Cypress BCM4390DKWBG Wicedâ ¢ wi-fi ieee 802.11 b/g/n soc with embedded application processor Datasheet

ADVANCE
CYW4390
WICED™ Wi-Fi IEEE 802.11 b/g/n SoC
with Embedded Application Processor
The Cypress CYW4390 is a single-chip device that provides the highest level of integration for applications targeting the Internet of
Things and provides a complete embedded wireless system solution included in a system-on-a-chip (SOC). The CYW4390 device
supports all the rates specified in the IEEE 802.11 b/g/n specifications. Included on-chip are an ARM Cortex-based applications
processor, single stream IEEE 802.11n MAC/baseband/radio, a 2.4 GHz transmit power amplifier (PA), and a receive low-noise
amplifier (LNA). It also supports optional antenna diversity for improved RF performance in difficult environments.
CYW4390 is an optimized SoC targeting embedded applications in the industrial and medical sensor, home appliances and, generally,
internet-of-things space.
Using advanced design techniques and process technology to reduce active and idle power, the CYW4390 is designed to address
the needs of embedded devices that require minimal power consumption and compact size.
It includes a power management unit which simplifies the system power topology and allows for direct operation from a battery for
battery powered applications while maximizing battery life.
Cypress Part Numbering Scheme
Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this conversion,
there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides
Cypress ordering part number that matches an existing IoT part number.
Table 1. Mapping Table for Part Number between Broadcom and Cypress
Broadcom Part Number
Cypress Part Number
BCM4390
CYW4390
BCM4390DKWBG
CYW4390DKWBG
BCM4390DKWBGT
CYW4390DKWBGT
Acronyms and Abbreviations
In most cases, acronyms and abbreviations are defined on first use.
For a comprehensive list of acronyms and other terms used in Cypress documents, go to http://www.cypress.com/glossary.
Features
General Features
■
Supports battery voltage range from 3.0V to 5.25V supplies
with internal switching regulator.
■
Programmable dynamic power management
■
6k-bit OTP for storing board parameters
■
Package options: 286 bump WLCSP (4.87 mm x 5.413 mm;
0.2 mm pitch)
■
Supports IEEE 802.15.2 external coexistence interface to
optimize bandwidth utilization with other co-located wireless
technologies such as Bluetooth, LTE, GPS, or WiMAX.
■
Integrated ARMCR4™ processor with tightly coupled memory
for complete WLAN subsystem functionality, minimizing the
need to wake up the applications processor for standard WLAN
functions (to further minimize power consumption while
maintaining the ability to upgrade to future features in the field)
■
Software architecture supported by standard WICED SDK to
allow easy migration from existing discrete MCU designs and
to future devices
Key IEEE 802.11x Features
■
IEEE 802.11n compliant
■
Single-stream spatial multiplexing up to 72 Mbps data rate
■
Supports 20 MHz channels with optional SGI.
■
Full IEEE 802.11 b/g legacy compatibility with enhanced performance
■
Tx and Rx low-density parity check (LDPC) support for
improved range and power efficiency
■
On-chip power and low-noise amplifiers.
■
Internal fractional nPLL allows support for a wide range of
reference clock frequencies.
Cypress Semiconductor Corporation
Document Number: 002-15055 Rev. *E
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised April 21, 2017
ADVANCE
■
Security support:
❐ WPA™ and WPA2™ (Personal) support for powerful encryption and authentication
❐ AES and TKIP in hardware for faster data encryption and
IEEE 802.11i compatibility
CYW4390
Reference WLAN subsystem provides Cisco® Compatible
Extensions (CCX, CCX 2.0, CCX 3.0, CCX 4.0, CCX 5.0)
❐ Supports Wi-Fi Protected Setup and Wi-Fi Easy-Setup
❐
■
Worldwide regulatory support: Global products supported with
worldwide homologated design
■
448 KB RAM for application code and data execution
Application Processor Features
■
ARM Cortex-M3 32-bit RISC processor
Figure 1. Functional Block Diagram
VIO
VBAT
CYW 4390
W L_REG_ON
W LAN
System I/F
W L_JTAG
W L_GPIO
2.4 GHz W LAN Tx
2.4 GHz W LAN
T/R
Switch
CLK_REQ
UART
Application
CPU Host I/F
SPI Flash
I2 S
37.4 M Hz XTAL
Apps_GPIO
IoT Resources
Cypress provides a wealth of data at http://www.cypress.com/internet-things-iot to help you to select the right IoT device for your
design, and quickly and effectively integrate the device into your design. Cypress provides customer access to a wide range of
information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software
updates. Customers can acquire technical documentation and software from the Cypress Support Community website
(http://community.cypress.com/).
Document Number: 002-15055 Rev. *E
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CYW4390
Contents
1. Overview ........................................................................ 4
1.1 Overview ............................................................... 4
1.2 Features ................................................................ 4
1.3 Standards Compliance .......................................... 5
2. Power Supplies and Power Management ................... 6
2.1 CYW4390 PMU Features ...................................... 6
2.2 Power Supply Topology ........................................ 6
2.3 Power Management .............................................. 8
2.4 PMU Sequencing .................................................. 8
2.5 Power-Off Shutdown ............................................. 9
2.6 Power-Up/Power-Down/Reset Circuits ................. 9
3. Frequency References ............................................... 10
3.1 Crystal Interface and Clock Generation .............. 10
3.2 External Frequency Reference ............................ 10
3.3 External 32.768 KHz Low-Power Oscillator ........ 12
4. Applications Microprocessor and Memory Unit ...... 13
4.1 Reset ................................................................... 13
5. Applications Microprocessor Subsystem
External Interfaces ..................................................... 14
5.1 Introduction .......................................................... 14
5.2 SPI Flash Interface .............................................. 16
5.3 UART Interfaces .................................................. 16
5.4 I2S Interface ........................................................ 17
5.5 General Purpose Input and Output ..................... 18
5.6 I2C ....................................................................... 18
6. WLAN Global Functions ............................................ 19
6.1 WLAN CPU and Memory Subsystem .................. 19
6.2 One-Time Programmable Memory ...................... 19
6.3 UART Interface .................................................... 19
6.4 JTAG Interfaces .................................................. 19
6.5 Boot Sequence .................................................... 20
7. Wireless LAN MAC and PHY ..................................... 21
7.1 IEEE 802.11n MAC ............................................. 21
7.2 IEEE 802.11n PHY .............................................. 24
8. WLAN Radio Subsystem ............................................ 26
8.1 Receiver Path ...................................................... 26
8.2 Transmit Path ...................................................... 26
8.3 Calibration ........................................................... 26
9. Pinout and Signal Descriptions ................................ 27
Document Number: 002-15055 Rev. *E
9.1 Ball Maps ............................................................. 27
9.2 Pin Lists ............................................................... 28
9.3 Signal Descriptions .............................................. 36
9.4 I/O States ............................................................ 40
10. DC Characteristics ................................................... 42
10.1 Absolute Maximum Ratings ............................... 42
10.2 Environmental Ratings ...................................... 42
10.3 Electrostatic Discharge Specifications .............. 43
10.4 Recommended Operating Conditions and
DC Characteristics ............................................ 44
11. WLAN RF Specifications .......................................... 45
11.1 Introduction ........................................................ 45
11.2 2.4 GHz Band General RF Specifications ......... 45
11.3 WLAN 2.4 GHz Receiver Performance
Specifications ................................................... 46
11.4 WLAN 2.4 GHz Transmitter Performance
Specifications ................................................... 48
11.5 General Spurious Emissions Specifications ...... 49
12. Internal Regulator Electrical Specifications .......... 50
12.1 Core Buck Switching Regulator ......................... 50
12.2 3.3V LDO (LDO3P3) ......................................... 51
12.3 CLDO ................................................................ 52
12.4 LNLDO .............................................................. 53
13. System Power Consumption ................................... 54
13.1 WLAN Current Consumption ............................. 55
13.2 JTAG Timing ..................................................... 55
14. Power-Up Sequence and Timing ............................. 56
14.1 Sequencing of Reset and Regulator
Control Signals ................................................. 56
15. Package Information ................................................ 59
15.1 Package Thermal Characteristics ..................... 59
15.2 Junction Temperature Estimation and
PSIJT Versus THETAJC .................................... 59
15.3 Environmental Characteristics ........................... 59
16. Mechanical Information ........................................... 60
17. Ordering Information ................................................ 62
Document History .......................................................... 63
Sales, Solutions, and Legal Information ...................... 64
Page 3 of 64
ADVANCE
CYW4390
1. Overview
1.1 Overview
The Cypress CYW4390 is a single-chip device that provides the highest level of integration for an embedded system-on-a-chip with
integrated IEEE 802.11 b/g/n MAC/baseband/radio and a separate ARM-Cortex M3 applications processor. It provides a small formfactor solution with minimal external components to drive down cost for mass volumes and allows for an embedded system with
flexibility in size, form, and function. Comprehensive power management circuitry and software ensure the system can meet the needs
of highly embedded systems that require minimal power consumption and reliable operation.
Figure 2 shows the interconnect of all the major physical blocks in the CYW4390 and their associated external interfaces, which are
described in greater detail in the following sections.
Figure 2. Block Diagram and IO
SPI (Flash)
CYW4390
GPIO_B[0:11]
RF Tx
2‐Wire UART4
RF Rx
2x4‐Wire UART1/2
2‐Wire UART3
2
ARM
Cortex‐M3
48 MHz
WLAN
Core
802.11n
448 KB
RAM
1x1
2.4 GHz
IS
GPIO_A[0:11]
2
IC
Tx/Rx Switch Control
Antenna Diversity
SPI Master/Slave
3V3
JTAG
GND
WAKE
RESET_N
1.2 Features
The CYW4390 supports the following features:
■
ARM Cortex-M3 clocked at 48 MHz
■
448 KB of SRAM available for the applications processor
■
Two high-speed 4-wire UART interfaces with operation up to 4 Mbps
■
Two low-speed 2-wire UART interfaces
■
One generic SPI master/slave interface with operation up to 24 MHz
■
One SPI master interface for serial flash
■
One I2C interface
■
One I2S interface
■
24 x GPIOs (12 dedicated,12 with alternate functions)
■
IEEE 802.11 b/g/n 1x1 2.4 GHz radio
■
Single- and dual-antenna support
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CYW4390
1.3 Standards Compliance
The CYW4390 supports the following standards:
■
IEEE 802.11n
■
IEEE 802.11b
■
IEEE 802.11g
■
IEEE 802.11d
■
IEEE 802.11h
■
IEEE 802.11i
■
Security:
❐ WEP
❐ WPA™ Personal
❐ WPA2™ Personal
❐ WMM
❐ WMM-PS (U-APSD)
❐ WMM-SA
❐ AES (hardware accelerator)
❐ TKIP (hardware accelerator)
❐ CKIP (software support)
Proprietary Protocols:
❐ CCXv2
❐ CCXv3
❐ CCXv4
❐ CCXv5
❐ WFAEC
The CYW4390 supports the following additional standards:
■
■
IEEE 802.11r—fast roaming (between APs)
■
IEEE 802.11w—secure management frames
■
IEEE 802.11 Extensions:
❐ IEEE 802.11e QoS enhancements (as per the WMM® specification is already supported)
❐ IEEE 802.11i MAC enhancements
❐ IEEE 802.11k radio resource measurement
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CYW4390
2. Power Supplies and Power Management
2.1 CYW4390 PMU Features
■
VBAT to 1.35Vout (275 mA nominal, 600 mA maximum) Core-Buck (CBUCK) switching regulator
■
VBAT to 3.3Vout (200 mA nominal, 450 mA maximum) LDO3P3
■
1.35V to 1.2Vout (100 mA nominal, 150 mA maximum) LNLDO
■
1.35V to 1.2out (175 mA nominal, 300 mA maximum) CLDO with bypass mode for deep sleep
■
Additional internal LDOs (not externally accessible)
2.2 Power Supply Topology
One buck regulator, multiple LDO regulators, and a power management unit (PMU) are integrated into the CYW4390. All regulators
are programmable via the PMU. These blocks simplify power supply design for embedded designs.
A single VBAT (3.0V to 5.25V DC max) and VIO supply (1.8V to 3.3V) can be used, with all additional voltages being provided by the
regulators in the CYW4390.
Two control signals, APPS_REG_ON and WL_REG_ON, are used to power-up the regulators and take the respective core out of
reset. The CBUCK CLDO and LNLDO power up when any of the reset signals are deasserted. All regulators are powered down only
when both APPS_REG_ON and WL_REG_ON are deasserted. The applications processor can drive WL_REG_ON internally when
the pin is externally tied to ground. The CLDO and LNLDO may be turned off/on based on the dynamic demands of the application.
The CYW4390 allows for an extremely low power-consumption mode by completely shutting down the CBUCK, CLDO, and LNLDO
regulators. When in this state, LPLDO1 and LPLDO2 (which are low-power linear regulators that are supplied by the system VIO
supply) provide the CYW4390 with all the voltages it requires, further reducing leakage currents.
Figure 3 shows the regulators and a typical power topology.
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ADVANCE
CYW4390
Figure 3. Typical Power Topology
Areas with hatching are
off‐chip
CYW4390
Internal LNLDO
1.2V
WL RF – AFE
Internal LNLDO
1.2V
WL RF – TX (2.4 GHz)
Internal VCOLDO
1.2V
WL RF – LOGEN (2.4 GHz)
Internal LNLDO
1.2V
WL RF – RX/LNA (2.4 GHz)
XTAL LDO
1.2V
LNLDO
1.2V
(80 mA)
(80 mA)
(80 mA)
(80 mA)
WL_REG_ON
APPS_REG_ON
VBAT
Core Buck
Regulator
CBUCK
Off‐chip
area
1.35V
Peak 600 mA
Average 275 mA
(30 mA)
(10 mA)
WL RF – XTAL
WL RF – RFPLL PFD/MMD
APPS ANALOG
Off‐chip area
WLAN BBPLL/DFLL
WLAN/APPS CPU/CLB/Top
(Always on)
WL OTP
VDDIO
LPDO1
(3 mA)
WL PHY
CLDO
1.1V
Peak 300 mA
Average 175 mA
(Bypass in deep‐sleep)
WL DIGITAL
1.2—1.1V
APPS CPU DIGITAL
WL/APPS CPU SRAMs
VDDIO
MEMLPLDO
(3 mA)
0.9V
WL PA/PAD (2.4 GHz)
VDDIO_RF
WL OTP 3.3V
VBAT
LDO3P3
Peak 800–450 mA
Average 200 mA
3.3V
Internal
LNLDO
2.5V
WL RF – VCO
Internal
LNLDO
2.5V
WL RF – CP
(25 mA)
(8 mA)
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CYW4390
2.3 Power Management
The CYW4390 has been designed with the stringent power consumption requirements of embedded devices in mind. All areas of the
chip design are optimized to minimize power consumption. Silicon processes and cell libraries were chosen to reduce leakage current
and supply voltages. Additionally, the CYW4390 integrated RAM is a high Vt memory with dynamic clock control. The dominant supply
current consumed by the RAM is leakage current only. The CYW4390 also includes an advanced WLAN power management unit
(PMU) sequencer. The PMU sequencer provides significant power savings by putting the CYW4390 into various power management
states appropriate to the current environment and activities that are being performed. The power management unit enables and
disables internal regulators, switches, and other blocks based on a computation of the required resources and a table that describes
the relationship between resources and the time needed to enable and disable them. Power up sequences are fully programmable.
