TI1 DS89C21TMX/NOPB Differential cmos line driver and receiver pair Datasheet

DS89C21
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SNLS091C – JUNE 1998 – REVISED APRIL 2013
DS89C21 Differential CMOS Line Driver and Receiver Pair
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FEATURES
DESCRIPTION
•
The DS89C21 is a differential CMOS line driver and
receiver pair, designed to meet the requirements of
TIA/EIA-422-A (RS-422) electrical characteristics
interface standard. The DS89C21 provides one driver
and one receiver in a minimum footprint. The device
is offered in an 8-pin SOIC package.
1
2
•
•
•
•
•
•
Meets TIA/EIA-422-A (RS-422) and CCITT V.11
Recommendation
LOW POWER Design—15 mW Typical
Guaranteed AC Parameters:
– Maximum Driver Skew 2.0 ns
– Maximum Receiver Skew 4.0 ns
Extended Temperature Range: −40°C to
+85°C
Available in SOIC Packaging
Operates over 20 Mbps
Receiver OPEN Input Failsafe Feature
The CMOS design minimizes the supply current to 6
mA, making the device ideal for use in battery
powered or power conscious applications.
The driver features a fast transition time specified at
2.2 ns, and a maximum differential skew of 2 ns
making the driver ideal for use in high speed
applications operating above 10 MHz.
The receiver can detect signals as low as 200 mV,
and also incorporates hysteresis for noise rejection.
Skew is specified at 4 ns maximum.
The DS89C21 is compatible with TTL and CMOS
levels (DI and RO).
Connection Diagram
See Package Number D (R-PDSO-G8)
Truth Table Driver
Input
Outputs
DI
DO
H
H
DO*
L
L
L
H
Truth Table Receiver
Inputs
Output
RI–RI*
RO
VDIFF ≥ +200 mV
H
VDIFF ≤ −200 mV
L
OPEN
(1)
(1)
H
Non-terminated
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS89C21
SNLS091C – JUNE 1998 – REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2) (3)
Supply Voltage (VCC)
7V
−1.5V to VCC + 1.5V
Driver Input Voltage (DI)
Driver Output Voltage (DO, DO *)
−0.5V to +7V
Receiver Input Voltage—V CM
(RI, RI*)
±14V
Differential Receiver Input
±14V
*
Voltage—VDIFF (RI, RI )
Receiver Output Voltage (RO)
−0.5V to VCC +0.5V
Receiver Output Current (RO)
±25 mA
Storage Temperature Range
−65°C to +150°C
(TSTG)
Lead Temperature (TL)
+260°C
(Soldering 4 sec.)
Maximum Junction Temperature
150°C
Maximum Package Power Dissipation @+25°C
D Package
714 mW
Derate D Package
(1)
(2)
(3)
5.7 mW/°C above +25°C
Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that
the devices should be operated at these limits. The tables of Electrical Characteristics specify conditions for device operation.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
ESD Rating: HBM (1.5 kΩ, 100 pF) all pins ≥ 2000V.EIAJ (0Ω, 200 pF) ≥ 250V
Recommended Operating Conditions
Min
Max
Supply Voltage (VCC)
4.50
5.50
V
Operating Temperature (TA)
−40
+85
°C
500
ns
Input Rise or Fall Time (DI)
2
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Units
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS89C21
DS89C21
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SNLS091C – JUNE 1998 – REVISED APRIL 2013
Electrical Characteristics
(1) (2)
Over recommended supply voltage and operating temperature ranges, unless otherwise specified.
