MX29LV004C T/B
4M-BIT [512K x 8] CMOS SINGLE VOLTAGE
3V ONLY FLASH MEMORY
FEATURES
• Extended single - supply voltage range 2.7V to 3.6V
• 524,288 x 8
• Single power supply operation
- 3.0V only operation for read, erase and program
operation
• Fully compatible with MX29LV004T/B device
• Fast access time: 45R/55R/70/90ns
• Low power consumption
- 30mA maximum active current
- 0.2uA typical standby current
• Command register architecture
- Byte Programming (9us typical)
- Sector Erase (Sector structure 16K-Byte x 1,
8K-Byte x 2, 32K-Byte x1, and 64K-Byte x7)
• Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors with
Erase Suspend capability.
- Automatically program and verify data at specified
address
• Erase suspend/Erase Resume
- Suspends sector erase operation to read data from,
or program data to, any sector that is not being erased,
then resumes the erase.
• Status Reply
- Data# Polling & Toggle bit for detection of program
and erase operation completion.
• Ready/Busy# pin (RY/BY#)
- Provides a hardware method of detecting program or
erase operation completion.
• Sector protection
- Hardware method to disable any combination of
sectors from program or erase operations
- Temporary sector unprotect allows code changes in
previously locked sectors
• CFI (Common Flash Interface) compliant
- Flash device parameters stored on the device and
provide the host system to access
• 100,000 minimum erase/program cycles
• Latch-up protected to 100mA from -1V to VCC+1V
• Boot Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
• Package type:
- 40-pin TSOP
- 32-pin PLCC
- All Pb-free devices are RoHS Compliant
• Compatibility with JEDEC standard
- Pinout and software compatible with single-power
supply Flash
• 20 years data retention
GENERAL DESCRIPTION
The MX29LV004C T/B is a 4-mega bit Flash memory
organized as 512K bytes of 8 bits. MXIC's Flash memories offer the most cost-effective and reliable read/write
non-volatile random access memory. The MX29LV004C
T/B is packaged in 40-pin TSOP and 32-pin PLCC. It is
designed to be reprogrammed and erased in system or
in standard EPROM programmers.
TTL level control inputs and fixed power supply levels
during erase and programming, while maintaining maximum EPROM compatibility.
The standard MX29LV004C T/B offers access time as
fast as 45ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention, the MX29LV004C T/B has separate chip enable
(CE#) and output enable (OE#) controls.
MXIC Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and programming
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields
for erase and program operations produces reliable cycling. The MX29LV004C T/B uses a 2.7V~3.6V VCC
supply to perform the High Reliability Erase and auto
Program/Erase algorithms.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29LV004C T/B uses a command register to manage
this functionality. The command register allows for 100%
The highest degree of latch-up protection is achieved
with MXIC's proprietary non-epi process. Latch-up protection is proved for stresses up to 100 milliamps on
address and data pin from -1V to VCC + 1V.
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MX29LV004C T/B
PIN CONFIGURATIONS
40 TSOP (Standard Type) (10mm x 20mm)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
A16
A15
A14
A13
A12
A11
A9
A8
WE#
RESET#
NC
RY/BY#
A18
A7
A6
A5
A4
A3
A2
A1
MX29LV004C T/B
32 PLCC
32
A17
1
WE#
VCC
A16
A15
4
A18
5
30
29
A14
A6
A13
A5
A8
A4
A9
A3
MX29LV004C T/B
9
25
A11
A2
OE#
A1
A10
A0
CE#
21
20
Q5
Q4
Q3
GND
Q2
17
SYMBOL
PIN NAME
A0~A18
Address Input
Q0~Q7
Data Input/Output
CE#
Chip Enable Input
WE#
Write Enable Input
RESET#
Hardware Reset Pin/Sector Protect
Unlock (for 40-TSOP)
Q7
Q6
13
14
Q1
Q0
A17
GND
NC
NC
A10
Q7
Q6
Q5
Q4
VCC
VCC
NC
Q3
Q2
Q1
Q0
OE#
VSS
CE#
A0
PIN DESCRIPTION
A12
A7
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
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OE#