Configurable, free-running counters (running at 32.768 kHz LPO clock) in the PMU sequencer are used to turn on/turn off individual
regulators and power switches. Clock speeds are dynamically changed (or gated altogether) for the current mode. Slower clock
speeds are used wherever possible.
The CYW4390 WLAN-specific power states are described as follows:
■
Active mode— All WLAN blocks in the CYW4390 are powered up and fully functional with active carrier sensing and frame transmission and receiving. All required regulators are enabled and put in the most efficient mode based on the load current. Clock
speeds are dynamically adjusted by the PMU sequencer.
■
Doze mode—The radio, analog domains, and most of the linear regulators are powered down. The rest of the WLAN portion of the
CYW4390 remains powered up in an IDLE state. All main clocks (PLL, crystal oscillator or TCXO) are shut down to reduce active
power to the minimum. The 32.768 kHz LPO clock is available only for the PMU sequencer. This condition is necessary to allow the
PMU sequencer to wake up the chip and transition to Active mode. In Doze mode, the primary power consumed by the WLAN core
is due to leakage current.
■
Deep-sleep mode—Most of the chip including both analog and digital domains and most of the regulators are powered off. Logic
states in the digital core are saved and preserved into a retention memory in the always-ON domain before the digital core is powered
off. Upon a wake-up event triggered by the PMU timers or an external interrupt, logic states in the digital core are restored to their
pre-deep-sleep settings to avoid lengthy HW reinitialization.
■
Power-down mode—The CYW4390 is effectively powered off by shutting down all internal regulators. The chip is brought out of
this mode by external logic re-enabling the internal regulators.
The CYW4390 application processor subsystem can be independently powered on or off at the system level in the power-down mode.
In addition it is also possible to keep the application processor in active mode while the WLAN blocks are in Doze or Deep-Sleep.
2.4 PMU Sequencing
The PMU sequencer is responsible for minimizing system power consumption. It enables and disables various system resources
based on a computation of the required resources and a table that describes the relationship between resources and the time needed
to enable and disable them.
Resource requests may come from several sources: clock requests from cores, the minimum resources defined in the ResourceMin
register, and the resources requested by any active resource request timers. The PMU sequencer maps clock requests into a set of
resources required to produce the requested clocks.
Each resource is in one of four states: enabled, disabled, transition_on, and transition_off and has a timer that contains 0 when the
resource is enabled or disabled and a non-zero value in the transition states. The timer is loaded with the time_on or time_off value
of the resource when the PMU determines that the resource must be enabled or disabled. That timer decrements on each 32.768 kHz
PMU clock. When it reaches 0, the state changes from transition_off to disabled or transition_on to enabled. If the time_on value is
0, the resource can go immediately from disabled to enabled. Similarly, a time_off value of 0 indicates that the resource can go
immediately from enabled to disabled. The terms enable sequence and disable sequence refer to either the immediate transition or
the timer load-decrement sequence.
During each clock cycle, the PMU sequencer performs the following actions:
■
Computes the required resource set based on requests and the resource dependency table.
■
Decrements all timers whose values are non zero. If a timer reaches 0, the PMU clears the ResourcePending bit for the resource
and inverts the ResourceState bit.
■
Compares the request with the current resource status and determines which resources must be enabled or disabled.
■
Initiates a disable sequence for each resource that is enabled, no longer being requested, and has no powered up dependents.
■
Initiates an enable sequence for each resource that is disabled, is being requested, and has all of its dependencies enabled.
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CYW4390
2.5 Power-Off Shutdown
The CYW4390 provides a low-power shutdown feature that allows the device to be turned off. When the CYW4390 is not needed in
the system, VDDIO_RF and VDDC are shut down while VDDIO remains powered. This allows the CYW4390 to be effectively off while
keeping the I/O pins powered so that they do not draw extra current from any other devices connected to the I/O.
During a low-power shut-down state, provided VDDIO remains applied to the CYW4390, all outputs are tristated, and most inputs
signals are disabled. Input voltages must remain within the limits defined for normal operation. This is done to prevent current paths
or create loading on any digital signals in the system, and enables the CYW4390 to be fully integrated in an embedded device and
take full advantage of the lowest power-savings modes.
When the CYW4390 is powered on from this state, it is the same as a normal power-up and the device does not retain any information
about its state from before it was powered down.
2.6 Power-Up/Power-Down/Reset Circuits
The CYW4390 has two signals (see Table 2) that enable or disable the application CPU and WLAN subsystems and the internal
regulator blocks, allowing external system circuitry to control power consumption. For timing diagrams of these signals and the
required power-up sequences, see Power-Up Sequence and Timing on page 56.
Table 2. Power-Up/Power-Down/Reset Control Signals
Signal
Description
WL_REG_ON
This signal is used by the PMU (with APPS_REG_ON) to power up the WLAN section. It is also OR-gated with
the APPS_REG_ON input to control the internal CYW4390 regulators. When this pin is high, the regulators
are enabled and the WLAN section is out of reset. When this pin is low, the WLAN section is in reset. If
APPS_REG_ON and WL_REG_ON are both low, the regulators are disabled. This pin has an internal 200 kΩ
pull-down resistor that is enabled by default. It can be disabled through programming.
APPS_REG_ON
This signal is used by the PMU (with WL_REG_ON) to decide whether or not to power down the internal
CYW4390 regulators. If APPS_REG_ON and WL_REG_ON are low, the regulators will be disabled. This pin
has an internal 200 kΩ pull-down resistor that is enabled by default. It can be disabled through programming.
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CYW4390
3. Frequency References
An external crystal is used for generating all radio frequencies and normal operation clocking. As an alternative, an external frequency
reference may be used. In addition, a low-power oscillator (LPO) is provided for lower power mode timing.
3.1 Crystal Interface and Clock Generation
The CYW4390 can use an external crystal to provide a frequency reference. The recommended configuration for the crystal oscillator
including all external components is shown in Figure 4. Consult the reference schematics for the latest configuration.
Figure 4. Recommended Oscillator Configuration
C
WRF_XTAL_IN
12–27 pF
37.4 MHz
C
X ohms*
WRF_XTAL_OUT
12–27 pF
* Resistor value
determined by crystal
drive level. See reference
schematics for details.
A fractional-N synthesizer in the CYW4390 generates the radio frequencies, clocks, and data/packet timing, enabling it to operate
using a wide selection of frequency references.
The recommended default frequency reference is a 37.4 MHz crystal. The signal characteristics for the crystal interface are listed in
Table 3 on page 11.
Note: Although the fractional-N synthesizer can support alternative reference frequencies, frequencies other than the default require
support to be added in the driver, plus additional extensive system testing. Contact Cypress for further details.
3.2 External Frequency Reference
As an alternative to a crystal, an external precision frequency reference can be used, provided that it meets the Phase Noise requirements listed in Table 3.
If used, the external clock should be connected to the WRF_XTAL_IN pin through an external 1000 pF coupling capacitor, as shown
in Figure 5. The internal clock buffer connected to this pin will be turned OFF when the CYW4390 goes into sleep mode. When the
clock buffer turns ON and OFF there will be a small impedance variation. Power must be supplied to the WRF_XTAL_BUCK_VDD1P5
pin.
Figure 5. Recommended Circuit to Use with an External Reference Clock
1000 pF
Reference
Clock
WRF_XTAL_IN
NC
Document Number: 002-15055 Rev. *E
WRF_XTAL_OUT
Page 10 of 64
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CYW4390
Table 3. Crystal Oscillator and External Clock – Requirements and Performance
Parameter
Min
Frequency
IEEE 802.11 b/g/n operation
Frequency tolerance
over the lifetime of the
equipment, including
temperaturee
Without trimming
External Frequency Referenceb c
Crystala
Conditions/Notes
Typ
Max
Min
Typ
Max
Units
Between 19 MHz and 52 MHzd
–20
–
20
–20
–
20
ppm
–
–
12
–
–
–
–
pF
–
–
–
60
–
–
–
Ω
200
–
–
–
–
–
µW
Resistive
–
–
–
30K
100K
–
Ω
Capacitive
–
–
7.5
–
–
7.5
pF
WRF_XTAL_IN
Input low level
DC-coupled digital signal
–
–
–
0
–
0.2
V
WRF_XTAL_IN
Input high level
DC-coupled digital signal
–
–
–
1.0
–
1.26
V
WRF_XTAL_IN
input voltage
(see Figure 5)
AC-coupled analog signal
–
–
–
400
–
1200
mVp-p
Duty cycle
37.4 MHz clock
–
–
–
40
50
60
%
Phase Noisef
(IEEE 802.11b/g)
37.4 MHz clock at 10 kHz offset
–
–
–
–
–
–129
dBc/Hz
37.4 MHz clock at 100 kHz offset
–
–
–
–
–
–136
dBc/Hz
37.4 MHz clock at 10 kHz offset
–
–
–
–
–
–134
dBc/Hz
37.4 MHz clock at 100 kHz offset
–
–
–
–
–
–141
dBc/Hz
Crystal load capacitance
ESR
External crystal must be able to
tolerate this drive level.
Drive level
Input impedance
(WRF_XTAL_IN)
f
Phase Noise
(IEEE 802.11n,
2.4 GHz)
a.
b.
c.
d.
e.
f.
(Crystal) Use WRF_XTAL_IN and WRF_XTAL_OUT.
See External Frequency Reference on page 10 for alternative connection methods.
For a clock reference other than 37.4 MHz, 20 × log10(f/ 37.4) dB should be added to the limits, where f = the reference clock frequency in MHz.
The frequency step size is approximately 80 Hz resolution.
It is the responsibility of the equipment designer to select oscillator components that comply with these specifications.
Assumes that external clock has a flat phase noise response above 100 kHz.
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CYW4390
3.3 External 32.768 KHz Low-Power Oscillator
The CYW4390 uses a secondary low frequency clock for low-power-mode timing. Either the internal low-precision LPO or an external
32.768 kHz precision oscillator is required. The internal LPO frequency range is approximately 33 kHz ± 30% over process, voltage,
and temperature, which is adequate for some applications. However, one trade-off caused by this wide LPO tolerance is a small
current consumption increase during power save mode that is incurred by the need to wake up earlier to avoid missing beacons.
Whenever possible, the preferred approach is to use a precision external 32.768 kHz clock that meets the requirements listed in Figure
4 on page 12.
The external 32.768 kHz crystal provides:
■
A real-time clock for the apps core
■
Accurate timing for the WLAN power-save modes
Table 4. External 32.768 kHz Sleep Clock Specifications
Parameter
Nominal input frequency
LPO Clock
Units
32.768
kHz
Frequency accuracy
±100
ppm
Duty cycle
30–70
%
200–1800
mV, p-p
Input signal amplitude
Signal type
Input impedancea
Clock jitter (during initial start-up)
Square-wave or sine-wave
–
>100K
<5
Ω
pF
<10,000
ppm
a. When power is applied or switched off.
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4. Applications Microprocessor and Memory Unit
The applications microprocessor core is based on the ARM® Cortex-M3™ 32-bit RISC processor with embedded ICE-RT debug and
JTAG interface units.
The applications processor boots from an internal ROM-based bootloader. The ROM bootloader copies a configurable boot application
from serial-flash to RAM, then passes execution to the boot application. The applications processor is responsible for running the
entirety of the WICED software stack, including the optional RTOS, WLAN driver, various libraries to implement WLAN, networking
features, and the end-user application.
The 48 MHz processor operates efficiently in both power and performance with tightly-coupled SRAM of 448 KB to provide space for
code execution and system resource and variable storage.
The application processor controls the peripheral I/O of the CYW4390, including a dedicated SPI flash interface, SPI master/slave
interface, GPIOs, I2C, I2S, and four UARTs. The application processor is also responsible for bootstrapping the WLAN core, including
downloading the WLAN firmware from external serial flash storage.
The CYW4390 does not have internal flash storage: all code is stored and loaded from external serial flash.
In addition to the dedicated SPI interface to serial flash, the CYW4390 provides a secondary master/slave SPI interface to allow
expansion with other devices.
To reduce overall system power consumption, the application processor can be powered down independently of the WLAN core.
During powerdown, the state of the entire 448 KB of Applications RAM is retained.
4.1 Reset
The CYW4390 has an integrated power-on reset circuit that resets all circuits to a known power-on state. The power-on reset (POR)
circuit is out of reset after APPS_REG_ON goes High. If APPS_REG_ON is low, then the POR circuit is held in reset.
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5. Applications Microprocessor Subsystem External Interfaces
5.1 Introduction
The CYW4390 provides a large variety of IO interfaces to enable flexible system design:
■
A SPI master for flash access
■
A SPI master/slave
■
Two high-speed 4-wire UARTs
■
Two 2-wire UART available for use by the Apps core (and WLAN core for debugging)
■
An I2C interface
■
An I2S interface
■
Up to 24 GPIOs organized in two separate banks of 12. GPIOs in Bank A have alternate functions (see Table 5 on page 15), GPIOs
in Bank B are dedicated.
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Table 5. GPIO Port A Alternate Functions
Name
Alternate Functions
UART1
UART2
UART3
SPI
I2C
I2S
GPIO
DEBUG
APPS_I2S_DO
–
UART2_CTS_N
UART3_TX/RX
–
–
I2S_DO
GPIO_A8
–
APPS_I2S_DI
–
UART2_RTS_N
UART3_TX/RX
–
–
I2S_DI
GPIO_A6
–
APPS_I2S_CLK
–
UART2_RXD
UART3_TX/RX
–
–
I2S_CLK
GPIO_A9
–
–
UART2_TXD
–
I2S_WS
APPS_I2S_WS
GPIO_A7
–
APPS_UART1_CTS_N
UART1_CTS_N
–
UART3_TX/RX
UART3_TX/RX
SPI_CLK
–
–
GPIO_A1
–
APPS_UART1_RTS_N
UART1_RTS_N
–
UART3_TX/RX
SPI_CS_N
–
–
GPIO_A0
–
APPS_UART1_RXD
UART1_RXD
–
UART3_TX/RX
SPI_MISO
I2C_SDA
–
GPIO_A5
–
APPS_UART1_TXD
UART1_TXD
SPI_MOSI
I2C_SCL
–
UART3_TX/RX
APPS_WAKE
–
–
UART3_TX/RX
APPS_SPI_IRQ
–
–
UART3_TX/RX
APPS_JTAG_TMS
–
–
UART3_TX/RX
–
–
SPI_IRQ
–
–
GPIO_A4
–
–
–
GPIO_A10
–
–
–
GPIO_A11
–
GPIO_A2
JTAG_TMS
–
I2S_DO
APPS_JTAG_TCK
–
–
UART3_TX/RX
–
–
I2S_DI
GPIO_A3
JTAG_TCK
APPS_JTAG_TDI
–
–
UART3_TX/RX
–
–
I2S_CLK
GPIO_A4
JTAG_TDI
APPS_JTAG_TDO
–
–
UART3_TX/RX
–
–
I2S_WS
GPIO_A5
JTAG_TDO
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5.2 SPI Flash Interface
The CYW4390 provides a dedicated SPI interface that connects to an external serial flash with a maximum clock speed of 24 MHz.
Use of the SPI flash interface is mandatory for self-hosted systems booting an application that runs on the Application processor.
5.2.1 SPI Master/Slave Interface
In addition to the SPI flash interface the CYW4390 supports a secondary SPI interface with a clock frequency of up to 24 MHz to
support external SPI peripherals. This interface can be configured either as a master or a slave interface. The SPI interface has various
configuration options including support for active-low or active-high operation for the chip-select, active-low or active-high operation
for the interrupt line and bit ordering on the MISO/MOSI lines to be either big endian or little endian.