Symbol
Parameter
Conditions
Pin
Min
DI
Typ
Max
Units
2.0
VCC
V
GND
0.8
V
±10
μA
−1.5
V
6.0
V
DRIVER CHARACTERISTICS
VIH
Input Voltage HIGH
VIL
Input Voltage LOW
IIH, IIL
Input Current
V IN = VCC, GND, 2.0V, 0.8V
VCL
Input Clamp Voltage
I IN = −18 mA
VOD1
Unloaded Output Voltage
No Load
VOD2
Differential Output Voltage
R L = 100Ω
ΔVOD2
Change in Magnitude of V OD2
0.05
DO,
DO*
4.2
2.0
3.0
5.0
V
400
mV
for Complementary Output States
VOD3
Differential Output Voltage
R L = 150Ω
2.1
3.1
V
VOD4
Differential Output Voltage
R L = 3.9 kΩ
4.0
6.0
VOC
Common Mode Voltage
R L = 100Ω
2.0
3.0
V
ΔVOC
Change in Magnitude of V OC
2.0
400
mV
V
for Complementary Output States
IOSD
Output Short Circuit Current
V OUT = 0V
IOFF
Output Leakage Current
VCC = 0V
−115
−150
mA
VOUT = +6V
−30
0.03
+100
μA
VOUT = −0.25V
−0.08
−100
μA
−200
±25
+200
mV
20
50
RECEIVER CHARACTERISTICS
VTL, VTH
Differential Thresholds
V IN = +7V, 0V, −7V
VHYS
Hysteresis
V CM = 0V
RIN
Input Impedance
V IN = −7V, +7V, Other = 0V
IIN
Input Current
Other Input = 0V,
VIN = +10V
VCC = 5.5V and
VIN = +3.0V
VCC = 0V
VIN = +0.5V
RI,
RI*
5.0
VIN = −3V
0
VIN = −10V
VOH
Output HIGH Voltage
IOH = −6 mA
VOL
Output LOW Voltage
I OL = +6 mA, VDIFF = −1V
IOSR
Output Short Circuit Current
V OUT = 0V
VDIFF = +1V
9.5
+1.0
0
VDIFF = OPEN
3.8
3.8
−25
kΩ
+1.5
mA
+0.22
mA
−0.04
mA
−0.41
−1.25
RO
mV
mA
−2.5
4.9
mA
V
4.9
V
0.08
0.3
V
−85
−150
mA
3.0
6
mA
3.8
12
mA
DRIVER AND RECEIVER CHARACTERISTICS
ICC
Supply Current
No Load
DI = VCC or GND
DI = 2.4V or 0.5V
(1)
(2)
VCC
Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
unless otherwise specified.
All typicals are given for VCC = 5.0V and T A = 25°C.
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3
DS89C21
SNLS091C – JUNE 1998 – REVISED APRIL 2013
Switching Characteristics
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(1) (2)
Over recommended supply voltage and operating temperature ranges, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
2
4.9
10
ns
2
4.5
10
ns
0.4
2.0
ns
2.2
9
ns
2.1
9
ns
6
18
30
ns
6
17.5
30
ns
0.5
4.0
ns
2.5
9
ns
2.1
9
ns
DIFFERENTIAL DRIVER CHARACTERISTICS
tPLHD
Propagation Delay LOW to HIGH
RL = 100Ω
tPHLD
Propagation Delay HIGH to LOW
CL = 50 pF
tSKD
Skew, |tPLHD–t PHLD|
tTLH
Transition Time LOW to HIGH
tTHL
Transition Time HIGH to LOW
(Figure 2 Figure 3)
(Figure 2 Figure 4)
RECEIVER CHARACTERISTICS
tPLH
Propagation Delay LOW to HIGH
CL = 50 pF
tPHL
Propagation Delay HIGH to LOW
VDIFF = 2.5V
tSK
Skew, |tPLH–t PHL|
VCM = 0V
tr
Rise Time
tf
Fall Time
(1)
(2)
(Figure 5 Figure 6)
(Figure 7)
All typicals are given for VCC = 5.0V and T A = 25°C.
f = 1 MHz, tr and tf ≤ 6 ns.
Parameter Measurement Information
Figure 1. VOD and VOC Test Circuit
f = 1 MHz, tr and tf ≤ 6 ns.
Figure 2. Driver Propagation Delay Test Circuit
4
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DS89C21
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SNLS091C – JUNE 1998 – REVISED APRIL 2013
Figure 3. Driver Differential Propagation Delay Timing
Figure 4. Driver Differential Transition Timing
f = 1 MHz, tr and tf ≤ 6 ns.
Figure 5. Receiver Propagation Delay Test Circuit
Figure 6. Receiver Propagation Delay Timing
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Product Folder Links: DS89C21
5
DS89C21
SNLS091C – JUNE 1998 – REVISED APRIL 2013
www.ti.com
Figure 7. Receiver Rise and Fall Times
6
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Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS89C21
DS89C21
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SNLS091C – JUNE 1998 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 6
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Jul-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS89C21TM
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
DS89C
21TM
DS89C21TM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
DS89C
21TM
DS89C21TMX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 85
DS89C
21TM
DS89C21TMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
DS89C
21TM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jul-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DS89C21TMX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
DS89C21TMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS89C21TMX
SOIC
D
8
2500
367.0
367.0
35.0
DS89C21TMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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