25 30 35 40 TJ, JUNCTION TEMPERATURE (°C) VIN, INPUT VOLTAGE (V) Figure 11. Current Limit Sense Voltage vs. Temperature Figure 12. Standby Current vs. Supply Voltage http://onsemi.com 6 NCP3064, NCP3064B, NCV3064 INTRODUCTION capacitor. When the output voltage level reaches nominal, the output switch next cycle turning on is inhibited. The feedback comparator will enable the switching immediately when the load current causes the output voltage to fall below nominal. Under these conditions, output switch conduction can be enabled for a partial oscillator cycle, a partial cycle plus a complete cycle, multiple cycles, or a partial cycle plus multiple cycles. The NCP3064 is a monolithic power switching regulator optimized for dc to dc converter applications. The combination of its features enables the system designer to directly implement step−up, step−down, and voltage−inverting converters with a minimum number of external components. Potential applications include cost sensitive consumer products as well as equipment for industrial markets. A representative block diagram is shown in Figure 4. Oscillator The oscillator frequency and off−time of the output switch are programmed by the value selected for the timing capacitor CT. Capacitor CT is charged and discharged by a 1 to 6 ratio internal current source and sink, generating a positive going sawtooth waveform at Pin 3. This ratio sets the maximum tON/(tON + tOFF) of the switching converter as 6/(6 + 1) or 0.857 (typical). The oscillator peak and valley voltage difference is 500 mV typically. To calculate the CT capacitor value for the required oscillator frequency, use the equation found in Figure 15. An Excel® based design tool can be found at www.onsemi.com on the NCP3064 product page. Operating Description The NCP3064 is a hysteric, dc−dc converter that uses a gated oscillator to regulate output voltage. In general, this mode of operation is some what analogous to a capacitor charge pump and does not require dominant pole loop compensation for converter stability. The Typical Operating Waveforms are shown in Figure 13. The output voltage waveform shown is for a step−down converter with the ripple and phasing exaggerated for clarity. During initial converter startup, the feedback comparator senses that the output voltage level is below nominal. This causes the output switch to turn on and off at a frequency and duty cycle controlled by the oscillator, thus pumping up the output filter Figure 13. Typical Operating Waveform http://onsemi.com 7 NCP3064, NCP3064B, NCV3064 Peak Current Sense Comparator inductor pins and with decreasing inductor value. It is recommended to check the real max peak current in the application at worst conditions to be sure that the maximum peak current will never get over the 1.5 A Darlington Switch Current maximum rating. With a voltage ripple gated converter operating under normal conditions, output switch conduction is initiated by the Voltage Feedback comparator and terminated by the oscillator. Abnormal operating conditions occur when the converter output is overloaded or when feedback voltage sensing is lost. Under these conditions, the Ipk Current Sense comparator will protect the Darlington output Switch. The switch current is converted to a voltage by inserting a fractional W resistor, RSC, in series with VCC and the Darlington output switch. The voltage drop across RSC is monitored by the Current Sense comparator. If the voltage drop exceeds 200 mV with respect to VCC, the comparator