IXYS IXDN604SIA Aec q100 qualified Datasheet

IXD_604SI & SIA
INTEGRATED CIRCUITS DIVISION
Automotive Grade
4-Ampere, Dual Low-Side, Ultrafast MOSFET Drivers
Features
Description
•
•
•
•
The IXD_604SI and IXD_604SIA are automotive
grade, dual high-speed gate drivers that are qualified
according to AEC Q100 standards. Each of the two
outputs can source and sink 4A of peak current, while
producing rise and fall times of less than 10ns. The
outputs and inputs are rated to 35V. The input of each
driver is virtually immune to latch-up, and proprietary
circuitry eliminates cross-conduction and
"shoot-through." The IXD_604 has a Grade 1, -40°C
to +125°C ambient operating temperature range.
•
•
•
•
•
•
AEC Q100 Qualified
4A Peak Source/Sink Drive Current
Wide Operating Voltage Range: 4.5V to 35V
AEC Q100 Grade 1 -40°C to +125°C Operating
Temperature Range
Logic Input Withstands Negative Swing of up to 5V
Outputs May be Connected in Parallel for Higher
Drive Current
Matched Rise and Fall Times
Low Propagation Delay Time
Low, 10A Supply Current
Low Output Impedance
Features
•
•
•
•
Automotive DC/DC regulators
Electronic Power Steering
Electric Vehicle Power Train Drives
Brushless DC motors
The IXDD604 is a dual non-inverting driver with an
enable. The IXDN604 is a dual non-inverting driver,
the IXDI604 is a dual inverting driver, and the IXDF604
has one inverting driver and one non-inverting driver.
The AEC Q100 qualified IXD_604SIA is available in a
standard 8-pin SOIC package, and the IXD_604SI is
available in an 8-pin Power SOIC package with an
exposed metal back.
Ordering Information
Part Number
IXDD604SI
IXDD604SITR
IXDD604SIA
IXDD604SIATR
IXDF604SI
IXDF604SITR
IXDF604SIA
IXDF604SIATR
IXDI604SI
IXDI604SITR
IXDI604SIA
IXDI604SIATR
IXDN604SI
IXDN604SITR
IXDN604SIA
IXDN604SIATR
Logic
Configuration
ENA
INA
A
OUTA
B
OUTB
ENB
INB
INA
A
OUTA
INB
B
OUTB
INA
A
OUTA
INB
B
OUTB
INA
A
OUTA
INB
B
OUTB
DS-IXD_604SI_SIA-R02
Package Type
Packing
Method
Quantity
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
Tube
Tape & Reel
Tube
100
2000
100
8-Pin SOIC
Tape & Reel
2000
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tape & Reel
100
2000
100
2000
100
2000
100
2000
100
2000
100
2000
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1
INTEGRATED CIRCUITS DIVISION
IXD_604SI & SIA
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Electrical Characteristics: -40°C < TA < +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
3
3
4
4
5
2. IXD_604 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 IXDD604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 IXDI604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 IXDF604. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4 IXDN604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
6
6
6
6
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
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10
10
10
10
11
R02
IXD_604SI & SIA
INTEGRATED CIRCUITS DIVISION
1 Specifications
1.1 Pin Configurations
1.2 Pin Definitions
IXDD604SI/SIA
IXDF604SI/SIA
Pin Name
ENA
1
INA
2
GND
3
INB
4
A
B
8
ENB
NC
1
7
OUTA
INA
2
6
VCC
GND
3
5
OUTB
INB
4
IXDI604SI/SIA
NC
1
INA
2
GND
3
INB
4
A
B
A
B
8
NC
7
OUTA
6
VCC
5
OUTB
Description
INA
Channel A Logic Input
INB
Channel B Logic Input
ENA
Channel A Enable Input Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
ENB
Channel B Enable Input Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
OUTA
OUTA
Channel A Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
OUTB
OUTB
Channel B Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC
Supply Voltage - Provides power to the device
GND
Ground - Common ground reference for the
device
IXDN604SI/SIA
8
NC
NC
1
7
OUTA
INA
2
6
VCC
GND
3
5
OUTB
INB
4
A
B
8
NC
7
OUTA
6
VCC
5
OUTB
1.3 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
VCC
-0.3
40
V
VINx , VENx
-5
VCC+0.3
V
IOUT
-
±4
A
Junction Temperature
TJ
-55
+150
°C
Storage Temperature
TSTG
-65
+150
°C
Supply Voltage
Input Voltage
Output Current
Absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
Parameter
Symbol
Range
Units
VCC
4.5 to 35
V
Operating Temperature Range
TA
-40 to +125
°C
R02
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Supply Voltage
3
IXD_604SI & SIA
INTEGRATED CIRCUITS DIVISION
1.5 Electrical Characteristics: TA = 25°C
Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted).
