LINER LTC2172-14 14-bit, 65msps/40msps/25msps low power octal adc Datasheet

LTM9008-14/
LTM9007-14/LTM9006-14
14-Bit, 65Msps/40Msps/
25Msps Low Power Octal ADCs
FEATURES
n
n
n
n
n
n
n
n
n
n
n
n
DESCRIPTION
8-Channel Simultaneous Sampling ADC
73dB SNR
90dB SFDR
Low Power: 88mW/59mW/46mW per Channel
Single 1.8V Supply
Serial LVDS Outputs: 1 or 2 Bits per Channel
Selectable Input Ranges: 1VP-P to 2VP-P
800MHz Full Power Bandwidth S/H
Shutdown and Nap Modes
Serial SPI Port for Configuration
Internal Bypass Capacitance, No External
Components
140-Pin (11.25mm × 9mm) BGA Package
The LTM®9008-14/LTM9007-14/LTM9006-14 are 8-channel, simultaneous sampling 14-bit A/D converters designed
for digitizing high frequency, wide dynamic range signals.
AC performance includes 73dB SNR and 90dB spurious
free dynamic range (SFDR). Low power consumption per
channel reduces heat in high channel count applications.
Integrated bypass capacitance and flowthrough pinout
reduces overall board space requirements.
DC specs include ±1LSB INL (typ), ±0.3LSB DNL (typ)
and no missing codes over temperature. The transition
noise is a low 1.2LSBRMS.
The digital outputs are serial LVDS to minimize the number of data lines. Each channel outputs two bits at a time
(2-lane mode). At lower sampling rates there is a one bit
per channel option (1-lane mode).
APPLICATIONS
n
n
n
n
n
n
Communications
Cellular Base Stations
Software Defined Radios
Portable Medical Imaging
Multichannel Data Acquisition
Nondestructive Testing
The ENC+ and ENC– inputs may be driven differentially
or single-ended with a sine wave, PECL, LVDS, TTL, or
CMOS inputs. An internal clock duty cycle stabilizer allows high performance at full speed for a wide range of
clock duty cycles.
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
1.8V
VDD
14-BIT
ADC CORE
OUT1A
0
OUT1B
–10
S/H
14-BIT
ADC CORE
OUT2A
–30
ENCODE
INPUT
S/H
•••
OUT8A
14-BIT
ADC CORE
OUT8B
DATA
CLOCK
OUT
PLL
FRAME
90067814 TA01
GND
GND
SERIALIZED
LVDS
OUTPUTS
AMPLITUDE (dBFS)
CHANNEL 8
ANALOG
INPUT
DATA
SERIALIZER
–20
OUT2B
•••
•••
CHANNEL 2
ANALOG
INPUT
S/H
•••
CHANNEL 1
ANALOG
INPUT
LTM9008-14, 65Msps,
2-Tone FFT, fIN = 70MHz and 75MHz
1.8V
OVDD
–40
–50
–60
–70
–80
–90
–100
–110
–120
0
20
10
FREQUENCY (MHz)
30
90067814 TA01b
90067814f
1
LTM9008-14/
LTM9007-14/LTM9006-14
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Notes 1, 2)
Supply Voltages
VDD, OVDD................................................. –0.3V to 2V
Analog Input Voltage (AIN+, AIN –,
PAR/SER, SENSE) (Note 3)........... –0.3V to (VDD + 0.2V)
Digital Input Voltage (ENC+, ENC–, CS,
SDI, SCK) (Note 4)..................................... –0.3V to 3.9V
SDO (Note 4).............................................. –0.3V to 3.9V
Digital Output Voltage................. –0.3V to (OVDD + 0.3V)
Operating Temperature Range
LTM9008C, LTM9007C, LTM9006C......... 0°C to 70°C
LTM9008I, LTM9007I, LTM9006I.........–40°C to 85°C
Storage Temperature Range................... –55°C to 125°C
TOP VIEW
A
B
C
D
E
F
G
H
J
K
L
M
N
P
1
2
3
4
5
6
7
8
9
10
BGA PACKAGE
140-LEAD (11.25mm × 9.00mm × 2.72mm)
TJMAX = 150°C, θJA = 30°C/W, θJC = 25°C/W, θJB = 15°C/W, θJCbottom = 12°C/W
ORDER INFORMATION
LEAD FREE FINISH
TRAY
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTM9008CY-14#PBF
LTM9008CY-14#PBF
LTM9008Y14
140-Lead (11.25mm × 9mm × 2.72mm) BGA 0°C to 70°C
LTM9008IY-14#PBF
LTM9008IY-14#PBF
LTM9008Y14
140-Lead (11.25mm × 9mm × 2.72mm) BGA –40°C to 85°C
LTM9007CY-14#PBF
LTM9007CY-14#PBF
LTM9007Y14
140-Lead (11.25mm × 9mm × 2.72mm) BGA 0°C to 70°C
LTM9007IY-14#PBF
LTM9007IY-14#PBF
LTM9007Y14
140-Lead (11.25mm × 9mm × 2.72mm) BGA –40°C to 85°C
LTM9006CY-14#PBF
LTM9006CY-14#PBF
LTM9006Y14
140-Lead (11.25mm × 9mm × 2.72mm) BGA 0°C to 70°C
LTM9006IY-14#PBF
LTM9006IY-14#PBF
LTM9006Y14
140-Lead (11.25mm × 9mm × 2.72mm) BGA –40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
This product is only offered in trays. For more information go to: http://www.linear.com/packaging/
90067814f
2
LTM9008-14/
LTM9007-14/LTM9006-14
CONVERTER CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 5)
PARAMETER
LTM9008-14
MIN
TYP MAX
CONDITIONS
Resolution (No Missing Codes)
l
LTM9007-14
MIN
TYP MAX
14
LTM9006-14
MIN
TYP MAX
14
UNITS
14
Bits
Integral Linearity Error
Differential Analog Input (Note 6) l
–4.1
±1.2
4.1
–2.75
±1
2.75
–2.75
±1
2.75
LSB
Differential Linearity Error
Differential Analog Input
l
–0.9
±0.3
0.9
–0.8
±0.3
0.8
–0.8
±0.3
0.8
LSB
Offset Error
(Note 7)
l
–12
±3
12
–12
±3
12
–12
±3
12
mV
Gain Error
Internal Reference
External Reference
–2.5
–1.3
–1.3
–2.5
–1.3
–1.3
–2.6
–1.3
–1.3
0.5
%FS
%FS
l
Offset Drift
0.5
0.5
±20
±20
±20
µV/°C
Full-Scale Drift
Internal Reference
External Reference
±35
±25
±35
±25
±35
±25
ppm/°C
ppm/°C
Gain Matching
External Reference
±0.2
±0.2
±0.2
%FS
±3
±3
±3
mV
External Reference
1.2
1.2
1.2
LSBRMS
Offset Matching
Transition Noise
ANALOG INPUT
The l denotes the specifications which apply over the full operating temperature range, otherwise
specifications are at TA = 25°C. (Note 5)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VIN(CM)
Analog Input Range (AIN+ – AIN–)
Analog Input Common Mode (AIN+ + AIN–)/2
VSENSE
External Voltage Reference Applied to SENSE External Reference Mode
IINCM
Analog Input Common Mode Current
Per Pin, 65Msps
Per Pin, 40Msps
Per Pin, 25Msps
IIN1
Analog Input Leakage Current
0 < AIN+, AIN– < VDD, No Encode
l
–1
1
µA
IIN2
PAR/SER Input Leakage Current
0 < PAR/SER < VDD
l
–3
3
µA
IIN3
SENSE Input Leakage Current
0.625 < SENSE < 1.3V
l
–6
6
µA
tAP
Sample-and-Hold Acquisition Delay Time
0
tJITTER
Sample-and-Hold Acquisition Delay Jitter
0.15
CMRR
Analog Input Common Mode Rejection Ratio
BW-3B
Full-Power Bandwidth
VIN
1.7V < VDD < 1.9V
l
Differential Analog Input (Note 8)
l
VCM – 100mV
VCM
VCM + 100mV
V
l
0.625
1.250
1.300
V
Figure 6 Test Circuit
1 to 2
VP-P
81
50
31
µA
µA
µA
ns
psRMS
80
dB
800
MHz
90067814f
3
LTM9008-14/
LTM9007-14/LTM9006-14
DYNAMIC ACCURACY
The l denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C. AIN = –1dBFS. (Note 5)
SYMBOL
PARAMETER
CONDITIONS
LTM9008-14
MIN
TYP MAX
LTM9007-14
MIN
TYP MAX
LTM9006-14
MIN
TYP MAX
UNITS
SNR
Signal-to-Noise Ratio
5MHz Input
30MHz Input
70MHz Input
140MHz Input
73.7
73.7
73.5
73
73.5
73.4
73.4
72.8
72.9
72.9
72.8
72.3
dBFS
dBFS
dBFS
dBFS
90
90
89
84
dBFS
dBFS
dBFS
dBFS
90
90
90
90
dBFS
dBFS
dBFS
dBFS
72.8
72.7
72.5
71.9
dBFS
dBFS
dBFS
dBFS
SFDR
Spurious Free Dynamic Range 5MHz Input
2nd or 3rd Harmonic
30MHz Input
70MHz Input
140MHz Input
Spurious Free Dynamic Range 5MHz Input
4th Harmonic or Higher
30MHz Input
70MHz Input
140MHz Input
S/(N+D)
l
71.8
l
74
l
84
l
71
69.6
90
90
89
84
76.8
90
90
90
90
84
90
90
89
84
69.6
76.8
90
90
90
90
84
Signal-to-Noise Plus
Distortion Ratio
5MHz Input
30MHz Input
70MHz Input
140MHz Input
Crosstalk, Near Channel
10MHz Input (Note 12)
–90
–90
–90
dBc
Crosstalk, Far Channel
10MHz Input (Note 12)
–105
–105
–105
dBc
73.6
73.5
73.2
72.5
69.5
73.3
73.2
73.1
72.3
69.5
INTERNAL REFERENCE CHARACTERISTICS
