1/21 STRUCTURE PRODUCT SERIES Silicon Monolithic Integrated Circuit 7-Channel Switching Regulator Controller for Digital Camera BD9745EKN TYPE PACKAGE Fig. 1 (Plastic mold) HQFN-48U package PIN ASSIGNMENT Fig. 2 BLOCK DIAGRAM Fig. 3 APPLICATION CIRCUIT Fig. 4 ● 1.5V Minimum input operating. FEATURES ● Controls up to 7 switching regulators. Step up converter (1channel), Step-down converter (1channel), Configurable for Step-up or Step-down conversion (3channels), Positive to negative converter (1channel), Step-up converter for LED (1channel). ● Synchronous rectifying action mode (4channel), Built-in FET Transistor. ● Step-up converter for CCD,Built-in FET Transistor. ● Internal compensation. ● Operating frequency 1.2MHz(CH1~4), 600kHz(CH5~7). ● Short Circuit Protection(SCP) for Over load condition. ● Built-in load switch with soft-start for Step-up converter(CH6,7). ● Back gate control synchronous rectified DC/DC for Step-up(CH1,2,4). ● Thermally enhanced QFN48 package. ( 7mmX 7mm,0.4mm pitch ) Absolute maximum ratings(Ta=25℃) Parameter Power Power Supply Input O u t p u t P o w e r Vo l ta g e Voltage C u r r e n t D i s s i p a t i o n O p e r a t i n g Te m p e r a t u r e S t o r a g e Te m p e r a t u r e J u n c t i o n Te m p e r a t u r e Symbol Limits Units VBAT, VCC, PVCC -0.3~7 V PVCC5, HS6H, HS7H -0.3~7 V VHx1~4 -0.3~7 V VLx1~4 VLx6 IomaxLx1 IomaxLx2~4 -0.3~7 -0.3~18 ±1.8 ±1.5 0.65(*1) 1.50(*2) -25~+85 -55~+150 +150 V V A A W W ℃ ℃ ℃ Pd Topr Tstg Tjmax (*1) Without external heat sink, the power dissipation reduces by 5.2mW/℃ over25℃. (*2) Reduced by 12mW/℃ over 25℃, when mounted on a PCB (70.0mm×70.0mm×1.6mm). Recommended operating conditions Parameter Power Supply Voltage Symbol Spec. Units VBAT 1.5 ~ 5.5 V VCC, PVCC 2.5 ~ 5.5 V REV. D 2/21 ○ Recommended operating conditions Standard value Parameter Symbol MIN TYP MAX Units VREF Pin Connect Capacitor CVREF 0.47 1.0 4.7 μF VREGA Pin Connect Capacitor CVREGA 0.47 1.0 4.7 μF Cscp - - 0.47 μF Oscillator Frequency fosc 0.6 1.2 1.5 MHz OSC Timing Resistor RT 47 62 120 kΩ P-channel Drain Current(CH1~4) Idpl - - 1.5 A N-channel Drain Current(CH1~4) Idnl - - 1.5 A N-channel Drain Current (CH6) Idnh - - 1.0 A P-channel Drain Current (Load SW of CH6~7) - - Idpr 1.5 A 500 mA SCP Pin Connect Capacitor 【Oscillator】 【Driver】 Driver Peak Current (CH5, 7) Idpeak - - REV. D Conditions 3/21 ○Electrical characteristics(Ta=25℃,VBAT=3V, VCC=5V, RT=62kohm, STB1~7=3V) Spec. Parameter Symbol Units Conditions. Min. Typ. Max 【 Reference Voltage for CH5 】 Reference Voltage Vref5 0.99 1.00 1.01 V STB5=3V Line Regulation DVLi 4.0 12.5 mV Vcc=2.8V~5.5V Load Regulation DVLo 1.0 7.5 mV Iref=10μA~100μA Short Circuit Output Current Ios 0.2 1 mA Vref=0V 【 Internal Regulator 】 REGA Output Voltage VREGA 2.4 2.5 2.6 V Ireg=5mA 【 Low Voltage Input Prevented Operation Faults Circuit 】 Threshold Voltage 2 Vstd2 2.3 2.4 2.5 V VCC monitor Hysteresis width 2 ΔVst2 100 200 300 mV Threshold Voltage 3 Vstd3 1.6 2.0 2.3 V VREGA monitor Hysteresis width 3 ΔVst3 100 200 300 mV 【 Start up Circuit 】 Oscillator Frequency Fstart 150 300 600 kHz Minimum VBAT Voltage Vst1 1.5 - - V Soft-start time Tss1 2.6 4.2 7.4 msec 【 Soft-Start 】 Soft-start time (CH2~4,CH6,7) Soft-start time CH5 Tss4 6.8 8.5 10.2 msec Tss3 5.8 7.7 9.6 msec 2.1 2.2 2.3 V 0.56 0.64 0.72 V 2 0.9 22 4 1.0 170 6 1.1 mV μA V VSCP=0.1V 1.0 1.2 1.4 MHz RT=62kohm 500 600 700 kHz RT=62kohm -5 0.79 -12 380 0 0.80 0 400 5 0.81 12 420 μA V mV mV INV1~4,6,7,7I,NON5=7.0V 86 77 92 85 97 93 % % 【 Protection Circuit 】 Timer Start Threshold Vtcfb Voltage Timer Start Threshold Vtcinv