Conditions
Symbol
Minimum
Input Voltage, High
Parameter
4.5V < VCC < 18V
VIH
3.0
-
-
Input Voltage, Low
4.5V < VCC < 18V
VIL
-
-
0.8
0V < VIN < VCC
IIN
±10
A
IXDD604 only
VENH
2/3VCC
-
High EN Input Voltage
-
Low EN Input Voltage
IXDD604 only
VENL
-
V
Output Voltage, High
-
VOH
VCC-0.025
1/3VCC
-
-
Output Voltage, Low
-
VOL
-
-
0.025
Output Resistance, High State
VCC=18V, IOUT=-10mA
ROH
-
1.3
2.5
Output Resistance, Low State
ROL
-
1.1
2
IDC
-
-
±1
Rise Time
VCC=18V, IOUT=10mA
Limited by package power
dissipation
VCC=18V, CLOAD=1000pF
tr
-
9
16
Fall Time
VCC=18V, CLOAD=1000pF
tf
-
8
14
On-Time Propagation Delay
VCC=18V, CLOAD=1000pF
tondly
-
29
50
Off-Time Propagation Delay
VCC=18V, CLOAD=1000pF
toffdly
-
35
50
Enable to Output-High Delay Time
IXDD604 only, VCC=18V
tENOH
-
35
55
Disable to High Impedance State Delay Time
IXDD604 only, VCC=18V
tDOLD
-
40
55
VCC=18V, VIN=3.5V
VCC=18V, VIN=0V
VCC=18V, VIN=VCC
REN
-
200
1
<1
<1
3
10
10
Input Current
Output Current, Continuous
Enable Pull-Up Resistor
Power Supply Current
ICC
Typical
Maximum
Units
V
V

A
ns
k
mA
A
1.6 Electrical Characteristics: -40°C < TA < +125°C
Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted).
Parameter
Conditions
Symbol
Minimum
Maximum
Input Voltage, High
4.5V < VCC < 18V
VIH
3.3
-
Input Voltage, Low
4.5V < VCC < 18V
VIL
-
0.65
0V < VIN < VCC
IIN
-
VOH
-10
VCC-0.025
10
Output Voltage, High
Output Voltage, Low
-
VOL
-
0.025
Output Resistance, High State
VCC=18V, IOUT=-10mA
ROH
-
3
Output Resistance, Low State
ROL
-
2.5
IDC
-
±1
Rise Time
VCC=18V, IOUT=10mA
Limited by package power
dissipation
VCC=18V, CLOAD=1000pF
tr
-
16
Fall Time
VCC=18V, CLOAD=1000pF
tf
-
14
On-Time Propagation Delay
VCC=18V, CLOAD=1000pF
tondly
-
65
Off-Time Propagation Delay
VCC=18V, CLOAD=1000pF
toffdly
-
65
Enable to Output-High Delay Time
IXDD604 only, VCC=18V
tENOH
-
65
Disable to High Impedance State Delay Time
IXDD604 only, VCC=18V
VCC=18V, VIN=3.5V
VCC=18V, VIN=0V
VCC=18V, VIN=VCC
tDOLD
-
65
3.5
150
150
Input Current
Output Current, Continuous
Power Supply Current
4
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ICC
-
Units
V
A
V

A
ns
mA
A
R02
IXD_604SI & SIA
INTEGRATED CIRCUITS DIVISION
1.7 Thermal Characteristics
Package
SI (8-Pin Power SOIC)
SIA (8-Pin SOIC)
SI (8-Pin Power SOIC)
Parameter
Symbol
Rating
Thermal Resistance, Junction-to-Ambient
JA
85
Thermal Resistance, Junction-to-Case
JC
Units
120
°C/W
10
2 IXD_604 Performance
2.1 Timing Diagrams
VIH
INx
VIH
INx
VIL
VIL
tondly
toffdly
tondly
toffdly
90%
OUTx
90%
OUTx
10%
10%
tf
tr
tf
tr
2.2 Characteristics Test Diagram
+
0.1μF
10μF
INA
VCC
-
VCC
INB
OUTA
OUTB
CLOAD
VCC
VIN
ENA
ENB
GND
R02
Tektronix
Current Probe
6302
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CLOAD
Tektronix
Current Probe
6302
5
IXD_604SI & SIA
INTEGRATED CIRCUITS DIVISION
3 Block Diagrams & Truth Tables
3.1 IXDD604
3.3 IXDF604
IXDD604
IXDF604
VCC
VCC
200kΩ
OUTA
INA
VCC
ENA
INA
GND
OUTA
VCC
VCC
200kΩ
OUTB
INB
VCC
ENB
INB
OUTB
GND
INA
OUTA
0
1
1
0
INX
ENX
OUTX
INB
0
1 or open
OUTB
0
0
1
1 or open
0
1
1
0
0
1
Z
1
0
Z
3.4 IXDN604
3.2 IXDI604
IXDI604
IXDN604
VCC
OUTA
INA
VCC
OUTA
INA
GND
GND
VCC
OUTB
INB
6
VCC
OUTB
INB
INX
OUTX
INX
OUTX
0
1
0
0
1
0
1
1
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R02
IXD_604SI & SIA
INTEGRATED CIRCUITS DIVISION
4 Typical Performance Characteristics
A&B Rise Times vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
120
A&B Rise and Fall Times