The l denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. AIN = –1dBFS. (Note 5)
PARAMETER
CONDITIONS
VCM Output Voltage
IOUT = 0
MIN
TYP
MAX
0.5 • VDD – 25mV
0.5 • VDD
0.5 • VDD + 25mV
VCM Output Temperature Drift
±25
VCM Output Resistance
–600µA < IOUT < 1mA
VREF Output Voltage
IOUT = 0
VREF Output Temperature Drift
1.250
±25
VREF Output Resistance
–400µA < IOUT < 1mA
VREF Line Regulation
1.7V < VDD < 1.9V
7
0.6
V
ppm/°C
4
1.225
UNITS
Ω
1.275
V
ppm/°C
Ω
mV/V
90067814f
4
LTM9008-14/
LTM9007-14/LTM9006-14
DIGITAL INPUTS AND OUTPUTS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
ENCODE INPUTS (ENC+, ENC– )
Differential Encode Mode (ENC– Not Tied to GND)
VID
Differential Input Voltage
(Note 8)
l
0.2
VICM
Common Mode Input Voltage
Internally Set
Externally Set (Note 8)
l
1.1
l
0.2
VIN
Input Voltage Range
ENC+, ENC– to GND
RIN
Input Resistance
(See Figure 10)
CIN
Input Capacitance
V
1.2
1.6
V
V
3.6
V
10
kΩ
3.5
pF
Single-Ended Encode Mode (ENC– Tied to GND)
VIH
High Level Input Voltage
VDD = 1.8V
1.26
V
VIL
Low Level Input Voltage
VDD = 1.8V
0.54
V
VIN
Input Voltage Range
ENC+ to GND
RIN
Input Resistance
(See Figure 11)
CIN
Input Capacitance
0 to 3.6
V
30
kΩ
3.5
pF
DIGITAL INPUTS (CS, SDI, SCK in Serial or Parallel Programming Mode. SDO in Parallel Programming Mode)
VIH
High Level Input Voltage
VDD = 1.8V
VIL
Low Level Input Voltage
VDD = 1.8V
l
IIN
Input Current
VIN = 0V to 3.6V
l
CIN
Input Capacitance
l
1.3
V
–10
0.6
V
10
µA
3
pF
200
Ω
SDO OUTPUT (Serial Programming Mode. Open-Drain Output. Requires 2kΩ Pull-Up Resistor if SDO Is Used)
ROL
Logic Low Output Resistance to GND
VDD = 1.8V, SDO = 0V
IOH
Logic High Output Leakage Current
SDO = 0V to 3.6V
COUT
Output Capacitance
l
–10
10
3
µA
pF
DIGITAL DATA OUTPUTS
VOD
Differential Output Voltage
100Ω Differential Load, 3.5mA Mode
100Ω Differential Load, 1.75mA Mode
l
l
247
125
350
175
454
250
VOS
Common Mode Output Voltage
100Ω Differential Load, 3.5mA Mode
100Ω Differential Load, 1.75mA Mode
l
l
1.125
1.125
1.250
1.250
1.375
1.375
RTERM
On-Chip Termination Resistance
Termination Enabled, OVDD = 1.8V
100
mV
mV
V
V
Ω
90067814f
5
LTM9008-14/
LTM9007-14/LTM9006-14
POWER REQUIREMENTS
The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 9)
SYMBOL PARAMETER
CONDITIONS
LTM9008-14
MIN
TYP MAX
LTM9007-14
MIN
TYP MAX
LTM9006-14
MIN
TYP MAX UNITS
1.9
1.7
1.9
1.7
1.7
1.7
VDD
Analog Supply Voltage
(Note 10)
l
1.7
OVDD
Output Supply Voltage
(Note 10)
l
1.7
1.8
1.9
1.8
1.9
1.8
1.9
V
IVDD
Analog Supply Current
Sine Wave Input
l
357
400
232
275
175
250
mA
IOVDD
Digital Supply Current
1-Lane Mode, 1.75mA Mode
1-Lane Mode, 3.5mA Mode
2-Lane Mode, 1.75mA Mode
2-Lane Mode, 3.5mA Mode
l
l
32
60
50
94
58
104
32
58
48
92
54
102
30
56
48
90
54
100
mA
mA
mA
mA
l
l
700
751
733
812
824
907
475
522
504
583
592
679
369
416
401
477
547
630
mW
mW
mW
mW
PDISS
Power Dissipation
1-Lane Mode, 1.75mA Mode
1-Lane Mode, 3.5mA Mode
2-Lane Mode, 1.75mA Mode
2-Lane Mode, 3.5mA Mode
1.8
1.8
1.8
1.9
V
PSLEEP
Sleep Mode Power
2
2
2
mW
PNAP
Nap Mode Power
170
170
170
mW
PDIFFCLK
Power Decrease With Single-Ended Encode Mode Enabled
(No Decrease for Sleep Mode)
40
40
40
mW
TIMING CHARACTERISTICS
The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 5)
LTM9008-14
MIN
TYP MAX
LTM9007-14
MIN
TYP MAX
LTM9006-14
MIN
TYP MAX
SYMBOL
PARAMETER
CONDITIONS
fS
Sampling Frequency
(Notes 10,11)
l
5
65
5
40
5
25
MHz
tENCL
ENC Low Time (Note 8)
Duty Cycle Stabilizer Off
Duty Cycle Stabilizer On
l
l
7.3
2
7.69
7.69
100
100
11.88
2
12.5
12.5
100
100
19
2
20
20
100
100
ns
ns
tENCH
ENC High Time (Note 8)
Duty Cycle Stabilizer Off
Duty Cycle Stabilizer On
l
l
7.3
2
7.69
7.69
100
100
11.88
2
12.5
12.5
100
100
19
2
20
20
100
100
ns
ns
tAP
Sample-and-Hold
Acquisition Delay Time
SYMBOL
PARAMETER
0
0
CONDITIONS
MIN
0
TYP
UNITS
ns
MAX
UNITS
Digital Data Outputs (RTERM = 100Ω Differential, CL = 2pF to GND on Each Output)
1/(8 • fS)
1/(7 • fS)
1/(6 • fS)
1/(16 • fS)
1/(14 • fS)
1/(12 • fS)
s
s
s
s
s
s
tSER
Serial Data Bit Period
2-Lanes, 16-Bit Serialization
2-Lanes, 14-Bit Serialization
2-Lanes, 12-Bit Serialization
1-Lane, 16-Bit Serialization
1-Lane, 14-Bit Serialization
1-Lane, 12-Bit Serialization
tFRAME
FR to DCO Delay
(Note 8)
l
0.35 • tSER
0.5 • tSER
0.65 • tSER
s
tDATA
DATA to DCO Delay
(Note 8)
l
0.35 • tSER
0.5 • tSER
0.65 • tSER
s
tPD
Propagation Delay
(Note 8)
l
tR
Output Rise Time
tF
0.7n + 2 • tSER 1.1n + 2 • tSER 1.5n + 2 • tSER
s
Data, DCO, FR, 20% to 80%
0.17
ns
Output Fall Time
Data, DCO, FR, 20% to 80%
0.17
DCO Cycle-Cycle Jitter
tSER = 1ns
Pipeline Latency
ns
60
psP-P
6
Cycles
90067814f
6
LTM9008-14/
LTM9007-14/LTM9006-14
TIMING CHARACTERISTICS
The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
SPI Port Timing (Note 8)
tSCK
SCK Period
tS
Write Mode
Read Back Mode, CSDO = 20pF,
RPULLUP = 2k
l
l
40
250
ns
ns
CS to SCK Setup Time
l
5
ns
tH
SCK to CS Setup Time
l
5
ns
tDS
SDI Setup Time
l
5
ns
tDH
SDI Hold Time
l
5
ns
tDO
SCK Falling to SDO Valid
Read Back Mode, CSDO = 20pF,
RPULLUP = 2k
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All voltage values are with respect to GND (unless otherwise
noted).
Note 3: When these pin voltages are taken below GND or above VDD, they
will be clamped by internal diodes. This product can handle input currents
of greater than 100mA below GND or above VDD without latchup.
Note 4: When these pin voltages are taken below GND they will be
clamped by internal diodes. When these pin voltages are taken above VDD
they will not be clamped by internal diodes. This product can handle input
currents of greater than 100mA below GND without latchup.
Note 5: VDD = OVDD = 1.8V, fSAMPLE = 65MHz (LTM9008), 40MHz
(LTM9007), or 25MHz (LTM9006), 2-lane output mode, differential ENC+/
ENC– = 2VP-P sine wave, input range = 2VP-P with differential drive, unless
otherwise noted.
Note 6: Integral nonlinearity is defined as the deviation of a code from a
best fit straight line to the transfer curve. The deviation is measured from
the center of the quantization band.
l
125
ns
Note 7: Offset error is the offset voltage measured from –0.5 LSB when
the output code flickers between 00 0000 0000 0000 and 11 1111 1111
1111 in 2’s complement output mode.
Note 8: Guaranteed by design, not subject to test.
Note 9: VDD = OVDD = 1.8V, fSAMPLE = 65MHz (LTM9008), 40MHz
(LTM9007), or 25MHz (LTM9006), 2-lane output mode, differential
ENC+/ENC– = 2VP-P sine wave, input range = 2VP-P with differential
drive, unless otherwise noted. The supply current and power dissipation
specifications are totals for the entire device, not per channel.
Note 10: Recommended operating conditions.
Note 11: The maximum sampling frequency depends on the speed grade
of the part and also which serialization mode is used. The maximum serial
data rate is 1000Mbps so tSER must be greater than or equal to 1ns.
Note 12: Near-channel crosstalk refers to Ch. 1 to Ch.2, and Ch.7 to Ch.8.
Far-channel crosstalk refers to Ch.1 to Ch.7, Ch.1 to Ch.8, Ch.2 to Ch.7, and
Ch.2 to Ch.8.