Voltage SCP Standby Voltage Vssc SCP Output Current Iscp SCP Threshold Voltage Vscp 【 Triangular wave oscillator 】 Oscillator Frequency fosc1 CH1~4 Oscillator Frequency fosc2 CH5~7 【 Error Amp 】 Iinv Input Bias Current VINV INV Threshold VINV5 NON5 Threshold VINV7I INV7I Threshold 【 PWM Comparator 】 MAX DUTY1, 2,3,4 MAX DUTY5, 6,7 Dmax2 Dmax4 VREF5monitor Error Amp Output monitor CH1,5~7 INV monitor CH2~4 CH1~4,CH6,7V CH5 CH7I ◎This product is not designed for normal operation within a radioactive environment. REV. D Test Circuit 4/21 ○Electrical characteristics(Ta=25℃,VBAT=3V, VCC=5V, RT=62kohm, STB1~7=3V) Spec. Parameter Symbol Units Conditions Min Typ. Max. 【 Output Circuit 】 CH1,2,3,4 Pch FET Ronlp 250 350 mΩ Hx=5V ON Resistor CH1 Nch FET ON Resistor Ron1n - 80 120 mΩ PVCC=5V CH2,3,4 Nch FET ON Resistor Ron2n - 130 200 mΩ PVCC=5V CH6,7 Load SW ON Resistor Ronl - 250 350 mΩ HS6, 7H=5V CH6 Nch FET ON Resistor Ronh - 450 700 mΩ PVCC=5V VOUT5H PVCC5 -1.0 PVCC5 -0.5 - V PVCC5=5V,IOUT5=50mA NON5=0.2V VOUT5H - 0.5 1.0 V PVCC5=5V,IOUT5= - 50mA NON5=-0.2V VOUT7H PVCC -1.0 PVCC -0.5 - V PVCC=5V,IOUT7=50mA INV7I=0V,INV7=0.4V VOUT7H - 0.5 1.0 V PVCC=5V,IOUT7= - 50mA INV7I=0.6V,INV7=1.2V VUDDO VBAT× 0.7 - VBAT V VUDUP 0 - VBAT ×0.3 V ON VSTBH1 1.5 - 5.5 V OFF VSTBL1 -0.3 - 0.3 V RSTB1 250 400 700 KΩ VBAT ISTB1 - - 5 μA VCC, PVCC ISTB2 - - 5 μA Hx ISTB3 - - 5 μA Step-down UDSEL1, 2,4=VBAT Lx ISTB4 - - 5 μA Step-up UDSEL1, 2,4=0V Start up Current (VBAT Sink Current) IST - 300 1000 μA VBAT=1.5V Circuit Current on Driving 1 (VBAT Sink Current) Icc1 - 200 400 μA VBAT=3.0V Circuit Current on Driving 2 (VCC,PVCC Sink Current) Icc2 - 4.8 8.5 mA OUT5 High-level Output Voltage ON Driving OUT5 Low-level Output Voltage ON Driving OUT7 High-level Output Voltage ON Driving OUT7 Low-level Output Voltage ON Driving 【 Step-up / down Selection 】 Step down Step up UDSEL12, UDSEL3 Control Voltage 【STB1~7】 STBControl Voltage STB Pull-down Resistor 【 Circuit Current 】 Stand by Current ◎This product is not designed for normal operation within a radioactive environment. REV. D STB1~7=3V INV=2.5V Test Circuit 5/21 BD9745 Lot No. 1pin Notice : Do not use the dotted line area For soldering Fig. 1 PACKAGE Fig. 2 PIN ASSIGNMENT REV. D 6/21 ○PIN DESCRIPTION PIN No. 22 31 21 2 33 17-18,6-7,43 NAME VBAT VCC PVCC PVCC5 GND PGND12,34,567 I/O - Description Power supply for the start-up circuit Power supply Power supply for Nch Driver Power supply for CH5 Pch Driver. Ground Power Ground for the Built-in FET. 30 VREGA O Output of REGA 34 VREF O Output of CH5 Reference. 1 OUT5 O 42 OUT7 O 14,20,9,4 15-16,19,8,5,44 46,40 45,41 26,25,27,28,36,38 35 37 Hx1,2,3,4 Lx1,2,3,4,6 HS6H, HS7H HS6L, HS7L INV1,2,3,4,6,7 NON5 INV7I O O I O I I I Connect to the Gate of CH5 external Pch FET. Connect to the Gate of CH7 external Nch FET. Power supply for Built-in Pch FET. Connect to the inductor. Power supply for Built-in High side-SW. Output of Built-in High side-SW. Error AMP inverted input. Error AMP non-inverted input. Error AMP inverted input. For Current Feed Back 29 RT - 32 SCP - 23,24,3 UDSEL1,2,4 I 13,12,11,10,48,47,39 STB1,2,3,4,5,6,7 I A resistor is placed to set the OSC frequency. Connect to a capacitor to set up the delay time of the SCP. Step-up/down switching mode selection H: step-down L: step-up ON/OFF SW H: Operating Over 1.5V REV. D NOTES Drive over 1.5V Drive over 2.5V Drive over 2.5V Output Voltage=2.5V Output Voltage=1.0V Output Voltage=1.0V CLK frequency 1.2MHz connecting 62kΩ to GND. Charge up current 4μA until 1.0V. All Low; Stand-by 32.SCP 31.VCC 33.GND 7/21 30.VREGA REG A PVCC U.V.L.O