Output Enable Input
RY/BY#
Ready/Busy# Output (for 40-TSOP)
VCC
Power Supply Pin (2.7V~3.6V)
GND
Ground Pin
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MX29LV004C T/B
BLOCK STRUCTURE
Table 1: MX29LV004CT SECTOR ARCHITECTURE
Sector
Sector Size
Address range
Sector Address
Byte Mode
Byte Mode (x8)
SA0
64Kbytes
00000-0FFFF
0
SA1
64Kbytes
10000-1FFFF
SA2
64Kbytes
SA3
A18 A17
A16
A15
A14
A13
0
0
X
X
X
0
0
1
X
X
X
20000-2FFFF
0
1
0
X
X
X
64Kbytes
30000-3FFFF
0
1
1
X
X
X
SA4
64Kbytes
40000-4FFFF
1
0
0
X
X
X
SA5
64Kbytes
50000-5FFFF
1
0
1
X
X
X
SA6
64Kbytes
60000-6FFFF
1
1
0
X
X
X
SA7
32Kbytes
70000-77FFF
1
1
1
0
X
X
SA8
8Kbytes
78000-79FFF
1
1
1
1
0
0
SA9
8Kbytes
7A000-7BFFF
1
1
1
1
0
1
SA10
16Kbytes
7C000-7FFFF
1
1
1
1
1
X
Table 2: MX29LV004CB SECTOR ARCHITECTURE
Sector
Sector Size
Address range
Sector Address
Byte Mode
Byte Mode (x8)
A16
A15
A14
A13
SA0
16Kbytes
00000-03FFF
0
0
0
0
0
X
SA1
8Kbytes
04000-05FFF
0
0
0
0
1
0
SA2
8Kbytes
06000-07FFF
0
0
0
0
1
1
SA3
32Kbytes
08000-0FFFF
0
0
0
1
X
X
SA4
64Kbytes
10000-1FFFF
0
0
1
X
X
X
SA5
64Kbytes
20000-2FFFF
0
1
0
X
X
X
SA6
64Kbytes
30000-3FFFF
0
1
1
X
X
X
SA7
64Kbytes
40000-4FFFF
1
0
0
X
X
X
SA8
64Kbytes
50000-5FFFF
1
0
1
X
X
X
SA9
64Kbytes
60000-6FFFF
1
1
0
X
X
X
SA10
64Kbytes
70000-7FFFF
1
1
1
X
X
X
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MX29LV004C T/B
BLOCK DIAGRAM
CE#
OE#
WE#
RESET#(for 40-TSOP)
CONTROL
INPUT
HIGH VOLTAGE
LOGIC
LATCH
BUFFER
REGISTER
FLASH
ARRAY
Y-DECODER
AND
WRITE
STATE
MACHINE
(WSM)
STATE
X-DECODER
ADDRESS
A0-A18
PROGRAM/ERASE
Y-PASS GATE
SENSE
AMPLIFIER
PGM
DATA
HV
ARRAY
SOURCE
HV
COMMAND
DATA
DECODER
COMMAND
DATA LATCH
PROGRAM
DATA LATCH
Q0-Q7
I/O BUFFER
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MX29LV004C T/B
dard microprocessor write timings. The device will automatically pre-program and verify the entire array. Then
the device automatically times the erase pulse width,
provides the erase verification, and counts the number
of sequences. A status bit toggling between consecutive read cycles provides feedback to the user as to the
status of the erasing operation.
AUTOMATIC PROGRAMMING
The MX29LV004C T/B is byte programmable using the
Automatic Programming algorithm. The Automatic Programming algorithm makes the external system do not
need to have time out sequence nor to verify the data
programmed. The typical chip programming time at room
temperature of the MX29LV004C T/B is less than 10
seconds.
Register contents serve as inputs to an internal statemachine which controls the erase and programming circuitry. During write cycles, the command register internally latches address and data needed for the programming and erase operations. During a system write cycle,
addresses are latched on the falling edge, and data are
latched on the rising edge of WE# or CE#, whichever
happens first.
AUTOMATIC CHIP ERASE
The entire chip is bulk erased using 10 ms erase pulses
according to MXIC's Automatic Chip Erase algorithm.
Typical erasure at room temperature is accomplished in
less than 4 second. The Automatic Erase algorithm automatically programs the entire array prior to electrical
erase. The timing and verification of electrical erase are
controlled internally within the device.
MXIC's Flash technology combines years of EPROM
experience to produce the highest levels of quality, reliability, and cost effectiveness. The MX29LV004C T/B
electrically erases all bits simultaneously using FowlerNordheim tunneling. The bytes are programmed by using the EPROM programming mechanism of hot electron injection.
AUTOMATIC SECTOR ERASE
The MX29LV004C T/B is sector(s) erasable using MXIC's
Auto Sector Erase algorithm. The Automatic Sector
Erase algorithm automatically programs the specified
sector(s) prior to electrical erase. The timing and verification of electrical erase are controlled internally within
the device. An erase operation can erase one sector,
multiple sectors, or the entire device.