90067814f
7
LTM9008-14/
LTM9007-14/LTM9006-14
TIMING DIAGRAMS
2-Lane Output Mode, 16-Bit Serialization*
tAP
ANALOG
INPUT
N+1
N
tENCH
ENC–
tENCL
ENC+
tSER
DCO–
DCO+
tFRAME
FR–
FR+
tDATA
tSER
tPD
OUT#A–
OUT#A+
OUT#B–
OUT#B+
tSER
D5
D3
D1
0
D13 D11 D9
D7
D5
D3
D1
0
D13 D11 D9
D4
D2
D0
0
D12 D10 D8
D6
D4
D2
D0
0
D12 D10 D8
SAMPLE N-6
SAMPLE N-5
SAMPLE N-4
90067814 TD01
*SEE THE DIGITAL OUTPUTS SECTION
2-Lane Output Mode, 14-Bit Serialization
tAP
ANALOG
INPUT
N+2
N
tENCH
ENC–
N+1
tENCL
ENC+
tSER
DCO–
DCO+
tFRAME
FR–
FR+
OUT#A–
OUT#A+
OUT#B–
OUT#B+
tDATA
tSER
tPD
tSER
D7
D5
D3
D1 D13 D11 D9
D7
D5
D3
D1 D13 D11 D9
D7
D5
D3
D1 D13 D11 D9
D6
D4
D2
D0 D12 D10 D8
D6
D4
D2
D0 D12 D10 D8
D6
D4
D2
D0 D12 D10 D8
SAMPLE N-6
SAMPLE N-5
SAMPLE N-4
SAMPLE N-3
90067814 TD02
NOTE THAT IN THIS MODE FR+/FR– HAS TWO TIMES THE PERIOD OF ENC+/ENC–
90067814f
8
LTM9008-14/
LTM9007-14/LTM9006-14
TIMING DIAGRAMS
2-Lane Output Mode, 12-Bit Serialization
tAP
ANALOG
INPUT
N
N+1
tENCH
ENC–
tENCL
ENC+
tSER
DCO–
DCO+
FR+
tFRAME
tDATA
tPD
tSER
FR–
OUT#A–
OUT#A+
OUT#B–
OUT#B+
tSER
D9
D7
D5
D3 D13 D11 D9
D7
D5
D3 D13 D11 D9
D8
D6
D4
D2 D12 D10 D8
D6
D4
D2 D12 D10 D8
SAMPLE N-6
SAMPLE N-5
SAMPLE N-4
90067814 TD03
1-Lane Output Mode, 16-Bit Serialization
tAP
ANALOG
INPUT
N+1
N
tENCH
ENC–
tENCL
ENC+
tSER
DCO–
DCO+
tFRAME
FR–
FR+
OUT#A–
OUT#A+
tDATA
tSER
tPD
D1
D0
0
tSER
0
SAMPLE N-6
D13 D12 D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
SAMPLE N-5
0
D13 D12 D11 D10
SAMPLE N-4
90067814 TD04
OUT#B+, OUT#B– ARE DISABLED
1-Lane Output Mode, 14-Bit Serialization
tAP
ANALOG
INPUT
N+1
N
tENCH
ENC–
tENCL
ENC+
tSER
DCO–
DCO+
tFRAME
FR–
FR+
OUT#A–
OUT#A+
tDATA
tSER
tPD
D3
D2
SAMPLE N-6
D1
tSER
D0 D13 D12 D11 D10 D9
SAMPLE N-5
D8
D7
D6
D5
D4
D3
D2
D1
D0 D13 D12 D11 D10
SAMPLE N-4
90067814 TD06
OUT#B+, OUT#B– ARE DISABLED
90067814f
9
LTM9008-14/
LTM9007-14/LTM9006-14
TIMING DIAGRAMS
1-Lane Output Mode, 12-Bit Serialization
tAP
ANALOG
INPUT
N+1
N
tENCH
ENC–
tENCL
ENC+
tSER
DCO–
DCO+
tFRAME
FR–
FR+
OUT#A–
OUT#A+
tDATA
tSER
tPD
D5
D4
D3
tSER
D2 D13 D12 D11 D10 D9
SAMPLE N-6
D8
D7
D6
D5
D4
D3
D2 D13 D12 D11
SAMPLE N-5
SAMPLE N-4
90067814 TD07
OUT#B+, OUT#B– ARE DISABLED
SPI Port Timing (Readback Mode)
tDS
tS
tDH
tSCK
tH
CS
SCK
tDO
SDI
SDO
R/W
A6
A5
A4
A3
A2
A1
A0
XX
D7
HIGH IMPEDANCE
XX
D6
XX
D5
XX
D4
XX
D3
XX
D2
XX
XX
D1
D0
SPI Port Timing (Write Mode)
CS
SCK
SDI
SDO
R/W
HIGH IMPEDANCE
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
90067814 TD08
90067814f
10
LTM9008-14/
LTM9007-14/LTM9006-14
TYPICAL PERFORMANCE CHARACTERISTICS
LTM9008-14: Integral
Nonlinearity (INL) vs Output Code
LTM9008-14: Differential
Nonlinearity (DNL) vs Output Code
2.0
1.5
0
0.4
–10
–20
0.3
0.5
0
–0.5
–1.0
–30
0.2
AMPLITUDE (dBFS)
DNL ERROR (LSB)
1.0
0.1
0
–0.1
–0.2
–1.5
–0.4
–2.0
–0.5
8192
4096
12288
16384
0
4096
12288
8192
OUTPUT CODE
–80
–120
16384
0
5
20
15
10
25
FREQUENCY (MHz)
LTM9008-14: 64k Point FFT,
fIN = 30MHz, –1dBFS, SENSE = VDD
0
–20
–20
–30
–30
AMPLITUDE (dBFS)
–10
–40
–50
–60
–70
–80
–90
35
LTM9008-14: 64k Point FFT,
fIN = 70MHz, –1dBFS, SENSE = VDD
–40
–50
–60
–70
–80
–90
–100
–100
–110
–110
0
5
20
15
10
25
FREQUENCY (MHz)
30
–120
35
0
5
20
15
10
25
FREQUENCY (MHz)
90067814 G04
0
30
90067814 G03
90067814 G02
–10
–120
–70
–110
90067814 G01
0
–50
–60
–100
OUTPUT CODE
AMPLITUDE (dBFS)
30
35
90067814 G05
LTM9008-14: 64k Point 2-Tone FFT,
fIN = 28.5MHz and fIN = 31.5MHz,
–7dBFS per Tone, SENSE = VDD
LTM9008-14: Shorted Input
Histogram
6000
–10
–20
5000
–30
–40
4000
–50
COUNT
0
–40
–90
–0.3
AMPLITUDE (dBFS)
INL ERROR (LSB)
0.5
LTM9008-14: 64k Point FFT,
fIN = 5MHz, –1dBFS, SENSE = VDD
–60
–70
–80
3000
2000
–90
–100
1000
–110
–120
0
5
20
15
10
25
FREQUENCY (MHz)
30
35
90067814 G06
0
8197
8199
8201
8203
OUTPUT CODE
8205
90067814 G07
90067814f
11
LTM9008-14/
LTM9007-14/LTM9006-14
TYPICAL PERFORMANCE CHARACTERISTICS
LTM9008-14: SNR vs Input
Frequency, –1dBFS, 2V Range,
65Msps
LTM9008-14: SFDR vs Input
Frequency, –1dBFS, 2V Range,
65Msps
74
110
95
100
73
90
70
69
SFDR (dBc AND dBFS)
SFDR (dBFS)
SNR (dBFS)
71
85
80
75
68
80
70
60
dBc
50
40
30
20
70
67
dBFS
90
72
66
LTM9008-14: SFDR vs Input Level,
fIN = 70MHz, 2V Range, 65Msps
10
0
50
100 150 200 250 300
INPUT FREQUENCY (MHz)
65
350
0
50
100 150 200 250 300
INPUT FREQUENCY (MHz)
90067814 G08
80
90067814 G09
LTM9008-14: SNR vs Input Level,
fIN = 70MHz, 2V Range, 65Msps
320
dBFS
90067814 G11
LTM9008-14: IVDD vs Sample Rate,
5MHz Sine Wave Input, –1dBFS
300
60
290
dBc
IVDD (mA)
50
40
30
280
270
260
250
20
240
10
230
0
–60
–50
–40
–30
–20
INPUT LEVEL (dBFS)
–10
220
0
0
10
20
30
40
50
SAMPLE RATE (Msps)
IOVDD vs Sample Rate, 5MHz Sine
Wave Input, –1dBFS
50
75
LTM9008-14: SNR vs SENSE,
fIN = 5MHz, –1dBFS
74
2-LANE, 3.5mA
40
60
90067814 G12
90067814 G11
73
1-LANE, 3.5mA
30
SNR (dBFS)
IOVDD (mA)
0
310
70
SNR (dBc AND dBFS)
0
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
350
2-LANE, 1.75mA
20
1-LANE, 1.75mA
10
72
71
70
69
68
0
0
20
40
SAMPLE RATE (Msps)
60
90067814 G13
67
0.6
0.7
0.8
0.9
1
1.1
SENSE PIN (V)
1.2
1.3
90067814 G14
90067814f
12
LTM9008-14/
LTM9007-14/LTM9006-14
TYPICAL PERFORMANCE CHARACTERISTICS
LTM9007-14: Integral Nonlinearity
(INL) vs Output Code
LTM9007-14: Differential
Nonlinearity (DNL) vs Output Code
0.5
2.0
1.5
–20
0.3
0.5
0
–0.5
–1.0
0.2
AMPLITUDE (dBFS)
DNL ERROR (LSB)
1.0
0.1
0
–0.1
–0.2
–30
–40
–50
–60
–70
–80
–90
–0.3
–100
–1.5
–0.4
–110
–2.0
–0.5
–120
8192
4096
16384
12288
0
4096
OUTPUT CODE
12288
8192
OUTPUT CODE
90067814 G15
16384
0
10
5
15
20
FREQUENCY (MHz)
90067814 G17
90067814 G16
LTM9007-14: 64k Point FFT,
fIN = 70MHz, –1dBFS, SENSE = VDD
LTM9007-14: 64k Point FFT,
fIN = 30MHz, –1dBFS, SENSE = VDD
0
–10
0
–10
–20
–20
–30
–40
–30
–40
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
–50
–60
–70
–80
–50
–60
–70
–80
–90
–90
–100
–100
–110
–110
–120
–120
0
5
10
15
20
0
5
10
20
15
FREQUENCY (MHz)
FREQUENCY (MHz)
90067814 G19
90067814 G18
LTM9007-14: 64k Point 2-Tone FFT,
fIN = 28.5MHz and fIN = 31.5MHz,
–7dBFS per Tone, SENSE = VDD
LTM9007-14: Shorted Input
Histogram
0
–10
6000
–20
5000
–30
–40
4000
–50
COUNT
0
AMPLITUDE (dBFS)
INL ERROR (LSB)
0
–10
0.4
LTM9007-14: 64k Point FFT,
fIN = 5MHz, –1dBFS, SENSE = VDD
–60
–70
–80
3000
2000
–90
–100
1000
–110
–120
0
2
4
6 8 10 12 14 16 18 20
FREQUENCY (MHz)
90067814 G20
0
8198
8200
8202
8204
OUTPUT CODE
8206
90067814 G21
90067814f
13
LTM9008-14/
LTM9007-14/LTM9006-14
TYPICAL PERFORMANCE CHARACTERISTICS
LTM9007-14: SNR vs Input
Frequency, –1dBFS, 2V Range,
40Msps
LTM9007-14: SFDR vs Input
Frequency, –1dBFS, 2V Range,
40Msps
LTM9007-14: SFDR vs Input Level,
fIN = 70MHz, 2V Range, 40Msps
95
74
110
100
73
90
70
69
SFDR (dBc AND dBFS)
SFDR (dBFS)
SNR (dBFS)
72
71
85
80
75
68
66
80
70
60
dBc
50
40
30
20
70
67
dBFS
90
10
0
50
100 150 200 250 300
INPUT FREQUENCY (MHz)
350
65
0
100 150 200 250 300
INPUT FREQUENCY (MHz)
50
350
0
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
90067814 G23
90067814 G22
LTM9007-14: IVDD vs Sample Rate,
5MHz Sine Wave Input, –1dBFS
0
90067814 G24
LTM9007-14: SNR vs SENSE,
fIN = 5MHz, –1dBFS
74
200
73
190
72
SNR (dBFS)
IVDD (mA)
180
170
160
71
70
69
68
150
140
67
0
10
20
30
SAMPLE RATE (Msps)
40
90067814 G25
66
0.6
0.7
0.8
0.9
1
1.1
SENSE PIN (V)
1.2
1.3
90067814 G26
90067814f
14
LTM9008-14/
LTM9007-14/LTM9006-14
TYPICAL PERFORMANCE CHARACTERISTICS
LTM9006-14: Integral Nonlinearity
(INL) vs Output Code
LTM9006-14: Differential
Nonlinearity (DNL) vs Output Code
0.5
2.0
0
–10
0.4
1.5
–20
0.3
0.5
0
–0.5
–1.0
0.2
AMPLITUDE (dBFS)
DNL ERROR (LSB)
1.0
0.1
0
–0.1
–0.2
–0.4
–2.0
–0.5
8192
4096
12288
16384
–60
–70
–80
–110
0
4096
12288
8192
OUTPUT CODE
90067814 G27
0
–10
–50
–100
OUTPUT CODE
–120
16384
0
2
8
10
4
6
FREQUENCY (MHz)
LTM9006-14: 64k Point FFT,
fIN = 30MHz, –1dBFS, SENSE = VDD
12
14
90067814 G29
90067814 G28
LTM9006-14: 64k Point FFT,
fIN = 70MHz, –1dBFS, SENSE = VDD
0
–10
–20
–20
–30
–40
–30
–40
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
–50
–60
–70
–80
–50
–60
–70
–80
–90
–90
–100
–100
–110
–110
–120
–120
0
2
8
10
4
6
FREQUENCY (MHz)
12
14
0
2
8
10
4
6
FREQUENCY (MHz)
90067814 G30
LTM9006-14: 64k Point 2-Tone FFT,
fIN = 28.5MHz and 31.5MHz, –7dBFS
per Tone, SENSE = VDD
6000
–20
5000
–30
–40
4000
–60
–70
–80
14
LTM9006-14: Shorted Input
Histogram
0
–10
–50
12
90067814 G31
COUNT
0
–30
–40
–90
–0.3
–1.5
AMPLITUDE (dBFS)
INL ERROR (LSB)
LTM9006-14: 64k Point FFT,
fIN = 5MHz, –1dBFS, SENSE = VDD
3000
2000
–90
–100
1000
–110
–120
0
2
8
10
4
6
FREQUENCY (MHz)
12
14
90067814 G32
0
8198
8200
8202
8204
OUTPUT CODE
8206
90067814 G33
90067814f
15
LTM9008-14/
LTM9007-14/LTM9006-14
TYPICAL PERFORMANCE CHARACTERISTICS
LTM9006-14: SNR vs Input
Frequency, –1dBFS, 2V Range,
25Msps
LTM9006-14: SFDR vs Input
Frequency, –1dBFS, 2V Range,
25Msps
74
LTM9006-14: SFDR vs Input Level,
fIN = 70MHz, 2V Range, 25Msps
95
110
100
73
90
70
69
SFDR (dBc AND dBFS)
SFDR (dBFS)
SNR (dBFS)
72
71
85
80
75
68
66
0
100 150 200 250 300
INPUT FREQUENCY (MHz)
50
350
dBc
60
50
40
30
0
50
100 150 200 250 300
INPUT FREQUENCY (MHz)
DCO Cycle-Cycle Jitter vs Serial
Data Rate
74
350
73
300
PEAK-TO-PEAK JITTER (ps)
150
SNR (dBFS)
72
130
71
70
69
68
5
10
15
20
SAMPLE RATE (Msps)
25
90067814 G37
66
250
200
150
100
50
67
0
0
90067814 G36
LTM9006-14: SNR vs SENSE,
fIN = 5MHz, –1dBFS
160
140
0
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
350
90067814 G35
LTM9006-14: IVDD vs Sample Rate,
5MHz Sine Wave Input, –1dBFS
IVDD (mA)
70
10
65
90067814 G34
120
80
20
70
67
dBFS
90
0.6
0.7
0.8
0.9
1
1.1
SENSE PIN (V)
1.2
1.3
90067814 G38
0
0
200
400
600
800
SERIAL DATA RATE (Mbps)
1000
90067814 G39
90067814f
16
LTM9008-14/
LTM9007-14/LTM9006-14
PIN FUNCTIONS
AIN1+ (B2): Channel 1 Positive Differential Analog Input.