To Control Block TIMER LATCH S R Q SCP CMOM1,5,6,7 + 2.2V SS 26.INV1 22.VBAT To Driver STB1 VBAT + ERRCOMP1 + + ERRAMP1 Start-Up OSC CH1 Step up /down Current mode control 0.8V Pch DRIVER BG CTL 15-16.Lx1 PVCC Nch DRIVER 17-18.PGND12 STEP UP/DOWN SELECTOR1 SCPCOMP2 + 21.PVCC UDSEL1 25.INV2 20.Hx2 + + 0.8V 14.Hx1 CH2 Step up /down Current mode control ERRAMP2 Pch DRIVER BG CTL 19.Lx2 PVCC Nch DRIVER STEP UP/DOWN SELECTOR2 SCPCOMP3 + 27.INV3 0.8V UDSEL2 9.Hx3 + + ERRAMP3 CH3 Step down Current mode control SCP COMP4 + 28.INV4 0.8V To ERRAMP 34.VREF + + ERRAMP4 CH4 Step up /down Current mode control Pch DRIVER 8.Lx3 PVCC Nch DRIVER Pch DRIVER BG CTL 4.Hx4 5.Lx4 PVCC Nch DRIVER 6-7.PGND34 STEP UP/DOWN SELECTOR4 UDSEL4 VOLTAGE REFERENNCE VREGA SS5 2.PVCC5 ERRAMP5 + 35.NON5 PWM COMP5 ++ Pch DRIVER 1.OUT5 46.HS6H Rood SW VREGA 45.HS6L 36.INV6 0.8V PWM COMP6 -+ + + + ERRAMP6 PVCC 44.Lx6 Nch DRIVER 43.PGND567 40.HS7H VREGA Rood SW 41.HS7L ERRAMP7V 38.INV7 + + 7V,7I priority L 0.8V 37.INV7I PWM COMP7 + + + - PVCC Nch DRIVER + + 0.4V ERRAMP7I SS_CLK OSC ON/OFF LOGIC Fig. 3 Block diagram REV. D 23.UDSEL1 24.UDSEL2 3.UDSEL4 SOFT START 13.STB1 12.STB2 11.STB3 10.STB4 48.STB5 47.STB6 39.STB7 STB 29.RT UVLO 42.OUT7 SCP VCC GND 8/21 UNREG 1.8~3.0V VREGA REG A PVCC U.V.L.O To Control Block TIMER LATCH S R Q SCP CMOM1,5,6,7 + 2.2V SS Vo1 + VBAT To Driver STB1 VBAT Vo1 (Feed Back 1ch) Start-Up OSC ERRCOMP1 INV1 Hx1 -+ + ERRAMP1 0.8V CH1 Step up Pch DRIVER /down PVCC Current mode control BG CTL Nch DRIVER Lx1 5.0V for Analog,IC PGND12 STEP UP/DOWN SELECTOR1 Vo2 PVCC SCPCOMP2 UDSEL1 + Hx2 INV2 ++ 0.8V ERRAMP2 CH2 Step up Pch DRIVER /down PVCC Current mode control BG CTL Lx2 Nch DRIVER Vo2 (Feed Back 2ch) 2.8V for Digital STEP UP/DOWN SELECTOR2 Vo3 SCPCOMP3 + UDSEL2 Hx3 INV3 0.8V ++ ERRAMP3 CH3 Step down Current mode control Vo4 SCPCOMP4 + Pch DRIVER Lx3 1.2V for ASIC PVCC Nch DRIVER Hx4 INV4 0.8V ++ ERRAMP4 CH4 Step up Pch DRIVER /down PVCC Current mode control Vo3 (Feed Back 3ch) BG CTL Nch DRIVER Lx4 Vo4 (Feed Back 4ch) 3.4V for Analog PGND34 STEP UP/DOWN SELECTOR4 To ERRAMP VREF UDSEL4 VOLTAGE REFERENNCE VREGA SS5 PVCC5 ERRAMP5 + NON5 Vo5 PWM COMP5 -+ + OUT5 Pch DRIVER -8V for CCD HS6H HS6L Rood SW VREGA Vo5 (Feed Back 5ch) Vo6 (Feed Back 6ch) Vo6 INV6 0.8V PWM COMP6 ++ ++ ERRAMP6 12V for CCD PVCC Lx6 Nch DRIVER PGND567 HS7H VREGA Rood SW HS7L Vo7 ERRAMP7V INV7 -+ + 7V,7I priority L 0.8V PWM COMP7 + + + - OUT7 Nch DRIVER LED INV7I ++ 0.4V ERRAMP7I INV7I Vo7 (Feed Back 7ch) PVCC For BACK LIGHT OSC UDSEL4 ON/OFF LOGIC UDSEL2 SS_CLK UDSEL1 SOFT START RT STB STB1 STB2 STB3 STB4 STB5 STB6 STB7 UVLO VBAT Fig. 4(1) Application Circuit for NiH2 2cell ※ Note The following application circuit is recommended. Make sure to confirm its characteristics. When making changes to the external components, make sure to leave adequate margin such as static and transitional characteristics, as well as dispersion of the IC. REV. D SCP VCC GND 9/21 UNREG 2.5~4.2V VREGA REG A PVCC U.V.L.O To Control Block TIMER LATCH S R Q SCP CMOM1,5,6,7 + 2.2V SS Vo1 + VBAT To Driver STB1 VBAT Vo1 (Feed Back 1ch) Start-Up OSC ERRCOMP1 INV1 Hx1 + + ERRAMP1 0.8V CH1 Step up Pch DRIVER /down PVCC Current mode control BG CTL Nch DRIVER Lx1 5.0V for Analog,IC PGND12 STEP UP/DOWN SELECTOR1 Vo2 PVCC SCPCOMP2 UDSEL1 + Hx2 INV2 + + 0.8V ERRAMP2 CH2 Step up Pch DRIVER /down PVCC Current mode control BG CTL Lx2 Vo2 (Feed Back 2ch) 2.8V for Digital Nch DRIVER STEP UP/DOWN SELECTOR2 Vo3 SCPCOMP3 + UDSEL2 Hx3 INV3 0.8V + + ERRAMP3 CH3 Step down Current mode control Vo4 SCPCOMP4 + Pch DRIVER Lx3 Vo3 (Feed Back 3ch) 