5.3 UART Interfaces
UART1 and UART2 have standard 4-wire interfaces (RX, TX, RTS, and CTS) with adjustable baud rates from 9600 bps to 4.0 Mbps.
UART1 has a 1040-byte receive FIFO and a 1040-byte transmit FIFO to support high data throughput. UART2 has a smaller FIFO
that is only 256-bytes. Access to the FIFOs is available to the application processor through the AHB interface and supports either
DMA or CPU driven data transfer.
The CYW4390 UART can perform XON/XOFF flow control and includes hardware support for the Serial Line Input Protocol (SLIP).
It can also perform wake-on activity. For example, activity on the RX or CTS inputs can wake the chip from a sleep state.
The CYW4390 UARTs can operate correctly with other devices as long as the combined baud rate error of the two devices is within
±2%.
Table 6. Example of Common Baud Rates
Desired Rate
Actual Rate
Error (%)
4000000
4000000
0.00
3692000
3692308
0.01
3000000
3000000
0.00
2000000
2000000
0.00
1500000
1500000
0.00
1444444
1454544
0.70
921600
923077
0.16
460800
461538
0.16
230400
230796
0.17
115200
115385
0.16
57600
57692
0.16
38400
38400
0.00
28800
28846
0.16
19200
19200
0.00
14400
14423
0.16
9600
9600
0.00
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The UART timing is shown by the combination of Figure 6 and Table 7.
Figure 6. UART Timing
UART_CTS_N
1
2
UART_TXD
Midpoint of STOP bit
Midpoint of STOP bit
UART_RXD
3
UART_RTS_N
Table 7. UART Timing Specifications
Ref No.
Min.
Typ.
Max.
Unit
1
Delay time, UART_CTS_N low to UART_TXD valid
Characteristics
–
–
1.5
Bit periods
2
Setup time, UART_CTS_N high before midpoint of stop bit
–
–
0.5
Bit periods
3
Delay time, midpoint of stop bit to UART_RTS_N high
–
–
0.5
Bit periods
5.4 I2S Interface
The CYW4390 has one I2S digital audio port, which supports both master and slave modes.
The I2S SCK and I2S WS (clock and word select) become outputs in master mode and inputs in slave mode, while the I2S SDO is
always output.
The channel word length is 16 bits and the data is justified so that the MSB of the left-channel data is aligned with the MSB of the I2S,
per the I2S specification. The MSB of each data word is transmitted one-bit clock cycle after the I2S WS transition, synchronous with
the falling edge of the bit clock.
Left-channel data is transmitted when I2S WS is low: right-channel data is transmitted when I2S WS is high.
Data bits sent by the CYW4390 are synchronized with the falling edge of I2S_SCLK and should be sampled by the receiver on the
rising edge of I2S_SCK.
In master mode, the clock rate is: 48 KHz x 32 bits per frame = 1.536 MHz.
The master clock is generated from the input reference clock using an N/M clock divider.
In the slave mode, any clock rate up to 3.072 MHz is supported.
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5.5 General Purpose Input and Output
The CYW4390 has 24 general purpose IO (GPIO) pins that can be configured as input or output. Each IO can be configured to have
internal pull-up or pull-down resistors. At power-on reset all IOs are configured as input with no pull. Software can configure the IOs
appropriately. In power-down modes, the IOs are configured as high-Z with no pull.
GPIOs are grouped into two banks of twelve GPIOs:
■
Bank A GPIOs have alternate functions (seeTable 5 on page 15).
■
Bank B GPIOs are dedicated GPIOs, except during test (see Table 8).
Table 8. Bank B GPIO Test Functions
GPIO
Test Function
GPIO_B0
–
GPIO_B1
–
GPIO_B2
WL_JTAG_TCK
GPIO_B3
WL_JTAG_TMS
GPIO_B4
WL_JTAG_TDI
GPIO_B5
WL_JTAG_TDO
GPIO_B6
WL_JTAG_TDO
GPIO_B7
–
GPIO_B8
–
GPIO_B9
–
GPIO_B10
–
GPIO_B11
–
5.6 I2C
TBD
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6. WLAN Global Functions
6.1 WLAN CPU and Memory Subsystem
The CYW4390 WLAN section includes an independent integrated ARM Cortex-R4™ 32-bit processor with internal RAM and ROM.
The ARM Cortex-R4 is a low-power processor that features low gate count, low interrupt latency, and low-cost debug capabilities. It
runs all WLAN firmware and provides support for the standards-compliant WLAN implementation running independent of the applications processor. The Cortex-R4 processor is not available to customers for general purpose applications processing.
At 0.19 μW/MHz, the Cortex-R4 is the most power efficient general-purpose microprocessor available, outperforming 8- and 16-bit
devices on MIPS/μW. It supports integrated sleep modes.
6.2 One-Time Programmable Memory
Various hardware configuration parameters may be stored in an internal 6 Kbit one-time programmable (OTP) memory, which is read
by WICED bootstrap system software after a device reset. In addition, customer-specific parameters, including the system vendor ID
and the MAC address can be stored, depending on the specific board design.
The initial state of all bits in an unprogrammed OTP device is 0. After any bit is programmed to a 1, it cannot be reprogrammed to 0.
The entire OTP array can be programmed in a single write cycle using a utility provided with the Cypress WLAN manufacturing test
tools. Alternatively, multiple write cycles can be used to selectively program specific bytes, but only bits which are still in the 0 state
can be altered during each programming cycle.
Prior to OTP programming, all values should be verified using the appropriate editable nvram.txt file, which is provided with the
reference board design package.
6.3 UART Interface
One 2-wire UART interface can be enabled by software as an alternate function on GPIO pins. Provided primarily for debugging during
WLAN development, this UART enables the CYW4390 to operate as RS-232 data termination equipment (DTE) for exchanging and
managing data with other serial devices. It is compatible with the industry standard 16550 UART, and provides a FIFO size of 64 × 8
in each direction.
6.4 JTAG Interfaces
The CYW4390 applications core and WLAN core have independent support for the IEEE 1149.1 JTAG boundary scan standard for
performing application firmware debugging and device package and PCB assembly testing during manufacturing.
The applications core JTAG port provides developers with single-step thread-aware and memory inspection debugging capability
using the Cypress WICED development system.
The WLAN core JTAG interface allows Cypress to assist customers by using proprietary debug and characterization test tools during
board bring-up. Therefore it is highly recommended to provide access to the JTAG pins by means of test points or a header on all
PCB designs.
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6.5 Boot Sequence
Figure 7 shows the boot sequence from power-up to firmware download.
Figure 7. Boot Sequence
VBAT*
VDDIO
WL_REG_ON
< 950 µs
VDDC
(from internal PMU)
< 104 ms
Internal POR
< 4 ms
Device requests for reference clock
8 ms
After 8 ms the reference clock is
assumed to be up. Access to PLL
registers is possible.
Chip active interrupt is asserted after the PLL locks
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before VBAT is high.
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7. Wireless LAN MAC and PHY
7.1 IEEE 802.11n MAC
The CYW4390 WLAN MAC is designed to support high-throughput operation with low-power consumption. Several power saving
modes have been implemented that allow the MAC to consume very little power while maintaining network-wide timing synchronization. The architecture diagram of the MAC is shown in Figure 8.
The following sections provide an overview of the important modules in the MAC.
Figure 8. WLAN MAC Architecture
Embedded CPU Interface
Host Registers, DMA Engines
TX‐FIFO
32 KB
PMQ
RX‐FIFO
10 KB
PSM
PSM
UCODE
Memory
IFS
Backoff
WEP
TKIP, AES, WAPI
TSF
SHM
BUS
IHR
NAV
BUS
EXT‐ IHR
TXE
TX A‐MPDU
RXE
RX A‐MPDU
Shared Memory
6 KB
MAC‐PHY Interface
The CYW4390 WLAN media access controller (MAC) supports features specified in the IEEE 802.11 base standard, and
amended by IEEE 802.11n. The key MAC features include:
■
Enhanced MAC for supporting IEEE 802.11n features
■
Transmission and reception of aggregated MPDUs (A-MPDU) for high throughput (HT)
■
Support for power management schemes, including WMM power-save, power-save multi-poll (PSMP) and multiphase PSMP
operation
■
Support for immediate ACK and Block-ACK policies
■
Interframe space timing support, including RIFS
■
Support for RTS/CTS and CTS-to-self frame sequences for protecting frame exchanges
■
Back-off counters in hardware for supporting multiple priorities as specified in the WMM specification
■
Timing synchronization function (TSF), network allocation vector (NAV) maintenance, and target beacon transmission time (TBTT)
generation in hardware
■
Hardware offload for AES-CCMP, legacy WPA TKIP, legacy WEP ciphers, WAPI, and support for key management
■
Programmable independent basic service set (IBSS) or infrastructure basic service set functionality
■
Statistics counters for MIB support
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Programmable State Machine
The programmable state machine (PSM) is a microcoded engine, which provides most of the low-level control to the hardware, to
implement the IEEE 802.11 specification. It is a microcontroller that is highly optimized for flow control operations, which are predominant in implementations of communication protocols. The instruction set and fundamental operations are simple and general, which
allows algorithms to be optimized until very late in the design process. It also allows for changes to the algorithms to track evolving
IEEE 802.11 specifications.
The PSM fetches instructions from the microcode memory. It uses the shared memory to obtain operands for instructions, as a data
store, and to exchange data between both the host and the MAC data pipeline (via the SHM bus). The PSM also uses a scratch-pad
memory (similar to a register bank) to store frequently accessed and temporary variables.
The PSM exercises fine-grained control over the hardware engines, by programming internal hardware registers (IHR). These IHRs
are co-located with the hardware functions they control, and are accessed by the PSM via the IHR bus.
The PSM fetches instructions from the microcode memory using an address determined by the program counter, instruction literal,
or a program stack. For ALU operations the operands are obtained from shared memory, scratch pad, IHRs, or instruction literals,
and the results are written into the shared memory, scratch pad, or IHRs.
There are two basic branch instructions: conditional branches and ALU based branches. To better support the many decision points
in the IEEE 802.11 algorithms, branches can depend on either a readily available signals from the hardware modules (branch condition
signals are available to the PSM without polling the IHRs), or on the results of ALU operations.
Wired Equivalent Privacy
The wired equivalent privacy (WEP) engine encapsulates all the hardware accelerators to perform the encryption and decryption, and
MIC computation and verification. The accelerators implement the following cipher algorithms: legacy WEP, WPA TKIP, and WPA2
AES-CCMP.
The PSM determines, based on the frame type and association information, the appropriate cipher algorithm to be used. It supplies
the keys to the hardware engines from an on-chip key table. The WEP interfaces with the TXE to encrypt and compute the MIC on
transmit frames, and the RXE to decrypt and verify the MIC on receive frames.
Transmit Engine
The transmit engine (TXE) constitutes the transmit data path of the MAC. It coordinates the DMA engines to store the transmit frames
in the TXFIFO. It interfaces with WEP module to encrypt frames, and transfers the frames across the MAC-PHY interface at the
appropriate time determined by the channel access mechanisms.
The data received from the DMA engines are stored in transmit FIFOs. The MAC supports multiple logical queues to support traffic
streams that have different QoS priority requirements. The PSM uses the channel access information from the IFS module to schedule
a queue from which the next frame is transmitted. Once the frame is scheduled, the TXE hardware transmits the frame based on a
precise timing trigger received from the IFS module.
The TXE module also contains the hardware that allows the rapid assembly of MPDUs into an A-MPDU for transmission. The hardware
module aggregates the encrypted MPDUs by adding appropriate headers and pad delimiters as needed.
Receive Engine
The receive engine (RXE) constitutes the receive data path of the MAC. It interfaces with the DMA engine to drain the received frames
from the RXFIFO. It transfers bytes across the MAC-PHY interface and interfaces with the WEP module to decrypt frames. The
decrypted data is stored in the RXFIFO.
The RXE module contains programmable filters that are programmed by the PSM to accept or filter frames based on several criteria
such as receiver address, BSSID, and certain frame types.
The RXE module also contains the hardware required to detect A-MPDUs, parse the headers of the containers, and disaggregate
them into component MPDUS.
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Interframe Space
The interframe space (IFS) module contains the timers required to determine interframe space timing including RIFS timing. It also
contains multiple backoff engines required to support prioritized access to the medium as specified by WMM.
The interframe spacing timers are triggered by the cessation of channel activity on the medium, as indicated by the PHY. These timers
provide precise timing to the TXE to begin frame transmission. The TXE uses this information to send response frames or perform
transmit frame-bursting (RIFS or SIFS separated, as within a TXOP).
The backoff engines (for each access category) monitor channel activity, in each slot duration, to determine whether to continue or
pause the backoff counters. When the backoff counters reach 0, the TXE gets notified, so that it may commence frame transmission.
In the event of multiple backoff counters decrementing to 0 at the same time, the hardware resolves the conflict based on policies
provided by the PSM.
The IFS module also incorporates hardware that allows the MAC to enter a low-power state when operating under the IEEE power
save mode. In this mode, the MAC is in a suspended state with its clock turned off. A sleep timer, whose count value is initialized by
the PSM, runs on a slow clock and determines the duration over which the MAC remains in this suspended state. Once the timer
expires the MAC is restored to its functional state. The PSM updates the TSF timer based on the sleep duration ensuring that the TSF
is synchronized to the network.
Timing Synchronization Function
The timing synchronization function (TSF) module maintains the TSF timer of the MAC. It also maintains the target beacon transmission time (TBTT). The TSF timer hardware, under the control of the PSM, is capable of adopting timestamps received from beacon
and probe response frames in order to maintain synchronization with the network.
The TSF module also generates trigger signals for events that are specified as offsets from the TSF timer, such as uplink and downlink
transmission times used in PSMP.
Network Allocation Vector
The network allocation vector (NAV) timer module is responsible for maintaining the NAV information conveyed through the duration
field of MAC frames. This ensures that the MAC complies with the protection mechanisms specified in the standard.
The hardware, under the control of the PSM, maintains the NAV timer and updates the timer appropriately based on received frames.
This timing information is provided to the IFS module, which uses it as a virtual carrier-sense indication.
MAC-PHY Interface
The MAC-PHY interface consists of a data path interface to exchange RX/TX data from/to the PHY. In addition, there is an
programming interface, which can be controlled either by the host or the PSM to configure and control the PHY.
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7.2 IEEE 802.11n PHY
The CYW4390 WLAN Digital PHY is designed to comply with IEEE 802.11 b/g/n single-stream specifications to provide wireless LAN
connectivity supporting data rates from 1 Mbps to 72 Mbps for low-power, high-performance embedded applications.
The PHY has been designed to work in the presence of interference, radio nonlinearity, and various other impairments. It incorporates
optimized implementations of the filters, FFT and Viterbi decoder algorithms. Efficient algorithms have been designed to achieve
maximum throughput and reliability, including algorithms for carrier sense/rejection, frequency/phase/timing acquisition and tracking,
channel estimation and tracking. The PHY receiver also contains a robust IEEE 802.11b demodulator. The PHY carrier sense has
been tuned to provide high throughput for IEEE 802.11g/11b hybrid networks.
The key PHY features include:
■
Programmable data rates in 20 MHz channels, as specified in IEEE 802.11n
■
Supports Optional Short GI and Green Field modes in Tx and Rx
■
Tx and Rx LDPC for improved range and power efficiency
■
All scrambling, encoding, forward error correction, and modulation in the transmit direction and inverse operations in the receive
direction.