AIN8+ (N1): Channel 8 Positive Differential Analog Input.
AIN1– (B1): Channel 1 Negative Differential Analog Input.
AIN8– (N2): Channel 8 Negative Differential Analog Input
VCM12 (B3): Common Mode Bias Output, Nominally Equal
to VDD/2. VCM should be used to bias the common mode
of the analog inputs of channels 1 and 2. VCM is internally
bypassed to ground with a 0.1µF ceramic capacitor. No
external capacitance is required.
VDD (D3, D4, E3, E4, K3, K4, L3, L4): 1.8V Analog Power
Supply. VDD is internally bypassed to ground with 0.1μF
ceramic capacitors.
AIN2+ (C2): Channel 2 Positive Differential Analog Input.
AIN2– (C1): Channel 2 Negative Differential Analog Input.
AIN3+ (E2): Channel 3 Positive Differential Analog Input.
AIN3– (E1): Channel 3 Negative Differential Analog Input.
VCM34 (F3): Common Mode Bias Output, Nominally Equal
to VDD/2. VCM should be used to bias the common mode
of the analog inputs of channels 3 and 4. VCM is internally
bypassed to ground with a 0.1µF ceramic capacitor. No
external capacitance is required.
AIN4+ (G2): Channel 4 Positive Differential Analog Input.
AIN4– (G1): Channel 4 Negative Differential Analog Input.
AIN5+ (H1): Channel 5 Positive Differential Analog Input.
AIN5– (H2): Channel 5 Negative Differential Analog Input.
VCM56 (J3): Common Mode Bias Output, Nominally Equal
to VDD/2. VCM should be used to bias the common mode
of the analog inputs of channels 5 and 6. VCM is internally
bypassed to ground with a 0.1µF ceramic capacitor. No
external capacitance is required.
AIN6+ (K1): Channel 6 Positive Differential Analog Input.
AIN6– (K2): Channel 6 Negative Differential Analog Input.
AIN7+ (M1): Channel 7 Positive Differential Analog Input.
AIN7– (M2): Channel 7 Negative Differential Analog Input.
VCM78 (N3): Common Mode Bias Output, Nominally Equal
to VDD/2. VCM should be used to bias the common mode
of the analog inputs of channels 7 and 8. VCM is internally
bypassed to ground with a 0.1µF ceramic capacitor. No
external capacitance is required.
ENC+ (P5): Encode Input. Conversion starts on the rising
edge.
ENC– (P6): Encode Complement Input. Conversion starts
on the falling edge.
CSA (L5): In serial programming mode, (PAR/SER = 0V),
CSA is the serial interface chip select input for registers
controlling channels 1, 4, 5 and 8. When CS is low, SCK
is enabled for shifting data on SDI into the mode control
registers. In parallel programming mode (PAR/SER = VDD),
CS selects 2-lane or 1-lane output mode. CS can be driven
with 1.8V to 3.3V logic.
CSB (M5): In serial programming mode, (PAR/SER = 0V),
CSB is the serial interface chip select input for registers
controlling channels 2, 3, 6 and 7. When CS is low, SCK
is enabled for shifting data on SDI into the mode control
registers. In parallel programming mode (PAR/SER = VDD),
CS selects 2-lane or 1-lane output mode. CS can be driven
with 1.8V to 3.3V logic.
SCK (L6): In serial programming mode, (PAR/SER =
0V), SCK is the serial interface clock input. In parallel
programming mode (PAR/SER = VDD), SCK selects 3.5mA
or 1.75mA LVDS output currents. SCK can be driven with
1.8V to 3.3V logic.
SDI (M6): In serial programming mode, (PAR/SER = 0V),
SDI is the serial interface data Input. Data on SDI is clocked
into the mode control registers on the rising edge of SCK.
In parallel programming mode (PAR/SER = VDD), SDI can
be used to power down the part. SDI can be driven with
1.8V to 3.3V logic.
GND (See Pin Configuration Table): ADC Power Ground.
Use multiple vias close to pins.
90067814f
17
LTM9008-14/
LTM9007-14/LTM9006-14
PIN FUNCTIONS
OVDD (G9, G10): Output Driver Supply. OVDD is internally
bypassed to ground with a 0.1µF ceramic capacitor.
SDOA (E6): In serial programming mode, (PAR/SER = 0V),
SDOA is the optional serial interface data output for
registers controlling channels 1, 4, 5 and 8. Data on SDO
is read back from the mode control registers and can be
latched on the falling edge of SCK. SDO is an open-drain
N-channel MOSFET output that requires an external 2k
pull-up resistor from 1.8V to 3.3V. If read back from the
mode control registers is not needed, the pull-up resistor is not necessary and SDO can be left unconnected. In
parallel programming mode (PAR/SER = VDD), SDOA is an
input that enables internal 100Ω termination resistors on
the digital outputs of channels 1, 4, 5 and 8. When used
as an input, SDO can be driven with 1.8V to 3.3V logic
through a 1k series resistor.
SDOB (D6): Serial Data Output Pin for Channels 2, 3, 6
and 7. See description for SDOA.
PAR/SER (A7): Programming Mode Selection Pin. Connect
to ground to enable the serial programming mode. CSA,
CSB, SCK, SDI, SDOA and SDOB become a serial interface
that control the A/D operating modes. Connect to VDD to
enable parallel programming mode where CSA, CSB, SCK,
SDI, SDOA and SDOB become parallel logic inputs that
control a reduced set of the A/D operating modes. PAR/
SER should be connected directly to ground or the VDD
of the part and not be driven by a logic signal.
VREF (B6): Reference Voltage Output. VREF is internally
bypassed to ground with a 1μF ceramic capacitor, nominally 1.25V.
SENSE (C5): Reference Programming Pin. Connecting
SENSE to VDD selects the internal reference and a ±1V
input range. Connecting SENSE to ground selects the
internal reference and a ±0.5V input range. An external
reference between 0.625V and 1.3V applied to SENSE
selects an input range of ±0.8 • VSENSE. SENSE is internally
bypassed to ground with a 0.1µF ceramic capacitor.
LVDS Outputs
All pins in this section are differential LVDS outputs.
The output current level is programmable. There is an
optional internal 100Ω termination resistor between the
pins of each LVDS output pair.
OUT1A–/OUT1A+, OUT1B–/OUT1B+ (E7/E8, C8/D8): Serial
Data Outputs for Channel 1. In 1-lane output mode only
OUT1A–/OUT1A+ are used.
OUT2A–/OUT2A+, OUT2B–/OUT2B+ (B8/A8, D7/C7): Serial
Data Outputs for Channel 2. In 1-lane output mode only
OUT2A–/OUT2A+ are used.
OUT3A–/OUT3A+, OUT3B–/OUT3B+ (D10/D9, E10/E9):
Serial Data Outputs for Channel 3. In 1-lane output mode
only OUT3A–/OUT3A+ are used.
OUT4A–/OUT4A+, OUT4B–/OUT4B+ (C9/C10, F7/F8): Serial
Data Outputs for Channel 4. In 1-lane output mode only
OUT4A–/OUT4A+ are used.
OUT5A–/OUT5A+, OUT5B–/OUT5B+ (J8/J7, K8/K7): Serial
Data Outputs for Channel 5. In 1-lane output mode only
OUT5A–/OUT5A+ are used.
OUT6A–/OUT6A+, OUT6B–/OUT6B+ (K9/K10, L9/L10):
Serial Data Outputs for Channel 6. In 1-lane output mode
only OUT6A–/OUT6A+ are used.
OUT7A–/OUT7A+, OUT7B–/OUT7B+ (M7/L7, P8/N8): Serial
Data Outputs for Channel 7. In 1-lane output mode only
OUT7A–/OUT7A+ are used.
OUT8A–/OUT8A+, OUT8B–/OUT8B+ (L8/M8, M10/M9):
Serial Data Outputs for Channel 8. In 1-lane output mode
only OUT8A–/OUT8A+ are used.
FRA–/FRA+ (H7/H8): Frame Start Outputs for Channels
1, 4, 5 and 8.
FRB–/FRB+ (J9/J10): Frame Start Outputs for Channels
2, 3, 6 and 7.
DCOA–/DCOA+ (G8/G7): Data Clock Outputs for Channels
1, 4, 5 and 8.
DCOB–/DCOB+ (F10, F9): Data Clock Outputs for Channels 2, 3, 6 and 7.