1.2V for ASIC PVCC Nch DRIVER Hx4 INV4 + + 0.8V ERRAMP4 CH4 Step up Pch DRIVER /down PVCC Current mode control BG CTL Nch DRIVER Lx4 Vo4 (Feed Back 4ch) 3.4V for Analog PGND34 STEP UP/DOWN SELECTOR4 To ERRAMP VREF UDSEL4 VOLTAGE REFERENNCE VREGA SS5 PVCC5 ERRAMP5 + NON5 Vo5 PWM COMP5 ++ OUT5 Pch DRIVER -8V for CCD HS6H HS6L Rood SW VREGA Vo5 (Feed Back 5ch) Vo6 (Feed Back 6ch) Vo6 INV6 PWM COMP6 -+ + + + 0.8V 12V for CCD PVCC Lx6 Nch DRIVER PGND567 ERRAMP6 HS7H VREGA Rood SW HS7L Vo7 ERRAMP7V INV7 + + 7V,7I priority L 0.8V PWM COMP7 + + + - OUT7 Nch DRIVER LED INV7I + + 0.4V ERRAMP7I INV7I Vo7 (Feed Back 7ch) PVCC For BACK LIGHT OSC UDSEL4 ON/OFF LOGIC UDSEL2 SS_CLK UDSEL1 SOFT START RT STB STB1 STB2 STB3 STB4 STB5 STB6 STB7 UVLO VBAT Fig. 4(2) Application Circuit for Li battery 1cell ※ Note The following application circuit is recommended. Make sure to confirm its characteristics. When making changes to the external components, make sure to leave adequate margin such as static and transitional characteristics, as well as dispersion of the IC. REV. D 10/21 ○ I/O Equivalent Circuit Diagrams Input / Pin. Pin Description Output No Name 26 INV1 I 25 INV2 I Error amp inverting input pin. 27 INV3 I 28 INV4 I 36 INV6 I 38 INV7 I 37 INV7I I 35 NON5 I Error amp non-inverting input pin. 29 RT - Pin circuit Note VCC VCC Connect to resistor to set up the OSC frequency. VCC RT 32 SCP - Connect to capacitor to set up the delay time for the timer-latch. VCC SCP REV. D 11/21 Pin. No 30 Pin Name VREGA Input / Output O Description Pin circuit REGA output voltage VCC Note VCC VREGA 34 VREF O Reference voltage for CH5. VREGA VCC VREF 23 24 3 22 UDSEL1 UDSEL2 UDSEL4 VBAT I I I - Step-up/down switching mode selection H= Step-down L= Step-up Battery input. VBAT UDSEL 13 12 11 10 48 47 39 STB1 STB2 STB3 STB4 STB5 STB6 STB7 I I I I I I I CH1~7 ON/OFF Switches, High = Operating VCC STB REV. D 12/21 Pin. No 14,20,4 15, -16,19,5 17-18,6-7 Input / Pin Description Output Name Hx1, 2,4 O Pch FET source. Lx1, 2,4 O Nch, Pch FET Drain. PGND12, 34 Ground. Pin circuit Note Hx Lx VCC PGND 9 8 Hx3 Lx3 O O Pch FET source Nch, Pch FET Drain Hx3 Lx3 VCC PGND34 21 42 PVCC OUT7 43 PGND567 O - Power supply for Nch Driver. Connect to the gate of CH7 external Nch FET. Ground. VCC PVCC VCC OUT7 VCC PGND567 REV. D 13/21 Pin. No 2 1 Pin Name PVCC5 OUT5 Input / Output 43 PGND567 - O Description Pin circuit Power supply for Driver. Connect to the gate of CH5 external Pch FET. Ground. Note PVCC5 VCC OUT5 PGND567 44 45 Lx6 PGND567 O - Nch FET Drain. Lx6 VCC PGND567 46,40 45,41 HS6H, 7H HS6L, 7L I O Input of PMOS High-side SW. Output of PMOS High-side SW. HS6H,7H HS6L,7L REV. D 14/21 ○ BLOCK DESCRIPTION 1. REGA This is an internal regulator that generates a 2.5V regulated output voltage. REGA supplies power for all the remaining circuit blocks. The output voltage can be supplied to external devices from VREGA (30pin). To prevent any oscillations at the output, a 1μF external capacitor is recommended. 2. Short Circuit Protect, Timer Latch When Error Amp’s output of CH1,5~7 voltages rise beyond 2.2 V, or INV pin voltage of CH2,3,4 fall under 80% of reference, the timer circuit is activated. This will charge up the capacitor connected to SCP (32pin) by approximately 4μA current. When the voltage reaches 1.0 V, the latch circuit is activated. While this protection circuit is activated, the entire channel’s output is turned OFF. In order to reset the latch circuit, two methods can be used: 1) disable the STB pin before enabling it. 2) Removing or refreshing the power supply voltage. 