vs. Temperature
(Input=0-5V, VCC=18V, CL=1nF)
A&B Fall Times vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
120
10
80
CL=10nF
CL=1nF
CL=470pF
60
40
80
40
20
0
0
15
20
25
30
Supply Voltage (V)
120
40
0
5
10
15
20
25
30
Supply Voltage (V)
A&B Rise Time vs. Load Capacitance
at Various VCC Levels
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=24V
VCC=35V
100
Rise Time (ns)
35
80
60
120
4000
6000
8000
Load Capacitance (pF)
140
120
100
toffdly
tondly
20
5
30
60
0
10000
2000
4000
6000
8000
Load Capacitance (pF)
100 120 140
50
40
toffdly
30
tondly
Min VIH
2.3
2.1
Max VIL
1.9
4
6
8
Input Voltage (V)
10
100 120 140
toffdly
40
35
tondly
30
25
-40 -20
12
2.8
2.6
2.4
2.2
VIH
2.0
1.8
VIL
0
5
10
15
20
25
Supply Voltage (V)
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30
35
0
20 40 60 80
Temperature (ºC)
100 120 140
Enable Threshold vs. Supply Voltage
Input Threshold vs. Supply Voltage
3.2
1.4
20 40 60 80
Temperature (ºC)
45
20
2
1.6
1.7
10000
Propagation Delay vs. Temperature
Enable Threshold (V)
2.5
0
20 40 60 80
Temperature (ºC)
50
3.0
2.7
-40 -20
0
40
60
35
Input Threshold (V)
Input Threshold Voltage (V)
10
15
20
25
Supply Voltage (V)
Input Threshold Voltage
vs. Temperature
(VCC=18V, CL=1nF)
2.9
R02
-40 -20
20
0
5
4
40
Propagation Delay vs. Input Voltage
(VCC=15V, CL=1nF)
70
Propagation Delay (ns)
Propagation Delay (ns)
2000
Propagation Delay vs. Supply Voltage
(VIN=0-5V, CL=1nF, f=1kHz)
40
6
0
0
60
tf
7
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=24V
VCC=35V
80
0
80
tr
8
20
20
160
9
A&B Fall Time vs. Load Capacitance
at Various VCC Levels
100
40
35
Propagation Delay (ns)
10
Fall Time (ns)
5
CL=10nF
CL=1nF
CL=470pF
60
20
0
Rise & Fall Times (ns)
100
Fall Time (ns)
Rise Time (ns)
100
22
20
18
16
14
12
10
8
6
4
2
0
VENH
VENL
0
5
10
15
20
25
Supply Voltage (V)
30
35
7
IXD_604SI & SIA
INTEGRATED CIRCUITS DIVISION
100
400
10
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=18V)
250
f=1MHz
f=500kHz
f=100kHz
f=50kHz
200
f=2MHz
350
300
400
150
100
250
200
150
100
50
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
250
200
150
100
50
Supply Current vs. Frequency
Both Outputs Active
(VCC=12V)
100
10
1
0.1
10
100
1000
Frequency (kHz)
CL=10nF
CL=1nF
CL=470pF
100
10
1
10000
1
Supply Current vs. Frequency
Both Outputs Active
(VCC=8V)
1000
CL=10nF
CL=1nF
CL=470pF
10000
0.1
1
10000
100
10
10
1
0.1
100
1000
Frequency (kHz)
10000
Quiesent Supply Current
vs. Temperature
(VCC=18V)
3.0
CL=10nF
CL=1nF
CL=470pF
Supply Current (mA)
1000
Load Capacitance (pF)
Supply Current (mA)
Supply Current (mA)
10
1000
Load Capacitance (pF)
Supply Current vs. Frequency
Both Outputs Active
(VCC=18V)
1000
CL=10nF
CL=1nF
CL=470pF
100
0
100
10000
1
0
100
1000
1000
Load Capacitance (pF)
Supply Current vs. Frequency
Both Outputs Active
(VCC=35V)
1000
Supply Current (mA)
300
Supply Current (mA)
10000
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=8V)
350
0
100
Supply Current (mA)
1000
Load Capacitance (pF)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
300
50
1
100
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=12V)
350
Supply Current (mA)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
Supply Current (mA)
Supply Current (mA)
1000
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=35V)
VIN=3.5V
VIN=5V
VIN=10V
2.5
2.0
1.5
1.0
0.5
VIN=0V & 18V
0.01
1000
Dynamic Supply Current
vs. Temperature
(VCC=18V, VIN=5V, f=1khz, CL=1nF)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
