ATMEL AT27C010-45JU 1mb (128k x 8) one-time programmable, read-only memory Datasheet

Features
• Fast read access time – 45ns
• Low-power CMOS operation
•
•
•
•
•
•
•
•
– 100µA max standby
– 25mA max active at 5MHz
JEDEC standard packages
– 32-lead PDIP
– 32-lead PLCC
5V ±10% supply
High-reliability CMOS technology
– 2000V ESD protection
– 200mA latchup immunity
Rapid programming algorithm – 100 µs/byte (typical)
CMOS- and TTL-compatible inputs and outputs
Integrated product identification code
Industrial temperature range
Green (Pb/halide-free) packaging option
1.
1Mb (128K x 8)
One-time
Programmable,
Read-only Memory
Atmel AT27C010
Description
The Atmel® AT27C010 is a low-power, high-performance 1,048,576-bit, one-time programmable, read-only memory (OTP EPROM) organized as 128K by 8 bits. Thedevice
requires only one 5V power supply in normal read mode operation. Any byte can be
accessed in less than 45ns, eliminating the need for speed reducing WAIT states on highperformance microprocessor systems.
In read mode, the AT27C010 typically consumes only 8mA. Standby mode supply current
is typically less than 10µA.
The AT27C010 is available in a choice of industry standard, JEDEC approved, one-time programmable (OTP) PDIP and PLCC packages. All devices feature two-line control (CE, OE)
to give designers the flexibility to prevent bus contention.
With 128K byte storage capability, the AT27C010 allows firmware to be stored reliably and
to be accessed by the system without the delays of mass storage media.
The AT27C010 has additional features to ensure high quality and efficient production use.
The rapid programming algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 100 µs/byte. The
integrated product identification code electronically identifies the device and manufacturer.
This feature is used by industry standard programming equipment to select the proper programming algorithms and voltages.
0321N–EPROM–4/11
2.
Pin configurations
s
O0 - O7
Outputs
CE
Chip enable
OE
Output enable
PGM
Program strobe
NC
No connect
A12
A15
A16
VPP
VCC
PGM
NC
Addresses
32-lead PDIP
Top view
A7
A6
A5
A4
A3
A2
A1
A0
O0
4
3
2
1
32
31
30
A0 - A16
32-lead PLCC
Top view
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
14
15
16
17
18
19
20
Function
O1
O2
GND
O3
O4
O5
O6
Pin name
3.
A14
A13
A8
A9
A11
OE
A10
CE
O7
VPP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
PGM
NC
A14
A13
A8
A9
A11
OE
A10
CE
O7
O6
O5
O4
O3
System considerations
Switching between active and standby conditions via the chip enable pin may produce transient voltage excursions. Unless
accommodated by the system design, these transients may exceed datasheet limits, resulting in device nonconformance.
At a minimum, a 0.1µF, high-frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This
capacitor should be connected between the VCC and ground terminals of the device, as close to the device as possible.
Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7µF bulk electrolytic
capacitor should be utilized, again connected between the VCC and ground terminals. This capacitor should be positioned as
close as possible to the point where the power supply is connected to the array.
Figure 3-1.
2
Block diagram
Atmel AT27C010
0321N–EPROM–4/11
Atmel AT27C010
4.
Absolute maximum ratings*
Temperature under bias . . . . . . . . . . . . . .-55°C to +125°C
*NOTICE:
Storage temperature . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage on any pin with
respect to ground . . . . . . . . . . . . . . . . . . . -2.0V to +7.0V(1)
Stresses beyond those listed under “Absolute maximum ratings” may cause permanent damage to
the device. This is a stress rating only, and functional operation of the device at these or any other
conditions beyond those indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Voltage on A9 with
respect to ground . . . . . . . . . . . . . . . . . -2.0V to +14.0V(1)
VPP supply voltage with
respect to ground . . . . . . . . . . . . . . . . . . -2.0V to +14.0V(1)
Note:
5.
1. Minimum voltage is -0.6V DC, which may undershoot to -2.0V for pulses of less than 20ns. Maximum output pin voltage is
VCC + 0.75V DC, which may overshoot to +7.0V for pulses of less than 20ns.
DC and AC characteristics
Table 5-1.
Operating modes
Mode/Pin
CE
OE
PGM
Ai
VPP
Outputs
(1)
Read
VIL
VIL
X
Ai
X
DOUT
Output disable
X
VIH
X
X
X
High Z
Standby
VIH
X
X
X
X
High Z
Rapid program(2)
VIL
VIH
VIL
Ai
VPP
DIN
PGM verify
VIL
VIL
VIH
Ai
VPP
DOUT
PGM inhibit
VIH
X
X
X
VPP
High Z
X
Identification code
(3)
Product identification(4)
Note:
VIL
VIL
X
A9 = VH
A0 = VIH or VIL
A1 - A16 = VIL
1. X can be VIL or VIH.
2. Refer to programming characteristics.
3. VH = 12.0 ± 0.5V.
4. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9, which is set to VH, and A0, which is toggled low
(VIL) to select the manufacturer’s identification byte and high (VIH) to select the device code byte.