3. U.V.L.O This circuit protects the IC from a transient surge at power-on or a momentary drop of the power supply voltage. Under voltage lockout is activated when the VCC pin voltage falls below 2.4V. During activation, the output drive pins for all Channels is turned OFF. 4. VOLTAGE REFERENCE (VREF) The reference voltage circuit for CH5 generates a 1.0V output voltage. The reference voltage can be supplied from VREF (34pin). This reference voltage is used to set the output voltage of CH5. When STB5 is enable, the reference is ramping to 1V. Inverting voltage of CH5 is following this reference. To prevent any oscillations at the output, a 1μF external capacitor is recommended. 5.OSC The BD9745EKN include a triangular waveform oscillator for voltage-mode PWM controllers, and slope oscillator for current-mode PWM controllers. To set the oscillator frequency, connect a timing resistor to the RT (29 pin). When the resistor is 62kΩ, it is set 1.2MHz(CH1~4), 600kHz(CH5~7). REV. D 15/21 6.SOFT START , SS1 The circuit prevents inrush current in startup by ramping DC/DC output voltage. The soft-start time of each channel is designed below. a. CH1・・・・・・・Typical IC Design’s output startup time is 4.2msec. Only CH1, the startup time doesn’t depend on OSC frequency. b. CH5・・・・・・・The soft start function of CH5 is accomplished by ramping the VREF pin (30pin) from 0V to 1V over period of about 10000 SLOPE cycle(7.7msec at 1.2MHz). c. CH2,3,4,6,7・・・The soft start function of these channel is accomplished by internal reference over period of about 10000 SLOPE cycle(8.5msec at 1.2MHz). 7.ERRAMP 1~7 This amplifier monitors the output voltage of the switching regulator channels and outputs a PWM controlled signal accordingly. ERRAMP1, 2,3,4,6,7’s reference voltage is set by applying voltage of 0.8V. ERRAMP5’s reference voltage connected to GND, ERRAMP7I’s reference voltage is set to 0.4V. And all channels have the R-C component for internal compensation. 8.ERRCOMP , Start Up OSC The Error Comparator monitors the output voltage of the switching regulator and outputs a PFM controlled signal accordingly. The Start Up OSC operates when power supply voltage reaches 1.5V, and is switched ON/OFF by output of ERRCOMP. This OSC oscillates at around 300kHz. When VCC voltage is above 2.6V, or CH1 soft-start time is over, this circuit stops to oscillate. 9.Current mode control block DC/DC converter of CH1~4 operates on current-mode PWM. In current-mode PWM controller, Main FET turn on to detect CLK edge, and turn off to detect a peak current of inductor. Using UDSEL pins, DC/DC converter of CH1~4 is switched to Step-up converter or Step-down converter. 10.PWM COMP The PWM comparators are voltage - pulse width converters that control the output pulse on time according to the input voltage. The circuit supplies a pulse width controlled signal to the driver, by comparing the triangular wave oscillator with the error amplifier’s output voltage. The maximum on-duty is established internally at approximately 85%. REV. D 16/21 11.Nch DRIVER This CMOS inverting output circuit is a Driver block with built-in and external Nch FET. PVCC pin voltage for DRIVER must have same voltage with VCC pin voltage for main block. 12.Pch DRIVER This CMOS inverting output circuit is a Driver block with built-in and external Pch FET. 13.Road SW This circuit controls high-side load switch with CH6, 7. HS6H, 7H (40,46pin) is input, and HS6L, 7L (41,45) is output. This circuit controls by ramping the HS6L, 7L voltage on startup to decrease in-rush current. 