TI LMT89 Lmt89 2.4v, 10ua, sc70, temperature sensor Datasheet

LMT89
www.ti.com
SNIS176 – MARCH 2013
LMT89 2.4V, 10µA, SC70, Temperature Sensor
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FEATURES
DESCRIPTION
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The LMT89 is a precision analog output CMOS
integrated-circuit temperature sensor that operates
over a −55°C to 130°C temperature range. The
power supply operating range is 2.4 V to 5.5 V. The
transfer function of LMT89 is predominately linear, yet
has a slight predictable parabolic curvature. The
accuracy of the LMT89 when specified to a parabolic
transfer function is ±1.5°C at an ambient temperature
of 30°C. The temperature error increases linearly and
reaches a maximum of ±2.5°C at the temperature
range extremes. The temperature range is affected
by the power supply voltage. At a power supply
voltage of 2.7 V to 5.5 V the temperature range
extremes are 130°C and −55°C. Decreasing the
power supply voltage to 2.4 V changes the negative
extreme to −30°C, while the positive remains at
130°C.
1
2
Cost-Effective Alternative to Thermistors
Rated for full −55°C to +130°C range
Available in an SC70 Package
Predictable Curvature Error
Suitable for Remote Applications
APPLICATIONS
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Industrial
HVAC
Automotive
Disk Drives
Portable Medical Instruments
Computers
Battery Management
Printers
Power Supply Modules
FAX Machines
Mobile Phones
Automotive
The LMT89 quiescent current is less than 10 μA.
Therefore, self-heating is less than 0.02°C in still air.
Shutdown capability for the LMT89 is intrinsic
because its inherent low power consumption allows it
to be powered directly from the output of many logic
gates or does not necessitate shutdown at all.
The LMT89 is a cost-competitive alternative to
thermistors.
TYPICAL APPLICATION
Full-Range Celsius (Centigrade) Temperature Sensor (−55°C TO 130°C) Operating From a Single LI-Ion
Battery Cell
V+
VO
LMT89
GND
NC
VO = (−3.88×10−6×T2) + (−1.15×10−2×T) + 1.8639
spacer between the 2 equations
(1.8639 VO )
6
T
1481.96
2.1962 u 10
6
3.88 u 10
where: T is temperature, and VO is the measured output voltage of the LMT89.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
LMT89
SNIS176 – MARCH 2013
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Figure 1. Output Voltage vs Temperature
Table 1. Output Voltage vs Temperature
TEMPERATURE (T)
TYPICAL VO
130°C
303 mV
100°C
675 mV
80°C
919 mV
30°C
1515 mV
25°C
1574 mV
0°C
1863.9 mV
–30°C
2205 mV
−40°C
2318 mV
−55°C
2485 mV
CONNECTION DIAGRAMS
V+
4
3
VO
LMT89
5
GND
2
GND
1
NC
GND (pin 2) may be grounded or left floating. For optimum thermal conductivity to the pc board ground plane, pin 2
must be grounded.
NC (pin 1) must be left floating or grounded. Other signal traces must not be connected to this pin.
Figure 2. SC70-5 Top View
2
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ABSOLUTE MAXIMUM RATINGS (1)
VALUES
Supply Voltage
6.5V to −0.2V
Output Voltage
(V+ + 0.6 V) to −0.6 V
Output Current
10 mA
Input Current at any pin
(2)
5 mA
−65°C to 150°C
Storage Temperature
Maximum Junction Temperature (TJMAX)
ESD Susceptibility
(3)
150°C
Human Body Model
2500 V
Machine Model
250 V
Soldering process must comply with the Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. (4)
(1)
(2)
(3)
(4)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For specifications and test conditions, see the
ELECTRICAL CHARACTERISTICS. The specified specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions.
When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V+), the current at that pin should be limited to 5 mA.
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Reflow temperature profiles are different for lead-free and non-lead-free packages.
OPERATION RATINGS
TMIN ≤ TA ≤ TMAX
Specified Temperature Range:
+
LMT89 with 2.4 V ≤ V ≤ 2.7 V
−30°C ≤ TA ≤ 130°C
LMT89 with 2.7 V ≤ V+≤ 5.5 V
−55°C ≤ TA ≤ 130°C
Supply Voltage Range (V+)
2.4 V to 5.5 V
Thermal Resistance, θJA (1)
SC70
415°C/W
(1)
The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air using the printed circuit board layout shown in
PCB Layouts Used For Thermal Measurements.
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ELECTRICAL CHARACTERISTICS
Unless otherwise noted, these specifications apply for V+ = +2.7 VDC. Boldface limits apply for TA = TJ = TMIN to TMAX ; all
other limits TA = TJ = 25°C; Unless otherwise noted.