During a program cycle, the state-machine will control
the program sequences and command register will not
respond to any command set. During a Sector Erase
cycle, the command register will only respond to Erase
Suspend command. After Erase Suspend is completed,
the device stays in read mode. After the state machine
has completed its task, it will allow the command register to respond to its full command set.
AUTOMATIC PROGRAMMING ALGORITHM
MXIC's Automatic Programming algorithm requires the
user to only write program set-up commands (including
2 unlock write cycle and A0H) and a program command
(program data and address). The device automatically
times the programming pulse width, provides the program verification, and counts the number of sequences.
A status bit similar to Data# Polling and a status bit
toggling between consecutive read cycles, provide feedback to the user as to the status of the programming
operation. Refer to write operation status, table7, for more
information on these status bits.
AUTOMATIC SELECT
The automatic select mode provides manufacturer and
device identification, and sector protection verification,
through identifier codes output on Q7~Q0. This mode is
mainly adapted for programming equipment on the device to be programmed with its programming algorithm.
When programming by high voltage method, automatic
select mode requires VID (11.5V to 12.5V) on address
pin A9 and other address pin A6, A1 as referring to Table
3. In addition, to access the automatic select codes insystem, the host can issue the automatic select command through the command register without requiring VID,
as shown in table4.
AUTOMATIC ERASE ALGORITHM
MXIC's Automatic Erase algorithm requires the user to
write commands to the command register using stan-
To verify whether or not sector being protected, the sec-
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5
MX29LV004C T/B
tor address must appear on the appropriate highest order
address bit (see Table 1 and Table 2). The rest of address
bits, as shown in table3, are don't care. Once all necessary bits have been set as required, the programming
equipment may read the corresponding identifier code on
Q7~Q0.
TABLE 3. MX29LV004C T/B AUTOSELECT MODE OPERATION
A18 A12
Description
CE# OE# WE# RESET#
|
|
A8
A9
(note) A13 A10
|
A5
A6
A7
|
A1 A0
Q15~Q0
A2
Manufacture Code
L
L
H
H
X
X
VID
X
L
X
L
L
C2H
Read
Device ID
L
L
H
H
X
X
VID
X
L
X
L
H
B5H
Silicon
(Top Boot Block)
ID
Device ID
L
L
H
H
X
X
VID
X
L
X
L
H
B6H
(Bottom Boot Block)
01H
Sector Protection Verification
L
L
H
H
SA
X
VID
X
L
X
H
L
(protected)
00H
(unprotected)
NOTE: SA=Sector Address, X=Don't Care, L=Logic Low, H=Logic High.
RESET# pin for 40-TSOP only.
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MX29LV004C T/B
TABLE 4. MX29LV004C T/B COMMAND DEFINITIONS
Command
Bus
First Bus
Cycle
Cycle Addr
Second Bus
Cycle
Data Addr
Third Bus
Cycle
Fourth Bus
Cycle
Data Addr
Data Addr
Data
Reset
1
XXXH F0H
Read
1
RA
Read Silicon ID
4
555H AAH 2AAH
55H
555H
90H ADI
DDI
Sector Protect
4
555H AAH 2AAH
55H
555H
90H (SA)
00H
Fifth Bus
Cycle
Addr
Sixth Bus
Cycle
Data Addr
Data
RD
Verify
x02H
01H
Program
4
555H AAH 2AAH
55H
555H
A0H PA
PD
Chip Erase
6
555H AAH 2AAH
55H
555H
80H 555H AAH
2AAH 55H
555H 10H
Sector Erase
6
555H AAH 2AAH
55H
555H
80H 555H AAH
2AAH 55H
SA
Sector Erase Suspend
1
XXXH B0H
Sector Erase Resume
1
XXXH 30H
CFI Query
1
AAH
30H
98
Note:
1. ADI = Address of Device identifier; A1=0, A0 = 0 for manufacturer code,A1=0, A0 = 1 for device code. A2-A17=do
not care.
(Refer to table 3)
DDI = Data of Device identifier : C2H for manufacture code, B5H/B6H (Top/Bottom) for device code.
X = X can be VIL or VIH
RA=Address of memory location to be read.
RD=Data to be read at location RA.
2. PA = Address of memory location to be programmed.
PD = Data to be programmed at location PA.
SA = Address of the sector to be erased.
3. The system should generate the following address patterns: 555H or 2AAH to Address A11~A0.
Address bit A12~A18=X=Don't care for all address commands except for Program Address (PA) and Sector
Address (SA). Write Sequence may be initiated with A12~A18 in either state.
4. For Sector Protect Verify operation:If read out data is 01H, it means the sector has been protected. If read out data
is 00H, it means the sector is still not being protected.