14.Back gate Control This circuit controls to switch back-gate voltage of Built-in Pch-FET. (CH1, 2,4) In monolithic IC of P-Sub, the parasitic diode remains between back-gate (cathode), and source, drain (anode). This circuit cut current pass through the parasitic diode in step-up situation on STB OFF. 15.ON/OFF LOGIC The output of each channel can be turned on and off by the input voltage applied on the STB pin. The channel is “ON” when the voltage of the STB pin is above 1.5 V. The channel is “OFF” when the voltage applied at STB pin is 0 V or the pin is left open. When all channels are “OFF”, the device is at Stand-by State. Each logic pin is connected to GND via a 400kΩpull-down resistor. 16.UDSEL LOGIC The output of CH1, 2, 4 can be switched step-down/up by input voltage applied on the UDSEL pin. The output is at step-up mode when UDSEL is GND, and step-down mode when UDSEL is VBAT. UDSEL pin must be connected to GND or VBAT to prevent unstable logic state, due to this logic is CMOS inverter powered VBAT. REV. D 17/21 ○APPLICATION INFORMATION 1.) CH1 Start up sequence. Using step up function in CH1, please take below measure to prevent operation faults and destruction on start-up. a:CH1 output input to VCC It must be put schottky Di between Lx1 and Hx1 to clamp Lx1 voltage the input of VBAT pin must short to VCC line and input through C-R filter. (Ref Fig-7) b:A battery input to VCC, or external power supply input to VCC.(Fig-5) The ERRCOMP circuit that adjust CH1 output voltage on UVLO condition, switches Lx1 NMOS ON/OFF to compare INV1 and soft-start output. In this circuit, if it is late to switch from start up OSC to main current mode control, it is possible that the output voltage is overshot (Ref, Fig-6) As a rule, VCC voltage is applied before applying STB voltage, or applied at the same time. At the worst, when VCC voltage is applied late from STB, UVLO function must be canceled within 1msec from applying STB voltage. STB1 t Within 1msec VCC 2.6V t 0 Fig-5 ● ERRCOMP: To compare SS and INV1 STB1 UVLO and UDSEL ⇒ ON SS Hx1 ON/OFF - Start-Up OSC + Pch DRIVER ERRCOMP Lx1 INV1 + + Nch DRIVER Current mode UVLO ⇒ ON ERRAMP Control Block PGND12 0.8V STB,UVLO Fig - 6 CH1 Block diagram: Start up circuit UDSEL pin of Step-down short to VBAT VCC UDSEL VBAT pin connect to VCC,PVCC line VBAT C Vo1 (Feed Back 1ch) R Hx1 RB551V-30 5.0V CH1 Step up Pch DRIVER /down PVCC Current mode control Nch DRIVER C BG CTL UNREG Lx1 L A parameter of C-R PGND12 Capacitance[uF] PVCC Fig – 7. Recommended application circuit of CH1 REV. D Resistance[Ω] 10 1~10 4.7 2.2~10 1 10 18/21 2.) Applying condition of VBAT voltage. The up/down selector UDSEL1,2,4 is constructed by inverter circuit whose STB power is VBAT, therefore it is possible that operation faults is happen to apply STB voltage without applying VBAT voltage. t As a rule, VBAT voltage is applied before applying STB voltage, or applied at the Within 50μsec same time. At the worst, when VBAT voltage is applied late from STB, VBAT voltage must be applied VBAT within 50μsec from applying STB voltage. t Fig-8 3.) Recommended operating condition of using back-gate control. The DC/DC converters of CH1,2,4 have back-gate control to cut the current pass of pmos parasitic diode. Using the back-gate control, it is limited by the ability of pmos parasitic diode and pmos switching back-gate position. When synchronous rectifying FET is OFF in normal operation and STB OFF, the inductor current flows to Hx through pmos parasitic diode (D2) and pmos switching back-gate position (M2). As a result, the voltage of Lx increase to “output voltage + D2 forward voltage Vf + voltage drop of