SLOS010B − MARCH 1987 − REVISED AUGUST 1994 D Low Input Bias Current . . . 50 pA Typ D Low Input Noise Current D D D D D D OR P PACKAGE (TOP VIEW) 0.01 pA/√Hz Typ Low Supply Current . . . 4.5 mA Typ High Input impedance . . . 1012 Ω Typ Internally Trimmed Offset Voltage Wide Gain Bandwidth . . . 3 MHz Typ High Slew Rate . . . 13 V/µs Typ 1OUT 1IN − 1IN+ VCC − 1 8 2 7 3 6 4 5 VCC + 2OUT 2IN − 2IN + description This device is a low-cost, high-speed, JFET-input operational amplifier with very low input offset voltage and a specified maximum input offset voltage drift. It requires low supply current yet maintains a large gain bandwidth product and a fast slew rate. In addition, the matched high-voltage JFET input provides very low input bias and offset currents. The LF412C can be used in applications such as high-speed integrators, digital-to-analog converters, sample-and-hold circuits, and many other circuits. The LF412C is characterized for operation from 0°C to 70°C. symbol (each amplifier) − IN − OUT + IN + AVAILABLE OPTIONS TA VIOmax AT 25°C 0°C to 70°C 3 mV PACKAGE SMALL OUTLINE (D) PLASTIC DIP (P) LF412CD LF412CP The D packages are available taped and reeled. Add the suffix R to the device type (ie., LF412CDR). absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC + . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V Supply voltage, VCC − . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 V Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 30 V Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 15 V Duration of output short circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW Operating temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C NOTE 1: Unless otherwise specified, the absolute maximum negative input voltage is equal to the negative power supply voltage. Copyright 1994, Texas Instruments Incorporated !"# $% $ ! ! & ' $$ ()% $ !* $ #) #$ * ## !% • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 1 SLOS010B − MARCH 1987 − REVISED AUGUST 1994 recommended operating conditions MIN MAX Supply voltage, VCC + 3.5 18 V Supply voltage, VCC − −3.5 −18 V UNIT electrical characteristics over operating free-air temperature range, VCC ± = ±15 V (unless otherwise specified) PARAMETER TEST CONDITIONS VIO Input offset voltage VIC = 0, RS = 10 kΩ αVIO Average temperature coefficient of input offset voltage VIC = 0, RS = 10 kΩ IIO Input offset current§ VIC = 0 IIB Input bias current§ VIC = 0 VICR Common-mode input voltage range VOM Maximum peak output voltage swing TA† 25°C MIN 25°C TYP MAX 1 3 10 20‡ µV/°C 25 100 pA 4 nA 200 pA 8 nA 70°C 25°C 50 70°C AVD Large-signal differential voltage VO = ± 10 V, RL = 2 kΩ ri Input resistance TA = 25°C CMRR Common-mode rejection ratio RS ≤ 10 kΩ kSVR Supply-voltage rejection ratio See Note 2 mV ± 11 −11.5 to 14.5 V V ± 12 ± 13.5 25°C 25 200 Full range 15 200 RL = 10 kΩ UNIT V/mV 1012 Ω 70 100 dB 70 100 dB ICC Supply current 4.5 6.8 mA † Full range is 0°C to 70°C. ‡ At least 90% of the devices meet this limit for αVIO. § Input bias currents of a FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive. Pulse techniques must be used that will maintain the junction temperatures as close to the ambient temperature as possible. NOTE 2: Supply-voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously. operating characteristics, VCC± = ±15 V, TA = 25°C PARAMETER TEST CONDITIONS VO1/VO2 SR Crosstalk attenuation B1 Vn Unity-gain bandwidth Equivalent input noise voltage f = 1 kHz, In Equivalent input noise current f = 1 kHz 2 MIN f = 1 kHz Slew rate • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • RS = 20 Ω TYP MAX UNIT 120 dB 8 13 V/µs 2.7 3 MHz 18 nV/√Hz 0.01 pA/√Hz PACKAGE OPTION ADDENDUM www.ti.com 19-Jul-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LF412 MWC ACTIVE WAFERSALE YS 0 1 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 85 LF412CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF412C LF412CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF412C LF412CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF412C LF412CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF412C LF412CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF412C LF412CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF412C LF412CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LF412CP LF412CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LF412CP (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 19-Jul-2016 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device LF412CDR Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 6.4 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LF412CDR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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