TI LM3480IM3X-3.3 Lm3480 100 ma, sot-23, quasi low-dropout linear voltage regulator Datasheet

LM3480
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SNVS011E – JUNE 1999 – REVISED MARCH 2013
LM3480 100 mA, SOT-23, Quasi Low-Dropout Linear Voltage Regulator
Check for Samples: LM3480
FEATURES
DESCRIPTION
•
•
The LM3480 is an integrated linear voltage regulator.
It features operation from an input as high as 30V
and a ensured maximum dropout of 1.2V at the full
100 mA load. Standard packaging for the LM3480 is
the 3-lead SOT-23 package.
1
2
3.3, 5, 12, and 15V Versions Available
Packaged in the Tiny 3-Lead SOT-23 Package
APPLICATIONS
•
•
•
•
Tiny Alternative to LM78LXX Series and
Similar Devices
Tiny 5V±5% to 3.3V, 100 mA Converter
Post Regulator for Switching DC/DC Converter
Bias Supply for Analog Circuits
KEY SPECIFICATIONS
•
•
•
•
•
30V Maximum Input for Operation
1.2V Ensured Maximum Dropout Over Full
Load and Temperature Ranges
100 mA Ensured Minimum Load Current
±5% Ensured Output Voltage Tolerance Over
Full Load and Temperature Ranges
−40 to +125°C Junction Temperature Range for
Operation
The 5, 12, and 15V members of the LM3480 series
are intended as tiny alternatives to industry standard
LM78LXX series and similar devices. The 1.2V quasi
low dropout of LM3480 series devices makes them a
nice fit in many applications where the 2 to 2.5V
dropout of LM78LXX series devices precludes their
(LM78LXX series devices) use.
The LM3480 series features a 3.3V member. The
SOT-23 packaging and quasi low dropout features of
the LM3480 series converge in this device to provide
a very nice, very tiny 3.3V, 100 mA bias supply that
regulates directly off the system 5V±5% power
supply.
Typical Application Circuit
Connection Diagram
Figure 1. Top View
SOT-23 Package
Package Number DBZ0003A
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM3480
SNVS011E – JUNE 1999 – REVISED MARCH 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
Input Voltage (IN to GND)
Power Dissipation
Junction Temp.
35V
(3)
333mW
(3)
+150°C
−65 to +150°C
Ambient Storage Temp.
Soldering Time, Temp.
Wave
Infrared
Vapor Phase
ESD
(1)
(2)
(3)
(4)
(5)
(4)
4 sec., 260°C
10 sec., 240°C
75 sec., 219°C
(5)
2kV
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using P = (TJ - TA)/θJA where TJ
is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. The 333 mW rating
results from substituting the Absolute Maximum junction temperature, 150°C, for TJ , 50°C for TA, and 300°C/W for θJA. More power can
be safely dissipated at lower ambient temperatures. Less power can be safely dissipated at higher ambient temperatures. The Absolute
Maximum power dissipation can be increased by 3.33 mW for each °C below 50°C ambient. It must be derated by 3.33 mW for each °C
above 50°C ambient. A θJA of 300°C/W represents the worst-case condition of no heat sinking of the 3-lead plastic SOT-23 package.
Heat sinking enables the safe dissipation of more power. The LM3480 actively limits its junction temperature to about 150°C.
Times shown are dwell times. Temperatures shown are dwell temperatures. For detailed information on soldering plastic small-outline
packages, refer to the Packaging Databook .
For testing purposes, ESD was applied using the human-body model, a 100 pF capacitor discharged through a 1.5 kΩ resistor.
Operating Ratings (1)
Max. Input Voltage (IN to GND)
30V
−40 to +125°C
Junction Temp. (TJ)
Max. Power Dissipation
(1)
(2)
(2)
250mW
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics.
As with the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature.