PARAMETER
Temperature to Voltage Error
VO = (−3.88×10−6×T2) + (−1.15×10−2×T) + 1.8639V (3)
CONDITIONS
TA = 25°C to 30°C
TYPICAL (1)
MAX (2)
±1.5
TA = –55°C
UNIT
(Limit)
°C
±2.5
°C
Output Voltage at 0°C
1.8639
V
Variance from Curve
±1.0
°C
(4)
–20°C ≤ TA ≤ 80°C
±0.4%
Sensor Gain (Temperature Sensitivity or Average
Slope) to equation:
VO=−11.77 mV/ °C×T+1.860V
–30°C ≤ TA ≤ 100°C
−11.77
Output Impedance
0 μA ≤ IL ≤ 16 μA
(5) (6)
160
Ω
Load Regulation (7)
0 μA ≤ IL ≤ 16 μA
(5) (6)
−2.5
mV
2.4 V ≤ V+ ≤ 5.0V
3.3
mV/V
5.0 V ≤ V+ ≤ 5.5 V
11
mV
7
μA
Non-Linearity
Line Regulation (8)
2.4V ≤ V+ ≤ 5.0V
Quiescent Current
Change of Quiescent Current
+
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
4
mV/°C (min)
mV/°C (max)
5.0V ≤ V ≤ 5.5V
4.5
9
μA
2.4V ≤ V+ ≤ 5.0V
4.5
10
μA
2.4 V ≤ V+ ≤ 5.5V
0.7
μA
−11
nA/°C
V+ ≤ 0.8 V
0.02
μA
Temperature Coefficient of Quiescent Current
Shutdown Current
4.5
−11.4
−12.2
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Limits are specified to TI's AOQL (Average Outgoing Quality Level).
Accuracy is defined as the error between the measured and calculated output voltage at the specified conditions of voltage, current, and
temperature (expressed in°C).
Non-Linearity is defined as the deviation of the calculated output-voltage-versus-temperature curve from the best-fit straight line, over
the temperature range specified.
Negative currents are flowing into the LMT89. Positive currents are flowing out of the LMT89. Using this convention the LMT89 can at
most sink −1 μA and source 16 μA.
Load regulation or output impedance specifications apply over the supply voltage range of 2.4V to 5.5V.
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
Line regulation is calculated by subtracting the output voltage at the highest supply input voltage from the output voltage at the lowest
supply input voltage.
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TYPICAL PERFORMANCE CHARACTERISTICS
Temperature Error
vs
Temperature
PCB Layouts Used For Thermal Measurements
Figure 3. Layout Used For No Heat Sink Measurements
Figure 4. Layout Used For Measurements With Small Heat Sink
LMT89 TRANSFER FUNCTION
The LMT89 transfer function can be described in different ways with varying levels of precision. A simple linear
transfer function, with good accuracy near 25°C, is
VO = −11.69 mV/°C × T + 1.8663 V
(1)
Over the full operating temperature range of −55°C to 130°C, best accuracy can be obtained by using the
parabolic transfer function.
VO = (−3.88×10−6×T2) + (−1.15×10−2×T) + 1.8639
(2)
solving for T:
T
1481.96
2.1962 u 10
6
(1.8639
VO )
3.88 u 10
6
(3)
A linear transfer function can be used over a limited temperature range by calculating a slope and offset that give
best results over that range. A linear transfer function can be calculated from the parabolic transfer function of
the LMT89. The slope of the linear transfer function can be calculated using the following equation:
m = −7.76 × 10−6× T − 0.0115,
(4)
where T is the middle of the temperature range of interest and m is in V/°C. For example for the temperature
range of TMIN = −30 to TMAX = +100°C:
T = 35°C
(5)
m = −11.77 mV/°C
(6)
and
The offset of the linear transfer function can be calculated using the following equation:
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b = (VOP(TMAX) + VOP(T) − m × (TMAX+T))/2
(7)
where:
VOP(TMAX) is the calculated output voltage at TMAX using the parabolic transfer function for VO
VOP(T) is the calculated output voltage at T using the parabolic transfer function for VO.
Using this procedure the best fit linear transfer function for many popular temperature ranges was calculated in
Table 2. As shown in Table 2 the error that is introduced by the linear transfer function increases with wider
temperature ranges.
Table 2. First Order Equations Optimized for Different Temperature Ranges
TEMPERATURE RANGE
LINEAR EQUATION
MAXIMUM DEVIATION OF LINEAR EQUATION
FROM PARABOLIC EQUATION (°C)
130
VO = −11.79 mV/°C × T + 1.8528 V
±1.41
110
VO = −11.77 mV/°C × T + 1.8577 V
±0.93
−30
100
VO = −11.77 mV/°C × T + 1.8605 V
±0.70
±0.65
Tmin (°C)
Tmax (°C)
−55
−40
-40
85
VO = −11.67 mV/°C × T + 1.8583 V
−10
65
VO = −11.71 mV/°C × T + 1.8641 V
±0.23
35
45
VO = −11.81 mV/°C × T + 1.8701 V
±0.004
20
30
VO = –11.69 mV/°C × T + 1.8663 V
±0.004
MOUNTING
The LMT89 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be
glued or cemented to a surface. The temperature that the LMT89 is sensing will be within about +0.02°C of the
surface temperature to which the LMT89's leads are attached to.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air
temperature were much higher or lower than the surface temperature, the actual temperature measured would
be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity the backside of the LMT89 die is directly attached to the pin 2 GND pin.