5. Any number of CFI data read cycle are permitted.
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MX29LV004C T/B
COMMAND DEFINITIONS
read mode. Table 4 defines the valid register command
sequences. Note that the Erase Suspend (B0H) and
Erase Resume (30H) commands are valid only while the
Sector Erase operation is in progress.
Device operations are selected by writing specific address and data sequences into the command register.
Writing incorrect address and data values or writing them
in the improper sequence will reset the device to the
TABLE 5. MX29LV004C T/B BUS OPERATION
REDESCRIPTION
CE#
OE# WE# SET#
(8)
Read
L
L
H
ADDRESS
A18 A12 A9 A8
A13 A10
A6 A5 A1
A7
H
Q8~Q15
A0
Q0~Q7
A2
AIN
Dout
BYTE
BYTE
=VIH
=VIL
Dout
Q8~Q14=High Z
Q15=A-1
Write
L
H
L
H
AIN
DIN(3)
DIN
Q8~Q14=High Z
Q15=A-1
Reset
X
X
X
L
X
High Z
High Z
High Z
Temporary sector unlock
X
X
X
VID
AIN
DIN
DIN
High Z
L
H
H
H
X
High Z
High Z
High Z
Vcc±
X
X
Vcc±
X
High Z
High Z
High Z
DIN
X
X
Output Disable
Standby
0.3V
Sector Protect
0.3V
L
H
L
VID
Chip Unprotect
L
Sector Protection Verify
L
SA
H
L
VID
X
L
H
H
SA
X
X
X
L
X
H
L
X
X
X
H
X
H
L
DIN
X
X
X VID X
L
X
H
L
CODE(5)
X
X
NOTES:
1. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 4.
2. VID is the Silicon-ID-Read high voltage, 11.5V to 12.5V.
3. Refer to Table 4 for valid Data-In during a write operation.
4. X can be VIL or VIH.
5. Code=00H means unprotected.
Code=01H means protected.
6. A18~A13=Sector address for sector protect.
7. The sector protect and chip unprotect functions may also be implemented via programming equipment.
8. RESET# pin for 40-TSOP package type only.
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MX29LV004C T/B
REQUIREMENTS FOR READING ARRAY
DATA
STANDBY MODE
When using both pins of CE# and RESET#, the device
enter CMOS Standby with both pins held at Vcc ± 0.3V.
The RESET# pin is provided only for 40-pin TSOP package type. If CE# and RESET# are held at VIH, but not
within the range of VCC ± 0.3V, the device will still be in
the standby mode, but the standby current will be larger.
During Auto Algorithm operation, Vcc active current
(Icc2) is required even CE# = "H" until the operation is
completed. The device can be read with standard access time (tCE) from either of these standby modes,
before it is ready to read data.
To read array data from the outputs, the system must
drive the CE# and OE# pins to VIL. CE# is the power
control and selects the device. OE# is the output control
and gates array data to the output pins. WE# should remain
at VIH.
The internal state machine is set for reading array data
upon device power-up, or after a hardware reset. This
ensures that no spurious alteration of the memory content
occurs during the power transition. No command is
necessary in this mode to obtain array data. Standard
microprocessor read cycles that assert valid address on
the device address inputs produce valid data on the device
data outputs. The device remains enabled for read access
until the command register contents are altered.
OUTPUT DISABLE
With the OE# input at a logic high level (VIH), output
from the devices are disabled. This will cause the output
pins to be in a high impedance state.
WRITE COMMANDS/COMMAND SEQUENCES
RESET# OPERATION (for 40-TSOP package type)
To program data to the device or erase sectors of memory
, the system must drive WE# and CE# to VIL, and OE#
to VIH.
The RESET# pin provides a hardware method of resetting
the device to reading array data. When the RESET# pin
is driven low for at least a period of tRP, the device
immediately terminates any operation in progress,
tristates all output pins, and ignores all read/write
commands for the duration of the RESET# pulse. The
device also resets the internal state machine to reading
array data. The operation that was interrupted should be
reinitiated once the device is ready to accept another
command sequence, to ensure data integrity
An erase operation can erase one sector, multiple sectors
, or the entire device. Table indicates the address space
that each sector occupies. A "sector address" consists
of the address bits required to uniquely select a sector.
The "Writing specific address and data commands or
sequences into the command register initiates device
operations. Table 1 defines the valid register command
sequences. Writing incorrect address and data values or
writing them in the improper sequence resets the device
to reading array data. Section has details on erasing a
sector or the entire chip, or suspending/resuming the erase
operation.