will set the latch and terminate output switch conduction on a cycle−by−cycle basis. This Comparator/Latch configuration ensures that the Output Switch has only a single on−time during a given oscillator cycle. Thermal Shutdown Internal thermal shutdown circuitry is provided to protect the IC in the event that the maximum junction temperature is exceeded. When activated, typically at 160°C, the Output Switch is disabled. The temperature sensing circuit is designed with 10°C hysteresis. The Switch is enabled again when the chip temperature decreases to at least 150°C threshold. This feature is provided to prevent catastrophic failures from accidental device overheating. It is not intended to be used as a replacement for proper heat−sinking. Output Switch Real Vturn−off on Rs Resistor Vipk(sense) The output switch is designed in a Darlington configuration. This allows the application designer to operate at all conditions at high switching speed and low voltage drop. The Darlington Output Switch is designed to switch a maximum of 40 V collector to emitter voltage and current up to 1.5 A I1 di/dt slope Io I through the Darlington Switch t_delay ON/OFF Function The ON/OFF function disables switching and puts the part into a low power consumption mode. A PWM signal up to 1 kHz can be used to pulse the ON/OFF and control the output. Pulling this pin below the threshold voltage (~1.4 V) or leaving it open turns the regulator off and has a standby current <100 mA. Pulling this pin above 1.4 V (up to 25 V max) allows the regulator to run in normal operation. If the ON/OFF feature is not needed, the ON/OFF pin can be connected to the input voltage VCC, provided that this voltage does not exceed 25 V. Figure 14. Current Sense Waveform The VIPK(Sense) Current Limit Sense Voltage threshold is specified at static conditions. In dynamic operation the sensed current turn−off value depends on comparator response time and di/dt current slope. Real Vturn−off on Rsc resistor Vturn_off = Vipk(sense) + Rs*(tdelay*di/dt) Typical Ipk comparator response time tdelay is 350 ns. The di/dt current slope is growing with voltage difference on the http://onsemi.com 8 NCP3064, NCP3064B, NCV3064 APPLICATIONS It is possible to create applications with external transistors. This solution helps to increase output current and helps with efficiency, still keeping the cost of materials low. Another advantage of using the external transistor is higher operating frequency, which can go up to 250 kHz. Smaller size of the output components such as inductor and capacitor can be used then. Figures 16, 20 and 24 show the simplicity and flexibility of the NCP3064. Two main converter topologies are demonstrated with actual test data shown below the circuit diagrams. Figure 15 gives the relevant design equations for the key parameters. Additionally, a complete application design aid for the NCP3064 can be found at www.onsemi.com. (See Notes 8, 9, 10) ton toff Step−Down Step−Up Voltage−Inverting Vout ) VF Vin * VSWCE * Vout Vout ) VF * Vin Vin * VSWCE |Vout| ) VF Vin * VSWCE ton toff ton toff ton ton toff f ǒton ) 1Ǔ f ǒton ) 1Ǔ t f ǒton ) 1Ǔ t off t off CT off *6 CT + 381.6 @ 10 * 343 @ 10 *12 fosc ǒ Ǔ ǒ Ǔ IL(avg) Iout t Iout on ) 1 toff t Iout on ) 1 toff Ipk (Switch) DI IL(avg) ) L 2 DI IL(avg) ) L 2 DI IL(avg) ) L 2 RSC 0.20 Ipk (Switch) 0.20 Ipk (Switch) 0.20 Ipk (Switch) L * Vout ǒVin * VSWCE Ǔ ton DIL ǒVin *DIVLSWCEǓ ton ǒVin *DIVLSWCEǓ ton Vripple(pp) DIL Vout Ǹǒ 1 8 f CO VTH Ǔ ) (ESR) 2 2 [ ǒRR2 ) 1Ǔ ton Iout ) DIL @ ESR CO VTH 1 ǒRR2 ) 1Ǔ 1 [ ton Iout ) DIL @ ESR CO VTH ǒRR2 ) 1Ǔ 1 8. VSWCE − Darlington Switch Collector to Emitter Voltage Drop, refer to Figures 7, 5, 8 and 9. 