The 250 mW rating appearing under Operating Ratings results from substituting the maximum junction temperature for operation,
125°C, for TJ, 50°C for TA, and 300°C/W for θJA in P = (TJ - TA)/θJA. More power can be dissipated at lower ambient temperatures. Less
power can be dissipated at higher ambient temperatures. The maximum power dissipation for operation appearing under Operating
Ratings can be increased by 3.33 mW for each °C below 50°C ambient. It must be derated by 3.33 mW for each °C above 50°C
ambient. A θJA of 300°C/W represents the worst-case condition of no heat sinking of the 3-lead plastic SOT-23 package. Heat sinking
enables the dissipation of more power during operation.
Electrical Characteristics LM3480-3.3, LM3480-5.0
Typicals and limits appearing in normal type apply for TA = TJ = 25°C. Limits appearing in boldface type apply over the entire
junction temperature range for operation, −40 to +125°C. (1) (2) (3)
Nominal Output Voltage (VNOM)
Symbol
VOUT
ΔVOUT
(1)
(2)
(3)
2
Parameter
Output Voltage
Line Regulation
3.3V
Conditions
VIN = VNOM + 1.5V,
1 mA ≤ IOUT ≤ 100 mA
VNOM + 1.5V ≤ VIN ≤ 30V,
IOUT = 1 mA
Typical
5.0V
Limit
3.30
Typical
Limit
5.00
3.17
3.14
3.43
3.46
10
4.80
4.75
5.20
5.25
V
V(min)
V(min)
V(max)
V(max)
25
mV
mV(max)
12
25
Units
A typical is the center of characterization data taken with TA = TJ = 25°C. Typicals are not ensured.
All limits are ensured. All electrical characteristics having room-temperature limits are tested during production with TA = TJ = 25°C. All
hot and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
All voltages except dropout are with respect to the voltage at the GND pin.
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Electrical Characteristics LM3480-3.3, LM3480-5.0 (continued)
Typicals and limits appearing in normal type apply for TA = TJ = 25°C. Limits appearing in boldface type apply over the entire
junction temperature range for operation, −40 to +125°C. (1) (2) (3)
Nominal Output Voltage (VNOM)
Symbol
ΔVOUT
IGND
VIN VOUT
3.3V
Parameter
Conditions
Load Regulation
VIN = VNOM + 1.5V,
10 mA ≤ IOUT ≤ 100 mA
20
VNOM + 1.5V ≤ VIN ≤ 30V,
No Load
2
Ground Pin Current
Dropout Voltage
IOUT = 10 mA
Typical
5.0V
Limit
Typical
20
40
0.9
Output Noise Voltage
VIN = 10V,
Bandwidth: 10 Hz to 100 kHz
4
mA
mA(max)
0.9
1.0
V
V(max)
V(max)
1.1
1.2
V
V(max)
V(max)
0.9
1.1
1.2
en
mV
mV(max)
0.7
0.9
1.0
100
Units
40
2
4
0.7
IOUT = 100 mA
Limit
150
µVrms
LM3480-12, LM3480-15
Typicals and limits appearing in normal type apply for TA = TJ = 25°C. Limits appearing in boldface type apply over the entire
junction temperature range for operation, −40 to +125°C. (1) (2) (3)
Nominal Output Voltage (VNOM)
Symbol
VOUT
ΔVOUT
ΔVOUT
IGND
VIN VOUT
Parameter
Output Voltage
Line Regulation
Load Regulation
Ground Pin Current
Dropout Voltage
12V
Conditions
VIN = VNOM + 1.5V,
1 mA ≤ IOUT ≤ 100 mA
Typical
12.00
Typical
14
VIN = VNOM + 1.5V,
10 mA ≤ IOUT ≤ 100 mA
36
VNOM + 1.5V ≤ VIN ≤ 30V,
No Load
2
0.9
(1)
(2)
(3)
VIN = 10V,
Bandwidth: 10 Hz to 100 kHz
360
mV
mV(max)
75
mV
mV(max)
4
mA
mA(max)
0.9
1.0
V
V(max)
V(max)
1.1
1.2
V
V(max)
V(max)
0.7
0.9
1.0
Output Noise
Voltage
40
2
4
0.9
1.1
1.2
en
V
V(min)
V(min)
V(max)
V(max)
45
60
450
Units
14.40
14.25
15.60
15.75
16
40
0.7
IOUT = 100 mA
Limit
15.00
11.52
11.40
12.48
12.60
VNOM + 1.5V ≤ VIN ≤ 30V,
IOUT = 1 mA
IOUT = 10 mA
15V
Limit
µVrms
A typical is the center of characterization data taken with TA = TJ = 25°C. Typicals are not ensured.