■
Supports IEEE 802.11h/k for worldwide operation
■
Advanced algorithms for low power, enhanced sensitivity, range, and reliability
■
Automatic gain control scheme for blocking and non blocking application scenario for cellular applications
■
Closed loop transmit power control
■
Digital RF chip calibration algorithms to handle CMOS RF chip non-idealities
■
On-the-fly channel frequency and transmit power selection
■
Supports per packet Rx antenna diversity
■
Available per-packet channel quality and signal strength measurements
■
Designed to meet FCC and other worldwide regulatory requirements
Figure 9 on page 25 is a block diagram of the WLAN PHY.
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Figure 9. WLAN PHY Block Diagram
CCK/DSSS Demodulate
Filters and
Radio Comp
Frequency and
Timing Synch
OFDM Demodulate
Viterbi Decoder
Descramble
and Deframe
Carrier Sense, AGC,
and Rx FSM
Radio Control
Block
Buffers
FFT/IFFT
AFE and
Radio
MAC
Interface
Tx FSM
Common Logic
Block
Modulation and
Coding
Frame and
Scramble
Filters and Radio
Comp
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8. WLAN Radio Subsystem
The CYW4390 includes an integrated single-band WLAN RF transceiver that has been optimized for use in 2.4 GHz WLAN systems.
It has been designed to provide low-power, low-cost, and robust communications for applications operating in the globally available
2.4 GHz unlicensed ISM band. The transmit and receive sections include all on-chip filtering, mixing, and gain control functions.
A block diagram of the radio subsystem is shown in Figure 10. Note that integrated on-chip baluns (not shown) convert the fully
differential transmit and receive paths to single-ended signal pins.
Figure 10. Radio Functional Block Diagram
WL DAC
WL PA
WL PAD
WL PGA
WL TX G‐Mixer
WL TXLPF
Voltage
Regulators
WLAN BB
WL ADC
WL LNA
WL G‐LNA12
WL RX G‐Mixer
WL GTX
WL GRX
WL RXLPF
CLB
WL LOGEN
WL PLL
XO
LPO/Ext LPO/RCAL
8.1 Receiver Path
The CYW4390 has a wide dynamic range, direct conversion receiver that employs high order on-chip channel filtering to ensure
reliable operation in the noisy 2.4 GHz ISM band. The 2.4 GHz receive path has a dedicated on-chip low-noise amplifier (LNA).
8.2 Transmit Path
Baseband data is modulated and upconverted to the 2.4 GHz ISM band, respectively. Linear on-chip power amplifiers are included,
which are capable of delivering high output powers while meeting IEEE 802.11 b/g/n specifications without the need for external PAs.
When using the internal PAs, closed-loop output power control is completely integrated.
8.3 Calibration
The CYW4390 features dynamic and automatic on-chip calibration to continually compensate for temperature and process variations
across components. These calibration routines are performed periodically in the course of normal radio operation. Examples of some
of the automatic calibration algorithms are baseband filter calibration for optimum transmit and receive performance, and LOFT
calibration for carrier leakage reduction. In addition, I/Q Calibration, R Calibration, and VCO Calibration are performed on-chip. No
per-board calibration is required in manufacturing test, which helps to minimize the test time and cost in large volume production.
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9. Pinout and Signal Descriptions
9.1 Ball Maps
Figure 11 shows the WLCSP bump map.
Figure 11. 286-Bump WLCSP (Bottom View, Bumps Facing Up)
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9.2 Pin Lists
Table 9 contains the 286-bump WLCSP coordinates.
Table 9. 286-Bump WLCSP Coordinates
Bump#
NET_NAME
Package Bump Side View
(0,0 center of die)
Package Top Side View
(0,0 center of die)
X
Y
X
Y
1
SR_PVSS_1
2275.005
2003.355
–2275.005
2003.355
2
SR_PVSS_2
1992.162
2003.355
–1992.162
2003.355
3
WL_REG_ON
1709.319
2003.355
–1709.319
2003.355
4
SR_PVSS_4
2133.584
1861.934
–2133.584
1861.934
5
SR_PVSS_5
1850.741
1861.934
–1850.741
1861.934
6
SR_VLX_6
1567.898
1861.934
–1567.898
1861.934
7
SR_VLX_7
1992.162
1720.512
–1992.162
1720.512
8
SR_VLX_8
1709.319
1720.512
–1709.319
1720.512
9
SR_VLX_9
1850.741
1579.091
–1850.741
1579.091
10
SR_VLX_10
1567.898
1579.091
–1567.898
1579.091
11
SR_VDDBATP5V_11
2275.005
1437.669
–2275.005
1437.669
12
SR_VDDBATP5V_12
1992.162
1437.669
–1992.162
1437.669
13
SR_VLX_13
1709.319
1437.669
–1709.319
1437.669
14
SR_VDDBATP5V_14
2133.584
1296.248
–2133.584
1296.248
15
SR_VDDBATA5V
1850.741
1296.248
–1850.741
1296.248
16
LDO_VDD1P5_16
2275.005
1154.826
–2275.005
1154.826
17
VOUT_CLDO_17
1992.162
1154.826
–1992.162
1154.826
18
VOUT_CLDO_18
1709.319
1154.826
–1709.319
1154.826
19
LDO_VDD1P5_19
2133.584
1013.405
–2133.584
1013.405
20
VOUT_CLDO_20
1850.741
1013.405
–1850.741
1013.405
21
PMU_AVSS
1567.898
1013.405
–1567.898
1013.405
22
VOUT_3P3_22
2275.005
871.983
–2275.005
871.983
23
LDO_VDD1P5_23
1992.162
871.983
–1992.162
871.983
24
VOUT_LNLDO_24
1709.319
871.983
–1709.319
871.983
25
VOUT_3P3_25
2133.584
730.562
–2133.584
730.562
26
LDO_VDD1P5_26
1850.741
730.562
–1850.741
730.562
27
LDO_VDDBAT5V_27
2275.005
589.140
–2275.005
589.140
28
VOUT_3P3_28
1992.162
589.140
–1992.162
589.140
29
VOUT_3P3_SENSE_29
1709.319
589.140
–1709.319
589.140
30
LDO_VDDBAT5V
2133.584
447.719
–2133.584
447.719
31
VSSC_31
1850.741
447.719
–1850.741
447.719
32
APPS_REG_ON_32
1567.898
447.719
–1567.898
447.719
33
NC_33
2275.005
306.297
–2275.005
306.297
34
LDO_VDDBAT5V_34
1992.162
306.297
–1992.162
306.297
35
VSSC_35
1709.319
306.297
–1709.319
306.297
36
LDO_VDDBAT5V_36
2133.584
164.876
–2133.584
164.876
Document Number: 002-15055 Rev. *E
Page 28 of 64
ADVANCE
CYW4390
Table 9. 286-Bump WLCSP Coordinates (Cont.)
Bump#
NET_NAME
Package Bump Side View
(0,0 center of die)
Package Top Side View
(0,0 center of die)
X
Y
X
Y
37
PMU_VDDIO_37
1850.741
164.876
–1850.741
164.876
38
PMU_VDDIO_38
1567.898
164.876
–1567.898
164.876
39
LPO_IN
2000.397
–45.054
–2000.397
–45.054
40
NC_40
2252.010
–55.251
–2252.010
–55.251
41
NC_41
2264.169
–255.429
–2264.169
–255.429
42
APPS_I2S_DO
1548.201
–773.253
–1548.201
–773.253
43
APPS_I2S_DI
1931.412
–980.847
–1931.412
–980.847
44
APPS_I2S_CLK
1659.396
–597.546
–1659.396
–597.546
45
APPS_I2S_WS
1944.471
–623.367
–1944.471
–623.367
46
APPS_SFLASH_CLK
2063.397
–268.848
–2063.397
–268.848
47
APPS_SFLASH_CS_N
1800.498
–434.448
–1800.498
–434.448
48
APPS_SFLASH_MISO
1794.801
–223.146
–1794.801
–223.146
49
APPS_SFLASH_MOSI
1784.397
–839.853
–1784.397
–839.853
50
APPS_UART_1_CTS_N
2136.414
–959.733
–2136.414
–959.733
51
APPS_UART1_RTS_N
1653.744
–991.854
–1653.744
–991.854
52
APPS_UART1_RXD
1583.904
–1213.488
–1583.904
–1213.488
53
APPS_UART1_TXD
1393.104
–1114.101
–1393.104
–1114.101
54
APPS_JTAG_EN
632.001
–1226.646
–632.001
–1226.646
55
NC_55
859.998
–1166.652
–859.998
–1166.652
56
NC_56
2156.196
–1334.853
–2156.196
–1334.853
57
APPS_WAKE
1652.097
–1650.546
–1652.097
–1650.546
58
APPS_SPI_IRQ
1925.202
–1363.752
–1925.202
–1363.752
59
APPS_JTAG_TMS
859.998
–966.654
–859.998
–966.654
60
APPS_JTAG_TCK
1688.097
–1449.099
–1688.097
–1449.099
61
APPS_JTAG_TDI
470.001
–1031.652
–470.001
–1031.652
62
APPS_JTAG_TDO
1139.997
–1226.646
–1139.997
–1226.646
63
APPS_VDDO_63
1358.481
–704.151
–1358.481
–704.151
64
APPS_VDDO_64
1489.998
–211.653
–1489.998
–211.653
65
APPS_VDDO_65
1475.499
–464.652
–1475.499
–464.652
66
NC_66
1265.574
–519.930
–1265.574
–519.930
67
APPS_VDDC_67
933.699
–1354.050
–933.699
–1354.050
68
APPS_VDDC_68
1482.501
–1453.950
–1482.501
–1453.950
69
APPS_VDDC_69
294.996
–1131.651
–294.996
–1131.651
70
APPS_VDDC_70
294.996
–1331.649
–294.996
–1331.649
71
APPS_VDDC_71
294.996
–931.653
–294.996
–931.653
72
APPS_VDDC_72
864.903
–482.949
–864.903
–482.949
73
APPS_VDDC_73
1067.997
–482.949
–1067.997
–482.949
74
APPS_VDDC_74
1139.997
–1026.648
–1139.997
–1026.648
Document Number: 002-15055 Rev. *E
Page 29 of 64
ADVANCE
CYW4390
Table 9. 286-Bump WLCSP Coordinates (Cont.)
Bump#
NET_NAME
Package Bump Side View
(0,0 center of die)
Package Top Side View
(0,0 center of die)
X
Y
X
Y
75
NC_75
1479.864
–2546.550
–1479.864
–2546.550
76
VSSC_76
1569.797
–1888.101
–1569.797
–1888.101
77
VSSC_77
1597.593
–2333.169
–1597.593
–2333.169
78
NC_78
1756.686
–2533.167
–1756.686
–2533.167
79
APPS_AVDD_79
1769.795
–1888.101
–1769.795
–1888.101
80
APPS_AVDD_80
1797.591
–2333.169
–1797.591
–2333.169
81
VSSC_81
2045.451
–1548.549
–2045.451
–1548.549
82
APPS_AVDD_82
2045.451
–1760.319
–2045.451
–1760.319
83
VSSC_83
2080.781
–2546.550
–2080.781
–2546.550
84
APPS_AVDD_84
2118.860
–1960.317
–2118.860
–1960.317
85
NC_85
2245.449
–1760.319
–2245.449
–1760.319
86
NC_86
2245.449
–1548.549
–2245.449
–1548.549
87
APPS_AVDD_87
2261.469
–2444.675
–2261.469
–2444.675
88
VSSC_88
2274.852
–2086.889
–2274.852
–2086.889
89
APPS_AVSS_89
99.975
–1842.066
–99.975
–1842.066
90
APPS_1P2_AVDD_90
99.975
–2042.064
–99.975
–2042.064
91
NC_91
99.975
–2291.099
–99.975
–2291.099
92
VOUT_LNDO_SENSE
281.861
–2422.625
–281.861
–2422.625
93
APPS_AC_GND
461.505
–2525.544
–461.505
–2525.544
94
APPS_LDO_VSS
661.503
–2491.097
–661.503
–2491.097
95
APPS_AVSS_95
873.183
–2116.746
–873.183
–2116.746
96
APPS_1P2_AVDD_96
1005.281
–2501.330
–1005.281
–2501.330
97
APPS_AVSS_97
1174.454
–1842.066
–1174.454
–1842.066
98
APPS_1P2_AVDD_98
1174.454
–2042.064
–1174.454
–2042.064
99
APPS_1P2_AVDD_99
1208.352
–2500.155
–1208.352
–2500.155
100
APPS_AVSS_100
1352.595
–2240.766
–1352.595
–2240.766
101
WRF_LNA_GND1P2_101
–2275.490
–2150.537
2275.490
–2150.537
102
RF_AC_GND
–2251.986
–2411.789
2251.986
–2411.789
103
WRF_RX_GND1P2_103
–2119.686
–1753.146
2119.686
–1753.146
104
WRF_LOGEN_GND1P2
–1902.494
–1572.417
1902.494
–1572.417
105
WRF_PA_VBAT_GND3P3_105
–1800.006
–2098.656
1800.006
–2098.656
106
RF_DC_GND_106
–1800.006
–2561.652
1800.006
–2561.652
107
WRF_PA_VBAT_GND3P3_107
–1600.008
–2570.652
1600.008
–2570.652
108
WRF_PADRV_VBAT_GND3P3_108
–1400.010
–1671.660
1400.010
–1671.660
109
WRF_PA_VBAT_GND3P3_109
–1400.010
–2098.656
1400.010
–2098.656
110
WRF_PA_VBAT_GND3P3_110
–1400.010
–2552.652
1400.010
–2552.652
111
WRF_PA_VBAT_GND3P3_111
–1125.249
–1987.776
1125.249
–1987.776
112
WRF_PADRV_VBAT_VDD3P3
–1089.249
–1666.260
1089.249
–1666.260
Document Number: 002-15055 Rev. *E
Page 30 of 64
ADVANCE
CYW4390
Table 9. 286-Bump WLCSP Coordinates (Cont.)