M2”. When Hx voltage is set to 5V, this voltage exceed absolute maximum voltage of Lx by increasing input current to about 1.2A. So that it is possible to break built-in FET. Fig-10 shows recommended operating area of using back-gate control. When the relation between output voltage and input current is out of range, it must be added schottky barrier diode between Lx and Hx. Using schottky barrier diode, back-gate control can be used not to exceed absolute maximum voltage of Lx. The DC/DC converter of CH1 must be added schottky barrier diode as it is explained in item 1). Hx ( ) 2.0 M2 Normally L ② D2 ( ) OFF M3 Normally H ① Lx M4 1.5A @3.6V 1.5 Input Current ① D2 Forward voltage Vf Input current [A] M1 ON ( ) D1 1.2A @4.2V 1.0 0.8A @5.0V Recommended region 0.5 ② M2 Drop due to On resistance △V 0.0 0 PGND 1 2 3 4 5 6 Output voltage [V] Fig - 10 Recommended operating area of using back-gate Fig - 9 Back gate control 4.) Setting the detection time for the short-circuit-protector (SCP). The detection time for the SCP is user-adjustable by varying the capacitor connected at SCP (pin32). The detection time [sec] = Cscp × Vtsc / Iscp (Cscp : The capacitance、Vtsc : The Threshold voltage SCP、Iscp :The SCP output current) Ex)Cscp = 0.1μF -6 -6 The detection time = 0.1×10 × 1 / {4×10 } = 25msec As the built-in FET breaks by heat in shorting output, it is recommended that the SCP capacitor is used below 0.47μF. REV. D 19/21 5.) Built-in Pch FET(CH1~4,CH67),the drop of current ability in low battery voltage situation The ON resistance of the built-in Pch FET increase because the FET operates in the saturation region below VGS=1.3V. Therefore when CH6, 7 step-up converter or step-down channel from a battery is used below 1.8V, the drop is must be considered. If operating condition below 1.8V should be anticipated, it is recommended that the converter is formed from other channel’s output and is not used high side switch. 100 100 IDS=200mA PMOS ON resistance[Ω] PMOS ON Resistance[Ω] IDS=200mA 10 Recommended region 1 0.1 10 Recommended region 1 0.1 0 1 2 3 4 5 0 1 2 3 4 5 Gate - Source Voltage VGS[V] Gate - Source Voltage VGS[V] b. CH7 Highside Switch a. CH4 Fig - 11 Built-in PMOS ON resistance - VGS 6.) Setting the oscillator frequency. The oscillator frequency is user-adjustable by varying the resistor connected to RT (29pin). The CH1~4 frequency is set 1.2MHz to connect 62kΩ,and the RT value is inverse proportional relation to the frequency. The CH5~7 frequency is set half value of the CH1~4 frequency. Fig.12 shows the relation the RT value and the frequency. Oscillator frequency [kHz] 10000 CH1~4 1000 CH5~6 100 10 100 RT [kΩ] Fig -12 Oscillator frequency – RT resister (EX) REV. D 1000 20/21 7.) Setting the output voltage. a. Setting for positive to negative converter (CH5). VREF R1 ERROR AMP5 NON5 + - R2 NON is connected to GND . CH5 output Fig-13 setting for CH5 feed back resistor The reference of CH5 Error AMP is internally connected to ground. So the high accuracy regulator can be formed up to set up a resistor divider to Fig.13, It is recommended that R1 resistance is over 20kΩ, because current ability of VREF is about 100μA. = - CH5 output R2 R1 × VREF ( = 1V ) = - R2 (Example) R1 = 20kΩ, R2 = 160kΩ R1 CH5 output = -8.0V b. Setting the feed back of CH7 Vo7 CH7 Output R1 INV7 ERROR AMP7V + R2 0.8V Io7 Priority L INV7I ERROR AMP7I + R3 0.4V Fig -14 Setting for Voltage and current of CH7. CH7 has two ERRORAMP whose reference is different. ERROR AMP 7I controls constant current feed back for LED Back light, and ERRORAMP7V controls over voltage feed back