90067814f
18
LTM9008-14/
LTM9007-14/LTM9006-14
PIN CONFIGURATION TABLE
1
2
3
4
5
6
7
8
9
10
A
GND
GND
GND
GND
GND
GND
PAR/SER
O2A+
GND
GND
B
AIN1–
AIN1+
VCM12
GND
GND
VREF
GND
O2A–
GND
GND
C
–
AIN2
+
AIN2
GND
GND
SENSE
GND
O2B+
O1B–
O4A–
O4A+
D
GND
GND
VDD
VDD
GND
SDOB
O2B–
O1B+
O3A+
O3A–
E
AIN3–
AIN3+
VDD
VDD
GND
SDOA
O1A–
O1A+
O3B+
O3B–
F
GND
GND
VCM34
GND
GND
GND
O4B–
O4B+
DCOB+
DCOB–
G
AIN4–
AIN4+
GND
GND
GND
GND
DCOA+
DCOA–
OVDD
OVDD
H
+
–
GND
FRA–
FRA+
GND
GND
O5A–
FRB–
FRB+
AIN5
AIN5
GND
GND
GND
J
GND
GND
VCM56
GND
GND
GND
O5A+
K
AIN6+
AIN6–
VDD
VDD
GND
GND
O5B+
O5B–
O6A–
O6A+
L
GND
GND
VDD
VDD
CSA
SCK
O7A+
O8A–
O6B–
O6B+
M
AIN7+
AIN7–
GND
GND
CSB
SDI
O7A–
O8A+
O8B+
O8B–
N
+
–
GND
O7B+
GND
GND
GND
O7B–
GND
GND
P
AIN8
GND
AIN8
GND
VCM78
GND
GND
GND
GND
GND
CLK+
CLK–
Top View of BGA Package (Looking Through Component).
90067814f
19
LTM9008-14/
LTM9007-14/LTM9006-14
FUNCTIONAL BLOCK DIAGRAM
VDD = 1.8V
OVDD = 1.8V
CH 1
ANALOG
INPUT
S/H
14-BIT
ADC CORE
OUT1A+
OUT1A–
OUT1B+
OUT1B–
CH 2
ANALOG
INPUT
S/H
14-BIT
ADC CORE
OUT2A+
OUT2A–
OUT2B+
OUT2B–
CH 3
ANALOG
INPUT
S/H
14-BIT
ADC CORE
OUT3A+
OUT3A–
OUT3B+
OUT3B–
CH 4
ANALOG
INPUT
S/H
14-BIT
ADC CORE
OUT4A+
OUT4A–
OUT4B+
OUT4B–
DATA
SERIALIZER
CH 5
ANALOG
INPUT
S/H
14-BIT
ADC CORE
OUT5A+
OUT5A–
OUT5B+
OUT5B–
CH 6
ANALOG
INPUT
S/H
14-BIT
ADC CORE
OUT6A+
OUT6A–
OUT6B+
OUT6B–
CH 7
ANALOG
INPUT
S/H
14-BIT
ADC CORE
OUT7A+
OUT7A–
OUT7B+
OUT7B–
CH 8
ANALOG
INPUT
S/H
14-BIT
ADC CORE
OUT8A+
OUT8A–
OUT8B+
OUT8B–
ENC+
DCOA±
DCOB±
FRA±
FRB±
PLL
ENC–
1.25V
REFERENCE
VREF
REFH
RANGE
SELECT
REFL
REF
BUFFER
SDOA
SDOB
SDI
SCK
CSA
CSB
PAR/SER
MODE
CONTROL
REGISTERS
VDD/2
DIFF
REF
AMP
GND
90067814 F01
SENSE
VCM12
Figure 1. Functional Block Diagram
20
VCM34
VCM56
VCM78
90067814f
LTM9008-14/
LTM9007-14/LTM9006-14
APPLICATIONS INFORMATION
CONVERTER OPERATION
INPUT DRIVE CIRCUITS
The LTM9008-14/LTM9007-14/LTM9006-14 are low
power, 8-channel, 14-bit, 65Msps/40Msps/25Msps A/D
converters that are powered by a single 1.8V supply. The
analog inputs should be driven differentially. The encode
input can be driven differentially for optimal jitter performance, or single-ended for lower power consumption. The
digital outputs are serial LVDS to minimize the number
of data lines. Each channel outputs two bits at a time
(2-lane mode) or one bit at a time (1-lane mode). Many
additional features can be chosen by programming the
mode control registers through a serial SPI port.
Input Filtering
ANALOG INPUT
The analog inputs are differential CMOS sample-and-hold
circuits (Figure 2). The inputs should be driven differentially
around a common mode voltage set by the appropriate
VCM output pins, which are nominally VDD/2. For the 2V
input range, the inputs should swing from VCM – 0.5V
to VCM + 0.5V. There should be 180° phase difference
between the inputs.
The eight channels are simultaneously sampled by a shared
encode circuit (Figure 2).
If possible, there should be an RC low pass filter right at
the analog inputs. This lowpass filter isolates the drive
circuitry from the A/D sample-and-hold switching, and also
limits wideband noise from the drive circuitry. Figure 3
shows an example of an input RC filter. The RC component
values should be chosen based on the application’s input
frequency.
Transformer Coupled Circuits
Figure 3 shows the analog input being driven by an RF
transformer with a center-tapped secondary. The center
tap is biased with VCM, setting the A/D input at its optimal DC level. At higher input frequencies a transmission
line balun transformer (Figures 4 to 6) has better balance,
resulting in lower A/D distortion.
50Ω
VCM
0.1µF
0.1µF
ANALOG
INPUT
T1
1:1
25Ω
25Ω
AIN+
LTM9008-14
0.1µF
12pF
LTM9008-14
+
AIN
VDD
RON
25Ω
10Ω
CSAMPLE
3.5pF
CPARASITIC
1.8pF
VDD
AIN–
25Ω
RON
25Ω
10Ω
VDD
CSAMPLE
3.5pF
25Ω
T1: MA/COM MABAES0060
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
AIN–
90067814 F03
Figure 3. Analog Input Circuit Using a Transformer.
Recommended for Input Frequencies from 5MHz to 70MHz
CPARASITIC
1.8pF
1.2V
10k
ENC+
ENC–
10k
1.2V
90067814 F02
Figure 2. Equivalent Input Circuit. Only One
of the Eight Analog Channels Is Shown
90067814f
21
LTM9008-14/
LTM9007-14/LTM9006-14
APPLICATIONS INFORMATION
Amplifier Circuits
Figure 7 shows the analog input being driven by a high
speed differential amplifier. The output of the amplifier is
AC-coupled to the A/D so the amplifier’s output common
mode voltage can be optimally set to minimize distortion.
See back page for a DC-coupled example.
50Ω
At very high frequencies an RF gain block will often have
lower distortion than a differential amplifier. If the gain
block is single-ended, then a transformer circuit (Figures 4
to 6) should convert the signal to differential before driving the A/D.
50Ω
VCM
VCM
0.1µF
0.1µF
0.1µF
ANALOG
INPUT
0.1µF
+
AIN
T2
T1
25Ω
LTM9008-14
0.1µF
ANALOG
INPUT
AIN+
T2
T1
25Ω
LTM9008-14
0.1µF
1.8pF
4.7pF
0.1µF
25Ω
0.1µF
–
AIN
25Ω
AIN–
90067814 F05
90067814 F04
T1: MA/COM MABA-007159-000000
T2: COILCRAFT WBC1-1LB
RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE
T1: MA/COM MABA-007159-000000
T2: MA/COM MABAES0060
RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE
Figure 4. Recommended Front End Circuit for Input
Frequencies from 70MHz to 170MHz
50Ω
Figure 5. Recommended Front End Circuit for Input
Frequencies from 170MHz to 300MHz
VCM
VCM
HIGH SPEED
DIFFERENTIAL
0.1µF
AMPLIFIER
0.1µF
0.1µF
2.7nH
ANALOG
INPUT
25Ω
AIN+
LTM9008-14
0.1µF
T1
0.1µF
25Ω
2.7nH
AIN–
90067814 F06
ANALOG
INPUT
+
+
–
–
200Ω
200Ω
25Ω
0.1µF
AIN+
LTM9008-14
12pF
0.1µF
25Ω
AIN–
90067814 F07
T1: MA/COM ETC1-1-13
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
Figure 6. Recommended Front End Circuit for Input
Frequencies Above 300MHz
Figure 7. Front End Circuit Using a High Speed
Differential Amplifier
90067814f
22
LTM9008-14/
LTM9007-14/LTM9006-14
APPLICATIONS INFORMATION
Reference
The input range can be adjusted by applying a voltage to
SENSE that is between 0.625V and 1.30V. The input range
will then be 1.6 • VSENSE. The reference is shared by all
eight ADC channels, so it is not possible to independently
adjust the input range of individual channels.
The LTM9008-14/LTM9007-14/LTM9006-14 has an internal 1.25V voltage reference. For a 2V input range using
the internal reference, connect SENSE to VDD. For a 1V
input range using the internal reference, connect SENSE
to ground. For a 2V input range with an external reference,
apply a 1.25V reference voltage to SENSE (Figure 9).
VREF
1.25V
The VREF , SENSE, REFH and REFL pins are internally
bypassed, as shown in Figure 8.
LTM9008-14
5Ω
1.25V BANDGAP
REFERENCE
1µF
0.625V
TIE TO VDD FOR 2V RANGE;
TIE TO GND FOR 1V RANGE;
RANGE = 1.6 • VSENSE FOR
0.65V < VSENSE < 1.300V
RANGE
DETECT
AND
CONTROL
SENSE
0.1µF
INTERNAL ADC
BUFFER
HIGH REFERENCE
0.1µF
2.2µF
0.1µF
0.8x
DIFF AMP
0.1µF
INTERNAL ADC
LOW REFERENCE
90067814 F08
Figure 8. Reference Circuit
1.25V
EXTERNAL
REFERENCE
LTM9008-14
SENSE
1µF
90067814 F09
Figure 9. Using an External 1.25V Reference
90067814f
23
LTM9008-14/
LTM9007-14/LTM9006-14
APPLICATIONS INFORMATION
Encode Input
The signal quality of the encode inputs strongly affects
the A/D noise performance. The encode inputs should
be treated as analog signals—do not route them next to
digital traces on the circuit board. There are two modes
of operation for the encode inputs: the differential encode
mode (Figure 10), and the single-ended encode mode
(Figure 11).
The differential encode mode is recommended for sinusoidal, PECL, or LVDS encode inputs (Figures 12 and 13).
LTM9008-14
The encode inputs are internally biased to 1.2V through
10k equivalent resistance. The encode inputs can be taken
above VDD (up to 3.6V), and the common mode range is
from 1.1V to 1.6V. In the differential encode mode, ENC–
should stay at least 200mV above ground to avoid falsely
triggering the single-ended encode mode. For good jitter
performance ENC+ should have fast rise and fall times.