Bump#
NET_NAME
Package Bump Side View
(0,0 center of die)
Package Top Side View
(0,0 center of die)
X
Y
X
Y
113
WRF_PA_VBAT_VDD3P3_113
–1000.014
–2552.652
1000.014
–2552.652
114
WRF_PA_VBAT_VDD3P3_114
–800.016
–2570.652
800.016
–2570.652
115
WRF_RFOUT
–600.018
–2552.652
600.018
–2552.652
116
WRF_PA_VBAT_GND3P3_116
–542.225
–2017.656
542.225
–2017.656
117
WRF_RX_GND1P2_117
–302.510
–1761.939
302.510
–1761.939
118
WRF_RFIN
–200.022
–2471.652
200.022
–2471.652
119
WRF_LNA_GND1P2_119
–200.022
–2071.656
200.022
–2071.656
120
WRF_RX_GND1P2_120
–165.822
–1590.174
165.822
–1590.174
121
NC_121
–200.022
–943.668
200.022
–943.668
122
WRF_GPIO_OUT
–279.173
–759.168
279.173
–759.168
123
WRF_LOGENG_GND1P2
–338.919
–1125.594
338.919
–1125.594
124
WRF_AFE_GND1P2
–661.308
–1125.594
661.308
–1125.594
125
WRF_TX_GND1P2
–856.014
–1271.664
856.014
–1271.664
126
WRF_VCO_GND1P2
–1032.414
–471.672
1032.414
–471.672
127
WRF_BUCK_VDD1P5_127
–1066.853
–1047.744
1066.853
–1047.744
128
WRF_BUCK_VDD1P5_128
–1066.853
–847.746
1066.853
–847.746
129
WRF_BUCK_GND1P5
–1166.852
–647.748
1166.852
–647.748
130
WRF_BUCK_VDD1P5_130
–1266.851
–1047.744
1266.851
–1047.744
131
WRF_BUCK_VDD1P5_131
–1266.851
–847.746
1266.851
–847.746
132
WRF_SYNTH_VBAT_VDD3P3
–1503.344
–1089.662
1503.344
–1089.662
133
WRF_MMD_GND1P2
–1627.031
–889.668
1627.031
–889.668
134
WRF_MMD_VDD1P2
–1854.006
–1271.664
1854.006
–1271.664
135
WRF_CP_GND1P2
–1922.892
–980.154
1922.892
–980.154
136
WRF_XTAL_VDD1P5
–1950.522
–353.066
1950.522
–353.066
137
WRF_XTAL_GND1P2
–2000.004
–554.598
2000.004
–554.598
138
WRF_XTAL_IN
–2199.998
–353.066
2199.998
–353.066
139
WRF_PFD_VDD1P2
–2200.002
–1185.062
2200.002
–1185.062
140
WRF_PFD_GND1P2
–2200.002
–985.064
2200.002
–985.064
141
WRF_XTAL_VDD1P2
–2200.002
–753.062
2200.002
–753.062
142
WRF_XTAL_OUT
–2200.002
–553.064
2200.002
–553.064
143
BBPLLAVDD1P2
–2205.429
–52.326
2205.429
–52.326
144
BBPLLAVSS
–2005.431
–57.348
2005.431
–57.348
145
RF_SW_CTRL_0
–1831.200
318.141
1831.200
318.141
146
RF_SW_CTRL_1
–2072.022
449.946
2072.022
449.946
147
RF_SW_CTRL_2
–1691.052
517.221
1691.052
517.221
148
RF_SW_CTRL_3
–1895.118
544.410
1895.118
544.410
149
RF_SW_CTRL_4
–1809.960
772.110
1809.960
772.110
150
RF_SW_CTRL_5
–1617.639
713.790
1617.639
713.790
Document Number: 002-15055 Rev. *E
Page 31 of 64
ADVANCE
CYW4390
Table 9. 286-Bump WLCSP Coordinates (Cont.)
Bump#
NET_NAME
Package Bump Side View
(0,0 center of die)
Package Top Side View
(0,0 center of die)
X
Y
X
Y
151
RF_SW_CTRL_6
–2129.154
817.452
2129.154
817.452
152
RF_SW_CTRL_7
–1573.278
922.392
1573.278
922.392
153
RF_SW_CTRL_8
–1749.264
1019.259
1749.264
1019.259
154
RF_SW_CTRL_9
–1944.888
972.936
1944.888
972.936
155
OTP_VDD33
–1400.001
808.353
1400.001
808.353
156
VDDIO_RF_156
–1399.398
343.350
1399.398
343.350
157
VDDIO_RF_157
–1400.001
543.348
1400.001
543.348
158
NC_158
–2055.795
2207.556
2055.795
2207.556
159
NC_159
–1943.295
2041.056
1943.295
2041.056
160
NC_160
–1689.455
2041.056
1689.455
2041.056
161
VSSC_161
–2280.795
2207.556
2280.795
2207.556
162
NC_162
–2168.295
2041.056
2168.295
2041.056
163
VSSC_163
–1830.795
2207.556
1830.795
2207.556
164
NC_164
–1576.959
2207.556
1576.959
2207.556
165
NC_165
–2168.295
2374.758
2168.295
2374.758
166
NC_166
–1943.295
2374.758
1943.295
2374.758
167
NC_167
–1689.455
2374.758
1689.455
2374.758
168
VSSC_168
–2280.795
2541.258
2280.795
2541.258
169
NC_169
–1830.795
2541.258
1830.795
2541.258
170
NC_170
–2055.795
2541.258
2055.795
2541.258
171
SDIO_CLK
–1269.996
1963.350
1269.996
1963.350
172
SDIO_CMD
–1269.996
2168.352
1269.996
2168.352
173
SDIO_DATA_0
–1040.001
1963.350
1040.001
1963.350
174
SDIO_DATA_1
–1040.001
2168.352
1040.001
2168.352
175
SDIO_DATA_2
–830.004
1963.350
830.004
1963.350
176
SDIO_DATA_3
–735.000
2168.352
735.000
2168.352
177
VDDIO_SD_177
–1040.001
1763.352
1040.001
1763.352
178
VDDIO_SD_178
–830.004
1763.352
830.004
1763.352
179
NC_179
–545.001
1963.350
545.001
1963.350
180
NC_180
–240.000
1963.350
240.000
1963.350
181
NC_181
–805.002
1568.349
805.002
1568.349
182
VSSC_182
–605.004
1553.346
605.004
1553.346
183
VSSC_183
–394.998
1763.352
394.998
1763.352
184
VSSC_184
–605.004
1763.352
605.004
1763.352
185
VSSC_185
–394.998
1553.346
394.998
1553.346
186
NC_186
–15.000
2168.352
15.000
2168.352
187
NC_187
4.998
1768.347
–4.998
1768.347
188
NC_188
–5.001
1968.354
5.001
1968.354
Document Number: 002-15055 Rev. *E
Page 32 of 64
ADVANCE
CYW4390
Table 9. 286-Bump WLCSP Coordinates (Cont.)
Bump#
NET_NAME
Package Bump Side View
(0,0 center of die)
Package Top Side View
(0,0 center of die)
X
Y
X
Y
189
GPIO_B0
239.997
1968.354
–239.997
1968.354
190
GPIO_B1
239.997
1768.347
–239.997
1768.347
191
GPIO_B2
290.001
2168.352
–290.001
2168.352
192
GPIO_B3
284.997
1568.349
–284.997
1568.349
193
GPIO_B4
675.003
1908.351
–675.003
1908.351
194
GPIO_B5
485.004
1568.349
–485.004
1568.349
195
GPIO_B6
675.003
1708.353
–675.003
1708.353
196
SDIO_SEL
689.997
1508.346
–689.997
1508.346
197
SDIO_PADVDDIO
920.001
1568.349
–920.001
1568.349
198
GPIO_B9
820.002
1348.353
–820.002
1348.353
199
GPIO_B10
820.002
1073.349
–820.002
1073.349
200
GPIO_B7
1119.999
1073.349
–1119.999
1073.349
201
GPIO_B8
1119.999
1338.354
–1119.999
1338.354
202
DEBUG_EN
1180.002
1738.350
–1180.002
1738.350
203
GPIO_B11
1180.002
1538.352
–1180.002
1538.352
204
NC_204
1180.002
1973.349
–1180.002
1973.349
205
JTAG_SEL
1119.999
2168.352
–1119.999
2168.352
206
VSSC_206
699.996
668.349
–699.996
668.349
207
VSSC_207
699.996
468.351
–699.996
468.351
208
VSSC_208
900.003
468.351
–900.003
468.351
209
VSSC_209
900.003
668.349
–900.003
668.349
210
VDDIO_210
605.001
1148.346
–605.001
1148.346
211
VDDIO_211
384.996
1368.351
–384.996
1368.351
212
VDDIO_212
605.001
948.348
–605.001
948.348
213
VDDC_213
–2120.001
1213.353
2120.001
1213.353
214
VDDC_214
–1920.003
1213.353
1920.003
1213.353
215
VDDC_215
–1689.999
–71.649
1689.999
–71.649
216
VDDC_216
–1490.001
–71.649
1490.001
–71.649
217
VDDC_217
–1490.001
128.349
1490.001
128.349
218
VDDC_218
–1249.998
128.349
1249.998
128.349
219
VDDC_219
–840.003
578.349
840.003
578.349
220
VDDC_220
–639.996
578.349
639.996
578.349
221
VDDC_221
–269.997
628.353
269.997
628.353
222
VDDC_222
–269.997
828.351
269.997
828.351
223
VDDC_223
–195.000
1568.349
195.000
1568.349
224
VDDC_224
–195.000
1768.347
195.000
1768.347
225
VDDC_225
–195.000
1268.352
195.000
1268.352
226
VDDC_226
4.998
–6.651
–4.998
–6.651
Document Number: 002-15055 Rev. *E
Page 33 of 64
ADVANCE
CYW4390
Table 9. 286-Bump WLCSP Coordinates (Cont.)
Bump#
NET_NAME
Package Bump Side View
(0,0 center of die)
Package Top Side View
(0,0 center of die)
X
Y
X
Y
227
VDDC_227
4.998
193.347
–4.998
193.347
228
VDDC_228
4.998
393.354
–4.998
393.354
229
VDDC_229
4.998
628.353
–4.998
628.353
230
VDDC_230
4.998
828.351
–4.998
828.351
231
VDDC_231
4.998
1028.349
–4.998
1028.349
232
VDDC_232
4.998
1568.349
–4.998
1568.349
233
VDDC_233
4.998
1268.352
–4.998
1268.352
234
VDDC_234
120.000
–216.648
–120.000
–216.648
235
VDDC_235
319.998
–216.648
–319.998
–216.648
236
VDDC_236
405.003
1148.346
–405.003
1148.346
237
VDDC_237
405.003
948.348
–405.003
948.348
238
VDDC_238
689.997
–211.653
–689.997
–211.653
239
VDDC_239
890.004
–211.653
–890.004
–211.653
240
VDDC_240
1090.002
–11.646
–1090.002
–11.646
241
VDDC_241
1396.119
–24.588
–1396.119
–24.588
242
VSSC_242
–1374.999
1263.348
1374.999
1263.348
243
VSSC_243
–1269.996
1563.354
1269.996
1563.354
244
VSSC_244
–1175.001
1263.348
1175.001
1263.348
245
VSSC_245
–1269.996
1763.352
1269.996
1763.352
246
VSSC_246
–1249.998
–71.649
1249.998
–71.649
247
VSSC_247
–975.003
1263.348
975.003
1263.348
248
VSSC_248
–1050.000
–71.649
1050.000
–71.649
249
VSSC_249
–1040.001
1563.354
1040.001
1563.354
250
VSSC_250
–840.003
–71.649
840.003
–71.649
251
VSSC_251
–840.003
128.349
840.003
128.349
252
VSSC_252
–840.003
328.347
840.003
328.347
253
VSSC_253
–840.003
828.351
840.003
828.351
254
VSSC_254
–840.003
1028.349
840.003
1028.349
255
VSSC_255
–805.002
1368.351
805.002
1368.351
256
VSSC_256
–639.996
828.351
639.996
828.351
257
VSSC_257
–639.996
1028.349
639.996
1028.349
258
VSSC_258
–439.998
128.349
439.998
128.349
259
VSSC_259
–439.998
328.734
439.998
328.734
260
VSSC_260
–439.998
–71.649
439.998
–71.649
261
VSSC_261
94.998
–606.654
–94.998
–606.654
262
VSSC_262
94.998
–806.652
–94.998
–806.652
263
VSSC_263
204.996
193.347
–204.996
193.347
264
VSSC_264
204.996
1028.349
–204.996
1028.349
Document Number: 002-15055 Rev. *E
Page 34 of 64
ADVANCE
CYW4390
Table 9. 286-Bump WLCSP Coordinates (Cont.)
Bump#
NET_NAME
Package Bump Side View
(0,0 center of die)
Package Top Side View
(0,0 center of die)
X
Y
X
Y
265
VSSC_265
204.996
628.353
–204.996
628.353
266
VSSC_266
204.996
828.351
–204.996
828.351
267
VSSC_267
133.104
–1457.550
–133.104
–1457.550
268
VSSC_268
305.004
–446.652
–305.004
–446.652
269
VSSC_269
204.996
393.354
–204.996
393.354
270
VSSC_270
499.998
193.347
–499.998
193.347
271
VSSC_271
457.401
–1457.550
–457.401
–1457.550
272
VSSC_272
499.998
–806.652
–499.998
–806.652
273
VSSC_273
505.002
–446.652
–505.002
–446.652
274
VSSC_274
499.998
468.351
–499.998
468.351
275
VSSC_275
499.998
668.349
–499.998
668.349
276
VSSC_276
499.998
–6.651
–499.998
–6.651
277
VSSC_277
699.996
–806.652
–699.996
–806.652
278
VSSC_278
699.996
–606.654
–699.996
–606.654
279
VSSC_279
699.996
–6.651
–699.996
–6.651
280
VSSC_280
660.603
–1457.550
–660.603
–1457.550
281
VSSC_281
900.003
68.346
–900.003
68.346
282
VSSC_282
1090.002
–211.653
–1090.002
–211.653
283
VSSC_283
1100.001
668.349
–1100.001
668.349
284
VSSC_284
1229.997
508.347
–1229.997
508.347
285
VSSC_285
1229.997
308.349
–1229.997
308.349
286
VSSC_286
1290.000
–211.653
–1290.000
–211.653
Document Number: 002-15055 Rev. *E
Page 35 of 64
ADVANCE
CYW4390
9.3 Signal Descriptions
The signal name, type, and description of each pin in the CYW4390 are listed in Table 10. The symbol listed in the Type column
indicates the pin direction (I/O = bidirectional, I = input, O = output) and the internal pull-up/pull-down characteristics, if any (PU =
weak internal pull-up resistor and PD = weak internal pull-down resistor).
Table 10. WLCSP and FCFBGA Pin Descriptions
Signal Name
WLCSP Bump #
Type
90, 96, 98, 99
PWR
Power supply.
93
GND
Connect to ground to reduce system RF noise.
APPS_AVDD
79, 80, 82, 84, 87
PWR
APPS CPU domain power supply. Connect to
1.2V
APPS_AVSS
89, 95, 97, 100
GND
Ground. Connect to VSSC for ESD mitigation.
APPS_WAKE
57
I/O
Application CPU subsystem. Device wakes from
sleep signal.
APPS_I2S_CLK
44
I/O
I2S clock. Can be master (output) or slave (input)
APPS_I2S_DI
43
I/O
I2S data input.
APPS_I2S_DO
42
I/O
I2S data output.
APPS_I2S_WS
45
I/O
I2S word select (WS).
APPS_JTAG_EN
54
I/O
Application CPU subsystem: JTAG enable.
APPS_JTAG_TCK
60
I/O
APPS_JTAG_TDI
61
I/O
APPS_JTAG_TDO
62
I/O
APPS_JTAG_TMS
59
I/O
APPS_LDO_VSS
94
GND
APPS_1P2_AVDD
APPS_AC_GND
Description
Application CPU subsystem: JTAG interface.
Connect to VSSC for ESD.
Used by the PMU to power up or power down the
on-chip regulators that supply power to the Application CPU subsystem. Also, when deasserted,
the Application CPU will be held in reset.
APPS_REG_ON
32
I
APPS_SFLASH_CLK
46
I/O
SPI serial flash interface SPI clock output.
APPS_SFLASH_CS_N
47
I/O
External serial flash interface chip-select
(functionality cannot be remapped to another
purpose).
APPS_SPI_IRQ
58
I/O
SPI interface interrupt input.
APPS_SFLASH_MISO
48
I
Serial flash SPI MISO input.
APPS_SFLASH_MOSI
49
O
Serial flash SPI MOSI output.
APPS_UART1_CTS_N
50
I
UART1 clear-to-send. Active-low, clear-to-send
signal for the HCI UART interface.
APPS_UART1_RTS_N
51
O
UART1 request-to-send. Active-low request-tosend signal for the UART1 interface.
APPS_UART1_RXD
52
I
UART1 serial input. Serial data input for the
UART1 interface.
APPS_UART1_TXD
53
O
UART1 serial output. Serial data output for the
UART1 interface.
APPS_VDDC
67, 68, 69, 70, 71, 72, 73,
74
PWR
1.2V core supply for APPS CPU.
APPS_VDDO
63, 64, 65
PWR
Connect to 3.3V.