9. VF − Output rectifier forward voltage drop. Typical value for 1N5819 Schottky barrier rectifier is 0.4 V. 10. The calculated ton/toff must not exceed the minimum guaranteed oscillator charge to discharge ratio. Figure 15. Design Equations The Following Converter Characteristics Must Be Chosen: Vin − Nominal operating input voltage. Vout − Desired output voltage. Iout − Desired output current. DIL − Desired peak−to−peak inductor ripple current. For maximum output current it is suggested that DIL be chosen to be less than 10% of the average inductor current IL(avg). This will help prevent Ipk (Switch) from reaching the current limit threshold set by RSC. If the design goal is to use a minimum inductance value, let DIL = 2(IL(avg)). This will proportionally reduce converter output current capability. f − Maximum output switch frequency. Vripple(pp) − Desired peak−to−peak output ripple voltage. For best performance the ripple voltage should be kept to a low value since it will directly affect line and load regulation. Capacitor CO should be a low equivalent series resistance (ESR) electrolytic designed for switching regulator applications. http://onsemi.com 9 NCP3064, NCP3064B, NCV3064 Input ON/OFF L1 ON R9 10k IC1 R1 R15 VIN + ON/OFF SWC Ipk SWE VCC C1 220mF + C2 0.1mF NCP3064 SOIC COMP VOUT 47mH R2 12k0 R3 3k9 C8 C9 0.1mF 220mF CT GND + D1 R4 2k4 C10 2n2 GND GND Figure 16. Typical Buck Application Schematic Table 1. TESTED PARAMETERS Parameter Input Voltage (V) Output Voltage (V) Input Current (A) Output Current (A) Value 10 − 16 3.3 Max. 0.6 A Max. 1.25 Table 2. BILL OF MATERIAL Designator Qty Description Value Tolerance Footprint Manufacturer Manufacturer Part Number R1 1 Resistor 0.15W 1% 1206 Susumu RL1632R-R150-F R2 1 Resistor 12k 1% 1206 ROHM MCR18EZHF1202 R3 1 Resistor 3k9 1% 1206 ROHM MCR18EZHF3901 R4 1 Resistor 2k4 1% 1206 ROHM MCR18EZHF4701 R9 1 Resisitor 10k 1% 1206 ROHM MCR18EZHF1002 C1 1 Capacitor 220mF/35V 20% F PANASONIC EEEFP1V221AP C2, C8 2 Capacitor 100nF 10% 1206 Kemet C1206C104K5RACTU C9 1 Capacitor 220mF/6V 20% F8 SANYO 6SVP220M C10 1 Capacitor 2.2nF 10% 1206 Kemet C1206C222K5RACTU L1 1 Inductor 47mH 20% DO3316 CoilCraft DO3316P-473MLB D1 1 Diode MBRS230 − SMB ON Semiconductor MBRS230LT3G IC 1 Switching Regulator NCP3064 − SOIC8 ON Semiconductor NCP3064DR2G http://onsemi.com 10 NCP3064, NCP3064B, NCV3064 Figure 17. Buck Demoboard Layout Figure 18. Buck Demoboard Photo 75 Vin = 10 V EFFICIENCY (%) 70 Vin = 16 V 65 60 55 50 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 OUTPUT CURRENT (A) Figure 19. Efficiency vs. Output Current for Buck Demoboard Table 3. TEST RESULTS Line Regulation Vin = 9 V to 12 V, Vout = 3.3 V, Iout = 800 mA 8 mV Load Regulation Vin = 12 V, Vout = 3.3 V, Iout = 800 mA 10 mV Output Ripple Vin = 12 V, Vout = 3.3 V, Iout = 100 mA to 800 mA Efficiency Vin = 12 V, Vout = 3.3 V, Iout = 500 mA http://onsemi.com 11 < 85 mV Peak - Peak 70% NCP3064, NCP3064B, NCV3064 L1 Input VOUT 100mH D2 ON/OFF ON R9 10k0 R1 0R15 VIN + ON/OFF SWC Ipk SWE VCC C1 150mF R5 18k0 IC1 C2 100n NCP3064 SOIC COMP C5 0.1mF CT C6 + 330mF R4 1k0 GND C10 2n2 GND GND Figure 20. Typical Boost Application Schematic Table 4. TESTED PARAMETERS Parameter Input Voltage (V) Output Voltage (V) Input Current (A) Output Current (A) Value 10 − 16 24 Max. 1.25 Max. 0.6 Table 5. BILL OF MATERIAL Designator Qty