The single-ended encode mode should be used with CMOS
encode inputs. To select this mode, ENC– is connected
to ground and ENC+ is driven with a square wave encode
VDD
DIFFERENTIAL
COMPARATOR
VDD
15k
ENC+
LTM9008-14
1.8V TO
3.3V
ENC–
0V
30k
ENC+
ENC–
30k
90067814 F11
90067814 F10
Figure 10. Equivalent Encode Input Circuit
for Differential Encode Mode
0.1µF
ENC+
T1
50Ω
0.1µF
CMOS LOGIC
BUFFER
Figure 11. Equivalent Encode Input Circuit for
Single-Ended Encode Mode
LTM9008-14
100Ω
0.1µF
50Ω
0.1µF
ENC–
90067814 F12
T1 = MA/COM ETC1-1-13
RESISTORS AND CAPACITORS
ARE 0402 PACKAGE SIZE
Figure 12. Sinusoidal Encode Drive
PECL OR
LVDS
CLOCK
ENC+
LTM9008-14
0.1µF
ENC–
90067814 F13
Figure 13. PECL or LVDS Encode Drive
90067814f
24
LTM9008-14/
LTM9007-14/LTM9006-14
APPLICATIONS INFORMATION
input. ENC+ can be taken above VDD (up to 3.6V) so 1.8V
to 3.3V CMOS logic levels can be used. The ENC+ threshold
is 0.9V. For good jitter performance ENC+ should have fast
rise and fall times.
Clock PLL and Duty Cycle Stabilizer
The encode clock is multiplied by an internal phase-locked
loop (PLL) to generate the serial digital output data. If the
encode signal changes frequency or is turned off, the PLL
requires 25µs to lock onto the input clock.
A clock duty cycle stabilizer circuit allows the duty cycle
of the applied encode signal to vary from 30% to 70%.
In the serial programming mode it is possible to disable
the duty cycle stabilizer, but this is not recommended. In
the parallel programming mode the duty cycle stabilizer
is always enabled.
DIGITAL OUTPUTS
The digital outputs of the LTM9008-14/LTM9007-14/
LTM9006-14 are serialized LVDS signals. Each channel
outputs two bits at a time (2-lane mode) or one bit at a
time (1-lane mode). The data can be serialized with 16, 14,
or 12-bit serialization (see the Timing Diagrams section for
details). Note that with 12-bit serialization the two LSBs
are not available—this mode is included for compatibility
with 12-bit versions of these parts.
The output data should be latched on the rising and falling
edges of the data clock out (DCO). A data frame output
(FR) can be used to determine when the data from a new
conversion result begins. In the 2-lane, 14-bit serialization
mode, the frequency of the FR output is halved.
The maximum serial data rate for the data outputs is
1Gbps, so the maximum sample rate of the ADC will depend on the serialization mode as well as the speed grade
of the ADC (see Table 1). The minimum sample rate for
all serialization modes is 5Msps.
By default the outputs are standard LVDS levels: 3.5mA
output current and a 1.25V output common mode voltage. An external 100Ω differential termination resistor
is required for each LVDS output pair. The termination
resistors should be located as close as possible to the
LVDS receiver.
The outputs are powered by OVDD and OGND which are
isolated from the A/D core power and ground.
Table 1. Maximum Sampling Frequency for All Serialization Modes. Note That These Limits Are for the LTM9008-14.
The Sampling Frequency for the Slower Speed Grades Cannot Exceed 40MHz (LTM9007-14) or 25MHz (LTM9006-14)
SERIALIZATION MODE
MAXIMUM SAMPLING
FREQUENCY, fS (MHz)
DCO FREQUENCY
FR FREQUENCY
SERIAL DATA RATE
2-Lane
16-Bit Serialization
65
4 • fS
fS
8 • fS
2-Lane
14-Bit Serialization
65
3.5 • fS
0.5 • fS
7 • fS
2-Lane
12-Bit Serialization
65
3 • fS
fS
6 • fS
1-Lane
16-Bit Serialization
62.5
8 • fS
fS
16 • fS
1-Lane
14-Bit Serialization
65
7 • fS
fS
14 • fS
1-Lane
12-Bit Serialization
65
6 • fS
fS
12 • fS
90067814f
25
LTM9008-14/
LTM9007-14/LTM9006-14
APPLICATIONS INFORMATION
Programmable LVDS Output Current
The default output driver current is 3.5mA. This current
can be adjusted by control register A2 in the serial programming mode. Available current levels are 1.75mA,
2.1mA, 2.5mA, 3mA, 3.5mA, 4mA and 4.5mA. In the
parallel programming mode, the SCK pin can select either
3.5mA or 1.75mA.
Optional LVDS Driver Internal Termination
In most cases, using just an external 100Ω termination resistor will give excellent LVDS signal integrity. In
addition, an optional internal 100Ω termination resistor
can be enabled by serially programming mode control register A2. The internal termination helps absorb
any reflections caused by imperfect termination at the
receiver. When the internal termination is enabled, the
output driver current is doubled to maintain the same
output voltage swing. In the parallel programming
mode the SDO pin enables internal termination. Internal
termination should only be used with 1.75mA, 2.1mA or
2.5mA LVDS output current modes.
DATA FORMAT
Table 2 shows the relationship between the analog input
voltage and the digital data output bits. By default the
output data format is offset binary. The 2’s complement
format can be selected by serially programming mode
control register A1.
Table 2. Output Codes vs Input Voltage
AIN+ – AIN–
(2V RANGE)
D13-D0
(OFFSET BINARY)
D13-D0
(2’s COMPLEMENT)
>1.000000V
11 1111 1111 1111
01 1111 1111 1111
+0.999878V
11 1111 1111 1111
01 1111 1111 1111
+0.999756V
11 1111 1111 1110
01 1111 1111 1110
+0.000122V
10 0000 0000 0001
00 0000 0000 0001
+0.000000V
10 0000 0000 0000
00 0000 0000 0000
–0.000122V
01 1111 1111 1111
11 1111 1111 1111
–0.000244V
01 1111 1111 1110
11 1111 1111 1110
–0.999878V
00 0000 0000 0001
10 0000 0000 0001
–1.000000V
00 0000 0000 0000
10 0000 0000 0000
<–1.000000V
00 0000 0000 0000
10 0000 0000 0000
Digital Output Randomizer
Interference from the A/D digital outputs is sometimes
unavoidable. Digital interference may be from capacitive or
inductive coupling or coupling through the ground plane.
Even a tiny coupling factor can cause unwanted tones
in the ADC output spectrum. By randomizing the digital
output before it is transmitted off chip, these unwanted
tones can be randomized which reduces the unwanted
tone amplitude.
The digital output is randomized by applying an exclusiveOR logic operation between the LSB and all other data
output bits. To decode, the reverse operation is applied
—an exclusive-OR operation is applied between the LSB
and all other bits. The FR and DCO outputs are not affected.
The output randomizer is enabled by serially programming
mode control register A1.
90067814f
26
LTM9008-14/
LTM9007-14/LTM9006-14
APPLICATIONS INFORMATION
Digital Output Test Pattern
DEVICE PROGRAMMING MODES
To allow in-circuit testing of the digital interface to the
A/D, there is a test mode that forces the A/D data outputs
(D13-D0) of all channels to known values. The digital
output test patterns are enabled by serially programming
mode control registers A3 and A4. When enabled, the test
patterns override all other formatting modes: 2’s complement and randomizer.
The operating modes of the LTM9008-14/LTM9007-14/
LTM9006-14 can be programmed by either a parallel
interface or a simple serial interface. The serial interface
has more flexibility and can program all available modes.
The parallel interface is more limited and can only program
some of the more commonly used modes.
Output Disable
The digital outputs may be disabled by serially programming mode control register A2. The current drive for all
digital outputs including DCO and FR are disabled to save
power or enable in-circuit testing. When disabled the common mode of each output pair becomes high impedance,
but the differential impedance may remain low.
Sleep and Nap Modes
The A/D may be placed in sleep or nap modes to conserve
power. In sleep mode the entire device is powered down,
resulting in 2mW power consumption. Sleep mode is
enabled by mode control register A1 (serial programming
mode), or by SDI (parallel programming mode). The time
required to recover from sleep mode is about 2ms.
In nap mode any combination of A/D channels can be
powered down while the internal reference circuits and the
PLL stay active, allowing faster wakeup than from sleep
mode. Recovering from nap mode requires at least 100
clock cycles. If the application demands very accurate DC
settling then an additional 50µs should be allowed so the
on-chip references can settle from the slight temperature
shift caused by the change in supply current as the A/D
leaves nap mode. Nap mode is enabled by mode control
register A1 in the serial programming mode.
Parallel Programming Mode
To use the parallel programming mode, PAR/SER should
be tied to VDD. The CS, SCK, SDI and SDO pins are binary
logic inputs that set certain operating modes. These pins
can be tied to VDD or ground, or driven by 1.8V, 2.5V, or
3.3V CMOS logic. When used as an input, SDO should
be driven through a 1k series resistor. Table 3 shows the
modes set by CS, SCK, SDI and SDO.
Table 3. Parallel Programming Mode Control Bits
(PAR/SER = VDD)
Pin
DESCRIPTION
CS
2-Lane / 1-Lane Selection Bit
0 = 2-Lane, 16-Bit Serialization Output Mode
1 = 1-Lane, 14-Bit Serialization Output Mode
SCK
LVDS Current Selection Bit
0 = 3.5mA LVDS Current Mode
1 = 1.75mA LVDS Current Mode
SDI
Power Down Control Bit
0 = Normal Operation
1 = Sleep Mode
SDO
Internal Termination Selection Bit
0 = Internal Termination Disabled
1 = Internal Termination Enabled
90067814f
27
LTM9008-14/
LTM9007-14/LTM9006-14
APPLICATIONS INFORMATION
Serial Programming Mode
To use the serial programming mode, PAR/SER should be
tied to ground. The CS, SCK, SDI and SDO pins become a
serial interface that program the A/D mode control registers.
Data is written to a register with a 16-bit serial word. Data
can also be read back from a register to verify its contents.
Serial data transfer starts when CS is taken low. The data
on the SDI pin is latched at the first 16 rising edges of
SCK. Any SCK rising edges after the first 16 are ignored.
The data transfer ends when CS is taken high again.
The first bit of the 16-bit input word is the R/W bit. The
next seven bits are the address of the register (A6:A0).
The final eight bits are the register data (D7:D0).
If the R/W bit is low, the serial data (D7:D0) will be written to the register set by the address bits (A6:A0). If the
R/W bit is high, data in the register set by the address
bits (A6:A0) will be read back on the SDO pin (see the
Timing Diagrams section). During a read back command
the register is not updated and data on SDI is ignored.
The SDO pin is an open-drain output that pulls to ground
with a 200Ω impedance. If register data is read back
through SDO, an external 2k pull-up resistor is required.
If serial data is only written and read back is not needed,
then SDO can be left floating and no pull-up resistor is
needed. Table 4 shows a map of the mode control registers.
Table 4. Serial Programming Mode Register Map (PAR/SER = GND)
REGISTER A0: RESET REGISTER (ADDRESS 00h)
D7
D6
D5
D4
D3
D2
D1
D0
RESET
X
X
X
X
X
X
X
Note That CSA Controls Channels 1, 4, 5 and 8, CSB Controls Channels 2, 3, 6 and 7.
RESET
Bit 7
Software Reset Bit
0 = Not Used
1 = Software Reset. All Mode Control Registers Are Reset to 00h. The ADC Is Momentarily Placed in SLEEP Mode.
After the Reset SPI Write Command Is Complete, Bit D7 Is Automatically Set Back to Zero. The Reset Register Is Write Only.