BBPLLAVDD
143
PWR
Connect to 1.2V
Document Number: 002-15055 Rev. *E
Page 36 of 64
ADVANCE
CYW4390
Table 10. WLCSP and FCFBGA Pin Descriptions (Cont.)
WLCSP Bump #
Type
BBPLLAVSS
Signal Name
144
GND
GPIO_B0
189
GPIO_B1
190
GPIO_B2
191
GPIO_B3
192
GPIO_B4
193
GPIO_B5
194
GPIO_B6
195
GPIO_B7
200
GPIO_B8
201
GPIO_B9
198
GPIO_B10
199
GPIO_B10
230
DEBUG_EN
202
–
Externally drives the 4390 JTAG enable pins high/
low under software control for debug security
purposes.
JTAG_SEL
205
I/O
WLAN JTAG enable. This pin must be connected
to ground if the JTAG interface is not used.
LDO_VDD1P5
16, 19, 23, 26
I
LNLDO input.
LDO_VDDBAT5V
27, 30, 34, 36
I
LDO VBAT.
LPO_IN
I/O
Description
Connect to VSSC for ESD.
Programmable Bank B GPIO pins.
39
I
External sleep clock input (32.768 KHz).
40, 41, 55, 56, 66, 75, 85,
86, 91, 121, 158, 160, 162,
164–166, 169, 170, 179–
181, 186–188, 202, 204
–
No connect.
OTP_VDD33
155
PWR
OTP 3.3V supply.
PMU_AVSS
21
GND
Quiet ground. Connect to VSSC for ESD.
PMU_VDDIO
37, 38
PWR
1.8V–3.3V supply for PMU controls. Must be
directly connected to VDDIO on the PCB.
RF_AC_GND
102
GND
Connect to Ground to reduce system RF noise.
RF_DC_GND
106
GND
Connect to Ground to reduce system RF noise.
RF_SW_CTRL_0
145
RF_SW_CTRL_1
146
RF_SW_CTRL_2
147
RF_SW_CTRL_3
148
RF_SW_CTRL_4
149
RF_SW_CTRL_5
150
O
Programmable RF switch control lines. The
control lines are programmable via the driver and
NVRAM file.
RF_SW_CTRL_6
151
RF_SW_CTRL_7
152
RF_SW_CTRL_8
153
RF_SW_CTRL_9
154
SDIO_CLK
171
I
SDIO clock input.
NC
Document Number: 002-15055 Rev. *E
Page 37 of 64
ADVANCE
CYW4390
Table 10. WLCSP and FCFBGA Pin Descriptions (Cont.)
WLCSP Bump #
Type
SDIO_CMD
Signal Name
172
I/O
SDIO command line.
SDIO_DATA_0
173
I/O
SDIO data line 0.
SDIO_DATA_1
174
I/O
SDIO data line 1.
SDIO_DATA_2
175
I/O
SDIO data line 2.
SDIO_DATA_3
176
I/O
SDIO data line 3.
SDIO_PADVDDIO
197
I/O
Connect to the same VDD supply rail as SDIO
interface.
SDIO_SEL
196
I/O
Connect to ground.
SR_PVSS
1, 2, 4, 5
GND
SR_VDDBATA5V
15
I
SR_VDDBATP5V
11, 12, 14
I
Power VBAT.
6, 7, 8, 9, 10,
13
O
Cbuck switching regulator output. Refer to Table
20 on page 50 for recommendations of the
inductor and capacitor for this supply.
VDDC
213–241
PWR
1.2V core supply for WLAN.
VDDIO
210–212
PWR
1.8V–3.3V supply for WLAN. Must be directly
connected to PMU_VDDIO and APPS_VDDO on
the PCB.
VDDIO_RF
156, 157
PWR
IO supply for RF switch control pads (3.3V).
VDDIO_SD
177, 178
PWR
1.8V–3.3V supply for SDIO pads.
VOUT_3P3
22, 25, 28
O
LDO 3.3V output.
29
O
Voltage sense pin for LDO 3.3V output.
SR_VLX
VOUT_3P3_SENSE
Description
Power ground.
Quiet VBAT.
VOUT_CLDO
17, 18, 20
O
Output of core LDO.
VOUT_LNLDO
24
O
Output of LNLDO.
31, 35, 76, 77, 78, 81, 83,
88, 159, 161, 163, 167,
168, 182–185 206 –209,
242–286
GND
VSSC
Core ground.
Used by the PMU to power up/power down the onchip regulators that supply power to the WLAN
subsystem. This pin may be internally driven by
the apps core even if the pin is externally
connected to GND.
WL_REG_ON
3
I
WL_VDDC
–
PWR
1.2V core supply for WLAN.
WRF_AFE_GND1P2
124
GND
AFE ground. Connect to VSSC for ESD.
WRF_BUCK_GND1P5
129
GND
Internal capacitor-less LDO ground. Connect to
VSSC for ESD.
WRF_BUCK_VDD1P5
127, 128, 130, 131
PWR
Internal capacitor-less LDO supply.
WRF_CP_GND1P2
135
GND
WRF_GPIO_OUT
122
I/O
101, 119
GND
Internal LNA ground.
WRF_LOGEN_GND1P2
104
GND
LOGEN ground. Connect to VSSC for ESD.
WRF_LOGENG_GND1P2
123
GND
LOGEN ground. Connect to VSSC for ESD.
WRF_MMD_GND1P2
133
GND
Ground. Connect to VSSC for ESD
WRF_LNA_GND1P2
Document Number: 002-15055 Rev. *E
Ground. Connect to VSSC for ESD.
GPIO
Page 38 of 64
ADVANCE
CYW4390
Table 10. WLCSP and FCFBGA Pin Descriptions (Cont.)
Signal Name
WLCSP Bump #
Type
134
PWR
1.2V supply
WRF_PA_VBAT_GND3P3
105, 107, 109, 110,
111,116
GND
Connect to VSSC for ESD
WRF_PA_VBAT_VDD3P3
113, 114
PWR
PA 3.3V VBAT supply
WRF_PADRV_VBAT_GND3P3
108
GND
PAD ground. Connect to VSSC for ESD.
WRF_PADRV_VBAT_VDD3P3
112
PWR
PA Driver VBAT supply.
WRF_MMD_VDD1P2
Description
WRF_PFD_GND1P2
140
GND
Ground. Connect to VSSC for ESD.
WRF_PFD_VDD1P2
139
PWR
1.2V supply.
WRF_RFIN
118
I
2.4 GHz WLAN Receiver input.
WRF_RFOUT
115
O
2.4 GHz WLAN PA output.
WRF_RX_GND1P2
103, 117, 120
GND
RX 2 GHz ground. Connect to VSSC for ESD.
WRF_SYNTH_VBAT_VDD3P3
132
PWR
Synth VDD 3.3V supply.
WRF_TX_GND1P2
125
GND
TX ground. Connect to VSSC for ESD.
WRF_VCO_GND1P2
126
GND
VCO/LOGEN ground. Connect to VSSC for ESD.
WRF_XTAL_GND1P2
137
GND
WRF_XTAL_IN
138
I
Crystal oscillator input.
WRF_XTAL_OUT
142
O
Crystal oscillator output.
WRF_XTAL_VDD1P2
141
I
Crystal LDO input (1.35V).
WRF_XTAL_VDD1P5
136
O
Crystal LDO output (1.2V).
Document Number: 002-15055 Rev. *E
XTAL ground. Connect to VSSC for ESD.
Page 39 of 64
ADVANCE
CYW4390
9.4 I/O States
The following notations are used in Table 11:
■
I: Input signal
■
O: Output signal
■
I/O: Input/Output signal
■
PU = Pulled up
■
PD = Pulled down
■
NoPull = Neither pulled up nor pulled down
Table 11. I/O States
Low Power State/
Sleep (All Power
Present)
Name
I/O
Keepera
APPS_WAKE
I/O
Y
Input/Output; PU, PD,
Input; PU, PD, NoPull
NoPull (programmable) (programmable)
APPS_REG_ON
I
N
APPS_UART1_CTS
_N
I
APPS_UART1_RTS
_N
Active Mode
Power-downb
(APPS_REG_ON and
WL_REG_ON Held Low)
High-Z, NoPull
Out-of-Reset;
Before SW Download
(APPS_RST_N High;
WL_REG_ON High)
(WL_REG_ON High and
APPS_RST_N=0) and
VDDIOs Are Present
Power Rail
Input, PD
Input, PD
APPS_VDDO
Input; PD (pull down can Input; PD (pull down can Input; PD (of 200K)
be disabled)
be disabled)
Input; PD (of 200K)
Input; PD (of 200K)
Y
Input; NoPull
Input; NoPull
High-Z, NoPull
Input; PU
Input; PU
APPS_VDDO
O
Y
Output; NoPull
Output; NoPull
High-Z, NoPull
Input; PU
Input; PU
APPS_VDDO
APPS_UART1_RXD
I
Y
Input; PU
Input; NoPull
High-Z, NoPull
Input; PU
Input; PU
APPS_VDDO
APPS_UART1_TXD
O
Y
Output; NoPull
Output; NoPull
High-Z, NoPull
Input; PU
Input; PU
APPS_VDDO
Input; PU (SDIO Mode)
Input; PU (SDIO Mode)
WL_VDDIO
–
SDIO_CMD
I/O
N
Input/Output; PU (SDIO
Input; PU (SDIO Mode) High-Z, NoPull
Mode),
SDIO_DATA[0:3]
I/O
N
Input/Output; PU (SDIO
Input; PU (SDIO Mode) High-Z, NoPull
Mode)
Input; PU (SDIO Mode)
Input; PU (SDIO Mode)
WL_VDDIO
I
N
Input; NoPull
Input; noPull
Input; noPull
WL_VDDIO
GPIO_B0
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
NoPull (programmable NoPull (programmable High-Z, NoPull
[Default: PD])
[Default: PD])
Input; PD
Input; PD
WL_VDDIO
GPIO_B1
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
NoPull (programmable NoPull (programmable High-Z, NoPull
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_B10
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
NoPull (programmable NoPull (programmable High-Z, NoPull
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
SDIO_CLK
Document Number: 002-15055 Rev. *E
Input; noPull
High-Z, NoPull
Page 40 of 64
ADVANCE
CYW4390
Table 11. I/O States (Cont.)
Low Power State/
Sleep (All Power
Present)
Power-downb
(APPS_REG_ON and
WL_REG_ON Held Low)
Out-of-Reset;
Before SW Download
(APPS_RST_N High;
WL_REG_ON High)
(WL_REG_ON High and
APPS_RST_N=0) and
VDDIOs Are Present
I/O
Keepera
GPIO_B11
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
NoPull (programmable NoPull (programmable High-Z, NoPull
[Default: PD])
[Default: PD])
Input; PD
Input; PD
WL_VDDIO
GPIO_B2
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
NoPull (programmable NoPull (programmable High-Z, NoPull
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_B3
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
NoPull (programmable NoPull (programmable High-Z, NoPull
[Default: PD])
[Default: PD])
Input; PD
Input; PD
WL_VDDIO
GPIO_B4
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
NoPull (programmable NoPull (programmable High-Z, NoPull
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_B5
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
NoPull (programmable NoPull (programmable High-Z, NoPull
[Default: PD])
[Default: PD])
Input; PD
Input; PD
WL_VDDIO
GPIO_B6
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
NoPull (programmable NoPull (programmable High-Z, NoPull
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_B7
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
NoPull (programmable NoPull (programmable High-Z, NoPull
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_B8
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
NoPull (programmable NoPull (programmable High-Z, NoPull
[Default: PD])
[Default: PD])
Input; PD
Input; PD
WL_VDDIO
GPIO_B9
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
NoPull (programmable NoPull (programmable High-Z, NoPull
[Default: PD])
[Default: PD])
Input; PD
Input; PD
WL_VDDIO
I
N
Input; PD (pull-down can Input; PD (pull-down can Input; PD (of 200K)
be disabled)
be disabled)
Input; PD (of 200K)
Input; PD (of 200K)
Name
WL_REG_ON
Active Mode
Power Rail
–
a. Keeper column: N = pad has no keeper. Y = pad has a keeper. Keeper is always active except in Power-down state. If there is no keeper, and it is an input and there is Nopull, then the pad should be driven to prevent
leakage due to floating pad (SDIO_CLK, for example).
b. In the Power-down state (xx_REG_ON=0): High-Z; NoPull => the pad is disabled because power is not supplied.
Document Number: 002-15055 Rev. *E
Page 41 of 64
ADVANCE
CYW4390
10. DC Characteristics
Note: Values in this data sheet are design goals and are subject to change based on the results of device characterization.
10.1 Absolute Maximum Ratings
Caution: The absolute maximum ratings in Table 12 indicate levels where permanent damage to the device can occur, even if these
limits are exceeded for only a brief duration. Functional operation is not guaranteed under these conditions. Operation at absolute
maximum conditions for extended periods can adversely affect long-term reliability of the device.
Table 12. Absolute Maximum Ratings
Rating
DC supply for VBAT and PA driver supply
DC supply voltage for digital I/O
DC supply voltage for RF switch I/Os
DC input supply voltage for CLDO and LNLDO
Symbol
Value
Unit
VBAT
–0.5 to +6.0
V
VDDIO
–0.5 to 3.9
V
VDDIO_RF
–0.5 to 3.9
V
–
–0.5 to 1.575
V
DC supply voltage for RF analog
VDDRF
–0.5 to 1.32
V
DC supply voltage for core
VDDC
–0.5 to 1.32
V
–
–0.5 to 3.63
V
Vundershoot
–0.5
V
Tj
125
°C
WRF_TCXO_VDD
Maximum undershoot voltage for I/O
Maximum junction temperature
10.2 Environmental Ratings
The environmental ratings are shown in Table 13.
Table 13. Environmental Ratings
Characteristic
Value
Units
Ambient Temperature (TA)
–30 to +85
°C
Storage Temperature
–40 to +125
°C
Relative Humidity
Conditions/Comments
Functional operationa
–
Less than 60
%
Storage
Less than 85
%
Operation
a. Functionality is guaranteed but specifications require derating at extreme temperatures; see the specification tables for details.
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10.3 Electrostatic Discharge Specifications
Extreme caution must be exercised to prevent electrostatic discharge (ESD) damage. Proper use of wrist and heel grounding straps
to discharge static electricity is required when handling these devices. Always store unused material in its antistatic packaging.
Table 14. ESD Specifications
Pin Type
Symbol
Condition
ESD Rating
Unit
ESD, Handling
Reference: NQY00083,
Section 3.4, Group D9,
Table B
ESD_HAND_HBM
Human body model contact discharge per JEDEC
EID/JESD22-A114
TBD
V
Machine Model (MM)
ESD_HAND_MM
Machine model contact
TBD
V
CDM
ESD_HAND_CDM
Charged device model contact discharge per JEDEC
EIA/JESD22-C101
TBD
V
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10.4 Recommended Operating Conditions and DC Characteristics
Caution: Functional operation is not guaranteed outside of the limits shown in Table 15 on page 44 and operation outside these limits
for extended periods can adversely affect long-term reliability of the device.