and constant voltage feedback. Each ERRORAMP setting shows below formula. CH7 output current = CH7 output voltage = 0.4V R3 R1+R2 R2 (Example R3 = 20Ω⇒ Io7 = 20mA) × 0.8V (Example R1 =180kΩ, R2=15kΩ⇒Vo7=13V) The lower output of two ERRAMP controls the DC/DC output. There fore, if it is used only one ERRORAMP, other ERRORAMP input must be shorted to GND. REV. D 21/21 ○Operation Notes 1.) Absolute maximum ratings This product is produced with strict quality control. However, the IC may be destroyed if operated beyond its absolute maximum ratings. If the device is destroyed by exceeding the recommended maximum ratings, the failure mode will be difficult to determine. (E.g. short mode, open mode) Therefore, physical protection counter-measures (like fuse) should be implemented when operating conditions beyond the absolute maximum ratings anticipated. 2.) GND potential Make sure GND is connected at lowest potential. All pins except NON5, must not have voltage below GND. Also, NON5 pin must not have voltage below - 0.3V on start up. 3.) Setting of heat Make sure that power dissipation does not exceed maximum ratings. 4.) Pin short and mistake fitting Avoid placing the IC near hot part of the PCB. This may cause damage to IC. Also make sure that the output-to-output and output to GND condition will not happen because this may damage the IC. 5.) Actions in strong magnetic field Exposing the IC within a strong magnetic field area may cause malfunction. 6.) Mutual impedance Use short and wide wiring tracks for the main supply and ground to keep the mutual impedance as small as possible. Use inductor and capacitor network to keep the ripple voltage minimum. 7.) Voltage of STB pin The threshold voltages of STB pin are 0.3V and 1.5V. STB state is set below 0.3V while action state is set beyond 1.5V. The region between 0.3V and 1.5V is not recommended and may cause improper operation. The rise and fall time must be under 10msec. In case to put capacitor to STB pin, it is recommended to use under 0.01μF. 8.) Thermal shutdown circuit (TSD circuit) The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. 9.)IC Terminal Input This IC is a monolithic IC that has a P- board and P+ isolation for the purpose of keeping distance between elements. A P-N junction is formed between the P-layer and the N-layer of each element, and various types of parasitic elements are then formed. For example, an application where a resistor and a transistor are connected to a terminal (shown in Fig.15): ○ When GND > (terminal A) at the resistor and GND > (terminal B) at the transistor (NPN), the P-N junction operates as a parasitic diode. ○When GND > (terminal B) at the transistor (NPN), a parasitic NPN transistor operates as a result of the NHayers of other elements in the proximity of the aforementioned parasitic diode. Parasitic elements are structurally inevitable in the IC due to electric potential relationships. The operation of parasitic elements induces the interference of circuit operations, causing malfunctions and possibly the destruction of the IC. Please be careful not to use the IC in a way that would cause parasitic elements to operate. For example, by applying a voltage that is lower than the GND (P-board) to the input terminal. Transistor (NPN) B (Terminal B)C Resistor (Terminal A) E GND (TerminalA) P P+ N N P-board P P+ P+ N N N Parasitic element ~ N P+ Parasitic element N P-board Parasitic element GND Fig - 15 Simplified structure of a Bipolar IC REV. D GND Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. 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