NX2158 PWM BOOST CONTROLLER PRODUCTION DATA SHEET Pb Free Product FEATURES DESCRIPTION The NX2158 controller IC is a boost controller IC designed for step up DC to DC converter applications. The NX2158 operates at programmable frequency from 200kHz to 2MHz and employs cycle by cycle current limiting by sensing the Rdson of NMOSFET. Other features of the device are: thermal shutdown, adaptive deadband control, internal digital soft start, VCC UVLO and Shutdown capability via the ENBUS pin. n Single Supply Voltage fom 3V to 5.5V n Programmable Frequency up to 2MHz n Internal Digital Soft Start Function n Cycle by Cycle Current Limit by Sensing Rdson of NMOSFET n Pb-free and RoHS compliant APPLICATIONS n USB 3.0 3.3V to 5V conversion TYPICAL APPLICATION 2.2uH VIN 3.3V VOUT 5V 22uF,X5R 2*22uF 1uF 14k 10 VCC LDrv 1uF 10k PGOOD SW HDrv PGND BST 308k 68p FB PGOOD ENBUS RT AGND OCP COMP 15pF 22k 10k 59k EN 20k 1nF Figure1 - Typical application of NX2158 ORDERING INFORMATION Device NX2158CMTR Temperature 0 to 70o C Package Frequency 3X3 MLPQ-16L 200kHz to 2MHz Pb-Free Yes Package Marking : NX2158XXX XXX is date code. For example, 935 means that this NX2158 is packaged in the 35th week of 2009 Rev.1.2 12/30/09 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 1 NX2158 ABSOLUTE MAXIMUM RATINGS(NOTE1) VCC to GND .................................................. 6.5V BST to GND Voltage ...................................... 6.5V VIN to GND Voltage ........................................ 6.5V SW to GND .................................................... -2V to 6.5V All other pins .................................................. -0.3V to 6.5V Storage Temperature Range ............................. -65oC to 150oC Operating Junction Temperature Range ............. -40oC to 125oC NOTE1: Stresses above those listed in "ABSOLUTE MAXIMUM RATINGS", may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. PACKAGE INFORMATION 16-LEAD PLASTIC 3X3 MLPQ NC OCP SW NC θ JA ≈ 46o C/W 16 15 14 13 HDRV 1 12 FB BST 2 11 COMP 17 PAD PGND 3 10 AGND 9 RT 5 6 7 8 VCC NC ENBUS PGOOD LDRV 4 ELECTRICAL SPECIFICATIONS Unless otherwise specified, these specifications apply over VCC=3.3V, VENBUS=1.5V, VBST=5V, T A = 25oC. Low duty cycle pulse testing is used which keeps junction and case temperatures equal to the ambient temperature. PARAMETER Reference Voltage SYM Ref Voltage Ref Voltage line regulation VREF Supply Voltage(VCC) VCC Voltage Range Input Voltage Current(Static) Input Voltage Current (Dynamic) Under Voltage Lockout VCC-Threshold VCC-Hysteresis Rev.1.2 12/30/09 Test Condition Min TYP MAX Units 0.793 0.8 0.7 0.808 1 V % VCC=3V to 5.5V Vin V No switching,ENBUS=0V COMP=2.4V VCC _UVLO VCC Rising VCC _Hyst VCC Falling 3 mA 3.5 mA 2.6 2.8 3 V 0.1 0.2 0.355 V Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 2 NX2158 PARAMETER SYM Test Condition M in TYP MAX Un its 1 0.05 1.2 0.1 1.4 0.15 V V ENBUS ENBUS threshold ENBUS Hysteresis SS Soft Start time Oscillator (Rt) Frequency Ram p-Amplitude Voltage Tss Rt=44k FS Rt=44k 550 Rt=44k 0.4 60 V RAMP LDRV Max Duty Cycle HDRV Min Controlable On Time Error Amplifiers Transconductance Input Bias Current Com p SD Threshold High Side Driver(CL =2200pF) Output Impedance , Sourcing Output Impedance , Sinking 1.6 1500 640 0.5 70 mS 720 0.58 80 kHz V % 250 nS 2500 100 0.3 umho nA V 1800 Ib R source(Hdrv) I=200mA 1.9 ohm R sink(Hdrv) I=200mA 1.7 ohm ns ns ns Rise Time Fall T ime Deadband Time Low Side Driver (CL =2200pF) THdrv(Rise) THdrv(Fall) Tdead(L to Ldrv going Low to Hdrv 14 17 30 Output Impedance, Sourcing Output Impedance, Sinking Current Rise Time Fall T ime Deadband Time Rsource (Ldrv) R sink (Ldrv) I=200mA I=200mA 1.9 1 ohm ohm 13 12 10 ns ns ns T Ldrv(Rise) TLdrv(Fall) Tdead(H to SW going Low to Ldrv L) going High, 10% to 10% OCP OCP current Over temperature Threshold Hysteresis PGOOD Pgood high rising threshold Power good hysteresis Rev.1.2 12/30/09 30 37 50 o 150 20 78 90 5 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 uA o 95 C C % Vref % 3 NX2158 PIN DESCRIPTIONS PIN # VCC PIN DESCRIPTION Voltage supply for the low side fet driver and internal logic circuit. A high frequency 1uF ceramic capacitor must be connected from this pin to the GND pin as close as possible. 7 ENBUS Enable pin for the controller. 12 FB This pin is the error amplifier inverting input. 11 COMP This pin is the output of the error amplifier and together with FB pin is used to compensate the voltage control feedback loop. This pin is also used as a shut down pin. When this pin is pulled below 0.3V, both drivers are turned off and internal soft start is reset. 2 BST This pin supplies voltage to the high side driver. A high frequency ceramic capacitor of 0.1 to 1 uF must be connected from this pin to ground. 15 OCP An internal current source is flown to the OCP resistor sets the OCP voltage across the Rdson of the low side MOSFET. Current limit point is this voltage divided by the Rds-on. 14 SW This pin is used by driver circuit and also sensing the RDSON of NMOSFET. 1 HDRV PMOS MOSFET gate driver. 3 PGND Power ground. 10 AGND Analog ground 4 LDRV NMOSFET gate driver. 7 RT Oscillator's frequency can be set by using an external resistor from this pin to GND. 8 PGOOD Power good indicator. 17 PAD PAD should be connected to ground. 13,16 NC Not used. 5 Rev.1.2 12/30/09 PIN SYMBOL Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 4 NX2158 BLOCK DIAGRAM ENBUS FB PGOOD SS_finished 0.9*0.8V VCC 1.25V Bias Generator 1.2V 0.8V UVLO BST POR START HDRV COMP 0.3V RT OC OVP START 0.8V Latch VCC PWM OSC Digital start Up Driver Logic ramp S R Q Thermal Shutdown LDRV FB 0.6V CLAMP COMP 1.3V CLAMP LDRV START SW OCP GND START VCC Figure 2 - Simplified block diagram of the NX2158 Rev.1.2 12/30/09 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 5