Table 15. Recommended Operating Conditions and DC Characteristics
Parameter
Symbol
Value
Minimum
Typical
Maximum
Unit
DC supply voltage for VBAT
VBAT
3.0a
–
5.25b
V
DC supply voltage for core
VDD
1.14
1.2
1.26
V
DC supply voltage for RF blocks in chip
VDDRF
1.14
1.2
1.26
V
DC supply voltage for TCXO input buffer
WRF_TCXO_VDD
1.62
1.8
1.98
V
DC supply voltage for digital I/O
VDDIO,
VDDIO_SD
1.71
–
3.63
V
DC supply voltage for RF switch I/Os
VDDIO_RF
3.13
3.3
3.46
V
Vth_POR
0.4
–
0.7
V
Internal POR threshold
Other Digital I/O Pins
For VDDIO = 1.8V:
Input high voltage
VIH
0.65 ×
VDDIO
–
–
V
Input low voltage
VIL
–
–
0.35 × VDDIO
V
Output high voltage @ 2 mA
VOH
VDDIO –
0.45
–
–
V
Output low voltage @ 2 mA
VOL
–
–
0.45
V
Input high voltage
VIH
2.00
–
–
V
Input low voltage
VIL
–
–
0.80
V
VOH
VDDIO – 0.4
–
–
V
VOL
–
–
0.40
V
V
For VDDIO = 3.3V:
Output high voltage @ 2 mA
Output low Voltage @ 2 mA
RF Switch Control Output Pinsc
For VDDIO_RF = 3.3V:
Output high voltage @ 2 mA
VOH
VDDIO – 0.4
–
–
Output low voltage @ 2 mA
VOL
–
–
0.40
V
CIN
–
–
5
pF
Input capacitance
a. The CYW4390 is functional across this range of voltages. Optimal RF performance specified in the data sheet, however, is guaranteed only for 3.13V < VBAT < 4.8V.
b. The maximum continuous voltage is 5.25V. Voltages up to 6.0V for up to 10 seconds, cumulative duration over the lifetime of the device are allowed. Voltages as high
as 5.5V for up to 250 seconds, cumulative duration over the lifetime of the device are allowed.
c. Programmable 2 mA to 16 mA drive strength. Default is 10 mA.
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11. WLAN RF Specifications
11.1 Introduction
The CYW4390 includes an integrated single-band direct conversion radio that supports the 2.4 GHz band. This section describes the
RF characteristics of the 2.4 GHz radio.
Note: Values in this section of the data sheet are design goals and are subject to change based on the results of device
characterization.
Unless otherwise stated, limit values apply for the conditions specified inTable 13 on page 42 and Table 15 on page 44. Typical values
apply for the following conditions:
■
VBAT = 3.6V
■
Ambient temperature +25°C
Figure 12. Port Locations
CYW4390
RF Switch
(0.5 dB Insertion Loss)
WLAN Tx
Filter
WLAN
Antenna
Port
Chip
Port
RF Port
Note: All WLAN specifications are specified at the chip port, unless otherwise specified.
11.2 2.4 GHz Band General RF Specifications
Table 16. 2.4 GHz Band General RF Specifications
Item
Tx/Rx switch time
Condition
Including TX ramp down
Minimum
Typical
Maximum
Unit
–
–
5
µs
Rx/Tx switch time
Including TX ramp up
–
–
2
µs
Power-up and power-down ramp time
DSSS/CCK modulations
–
–
<2
µs
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11.3 WLAN 2.4 GHz Receiver Performance Specifications
Note: The specifications in Table 17 are specified at the chip port, unless otherwise specified.
Table 17. WLAN 2.4 GHz Receiver Performance Specifications
Parameter
Condition/Notes
Minimum
Typical
Maximum
Unit
–
2400
–
2500
MHz
1 Mbps DSSS
–
–98.4
–
dBm
2 Mbps DSSS
–
–96.5
–
dBm
5.5 Mbps DSSS
–
–93.7
–
dBm
11 Mbps DSSS
–
–91.4
–
dBm
6 Mbps OFDM
–
–95.5
–
dBm
9 Mbps OFDM
–
–94.1
–
dBm
12 Mbps OFDM
–
–93.2
–
dBm
18 Mbps OFDM
–
–90.6
–
dBm
24 Mbps OFDM
–
–87.3
–
dBm
36 Mbps OFDM
–
–84
–
dBm
48 Mbps OFDM
–
–79.3
–
dBm
54 Mbps OFDM
–
–77.8
–
dBm
MCS0
–
–95
–
dBm
MCS1
–
–92.7
–
dBm
MCS2
–
–90.2
–
dBm
MCS3
–
–87.1
–
dBm
MCS4
–
–83.5
–
dBm
MCS5
–
–78.9
–
dBm
MCS6
–
–77.3
–
dBm
MCS7
–
–75.7
–
dBm
CDMA2000
–
–24
–
dBm
Frequency range
RX sensitivity IEEE 802.11b
(8% PER for 1024 octet
PSDU)a
RX sensitivity IEEE 802.11g
(10% PER for 1024 octet
PSDU)a
20 MHz channel spacing for all MCS rates
RX sensitivity IEEE 802.11n
(10% PER for 4096 octet
PSDU)a,b. Defined for default
parameters: GF, 800 ns GI,
and non-STBC.
776–794 MHz
d
cdmaOne
–
–25
–
dBm
824–849 MHz
GSM850
–
–15
–
dBm
880–915 MHz
E-GSM
–
–16
–
dBm
1710–1785 MHz
GSM1800
–
–18
–
dBm
1850–1910 MHz
Blocking level for 1dB Rx
sensitivity degradation (without 1850–1910 MHz
external filtering)c
1850–1910 MHz
GSM1800
–
–19
–
dBm
cdmaOne
–
–26
–
dBm
WCDMA
–
–26
–
dBm
1920–1980 MHz
WCDMA
–
–28.5
–
dBm
2500–2570 MHz
Band 7
–
–45
–
dBm
2300–2400 MHz
Band 40
–
–50
–
dBm
2570–2620 MHz
Band 38
–
–45
–
dBm
2545–2575 MHz
XGP Band
–
–45
–
dBm
824–849 MHz
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Table 17. WLAN 2.4 GHz Receiver Performance Specifications (Cont.)
Parameter
Condition/Notes
Minimum
Typical
Maximum
Unit
In-band static CW jammer
immunity
(fc – 8 MHz < fcw < + 8 MHz)
Rx PER < 1%, 54 Mbps OFDM,
1000 octet PSDU for:
(RxSens + 23 dB < Rxlevel < max input level)
–80
–
–
dBm
Maximum LNA gain
–
–15.5
–
dBm
Minimum LNA gain
–
–1.5
–
dBm
Input In-Band IP3a
Maximum Receive Level
@ 2.4 GHz
@ 1, 2 Mbps (8% PER, 1024 octets)
–3.5
–
–
dBm
@ 5.5, 11 Mbps (8% PER, 1024 octets)
–9.5
–
–
dBm
@ 6–54 Mbps (10% PER, 1024 octets)
–9.5
–
–
dBm
@ MCS0–7 rates (10% PER, 4095 octets)
–9.5
–
–
dBm
9
–
12
MHz
LPF 3 dB Bandwidth
–
Adjacent channel rejection1 Mbps DSSS
DSSS
(Difference between interfering 2 Mbps DSSS
and desired signal at 8% PER
for 1024 octet PSDU with
desired signal level as
5.5 Mbps DSSS
specified in Condition/Notes)
11 Mbps DSSS
Adjacent channel rejectionOFDM
(Difference between interfering
and desired signal (25 MHz
apart) at 10% PER for 1024
octet PSDU with desired signal
level as specified in Condition/
Notes)
Adjacent channel rejection
MCS0– 7 (Difference between
interfering and desired signal
(25 MHz apart) at 10% PER for
4096 octet PSDU with desired
signal level as specified in
Condition/Notes)
Desired and interfering signal 30 MHz apart
–74 dBm
35
–
–
dB
–74 dBm
35
–
–
dB
Desired and interfering signal 25 MHz apart
–70 dBm
35
–
–
dB
–70 dBm
35
–
–
dB
6 Mbps OFDM
–79 dBm
16
–
–
dB
9 Mbps OFDM
–78 dBm
15
–
–
dB
12 Mbps OFDM
–76 dBm
13
–
–
dB
18 Mbps OFDM
–74 dBm
11
–
–
dB
24 Mbps OFDM
–71 dBm
8
–
–
dB
36 Mbps OFDM
–67 dBm
4
–
–
dB
48 Mbps OFDM
–63 dBm
0
–
–
dB
54 Mbps OFDM
–62 dBm
–1
–
–
dB
MCS0
–79 dBm
16
–
–
dB
MCS1
–76 dBm
13
–
–
dB
MCS2
–74 dBm
11
–
–
dB
MCS3
–71 dBm
8
–
–
dB
MCS4
–67 dBm
4
–
–
dB
MCS5
–63 dBm
0
–
–
dB
MCS6
–62 dBm
–1
–
–
dB
MCS7
–61 dBm
–2
–
–
dB
–
95
–
dB
Maximum receiver gain
Gain control step
–
–
–
–
–
3
–
dB
Range –98 dBm to –30 dBm
–5
–
5
dB
Range above –30 dBm
–8
–
8
dB
Return loss
Zo = 50Ω, across the dynamic range
10
11.5
13
dB
Receiver cascaded noise
figure
At maximum gain
–
4
–
dB
RSSI accuracye
a. Derate by 1.5 dB for –30°C to –10°C and 55°C to 85°C.
b. Sensitivity degradations for alternate settings in MCS modes. MM: 0.5 dB drop, and SGI: 2 dB drop.
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c. The cellular standard listed for each band indicates the type of modulation used to generate the interfering signal in that band for the purpose of this test. It is not intended
to indicate any specific usage of each band in any specific country.
d. The blocking levels are valid for channels 1 to 11. (For higher channels, the performance may be lower due to third harmonic signals (3 × 824 MHz) falling within band.)
e. The minimum and maximum values shown have a 95% confidence level.
11.4 WLAN 2.4 GHz Transmitter Performance Specifications
Note: The specifications in Table 18 are specified at the chip port output, unless otherwise specified.
Table 18. WLAN 2.4 GHz Transmitter Performance Specifications
Parameter
Condition/Notes
Minimum
Typical
Maximum
Unit
–
2400
–
2500
MHz
Frequency range
Harmonic level (at 18 dBm
with 100% duty cycle)
4.8–5.0 GHz
2nd harmonic
–
–8
–
dBm/1 MHz
7.2–7.5 GHz
3rd harmonic
–
–18
–
dBm/1 MHz
19
20.5
–
dBm
EVM Does Not Exceed
802.11b
(DSSS/CCK)
–9 dB
OFDM, BPSK
Tx power at RF port for
highest power level setting at OFDM, QPSK
25°C and VBAT = 3.6V with OFDM, 16-QAM
spectral mask and EVM
OFDM, 64-QAM
compliancea, b
(R = 3/4)
–8 dB
19
20
–
dBm
–13 dB
19
20
–
dBm
–19 dB
17.5
19
–
dBm
–25 dB
16.5
18
–
dBm
–28 dB
15.5
17
–
dBm
37.4 MHz Crystal, Integrated from 10 kHz
to 10 MHz
–
0.45
–
Degrees
–
10
–
–
dB
Across full temperature and voltage range.
Applies across 10 dBm to 20 dBm output
power range.
–
–
±1.5
dB
Carrier suppression
–
15
–
–
dBc
Gain control step
–
–
0.25
–
dB
–
6
–
dB
OFDM, 64-QAM
(R = 5/6)
Phase noise
Tx power control dynamic
range
Closed-loop Tx power
variation at highest
power level setting
Return loss at
Chip port Tx
Zo = 50Ω
a. Derate by 1.5 dB for temperatures less than –10°C or more than 55°C, or voltages less than 3.0V. Derate by 3.0 dB for voltages of less than 2.7V, or voltages of less
than 3.0V at temperatures less than –10°C or greater than 55°C. Derate by 4.5 dB for –40°C to –30°C.
b. Tx power for Channel 1 and Channel 11 is specified by non-volatile memory parameters.
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11.5 General Spurious Emissions Specifications
Table 19. General Spurious Emissions Specifications
Parameter
Condition/Notes
Min
Typ
Max
Unit
–
2400
–
2500
MHz
Frequency range
General Spurious Emissions
Tx Emissions
Rx/standby Emissions
30 MHz < f < 1 GHz
RBW = 100 kHz
–
–93
–
dBm
1 GHz < f < 12.75 GHz
RBW = 1 MHz
–
–45.5
–
dBm
1.8 GHz < f < 1.9 GHz
RBW = 1 MHz
–
–72
–
dBm
5.15 GHz < f < 5.3 GHz
RBW = 1 MHz
–
–87
–
dBm
30 MHz < f < 1 GHz
RBW = 100 kHz
–
–107
–
dBm
a
1 GHz < f < 12.75 GHz
RBW = 1 MHz
–
–65
–
dBm
1.8 GHz < f < 1.9 GHz
RBW = 1 MHz
–
–87
–
dBm
5.15 GHz < f < 5.3 GHz
RBW = 1 MHz
–
–100
–
dBm
a. For frequencies other than 3.2 GHz, the emissions value is –96 dBm. The value presented in table is the result of LO leakage at 3.2 GHz.
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12. Internal Regulator Electrical Specifications
Note: Values in this data sheet are design goals and are subject to change based on the results of device characterization.
Functional operation is not guaranteed outside of the specification limits provided in this section.
12.1 Core Buck Switching Regulator
Table 20. Core Buck Switching Regulator (CBUCK) Specifications
Specification
Notes
Min
Typ
Max
a
Units
V
Input supply voltage (DC)
DC voltage range inclusive of disturbances.
3.0
3.6
5.25
PWM mode switching frequency
CCM, Load > 100 mA VBAT = 3.6V
2.8
4
5.2
MHz
600
mA
PWM output current
–
–
–
Output current limit
–
–
1400
mA
Output voltage range
Programmable, 30 mV steps
Default = 1.35V
1.2
1.35
1.5
V
PWM output voltage
DC accuracy
Includes load and line regulation.
Forced PWM mode
–4
–
4
%
PWM ripple voltage, static
Measure with 20 MHz bandwidth limit.
Static Load. Max Ripple based on VBAT = 3.6V,
Vout = 1.35V,
Fsw = 4 MHz, 2.2 μH inductor L > 1.05 μH, Cap
+ Board total-ESR < 20 mΩ,
Cout > 1.9 μF, ESL<200pH
–
7
20
mVpp
PWM mode peak efficiency
Peak Efficiency at 200 mA load
78
86
–
%
PFM mode efficiency
10 mA load current
70
81
–
%
Start-up time from
power down
VIO already ON and steady.
Time from REG_ON rising edge to CLDO
reaching 1.2V
–
–
850
μs
External inductor
0806 size, ± 30%, 0.11 ± 25% Ohms
–
2.2
–
μH
External output capacitor
Ceramic, X5R, 0402,
ESR <30 mΩ at 4 MHz, ± 20%, 6.3V
2.0b
4.7
10c
μF
External input capacitor
For SR_VDDBATP5V pin,
ceramic, X5R, 0603,
ESR < 30 mΩ at 4 MHz, ± 20%, 6.3V, 4.7 µF
0.67b
4.7
–
μF
Input supply voltage ramp-up time
0 to 4.3V
40
–
–
μs
a. The maximum continuous voltage is 5.25V. Voltages up to 6.0V for up to 10 seconds, cumulative duration, over the lifetime of the device are allowed. Voltages as high
as 5.5V for up to 250 seconds, cumulative duration, over the lifetime of the device are allowed.
b. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part tolerance, DC-bias, temperature, and aging.
c. Total capacitance includes those connected at the far end of the active load.
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12.2 3.3V LDO (LDO3P3)
Table 21. LDO3P3 Specifications
Specification
Input supply voltage, Vin
Notes
Min
Typ
Max
Units
Min = Vo + 0.2V = 3.5V dropout voltage
requirement must be met under maximum
load for performance specifications.