Bits 6-0
Unused, Don’t Care Bits.
REGISTER A1 (CSA): FORMAT AND POWER-DOWN REGISTER (ADDRESS 01h with CSA = GND)
D7
D6
D5
D4
D3
D2
D1
D0
DCSOFF
RAND
TWOSCOMP
SLEEP
NAP_8
NAP_5
NAP_4
NAP_1
Note That CSA Controls Channels 1, 4, 5 and 8, CSB Controls Channels 2, 3, 6 and 7.
Bit 7
DCSOFF
Clock Duty Cycle Stabilizer Bit
0 = Clock Duty Cycle Stabilizer On
1 = Clock Duty Cycle Stabilizer Off. This Is Not Recommended.
Bit 6
RAND
Data Output Randomizer Mode Control Bit
0 = Data Output Randomizer Mode Off
1 = vData Output Randomizer Mode On
Bit 5
TWOSCOMP Two’s Complement Mode Control Bit
0 = Offset Binary Data Format
1 = Two’s Complement Data Format
Bits 4-0
SLEEP: NAP_X Sleep/Nap Mode Control Bits
00000 = Normal Operation
0XXX1 = Channel 1 in Nap Mode
0XX1X = Channel 4 in Nap Mode
0X1XX = Channel 5 in Nap Mode
01XXX = Channel 8 in Nap Mode
1XXXX = Sleep Mode. Channels 1, 4, 5 and 8 Are Disabled
Note: Any Combination of Channels Can Be Placed in Nap Mode.
90067814f
28
LTM9008-14/
LTM9007-14/LTM9006-14
APPLICATIONS INFORMATION
REGISTER A1 (CSB): FORMAT AND POWER-DOWN REGISTER (ADDRESS 01h with CSB = GND)
D7
D6
D5
D4
D3
D2
D1
D0
DCSOFF
RAND
TWOSCOMP
SLEEP
NAP_7
NAP_6
NAP_3
NAP_2
Note That CSA Controls Channels 1, 4, 5 and 8, CSB Controls Channels 2, 3, 6 and 7.
Bit 7
DCSOFF
Clock Duty Cycle Stabilizer Bit
0 = Clock Duty Cycle Stabilizer On
1 = Clock Duty Cycle Stabilizer Off. This Is Not Recommended.
Bit 6
RAND
Data Output Randomizer Mode Control Bit
0 = Data Output Randomizer Mode Off
1 = Data Output Randomizer Mode On
Bit 5
TWOSCOMP Two’s Complement Mode Control Bit
0 = Offset Binary Data Format
1 = Two’s Complement Data Format
Bits 4-0
SLEEP: NAP_4:NAP_1 Sleep/Nap Mode Control Bits
00000 = Normal Operation
0XXX1 = Channel 2 in Nap Mode
0XX1X = Channel 3 in Nap Mode
0X1XX = Channel 6 in Nap Mode
01XXX = Channel 7 in Nap Mode
1XXXX = Sleep Mode. Channels 2, 3, 6 and 7 Are Disabled
Note: Any Combination of Channels Can Be Placed in Nap Mode.
REGISTER A2: OUTPUT MODE REGISTER (ADDRESS 02h)
D7
D6
D5
D4
D3
D2
D1
D0
ILVDS2
ILVDS1
ILVDS0
TERMON
OUTOFF
OUTMODE2
OUTMODE1
OUTMODE0
Note That CSA Controls Channels 1, 4, 5 and 8, CSB Controls Channels 2, 3, 6 and 7.
Bits 7-5
ILVDS2:ILVDS0 LVDS Output Current Bits
000 = 3.5mA LVDS Output Driver Current
001 = 4.0mA LVDS Output Driver Current
010 = 4.5mA LVDS Output Driver Current
011 = Not Used
100 = 3.0mA LVDS Output Driver Current
101 = 2.5mA LVDS Output Driver Current
110 = 2.1mA LVDS Output Driver Current
111 = 1.75mA LVDS Output Driver Current
Bit 4
TERMON LVDS Internal Termination Bit
0 = Internal Termination Off
1 = Internal Termination On. LVDS Output Driver Current Is 2x the Current Set by ILVDS2:ILVDS0. Internal Termination Should Only Be
Used with 1.75mA, 2.1mA or 2.5mA LVDS Output Current Modes.
Bit 3
OUTOFF Output Disable Bit
0 = Digital Outputs Are Enabled.
1 = Digital Outputs Are Disabled.
Bits 2-0
OUTMODE2:OUTMODE0 Digital Output Mode Control Bits
000 = 2-Lanes, 16-Bit Serialization
001 = 2-Lanes, 14-Bit Serialization
010 = 2-Lanes, 12-Bit Serialization
011 = Not Used
100 = Not Used
101 = 1-Lane, 14-Bit Serialization
110 = 1-Lane, 12-Bit Serialization
111 = 1-Lane, 16-Bit Serialization
90067814f
29
LTM9008-14/
LTM9007-14/LTM9006-14
APPLICATIONS INFORMATION
REGISTER A3: TEST PATTERN MSB REGISTER (ADDRESS 03h)
D7
D6
D5
D4
D3
D2
D1
D0
OUTTEST
X
TP13
TP12
TP11
TP10
TP9
TP8
Note That CSA Controls Channels 1, 4, 5 and 8, CSB Controls Channels 2, 3, 6 and 7.
Bit 7
OUTTEST
Digital Output Test Pattern Control Bit
0 = Digital Output Test Pattern Off
1 = Digital Output Test Pattern On
Bit 6
Unused, Don’t Care Bit.
Bit 5-0
TP13:TP8
Test Pattern Data Bits (MSB)
TP13:TP8 Set the Test Pattern for Data Bit 13 (MSB) Through Data Bit 8.
REGISTER A4: TEST PATTERN LSB REGISTER (ADDRESS 04h)
D7
D6
D5
D4
D3
D2
D1
D0
TP7
TP6
TP5
TP4
TP3
TP2
TP1
TP0
Note That CSA Controls Channels 1, 4, 5 and 8, CSB Controls Channels 2, 3, 6 and 7.
Bit 7-0
TP7:TP0
Test Pattern Data Bits (LSB)
TP7:TP0 Set the Test Pattern for Data Bit 7 Through Data Bit 0 (LSB).
Software Reset
If serial programming is used, the mode control registers
should be programmed as soon as possible after the power
supplies turn on and are stable. The first serial command
must be a software reset which will reset all register data
bits to logic 0. To perform a software reset, bit D7 in the
reset register is written with a logic 1. After the reset SPI
write command is complete, bit D7 is automatically set
back to zero.
GROUNDING AND BYPASSING
The LTM9008-14/LTM9007-14/LTM9006-14 requires a
printed circuit board with a clean unbroken ground plane.
A multilayer board with an internal ground plane in the
first layer beneath the ADC is recommended. Layout for
the printed circuit board should ensure that digital and
analog signal lines are separated as much as possible. In
particular, care should be taken not to run any digital track
alongside an analog signal track or underneath the ADC.
Bypass capacitors are integrated inside the package; additional capacitance is optional.
The analog inputs, encode signals, and digital outputs
should not be routed next to each other. Ground fill and
grounded vias should be used as barriers to isolate these
signals from each other.
The pin assignments of the LTM9008-14/LTM9007-14/
LTM9006-14 allow a flow-through layout that makes
it possible to use multiple parts in a small area when
a large number of ADC channels are required. The
device has similar layout rules to other BGA packages. The layout can be implemented with 6mil blind vias
and 5mil traces. The pinout has been designed to minimize
the space required to route the analog and digital traces.
The analog and digital traces can essentially be routed
within the width of the package. This allows multiple
packages to be located close together for high channel
count applications. Trace lengths for the analog inputs
and digital outputs should be matched as well as possible.
90067814f
30
LTM9008-14/
LTM9007-14/LTM9006-14
APPLICATIONS INFORMATION
Table 5 lists the trace lengths for the analog inputs and
digital outputs inside the package from the die pad to the
package pad. These should be added to the PCB trace
lengths for best matching.
The material used for the substrate is BT (bismaleimidetriazine), supplied by Mitsubishi Gas and Chemical. In
the DC to 125MHz range, the speed for the analog input
signals is 198ps/in or 7.795ps/mm. The speed for the
digital outputs is 188.5ps/in or 7.417ps/mm.
HEAT TRANSFER
Most of the heat generated by the LTM9008-14/LTM9007-14/
LTM9006-14 is transferred from the die through the bottom of the package onto the printed circuit board. The
ground pins should be connected to the internal ground
planes by multiple vias.