Description Value Tolerance Footprint Manufacturer Manufacturer Part Number R1 1 Resistor 0.15W 1% 1206 Susumu RL1632R-R150-F R5 1 Resistor 18k 1% 1206 ROHM MCR18EZHF1802 R6 1 Resistor 1k 1% 1206 ROHM MCR18EZHF1001 R9 1 Resisitor 10k 1% 1206 ROHM MCR18EZHF1002 C1 1 Capacitor 150mF/16V 20% F8 SANYO 6SVP150M C2, C5 2 Capacitor 100nF 10% 1206 Kemet C1206C104K5RACTU C6 1 Capacitor 330mF/25V 20% SMD Panasonic EEE-FK1E331GP C10 1 Capacitor 2.2nF 10% 1206 Kemet C1206C222K5RACTU L2 1 Inductor 100mH 20% DO3316 CoilCraft DO3316P-104MLB D2 1 Diode MBRS230 − SMB ON Semiconductor MBRS230LT3G IC 1 Switching Regulator NCP3064 − SOIC8 ON Semiconductor NCP3064DR2G Figure 21. Boost Demoboard Layout Figure 22. Boost Demoboard Photo http://onsemi.com 12 NCP3064, NCP3064B, NCV3064 Table 6. TEST RESULTS Line Regulation Vin = 9 V to 15 V, Vout = 24 V, Iout = 250 mA 3 mV Load Regulation Vin = 12 V, Vout = 24 V, Iout = 50 to 350 mA 5 mV Output Ripple Vin = 12 V, Vout = 24 V, Iout = 50 to 350 mA < 350 mV Peak - Peak Efficiency Vin = 12 V, Vout = 24 V, Iout = 200 mA 86% 95 90 Vin = 16 V EFFICIENCY (%) 85 Vin = 10 V 80 75 70 65 60 55 50 45 0 0.04 0.12 0.2 0.28 0.36 0.44 OUTPUT CURRENT (A) Figure 23. Efficiency vs. Output Current Current for Boost Demoboard http://onsemi.com 13 NCP3064, NCP3064B, NCV3064 Q1 Q2 D2 ON/OFF ON L1 R9 10k Input R14 ...... R16 R7 10k IC1 R1 4 x R15 VIN + ON/OFF SWC Ipk SWE NCP3064 C2 +100n COMP R5 3k9 D1 C5 CT VCC C1 m15 VOUT 22mH R5 1k 0.1mF R6 1k GND C9 + 1mF R4 2k4 GND GND C4 1n8 C10 2n2 Figure 24. Typical Buck with External Transistor Application Schematic Table 7. TESTED PARAMETERS Parameter Input Voltage (V) Output Voltage (V) Input Current (A) Output Current (A) Value 10 – 16 3.3 Max. 1.25 Max. 3 Table 8. BILL OF MATERIAL Designator Qty Description Value Tolerance Footprint Manufacturer Manufacturer Part Number R1, R14, R15, R16 4 Resistor 0.15R 1% 1206 Susumu RL1632R-R150-F R5, R6 2 Resistor 1k 1% 1206 ROHM MCR18EZHF1001 R3 1 Resistor 3k9 1% 1206 ROHM MCR18EZHF3901 R4 1 Resistor 2k4 1% 1206 ROHM MCR18EZHF2401 R7;R9 2 Resistor 10k 1% 1206 ROHM MCR18EZHF1002 C1 1 Capacitor 270mF 20% 10 x 16 PANASONIC EEUFC1V271 C4 1 Capacitor 1n8 10% 1206 Kemet C1206C182K5RACTU C2, C8 2 Capacitor 100nF 10% 1206 Kemet C1206C104K5RACTU C9 1 Capacitor 1mF 20% F8 SANYO 4SA1000M C10 1 Capacitor 2.2nF 10% 1206 Kemet C1206C222K5RACTU Q1 1 Transistor MMSF7P03 − SOIC8 ON Semiconductor MMSF7P03HDR2G Q2 1 Transistor NPN MMBT489L − SOT-23 ON Semiconductor MMBT489LT1G D2 1 Diode MBR130T − SOD-123 ON Semiconductor MBR130T1G IC1 1 Switching Regulator NCP3064 − SOIC8 ON Semiconductor NCP3064DR2G D1 1 Diode MBRS330T − SMC ON Semiconductor MBRS330T3G L1 1 Inductor 22mH 20% Coilcraft Coilcraft DO5040H-223MLB http://onsemi.com 14 NCP3064, NCP3064B, NCV3064 Figure 25. Buck Demoboard with External PMOS Transistor Layout Figure 26. Buck Demoboard with External PMOS Transistor Photo 90 EFFICIENCY (%) 85 Vin = 10 V 80 Vin = 16 V 75 70 65 60 0 0.5 1.0 1.5 2.0 2.5 3.0 OUTPUT CURRENT (A) Figure 27. Efficiency vs. Output Current Current for Buck Demoboard with External PMOS Transistor Table 9. TEST RESULTS Line Regulation Vin = 9 V to 15 V, Vout = 3.3 V, Iout = 2 A 8 mV Load Regulation Vin = 12 V, Vout = 3.3 V, Iout = 0.5 to 3.0 A 10 mV Output Ripple Vin = 12 V, Vout = 3.3 V, Iout = 0.5 to 3.0 A < 300 mV Peak - Peak Efficiency Vin = 12 V, Vout = 3.3 V, Iout = 2 A http://onsemi.com 15 82% NCP3064, NCP3064B, NCV3064 If the application allows ON/OFF pin to be biased by voltage and the power supply is not connected