All limits are ensured. All electrical characteristics having room-temperature limits are tested during production with TA = TJ = 25°C. All
hot and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
All voltages except dropout are with respect to the voltage at the GND pin.
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Typical Performance Characteristics
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.
4
Dropout Voltage vs Load Current
Dropout Voltage vs Junction Temperature
Figure 2.
Figure 3.
Ground Pin Current vs Input Voltage
Ground Pin Current vs Input Voltage
Figure 4.
Figure 5.
Ground Pin Current vs Load Current
Ground Pin Current vs Junction Temperature
Figure 6.
Figure 7.
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LM3480
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SNVS011E – JUNE 1999 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.
Input Current vs Input Voltage
Input Current vs Input Voltage
Figure 8.
Figure 9.
Line Transient Response
Line Transient Response
Figure 10.
Figure 11.
Load Transient Response
Load Transient Response
Figure 12.
Figure 13.
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LM3480
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Typical Performance Characteristics (continued)
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.
6
Load Transient Response
Load Transient Response
Figure 14.
Figure 15.
Output Voltage vs Input Voltage
Output Voltage vs Input Voltage
Figure 16.
Figure 17.
Output Voltage vs Input Voltage
Output Voltage vs Input Voltage
Figure 18.
Figure 19.
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LM3480
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SNVS011E – JUNE 1999 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.
Output Short- Circuit Current
Output Short- Circuit Current
Figure 20.
Figure 21.
Power Supply Rejection Ratio
Power Supply Rejection Ratio
Figure 22.
Figure 23.
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Typical Performance Characteristics (continued)
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.
DC Load Regulation
Figure 24.
8
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SNVS011E – JUNE 1999 – REVISED MARCH 2013
REVISION HISTORY
Changes from Revision D (March 2013) to Revision E
•
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM3480IM3-12
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 125
L0C
LM3480IM3-12/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L0C
LM3480IM3-15/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L0D
LM3480IM3-3.3
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 125
L0A
LM3480IM3-3.3/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L0A
LM3480IM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 125
L0B
LM3480IM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L0B
LM3480IM3X-12
NRND
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-40 to 125
L0C
LM3480IM3X-12/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L0C
LM3480IM3X-15/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L0D
LM3480IM3X-3.3
NRND
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-40 to 125
L0A
LM3480IM3X-3.3/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L0A
LM3480IM3X-5.0
NRND
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-40 to 125
L0B
LM3480IM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L0B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM3480IM3-12
SOT-23
DBZ
3
1000
178.0
8.4
LM3480IM3-12/NOPB
SOT-23
DBZ
3
1000
178.0
LM3480IM3-15/NOPB
SOT-23
DBZ
3
1000
178.0
LM3480IM3-3.3
SOT-23
DBZ
3
1000
LM3480IM3-3.3/NOPB
SOT-23
DBZ
3
W
Pin1
(mm) Quadrant
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM3480IM3-5.0
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM3480IM3-5.0/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM3480IM3X-12
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM3480IM3X-12/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM3480IM3X-15/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM3480IM3X-3.3
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM3480IM3X-3.3/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM3480IM3X-5.0
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM3480IM3X-5.0/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM3480IM3-12
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM3480IM3-12/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM3480IM3-15/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM3480IM3-3.3
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM3480IM3-3.3/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM3480IM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM3480IM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM3480IM3X-12
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM3480IM3X-12/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM3480IM3X-15/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM3480IM3X-3.3
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM3480IM3X-3.3/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM3480IM3X-5.0
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM3480IM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
Pack Materials-Page 2
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