Table 5-2.
DC and AC operating conditions for read operation
Atmel AT27C010
Operating temp. (case)
VCC power supply
Ind.
-45
-70
-40C - 85C
-40C - 85C
5V 10%
5V 10%
3
0321N–EPROM–4/11
Table 5-3.
DC and operating characteristics for read operation
Max
Units
Ind.
±1
µA
Ind.
±5
µA
VPP = VCC
10
µA
ISB1 (CMOS), CE = VCC± 0.3V
100
µA
ISB2 (TTL), CE = 2.0 to VCC + 0.5V
1
mA
f = 5MHz, IOUT = 0mA, CE = VIL
25
mA
Symbol
Parameter
ILI
Input load current
VIN = 0V to VCC
ILO
Output leakage current
VOUT = 0V to VCC
IPP1
(2)
VPP
(1))
read/standby current
Min
Condition
ISB
VCC(1) standby current
ICC
VCC active current
VIL
Input low voltage
-0.6
0.8
V
VIH
Input high voltage
2.0
VCC + 0.5
V
VOL
Output low voltage
IOL = 2.1mA
0.4
V
VOH
Output high voltage
IOH = -400µA
Notes:
2.4
V
1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP.
2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and
IPP.
Table 5-4.
AC characteristics for read operation
Atmel AT27C010
-45
Symbol
tACC
(3)
Condition
Min
Max
Min
Max
Units
Address to output delay
CE = OE = VIL
45
70
ns
(2)
CE to output delay
OE = VIL
45
70
ns
tOE(2)(3)
OE to output delay
CE = VIL
20
30
ns
tDF(4)(5)
OE or CE high to output float, whichever occurred first
20
25
ns
tOH
Output hold from address, CE or OE, whichever occurred first
tCE
Figure 5-1.
Notes:
Parameter
-70
7
7
ns
AC waveforms for read operation(1)
1. Timing measurement reference level is 1.5V for -45 devices. Input AC drive levels are VIL = 0.0V and VIH = 3.0V. Timing measurement reference levels for all other speed grades are VOL = 0.8V and VOH = 2.0V. Input AC drive levels are VIL = 0.45V and VIH = 2.4V.
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE.
3. OE may be delayed up to tACC - tOE after the address is valid without impact on tACC.
4. This parameter is only sampled, and is not 100% tested.
5. Output float is defined as the point when data is no longer driven.
4
Atmel AT27C010
0321N–EPROM–4/11
Atmel AT27C010
Figure 5-2.
Input test waveforms and measurement levels
For -45 devices only:
tR, tF < 5ns (10% to 90%)
For -70 devices:
tR, tF < 20ns (10% to 90%)
Figure 5-3.
Output test load
CL = 100pF including jig capacitance, except for the -45
devices, where CL = 30pF
Table 5-5.
Pin capacitance
f = 1MHz, T = 25°C(1)
Symbol
Typ
Max
Units
Conditions
CIN
4
8
pF
VIN = 0V
COUT
8
12
pF
VOUT = 0V
Note:
1. Typical values for nominal supply voltage. This parameter is only sampled, and is not 100% tested.
5
0321N–EPROM–4/11
Figure 5-4.
Notes:
Programming Waveforms(1)
1. The input timing reference is 0.8V for VIL and 2.0V for VIH.
2. tOE and tDFP are characteristics of the device, but must be accommodated by the programmer.
3. When programming the Atmel AT27C010, a 0.1µF capacitor is required across VPP and ground to suppress spurious voltage transients.
6
Atmel AT27C010
0321N–EPROM–4/11
Atmel AT27C010
Table 5-6.
DC programming characteristics
TA = 25  5°C, VCC = 6.5  0.25V, VPP = 13.0  0.25V
Limits
Symbol
Parameter
Test conditions
ILI
Input load current
VIN = VIL, VIH
VIL
Input low level
VIH
Input high level
VOL
Output low voltage
IOL = 2.1mA
VOH
Output high voltage
IOH = -400µA
ICC2
VCC supply current (program and verify)
IPP2
VPP supply current
VID
A9 product identification voltage
Table 5-7.
