I533/I534/I733/I734 Series 3.2 mm x 5 mm Ceramic Package SMD TCXO Product Features: Applications: Low Jitter, Non-PLL Based Output Available in Both Clipped Sinewave and HCMOS Output Levels Compatible with Leadfree Processing Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 Fibre Channel 5.0 4 3 3.2 Frequency 8.000 Mhz to 40 Mhz Output Level Clipped Sinewave HCMOS Output Load Clipped Sinewave HCMOS 1 0.8 V p-p Min. ‘0’=0.5 VDC Max., ‘1’=0.8Vcc Min. 2 1.5 20K Ohms / 10 pF 15pF 2.6 Duty Cycle (HCMOS) 50% ±10% Rise / Fall Time (HCMOS) Frequency Stability Vs Temperature Vs Voltage Vs Load(5%) Frequency Tolerance @ 25 C Aging 10 nS Max. Supply Voltage See Supply Voltage Table , tolerance 5% Current 2.0 mA Max. (Clipped Sinewave) 1 2 4 3 1.4 See Frequency Stability Table 0.3 ppm Max. .0.2 ppm Max. 1.0 ppm 4.0 3 4 1 ppm / Year Max. 1.35 2.5 1 2 1.6 6.0 mA Max. (HCMOS) Voltage Control (I733/I734) Operating 1.5 VDC 1.0 VDC, 5.0 ppm Min. Storage -40 C to +85 C Phase Noise (typ. @ 20Mhz) -86 dBc/Hz @ 10 Hz -115 dBc/Hz @ 100 Hz -138 dBc/Hz @ 1KHz -146 dBc/Hz @ 10 Khz Pin 1 2 3 4 See Operating Temperature Table Package I533 (Clipped Sinewave TCXO) I534 (HCMOS TCXO) I733 (Clipped Sinewave TCVCXO) I734 (HCMOS TCVCXO) Connection Control Voltage or N.C. GND Output Vcc Dimension Units: mm Part Number Guide Operating Temperature 7 = 0 C to +50 C Sample Part Number: I537-1Q3-20.000 Mhz FrequencyStability vs Temperature Supply Voltage **N = 1.0 ppm 3 = 3.3 V 1 = 0 C to +70 C **O = 1.5 ppm 7 = 3.0 V 3 = -20 C to +70 C **P = 2.0 ppm 2 = 2.7 V 2 = -40 C to +85 C Q = 2.5 ppm R = 3.0 ppm J = 5.0 ppm NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 12/20/11_D Specifications subject to change without notice Page 1 Frequency - 20.000 MHz I533/I534/I733/I734 Series 3.2 mm x 5 mm Ceramic Package SMD TCXO Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 8 +/-.3 4 +/-.2 3.5 +/-.2 9 +/-1 or 12 +/-3 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: I - Date Code (YWW) Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 12/20/11_D Specifications subject to change without notice Page 2