The tempertures of the lands and traces to the other leads of the LMT89 will also affect the temperature that is
being sensed.
Alternatively, the LMT89 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or
screwed into a threaded hole in a tank. As with any IC, the LMT89 and accompanying wiring and circuits must be
kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold
temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy
paints or dips are often used to ensure that moisture cannot corrode the LMT89 or its connections.
The thermal resistance junction to ambient (θJA) is the parameter used to calculate the rise of a device junction
temperature due to its power dissipation. For the LMT89 the equation used to calculate the rise in the die
temperature is as follows:
TJ = TA + θJA [(V+ IQ) + (V+ − VO) IL]
where IQ is the quiescent current and ILis the load current on the output. Since the LMT89's junction temperature
is the actual temperature being measured care should be taken to minimize the load current that the LMT89 is
required to drive.
The tables shown in Table 3 summarize the rise in die temperature of the LMT89 without any loading, and the
thermal resistance for different conditions.
6
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Table 3. Temperature Rise of LMT89 Due to Self-Heating and Thermal Resistance (θJA) (1)
SC70-5
SC70-5
NO HEAT SINK
SMALL HEAT SINK
θJA
(°C/W)
TJ − TA
(°C)
θJA
(°C/W)
TJ − TA
(°C)
Still air
412
0.2
350
0.19
Moving air
312
0.17
266
0.15
(1)
See PCB Layouts Used For Thermal Measurements for PCB layout samples.
CAPACITIVE LOADS
The LMT89 handles capacitive loading well. Without any precautions, the LMT89 can drive any capacitive load
less than 300 pF as shown in . Over the specified temperature range the LMT89 has a maximum output
impedance of 160 Ω. In an extremely noisy environment it may be necessary to add some filtering to minimize
noise pickup. It is recommended that 0.1 μF be added from V+ to GND to bypass the power supply voltage, as
shown in Figure 5. In a noisy environment it may even be necessary to add a capacitor from the output to ground
with a series resistor as shown in Figure 5. A 1 μF output capacitor with the 160 Ω maximum output impedance
and a 200 Ω series resistor will form a 442 Hz lowpass filter. Since the thermal time constant of the LMT89 is
much slower, the overall response time of the LMT89 will not be significantly affected.
+
Heavy Capacitive Load, Wiring, Etc.
LMT89
To A High-Impedance Load
OUT
d
Figure 5. LMT89 No Decoupling Required for Capacitive Loads Less Than 300 pF
R (Ω)
C (µF)
200
1
470
0.1
680
0.01
1k
0.001
+
LMT89
0.1 µF Bypass
Optional
Heavy Capacitive Load, Wiring, Etc.
OUT
d
R
C
+
Heavy Capacitive Load, Wiring, Etc.
R
LMT89
0.1 µF Bypass
Optional
OUT
d
C
Figure 6. LMT89 with Filter for Noisy Environment and Capacitive Loading Greater Than 300 pF
NOTE
Either placement of resistor as shown above is just as effective.
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APPLICATION CIRCUITS
V+
VTEMP
R3
VT1
R4
VT2
LM4040
V+
VT
R1
4.1V
U3
0.1 PF
LMT89
(High = overtemp alarm)
+
U1
-
R2
VOUT
VOUT
LM7211
VTemp
U2
VT1 =
(4.1)R2
R2 + R1||R3
VT2 =
(4.1)R2||R3
R1 + R2||R3
Figure 7. Centigrade Thermostat
+VS
SHUTDOWN
VO
LMT89
Any logic
device output
Figure 8. Conserving Power Dissipation with Shutdown
V+ (+5.0V)
1k
1
0.1 PF
LM4040BIM3-4.1
4
5
3
V+
VO
LMT89
2
GND
GND
NC
1
470 Ÿ
V+
6
3
VIN
5
4
0.1 PF
2
CS
DO
CLK
ADCV0831
GND
Figure 9. Suggested Connection to a Sampling Analog to Digital Converter Input Stage
Most CMOS ADCs found in ASICs have a sampled data comparator input structure that is notorious for causing
grief to analog output devices such as the LMT89 and many op amps. The cause of this grief is the requirement
of instantaneous charge of the input sampling capacitor in the ADC. This requirement is easily accommodated by
the addition of a capacitor. Since not all ADCs have identical input stages, the charge requirements will vary
necessitating a different value of compensating capacitor. This ADC is shown as an example only. If a digital
output temperature is required please refer to devices such as the LM74.
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LMT89DCKR
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 130
T3B
LMT89DCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 130
T3B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LMT89DCKR
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT89DCKT
SC70
DCK
5
250
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMT89DCKR
SC70
DCK
5
3000
210.0
185.0
35.0
LMT89DCKT
SC70
DCK
5
250
210.0
185.0
35.0
Pack Materials-Page 2
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