to Vcc pin at the same time, then it is recommended to limit ON/OFF current by resistor with value 10 kW to protect the NCP3064 device. This situation is mentioned in Figure 29, ON/OFF Serial Resistor Connection. This resistor shifts the ON/OFF threshold by about 200 mV to higher value, but the TTL logic compatibility is kept in full range of input voltage and operating temperature range. The picture in Figure 24. Typical Buck Application Schematic shows typical configuration with external PMOS transistor. Resistor R7 connected between timing capacitor TC Pin and SWE Pin provides a pulse feedback voltage. The pulse feedback approach increases the operating ffrequency by up to 50%. Figure 28, Oscillator Frequency vs. Timing Capacitor with Pulse Feedback, shows the impact to the oscillator frequency at buck converter for Vin = 12 V and Vout = 3.3 V with pulse feedback resistor R7 = 10 kW. It also creates more regular switching waveforms with constant operating frequency which results in lower ripple voltage and improved efficiency. OSCILLATOR FREQUENCY (kHz) 450 400 350 300 250 200 With Pulse Feedback 150 100 50 Without Pulse Feedback 0 0 2 4 6 8 10 12 14 16 18 20 22 TIMING CAPACITANCE (nF) Figure 28. Oscillator Frequency vs. Timing Capacitor with Pulse Feedback R ON/OFF 10k IC1 Rsense R15 ON/OFF SWC Ipk SWE NCP3064 VIN VCC + FB Figure 29. ON/OFF Serial Resistor Connection http://onsemi.com 16 CT GND NCP3064, NCP3064B, NCV3064 ORDERING INFORMATION Package Shipping† NCP3064MNTXG DFN−8 (Pb−Free) 4000 Units / Tape & Reel NCP3064BMNTXG DFN−8 (Pb−Free) 4000 Units / Tape & Reel NCP3064PG PDIP−8 (Pb−Free) 50 Units / Rail NCP3064BPG PDIP−8 (Pb−Free) 50 Units / Rail NCP3064DR2G SOIC−8 (Pb−Free) 2500 Units / Tape & Reel NCP3064BDR2G SOIC−8 (Pb−Free) 2500 Units / Tape & Reel NCV3064MNTXG DFN−8 (Pb−Free) 4000 Units / Tape & Reel NCV3064PG PDIP−8 (Pb−Free) 50 Units / Rail NCV3064DR2G SOIC−8 (Pb−Free) 2500 Units / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 17 NCP3064, NCP3064B, NCV3064 PACKAGE DIMENSIONS 8 LEAD PDIP CASE 626−05 ISSUE L 8 5 −B− 1 4 F −A− NOTE 2 L C J −T− N SEATING PLANE D H NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. M K G 0.13 (0.005) M T A M B M http://onsemi.com 18 DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC --10_ 0.76 1.01 STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. AC IN DC + IN DC - IN AC IN GROUND OUTPUT AUXILIARY VCC INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC --10_ 0.030 0.040 NCP3064, NCP3064B, NCV3064 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AJ −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 19 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 NCP3064, NCP3064B, NCV3064 PACKAGE DIMENSIONS 8 PIN DFN, 4x4 CASE 488AF−01 ISSUE B A D 8X B PIN ONE IDENTIFICATION 8X b 0.15 C 0.10 C 8X 0.08 C SEATING PLANE A1 8X NOTE 3 TOP VIEW D2 4 5 0.15 C 2X 1 8 E 2X L ÇÇ Ç ÇÇ Ç ÇÇ Ç K E2 ÇÇÇ Ç DIM A A1 A3 b D D2 E E2 e K L e 0.10 C A B 0.05 C NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. BOTTOM VIEW A (A3) MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.25 0.35 4.00 BSC 1.91 2.21 4.00 BSC 2.09 2.39 0.80 BSC 0.20 −−− 0.30 0.50 C SIDE VIEW SOLDERING FOOTPRINT* 4.30 2.21 ÇÇ ÇÇ ÇÇ ÇÇ ÇÇ ÇÇ 2.39 1 8X 0.35 DIMENSIONS: MILLIMETERS 8X ÇÇ ÇÇ ÇÇ ÇÇ ÇÇ ÇÇ 0.63 0.40 0.80 PITCH 2.75 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Excel is a registered trademark of Microsoft Corporation. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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