Min
Max
Units
10
µA
-0.6
0.8
V
2.0
VCC + 1
V
0.4
V
2.4
V
CE = PGM = VIL
11.5
40
mA
20
mA
12.5
V
AC programming characteristics
TA = 25 ± 5°C, VCC = 6.5 ± 0.25 V, VPP = 13.0 ± 0.25V
Limits
(1)
Symbol
Parameter
tAS
Address setup time
tCES
CE setup time
tOES
OE setup time
tDS
Data setup time
tAH
Address hold time
tDH
Data hold time
Test conditions
OE high to output float delay
tVPS
VPP setup time
tVCS
VCC setup time
2
µs
2
µs
2
µs
Input pulse levels
0.45V to 2.4V
0
µs
2
µs
Input timing reference level
0.8V to 2.0V
0
Output timing reference level
0.8V to 2.0V
tPW
PGM program pulse width
tOE
Data valid from OE
tPRT
VPP pulse rise time during programming
Units
µs
(2)
(3)
Max
2
Input rise and fall times
(10% to 90%) 20ns
tDFP
Notes:
Min
130
ns
2
µs
2
µs
95
105
µs
150
ns
50
ns
1. VCC must be applied simultaneously with or before VPP and removed simultaneously with or after VPP.
2. This parameter is only sampled, and is not 100% tested. Output float is defined as the point where data is no longer driven.
See timing diagram.
3. Program pulse width tolerance is 100µsec±5%.
Table 5-8.
The Atmel AT27C010 integrated product identification code
Pins
A0
O7
O6
O5
O4
O3
O2
O1
O0
Hex
data
Manufacturer
0
0
0
0
1
1
1
1
0
1E
Device type
1
0
0
0
0
0
1
0
1
05
Codes
7
0321N–EPROM–4/11
6.
Rapid programming algorithm
A 100µs PGM pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and VPP is raised
to 13.0V. Each address is first programmed with one 100µs PGM pulse without verification. Then a
verification/reprogramming loop is executed for each address. In the event a byte fails to pass verification, up to 10
successive 100µs pulses are applied with a verification after each pulse. If the byte fails to verify after 10 pulses have been
applied, the part is considered failed. After the byte verifies properly, the next address is selected until all have been
checked. VPP is then lowered to 5.0V and VCC to 5.0V. All bytes are read again and compared with the original data to
determine if the device passes or fails.
Figure 6-1.
8
Rapid programming algorithm
Atmel AT27C010
0321N–EPROM–4/11
Atmel AT27C010
7.
Ordering information
Green package option (Pb/halide-free)
ICC (mA)
tACC
(ns)
Active
Standby
Atmel ordering code
Package
Lead finish
Operation range
45
25
0.1
AT27C010-45JU
32J
Matte tin
Industrial
(-40C to 85C)
70
25
0.1
AT27C010-70JU
AT27C010-70PU
32J
32P6
Matte tin
Matte tin
Industrial
(-40C to 85C)
Package type
32J
32-lead, plastic, J-leaded chip carrier (PLCC)
32P6
32-lead, 0.600" wide, plastic, dual inline package (PDIP)
9
0321N–EPROM–4/11
8.
Package Information
32J – PLCC
1.14(0.045) X 45°
PIN NO. 1
IDENTIFIER
1.14(0.045) X 45°
0.318(0.0125)
0.191(0.0075)
E1
E2
B1
E
B
e
A2
D1
A1
D
A
0.51(0.020)MAX
45° MAX (3X)
COMMON DIMENSIONS
(Unit of measure = mm)
D2
Notes:
1. This package conforms to JEDEC reference MS-016, Variation AE.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.10mm) maximum.
SYMBOL
MIN
NOM
MAX
A
3.175
–
3.556
A1
1.524
–
2.413
A2
0.381
–
–
D
12.319
–
12.573
D1
11.354
–
11.506
D2
9.906
–
10.922
E
14.859
–
15.113
E1
13.894
–
14.046
E2
12.471
–
13.487
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
Package Drawing Contact:
[email protected]
10
TITLE
32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
32J
REV.
B
Atmel AT27C010
0321N–EPROM–4/11
Atmel AT27C010
32P6 – PDIP
D
PIN
1
E1
A
SEATING PLANE
A1
L
B
B1
e
E
0º ~ 15º
C
eB
Note:
1. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25mm (0.010").
COMMON DIMENSIONS
(Unit of Measure = mm)
REF
SYMBOL
MIN
NOM
MAX
A
–
–
4.826
A1
0.381
–
–
D
41.783
–
42.291
E
15.240
–
15.875
E1
13.462
–
13.970
B
0.356
–
0.559
B1
1.041
–
1.651
L
3.048
–
3.556
C
0.203
–
0.381
eB
15.494
–
17.526
e
NOTE
Note 1
Note 1
2.540 TYP
09/28/01
Package Drawing Contact:
[email protected]
TITLE
32P6, 32-lead (0.600"/15.24mm wide) Plastic Dual
Inline Package (PDIP)
DRAWING NO.
32P6
REV.
B
11
0321N–EPROM–4/11
9.
12
Revision history
Doc. Rev.
Date
0321N
04/2011
0321M
12/2007
Comments
Remove TSOP package
Add lead finish to ordering information
Atmel AT27C010
0321N–EPROM–4/11
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