Table 5. Internal Trace Lengths
PIN
NAME
LENGTH
(mm)
PIN
NAME
LENGTH
(mm)
PIN
NAME
LENGTH
(mm)
PIN
NAME
LENGTH
(mm)
E7
01A–
1.775
K8
05B–
0.379
E1
AIN3–
2.491
F10
DCOB–
1.811
E8
01A+
1.947
K7
05B+
0.528
E2
AIN3+
2.505
F9
DCOB+
1.812
C8
01B–
K9
06A–
G1
–
H7
FRA–
1.117
D8
01B+
1.850
K10
06A+
1.865
1.038
B8
02A–
3.233
L9
06B–
2.268
1.644
A8
02A+
3.246
L10
06B+
D7
02B–
0.179
M7
07A–
C7
02B+
1.127
L7
07A+
D10
03A–
2.126
P8
07B–
D9
03A+
2.177
N8
07B+
E10
03B–
L8
08A–
E9
03B+
1.812
M8
08A+
1.847
C9
04A–
3.199
M10 08B–
4.021
C10
04A+
3.196
M9
08B+
F7
04B–
0.706
B1
AIN1–
F8
04B+
B2
J8
05A–
0.392
C1
J7
05A+
0.436
C2
AIN1+
AIN2–
AIN2+
1.847
1.811
0.639
1.866
AIN4
3.376
G2
AIN4
+
3.372
H8
FRA+
H2
AIN5–
3.301
J9
FRB–
2.267
H1
AIN5
+
3.346
J10
FRB+
1.643
1.089
K2
AIN6–
2.506
A7
PAR/SER
3.838
0.179
K1
AIN6+
2.533
L6
SCK
0.240
3.281
M2
AIN7
–
3.198
E6
SDOA
0.453
3.149
M1
AIN7+
3.214
D6
SDOB
0.274
N2
–
4.726
M6
SDI
1.069
N1
AIN8
+
4.691
B3
VCM12
3.914
P6
CLK–
4.106
F3
VCM34
0.123
4.016
P5
CLK+
4.106
J3
VCM56
0.079
4.689
L5
CSA
0.919
N3
VCM78
3.915
4.709
M5
CSB
1.162
4.724
G8
DCOA–
1.157
4.769
G7
DCOA+
1.088
1.862
AIN8
90067814f
31
LTM9008-14/
LTM9007-14/LTM9006-14
TYPICAL APPLICATIONS
Silkscreen Top
Inner Layer 2
Top Side
Inner Layer 3
90067814f
32
LTM9008-14/
LTM9007-14/LTM9006-14
TYPICAL APPLICATIONS
Inner Layer 4
Inner Layer 5
Bottom Side
Silkscreen Bottom
90067814f
33
CLK+
CLK+
GND
E4
E3
C3
0.01µF
V+
3V TO 6V
J1
J2
R26
(OPT)
R48
100Ω
R27
(OPT)
+1.8V
C17 R37
(OPT) 0Ω
0805
R36
0Ω
0603
R15
(OPT)
C10
4.7µF
6.3V
0603
R16
(OPT)
C12
1µF
0603
C4
T1
R19 0.01µF
MABA100Ω
007159-000000
5
1
2
C6
C9
0.01µF C8
4
3 0.01µF
(OPT) 0.01µF
VCM12
IN–
IN+
R31
0Ω
0805
C19
(OPT)
R37
100Ω
R14
(OPT)
R25
(OPT)
R18
(OPT)
4
1
2
3
9
AIN1 B1
VCM12 B3
AIN2+ C2
AIN2– C1
AIN3+ E2
AIN3– E1
VCM34 F3
AIN4+ G2
AIN4– G1
AIN5+ H2
AIN5– H1
VCM56 J3
AIN6+ K1
AIN6– K2
AIN7+ M1
AIN7– M2
AIN8+ N1
AIN8– N2
VCM78 N3
AIN1+ B2
–
C56
0.1µF
R29
180k
1%
C11
1µF
0603
+
CLK+ P5
CLK– P6
+1.8V
D3
C5
D4
E3
4.7pF
E4
K3
K4
L3
L4
+1.8VO
G9
G10
R20
R24
100Ω C7
(OPT)
4.7pF
C2
(OPT)
(SAME FOR OTHER CHANNELS)
R38
0Ω
0603
LT3080EDD
OUT
OUT
OUT
5
OUT
VCTRL
6 NC
SET
7
IN
8
IN
R17
5.1Ω
R21
49.9Ω
1%
R22
49.9Ω
1%
R23
5.1Ω
L1
(OPT)
C23
(OPT)
C18
(OPT)
C15
(OPT)
R32
0Ω
0603
AIN1+
AIN1–
VCM12
AIN2+
AIN2–
AIN3+
AIN3–
VCM34
AIN4+
AIN4–
AIN5+
AIN5–
VCM56
AIN6+
AIN6–
AIN7+
AIN7–
AIN8+
AIN8–
VCM78
CLK+
CLK–
+1.8V
+1.8V
+1.8V
+1.8V
+1.8V
+1.8V
+1.8V
+1.8V
+1.8VO
+1.8VO
SENSE
PAR/SER
+1.8V
C1
2.2µF, 0603
EXT REF
E1
R10
1k
PAR/SER
R6
1k R9
100Ω
A7
VREF
JP2
M6
LTM9008-14
SCI
CSA
SCK
R7
1k
+1.8V
ILVDS
1
1.7mA
2
3
3.5mA
MOSI
JP5
2 LANE
1 LANE
CSB
SDOB
R13
31.6k
1%
R11
10k
R8
1k
JP6
C13
100µF
10V
R28
3k
FB2
BLM31PG330SN1L
FB1
BLM31PG330SN1L
+1.8V
+1.8VO
C14
0.1µF
R3
1k
JP3
DIS
TERM
EN
OUT1A+
OUT1A–
OUT1B+
OUT1B–
OUT2A+
OUT2A–
OUT2B+
OUT2B–
OUT3A+
OUT3A–
OUT3B+
OUT3B–
OUT4A+
OUT4A–
OUT4B+
OUT4B–
OUT5A+
OUT5A–
OUT5B+
OUT5B–
OUT6A+
OUT6A–
OUT6B+
OUT6B–
OUT7A+
OUT7A–
OUT7B+
OUT7B–
FRA+
FRA–
FRB+
FRB–
DCOA+
DCOA–
DCOB+
DCOB–
1
2
3
90067814 TA02
E8
E7
D8
C8
A8
B8
C7
D7
D9
D10
E9
E10
C10
C9
F8
F7
J7
J8
K7
K8
K10
K9
L10
L9
M8
L8
M9
M10
H8
H7
J10
J9
G7
G8
F9
F10
DIS
TERM
EN
OUT1A+
OUT1A–
OUT1B+
OUT1B–
OUT2A+
OUT2A–
OUT2B+
OUT2B–
OUT3A+
OUT3A–
OUT3B+
OUT3B–
OUT4A+
OUT4A–
OUT4B+
OUT4B–
OUT5A+
OUT5A–
OUT5B+
OUT5B–
OUT6A+
OUT6A–
OUT6B+
OUT6B–
OUT7A+
OUT7A–
OUT7B+
OUT7B–
FRA+
FRA–
FRB+
FRB–
DCOA+
DCOA–
DCOB+
DCOB–
1
2
3
R5
31.6k
1%
R4
10k
3.3 AUX +1.8V
3.3 AUX +1.8V
R1 LANE
1k 1
1 LANE
2
3
2 LANE
JP3
SDOA
+1.8V
SCK CSA CSB SDOA SDOB
L5
A1
A2
A3
A4
A5
A6
B4
B5
B7
C3
C4
C6
D1
D2
D5
E5
F1
F2
F4
F5
F6
G3
G4
G5
G6
H3
H4
H5
H6
J1
J2
J4
J5
J6
K5
K6
L1
L2
M3
M4
N4
N5
N6
N7
P1
P2
P3
P4
P7
R30
0Ω
0603
PAR/SER
1
PAR
2
3
SER
JP4
C5
R2
1k
L6
+1.8V
B6
+1.8V
M5
LANE
E6
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
A9
A10
B9
B10
H9
H10
N9
N10
P9
P10
34
D6
LTM9008-14 Schematic
LTM9008-14/
LTM9007-14/LTM9006-14
TYPICAL APPLICATION
90067814f
2.000
2.000
SUGGESTED PCB LAYOUT
TOP VIEW
1.200
aaa Z
0.4 Ø 140x
0.000
PACKAGE TOP VIEW
0.400
4
0.400
PIN “A1”
CORNER
2.800
E
1.200
X
D
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5.200
4.400
3.600
2.800
2.000
1.200
0.400
0.400
1.200
2.000
2.800
3.600
4.400
5.200
Y
0.000
aaa Z
1.95 – 2.05
SYMBOL
A
A1
A2
b
b1
D
E
e
D1
E1
aaa
bbb
ccc
ddd
eee
NOM
2.72
0.40
2.32
0.50
0.40
11.25
9.0
0.80
10.40
7.2
DIMENSIONS
0.15
0.10
0.12
0.15
0.08
MAX
2.87
0.45
2.42
0.55
0.45
NOTES
DETAIL B
PACKAGE SIDE VIEW
TOTAL NUMBER OF BALLS: 140
MIN
2.57
0.35
2.22
0.45
0.35
DETAIL A
ddd M Z X Y
eee M Z
DETAIL B
b1
0.27 – 0.37
SUBSTRATE
A1
A2
A
Z
D1
e
b
10
e
9
7
6
5
b
4
3
PACKAGE BOTTOM VIEW
8
E1
2
1
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
4
TRAY PIN 1
BEVEL
COMPONENT
PIN “A1”
BGA 140 0709 REV A
PACKAGE IN TRAY LOADING ORIENTATION
LTMXXXXXX
µModule
5. PRIMARY DATUM -Z- IS SEATING PLANE
BALL DESIGNATION PER JESD MS-028 AND JEP95
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
P
N
M
L
K
J
H
G
F
E
D
C
B
A
PIN 1
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
3
SEE NOTES
(Reference LTC DWG # 05-08-1849 Rev A)
MOLD
CAP
ccc Z
Øb (140 PLACES)
// bbb Z
BGA Package
140-Lead (11.25mm × 9.00mm × 2.72mm)
LTM9008-14/
LTM9007-14/LTM9006-14
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
90067814f
35
3.600
2.800
3.600
LTM9008-14/
LTM9007-14/LTM9006-14
TYPICAL APPLICATION
Single-Ended to Differential Conversion Using LTC6409 and 50MHz
Lowpass Filter (Only One Channel Shown). Filter for Use at 61.44Msps
0.8pF
1.8V
1.8V
0.1µF
IN–
150Ω
49.9Ω
+
68pF
150pF
LTC6409
–
SHDN
37.4Ω
VOCM
474Ω
180nH
150pF
180nH
100pF
O1A+ E8
B1 AIN1
–
O1A– E7
B3
DCO+ G7
75Ω
C1
F2
GND
F1
50Ω
VDD
+
B2 AIN1
C2
0.8pF
66.9Ω
75Ω
33pF
68pF
OUT+
B6
VREF
OUT –
180nH
SENSE
IN+
180nH
•••
0.1µF
C5
37.4Ω
F3
G2
•••
G1
N1
N2
VCM12
AIN2+
LTM9008-14
AIN2–
DCO– G8
FR+ H8
FR– H7
AIN3+
AIN3–
VCM34
AIN4+
AIN4–
AIN8+
AIN8–
CLK–
66.9Ω
474Ω
V+
CLK+
150Ω
OVDD
3.3V
P5 P6
90067814 TA03
RELATED PARTS
PART NUMBER
ADCs
LTC2170-14/LTC2171-14/
LTC2172-14
LTC2173-14/LTC2174-14/
LTC2175-14
LTM9009-14/LTM9010-14/
LTM9011-14
Amplifiers/Filters
LTC6412
LTC6420-20
LTC6421-20
LTC6605-7/ LTC6605-10/
LTC6605-14
Signal Chain Receivers
LTM9002
DESCRIPTION
COMMENTS
14-Bit, 25Msps/40Msps/65Msps
1.8V Quad ADCs, Ultralow Power
14-Bit, 80Msps/105Msps/125Msps
1.8V Quad ADCs, Ultralow Power
14-Bit, 80Msps/105Msps/125Msps 1.8V
Octal ADCs, Ultralow Power
178mW/234mW/360mW, 73.4dB SNR, 85dB SFDR, Serial LVDS Outputs,
7mm × 8mm QFN-52
412mW/481mW/567mW, 73.4dB SNR, 85dB SFDR, Serial LVDS Outputs,
7mm × 8mm QFN-52
801mW/950mW/1145mW, 73.1dB SNR, 85dB SFDR, Serial LVDS Outputs,
11.25mm × 9mm BGA-140
800MHz, 31dB Range, Analog-Controlled
Variable Gain Amplifier
1.8GHz Dual Low Noise, Low Distortion
Differential ADC Drivers for 300MHz IF
1.3GHz Dual Low Noise, Low Distortion
Differential ADC Drivers
Dual Matched 7MHz/10MHz/14MHz
Filters with ADC Drivers
Continuously Adjustable Gain Control, 35dBm OIP3 at 240MHz, 10dB Noise
Figure, 4mm × 4mm QFN-24
Fixed Gain 10V/V, 1nV/√Hz Total Input Noise, 80mA Supply Current per Amplifier,
3mm × 4mm QFN-20
Fixed Gain 10V/V, 1nV/√Hz Total Input Noise, 40mA Supply Current per Amplifier,
3mm × 4mm QFN-20
Dual Matched 2nd Order Lowpass Filters with Differential Drivers,
Pin-Programmable Gain, 6mm × 3mm DFN-22
14-Bit Dual Channel IF/Baseband
Receiver Subsystem
Integrated High Speed ADC, Passive Filters and Fixed Gain Differential Amplifiers
90067814f
36
Linear Technology Corporation
LT 1112 • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2012

Open as PDF

Similar pages