10
100
1000
Frequency (kHz)
0
20 40 60 80
Temperature (ºC)
100 120 140
-40 -20
10000
Output Source Current
vs. Supply Voltage
(CL=10nF)
-10
-8
-6
-4
-2
0
20 40 60 80
Temperature (ºC)
100 120 140
Output Sink Current
vs. Supply Voltage
(CL=10nF)
10
8
6
4
2
0
0
-40 -20
8
1
Output Source Current (A)
Supply Current (mA)
10
100
Frequency (kHz)
Output Sink Current (A)
1
1.4
0.0
0.01
0
5
10
15
20
25
Supply Voltage (V)
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30
35
0
5
10
15
20
25
Supply Voltage (V)
30
35
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IXD_604SI & SIA
INTEGRATED CIRCUITS DIVISION
Output Source Current
vs. Temperature
(VCC=18V, CL=10nF)
6.0
Output Sink Current (A)
Output Source Current (A)
6
5
4
3
2
0
20 40 60 80
Temperature (ºC)
100 120 140
4.0
3.0
-40 -20
High State Output Resistance
vs. Supply Voltage
(IOUT= -10mA)
4.0
3.5
3.0
3.0
2.5
2.0
1.5
1.0
0
20 40 60 80
Temperature (ºC)
100 120 140
Low State Output Resistance
vs. Supply Voltage
(IOUT= +10mA)
4.0
3.5
Resistance (Ω)
Resistance (Ω)
5.0
2.0
-40 -20
2.5
2.0
1.5
1.0
0.5
0.5
0.0
0.0
0
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Output Sink Current
vs. Temperature
(VCC=18V, CL=10nF)
5
10
15
20
25
Supply Voltage (V)
30
35
0
www.ixysic.com
5
10
15
20
25
Supply Voltage (V)
30
35
9
IXD_604SI & SIA
INTEGRATED CIRCUITS DIVISION
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating of 1, and should be handled according to the
requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Reflow Profile
This product has a maximum body temperature and time rating of 260°C for 30 seconds. All other guidelines of
J-STD-020 must be observed.
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IXD_604SI & SIA
INTEGRATED CIRCUITS DIVISION
5.4 Mechanical Dimensions
5.4.1 SIA Package (8-Pin SOIC)
1.270 REF
(0.050)
Pin 8
PCB Land Pattern
0.60
(0.024)
0.762 ± 0.254
(0.030 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
5.994 ± 0.254
(0.236 ± 0.010)
1.55
(0.061)
5.40
(0.213)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
1.346 ± 0.076
(0.053 ± 0.003)
4.928 ± 0.254
(0.194 ± 0.010)
1.27
(0.050)
0.559 ± 0.254
(0.022 ± 0.010)
Dimensions
mm
(inches)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
5.4.2 SI Package (8-Pin Power SOIC with Exposed Metal Back)
3.80
(0.150)
3.937 ± 0.254
(0.155 ± 0.010)
5.994 ± 0.254
(0.236 ± 0.010)
0.762 ± 0.254
(0.030 ± 0.010)
5.40
2.75
(0.209) (0.108)
1.55
(0.061)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
1.27
(0.050)
1.270 REF
(0.050)
4.928 ± 0.254
(0.194 ± 0.010)
0.60
(0.024)
Recommended PCB Land Pattern
1.346 ± 0.076
(0.053 ± 0.003)
2.540 ± 0.254
(0.100 ± 0.010)
7º
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
3.556 ± 0.254
(0.140 ±0.010)
Dimensions
mm
(inches)
Note: The exposed metal pad on the back of the SI package should be connected to GND. It is not suitable for
carrying current.
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11
IXD_604SI & SIA
INTEGRATED CIRCUITS DIVISION
5.4.3 Tape & Reel Information for SI and SIA Packages
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=12.00
(0.472)
B0=5.30
(0.209)
K0= 2.10
(0.083)
A0=6.50
(0.256)
P=8.00
(0.315)
User Direction of Feed
Embossed Carrier
Embossment
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_604SI_SIA-R02
©Copyright 2014, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
6/16/2014
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