3.0
3.6
5.25a
V
–
0.001
–
450
mA
Output current
Nominal output voltage, Vo
Default = 3.3V
–
3.3
–
V
Dropout voltage
At max load.
–
–
200
mV
Output voltage DC accuracy
Includes line/load regulation.
–5
–
+5
%
Quiescent current
No load
–
–
100
μA
Line regulation
Vin from (Vo + 0.2V) to 4.8V, max load
–
–
3.5
mV/V
Load regulation
load from 1 mA to 450 mA
–
–
0.3
mV/mA
PSRR
Vin ≥ Vo + 0.2V,
Vo = 3.3V, Co = 4.7 μF,
Max load, 100 Hz to 100 kHz
20
–
–
dB
LDO turn-on time
Chip already powered up.
–
160
250
μs
External output capacitor, Co
Ceramic, X5R, 0402,
(ESR: 5 mΩ–240 mΩ), ± 10%, 10V
1.0b
4.7
10
μF
External input capacitor
For SR_VDDBATA5V pin (shared with
Bandgap) Ceramic, X5R, 0402,
(ESR: 30m–200 mΩ), ± 10%, 10V.
Not needed if sharing VBAT capacitor
4.7 μF with SR_VDDBATP5V.
–
4.7
–
μF
a. The maximum continuous voltage is 5.25V. Voltages up to 6.0V for up to 10 seconds, cumulative duration, over the lifetime of the device are allowed. Voltages as high
as 5.5V for up to 250 seconds, cumulative duration, over the lifetime of the device are allowed.
b. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part tolerance, DC-bias, temperature, and aging.
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12.3 CLDO
Table 22. CLDO Specifications
Specification
Input supply voltage, Vin
Notes
Min
Typ
Max
Units
Min = 1.2 + 0.15V = 1.35V dropout voltage
requirement must be met under maximum load.
1.3
1.35
1.5
V
–
0.2
–
300
mA
1.1
1.2
1.275
V
Output current
Output voltage, Vo
Programmable in 25 mV steps.
Default = 1.2.V
Dropout voltage
At max load
–
–
150
mV
Output voltage DC accuracy
Includes line/load regulation
–4
–
+4
%
No load
–
24
–
μA
Quiescent current
300 mA load
–
2.1
–
mA
Line Regulation
Vin from (Vo + 0.15V) to 1.5V, maximum load
–
–
5
mV/V
Load Regulation
Load from 1 mA to 300 mA
–
0.02
0.05
mV/mA
Power down
–
–
20
μA
3
μA
Leakage Current
Bypass mode
–
1
PSRR
@1 kHz, Vin ≥ 1.35V, Co = 4.7 μF
20
–
Start-up Time of PMU
VIO up and steady. Time from the REG_ON rising
edge to the CLDO reaching 1.2V.
–
–
700
μs
LDO Turn-on Time
LDO turn-on time when rest of the chip is up
–
140
180
μs
1.32a
4.7
–
μF
–
1
2.2
μF
External Output Capacitor, Co
Total ESR: 5 mΩ–240 mΩ
External Input Capacitor
Only use an external input capacitor at the
VDD_LDO pin if it is not supplied from CBUCK
output.
dB
a. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part tolerance, DC-bias, temperature, and aging.
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12.4 LNLDO
Table 23. LNLDO Specifications
Specification
Input supply voltage, Vin
Notes
Min
Typ
Max
Units
Min = 1.2Vo + 0.15V = 1.35V dropout voltage
requirement must be met under maximum load.
1.3
1.35
1.5
V
–
0.1
–
150
mA
1.1
1.2
1.275
V
Output Current
Output Voltage, Vo
Programmable in 25 mV steps.
Default = 1.2V
Dropout Voltage
At maximum load
–
–
150
mV
Output Voltage DC Accuracy
Includes line/load regulation
–4
–
+4
%
No load
–
44
–
μA
Quiescent current
Max load
–
970
990
μA
Line Regulation
Vin from (Vo + 0.1V) to 1.5V, max load
–
–
5
mV/V
Load Regulation
Load from 1 mA to 150 mA
–
0.02
0.05
mV/mA
Leakage Current
Power-down
–
–
10
μA
Output Noise
@30 kHz, 60–150 mA load Co = 2.2 μF
@100 kHz, 60–150 mA load Co = 2.2 μF
–
–
60
35
nV/rt Hz nV/
rt Hz
PSRR
@ 1kHz, Input > 1.35V, Co= 2.2 μF, Vo = 1.2V
20
–
–
dB
LDO Turn-on Time
LDO turn-on time when rest of chip is up
–
140
180
μs
External Output Capacitor, Co
Total ESR (trace/capacitor):
5 mΩ–240 mΩ
0.5a
2.2
4.7
μF
External Input Capacitor
Only use an external input capacitor at the
VDD_LDO pin if it is not supplied from CBUCK
output.
Total ESR (trace/capacitor): 30 mΩ–200 mΩ
–
1
2.2
μF
a. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part tolerance, DC-bias, temperature, and aging.
Document Number: 002-15055 Rev. *E
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CYW4390
13. System Power Consumption
Note: Values in this data sheet are design goals and are subject to change based on the results of device characterization.
Note: Unless otherwise stated, these values apply for the conditions specified in Table 15 on page 44.
Table 24. Application Processor Current Consumption
Mode
Bandwidth
(MHz)
Band (GHz)
Vbat = 3.6V, VDDIO = 1.8V,
T(A) = 25°C
Vbat, mA
Vio, μA
Notes
Sleep Modes
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Document Number: 002-15055 Rev. *E
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CYW4390
13.1 WLAN Current Consumption
The WLAN current consumption measurements are shown in Table 25.
Table 25. Typical WLAN Power Consumptiona
Bandwidth
(MHz)
Mode
Band (GHz)
Vbat = 3.6V, VDDIO = 1.8V,
T(A) = 25°C
Notes
Vbat, mA
Vio, μA
0.005
3
Noteb
Sleep
0.1
200
Notec
IEEE Power Save, DTIM 1
1.2
60
Noted
IEEE Power Save, DTIM 3
0.4
60
Noted
Sleep Modes
Off
Active Modes
Transmit, CCK
20
2.4
88
60
Notese, f
Transmit, MCS7
20
2.4
111
60
Notese, f
Transmit, CCK (@20 dBm)
20
2.4
342
60
Notesf, g
Transmit, MCS7 (@18.5 dBm)
20
2.4
295
60
Notesf, g
Receive
20
2.4
61
60
Notesf, h, i
CRS
20
2.4
56
60
Notej
a.
b.
c.
d.
e.
f.
g.
h.
i.
j.
Vio is specified with all pins idle (not switching) and not driving any loads.
WL_REG_ON and APPS_REG_ON are low.
Idle, not associated or inter-beacon.
Beacon interval is 102.4 ms and beacon duration is 1 ms @ 1 Mbps. Average current is over three DTIM intervals.
Duty cycle is 100%.
Measured using packet engine test mode.
Duty cycle is 100%. It includes internal PA contribution.
Duty cycle is 100%. Carrier sense (CS) detect/packet receive.
MCS7 and HT20.
Carrier Sense (CCA) when no carrier is present.
13.2 JTAG Timing
Table 26. JTAG Timing Characteristics
Period
Output
Maximum
Output
Minimum
Setup
Hold
TCK
125 ns
–
–
–
–
TDI
–
–
–
20 ns
0 ns
TMS
–
–
–
20 ns
0 ns
–
100 ns
0 ns
–
–
250 ns
–
–
–
–
Signal Name
TDO
JTAG_TRST
Document Number: 002-15055 Rev. *E
Page 55 of 64
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CYW4390
14. Power-Up Sequence and Timing
14.1 Sequencing of Reset and Regulator Control Signals
The CYW4390 has two signals that allow the host to control power consumption by enabling or disabling the APPS CPU, WLAN, and
internal regulator blocks. These signals are described below. Additionally, diagrams are provided to indicate proper sequencing of the
signals for various operational states (see Figure 13 and Figure 14 on page 57, and Figure 15 and Figure 16 on page 58). The timing
values indicated are minimum required values; longer delays are also acceptable.
14.1.1 Description of Control Signals
■
WL_REG_ON: Used by the PMU to power up the WLAN section. It is also OR-gated with the APPS_REG_ON input to control the
internal CYW4390 regulators. When this pin is high, the regulators are enabled and the WLAN section is out of reset. When this pin
is low the WLAN section is in reset. If both the APPS_REG_ON and WL_REG_ON pins are low, the regulators are disabled.
■
APPS_REG_ON: Used by the PMU (OR-gated with WL_REG_ON) to power up the internal CYW4390 regulators. If both the
APPS_REG_ON and WL_REG_ON pins are low, the regulators are disabled. When this pin is low and WL_REG_ON is high, the
APPS CPU section is in reset.
Note: For both the WL_REG_ON and APPS_REG_ON pins, there should be at least a 10 ms time delay between consecutive toggles
(where both signals have been driven low). This is to allow time for the CBUCK regulator to discharge. If this delay is not followed,
then there may be a VDDIO in-rush current on the order of 36 mA during the next PMU cold start.
Note: The CYW4390 has an internal power-on reset (POR) circuit. The device will be held in reset for a maximum of 110 ms after
VDDC and VDDIO have both passed the POR threshold.
Note: VBAT should not rise 10%–90% faster than 40 microseconds. VBAT should be up before or at the same time as VDDIO. VDDIO
should NOT be present first or be held high before VBAT is high.
Document Number: 002-15055 Rev. *E
Page 56 of 64
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CYW4390
14.1.2 Control Signal Timing Diagrams
Figure 13. WLAN = ON, APPS CPU = ON
32.678 kHz
Sleep Clock
90% of VH
VBAT*
VDDIO
~ 2 Sleep cycles
WL_REG_ON
APPS_REG_ON
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high
before VBAT is high.
Figure 14. WLAN = OFF, APPS CPU = OFF
32.678 kHz
Sleep Clock
VBAT*
VDDIO
WL_REG_ON
APPS_REG_ON
*Notes:
1. VBAT should not rise 10%–90%faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before VBAT is high.
Document Number: 002-15055 Rev. *E
Page 57 of 64
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CYW4390
Figure 15. WLAN = ON, APPS CPU = OFF
32.678 kHz
Sleep Clock
90% of VH
VBAT*
VDDIO
~ 2 Sleep cycles
WL_REG_ON
APPS_REG_ON
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before VBAT is high.
Figure 16. WLAN = OFF, APPS CPU= ON
32.678 kHz
Sleep Clock
VBAT*
90% of VH
VDDIO
~ 2 Sleep cycles
WL_REG_ON
APPS_REG_ON
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before VBAT is high.
Document Number: 002-15055 Rev. *E
Page 58 of 64
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CYW4390
15. Package Information
15.1 Package Thermal Characteristics
Table 27. Package Thermal Characteristicsa
Characteristic
JA (°C/W) (value in still air)
JB (°C/W)
JC (°C/W)
JT (°C/W)
JB (°C/W)
Maximum Junction Temperature Tj (°C)
Maximum Power Dissipation (W)
WLCSP
33.45
3.45
1.00
3.45
10.64
125
1.119
a. No heat sink, TA = 70°C. This is an estimate, based on a 4-layer PCB that conforms to EIA/JESD51–7 (101.6 mm × 101.6 mm × 1.6 mm) and P = 1.119W continuous
dissipation.
15.2 Junction Temperature Estimation and PSIJT Versus THETAJC
Package thermal characterization parameter PSI–JT (JT) yields a better estimation of actual junction temperature (TJ) versus using
the junction-to-case thermal resistance parameter Theta–JC (JC). The reason for this is that JC assumes that all the power is
dissipated through the top surface of the package case. In actual applications, some of the power is dissipated through the bottom
and sides of the package. JT takes into account power dissipated through the top, bottom, and sides of the package. The equation
for calculating the device junction temperature is:
TJ = TT + P x JT
Where:
■
TJ = Junction temperature at steady-state condition (°C)
■
TT = Package case top center temperature at steady-state condition (°C)
■
P = Device power dissipation (Watts)
■
JT = Package thermal characteristics; no airflow (°C/W)
15.3 Environmental Characteristics
For environmental characteristics data, see Table 13 on page 42.
Document Number: 002-15055 Rev. *E
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CYW4390
16. Mechanical Information
Figure 17. 286-Bump WLCSP Package Bump Map
Document Number: 002-15055 Rev. *E
Page 60 of 64
ADVANCE
CYW4390
Figure 18. WLCSP Keep-Out Areas for PCB Layout—Bottom View, Bumps Facing Up
Note: Top-layer metal is not allowed in the keep-out areas.
Document Number: 002-15055 Rev. *E
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CYW4390
17. Ordering Information
Part Number
CYW4390DKWBG
Package
286-bump WLCSP
(4.87 mm × 5.413 mm, 0.2 mm pitch)
Document Number: 002-15055 Rev. *E
Description
Single-band 2.4 GHz WLAN
Ambient Operating
Temperature
–30°C to +85°C
Page 62 of 64
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CYW4390
Document History
Document Title: CYW4390 WICED™ Wi-Fi IEEE 802.11 b/g/n SoC with Embedded Application Processor
Document Number: 002-15055
Revision
ECN
Orig. of
Change
Submission
Date
**
–
–
05/15/2013
4390-DS100-R:
Initial release
*A
–
–
12/05/2013
4390-DS101-R:
Updated:
• Significant changes throughout the document.
Description of Change
*B
–
–
12/11/2013
4390-DS102-R:
Updated:
• Figure 1 on page 1
• “General Features” on page 2
• “Power Supply Topology” on page 12
• Figure 3: “Typical Power Topology,” on page 13
• “External 32.768 KHz Low-Power Oscillator” on page 20
• Table 4: “GPIO Port A Alternate Functions,” on page 23
• Figure 9: “WLAN PHY Block Diagram,” on page 35
• Figure 10: “Radio Functional Block Diagram,” on page 36
• “Receiver Path” on page 36
• Table 8: “WLAN MAC Architecture,” on page 30
• Table 9: “WLCSP and FCFBGA Pin Descriptions,” on page 48
• Table 14: “Recommended Operating Conditions and DC Characteristics,” on page 57
• Table 16: “WLAN 2.4 GHz Receiver Performance Specifications,” on page 60
• Table 19: “Core Buck Switching Regulator (CBUCK) Specifications,” on page 65
• Table 20: “LDO3P3 Specifications,” on page 66
• Table 24: “Typical WLAN Power Consumption,” on page 69
• Figure 14: “WLAN = OFF, APPS CPU = OFF,” on page 72
• Figure 15: “WLAN = ON, APPS CPU = OFF,” on page 73
• Figure 16: “WLAN = OFF, APPS CPU= ON,” on page 73
• Figure 18: “WLCSP Keep-Out Areas for PCB Layout —Bottom View, Bumps Facing
Up,” on page 76
*C
–
–
02/05/2014
4390-DS103-R:
Updated:
• “Features” on page 1
*D
5524606
UTSV
11/17/2016
Updated to Cypress template
*E
5705750
AESATMP7
04/21/2017
Updated Cypress Logo and Copyright.
Document Number: 002-15055 Rev. *E
Page 63 of 64
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CYW4390
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
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closest to you, visit us at Cypress Locations.
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Cypress Developer Community
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Training | Components
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cypress.com/wireless
64
© Cypress Semiconductor Corporation, 2013-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
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provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation
of the Software is prohibited.
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products
are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or
systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the
device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably
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Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
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Document Number: 002-15055 Rev. *E
Revised April 21, 2017
Page 64 of 64