Current is reduced for the duration of the RESET# pulse.
When RESET# is held at VSS±0.3V, the device draws
CMOS standby current (ICC4). If RESET# is held at VIL
but not within VSS±0.3V, the standby current will be
greater.
After the system writes the autoselect command
sequence, the device enters the autoselect mode. The
system can then read autoselect codes from the internal
register (which is separate from the memory array) on
Q7-Q0. Standard read cycle timings apply in this mode.
Refer to the Autoselect Mode and Autoselect Command
Sequence section for more information.
The RESET# pin may be tied to system reset circuitry.
A system reset would that also reset the Flash memory,
enabling the system to read the boot-up firm-ware from
the Flash memory.
If RESET# is asserted during a program or erase
operation, the RY/BY# pin remains a "0" (busy) until the
internal reset operation is complete, which requires a time
of tREADY (during Embedded Algorithms). The system
can thus monitor RY/BY# to determine whether the reset
ICC2 in the DC Characteristics table represents the active
current specification for the write mode. The "AC
Characteristics" section contains timing specification table
and timing diagrams for write operations.
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MX29LV004C T/B
operation is complete. If RESET# is asserted when a
program or erase operation is completed within a time of
tREADY (not during Embedded Algorithms). The system
can read data tRH after the RESET# pin returns to VIH.
sector erase command 30H.
The Automatic Chip Erase does not require the device to
be entirely pre-programmed prior to executing the Automatic Chip Erase. Upon executing the Automatic Chip
Erase, the device will automatically program and verify
the entire memory for an all-zero data pattern. When the
device is automatically verified to contain an all-zero pattern, a self-timed chip erase and verify begin. The erase
and verify operations are completed when the data on
Q7 is "1" at which time the device returns to the Read
mode. The system is not required to provide any control
or timing during these operations.
Refer to the AC Characteristics tables for RESET#
parameters and to Figure 24 for the timing diagram.
READ/RESET COMMAND
The read or reset operation is initiated by writing the read/
reset command sequence into the command register.
Microprocessor read cycles retrieve array data. The device remains enabled for reads until the command register contents are altered.
When using the Automatic Chip Erase algorithm, note
that the erase automatically terminates when adequate
erase margin has been achieved for the memory array(no
erase verification command is required).
If program-fail or erase-fail happen, the write of F0H will
reset the device to abort the operation. A valid command must then be written to place the device in the
desired state.
If the Erase operation was unsuccessful, the data on Q5
is "1"(see Table 7), indicating the erase operation exceed internal timing limit.
The automatic erase begins on the rising edge of the last
WE# or CE# pulse, whichever happens first in the command sequence and terminates when the data on Q7 is
"1" and the data on Q6 stops toggling for two consecutive read cycles, at which time the device returns to the
Read mode.
SILICON-ID READ COMMAND
Flash memories are intended for use in applications where
the local CPU alters memory contents. As such, manufacturer and device codes must be accessible while the
device resides in the target system. PROM programmers typically access signature codes by raising A9 to
a high voltage (VID). However, multiplexing high voltage
onto address lines is not generally desired system design practice.
The MX29LV004C T/B contains a Silicon-ID-Read operation to supple traditional PROM programming methodology. The operation is initiated by writing the read
silicon ID command sequence into the command register. Following the command write, a read cycle with
A1=VIL, A0=VIL retrieves the manufacturer code of C2H.
A read cycle with A1=VIL, A0=VIH returns the device
code of B5H for MX29LV004CT, B6H for MX29LV004CB.
SET-UP AUTOMATIC CHIP/SECTOR ERASE
COMMANDS
Chip erase is a six-bus cycle operation. There are two
"unlock" write cycles. These are followed by writing the
"set-up" command 80H. Two more "unlock" write cycles
are then followed by the chip erase command 10H or
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MX29LV004C T/B
TABLE 6. EXPANDED SILICON ID CODE
Pins
A0
A1
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
Code(Hex)
Manufacture code
VIL
VIL
1
1
0
0
0
0
1
0
C2H
Device code
VIH
VIL
1
0
1
1
1
0
0
1
B5H
VIH
VIL
1
0
1
1
1
0
1
0
B6H
Sector Protection
X
VIH
0
0
0
0
0
0
0
1
01H (Protected)
Verification
X
VIH
0
0
0
0
0
0
0
0
00H (Unprotected)
for MX29LV004CT
Device code
for MX29LV004CB
READING ARRAY DATA
RESET COMMAND
The device is automatically set to reading array data
after device power-up. No commands are required to retrieve data. The device is also ready to read array data
after completing an Automatic Program or Automatic
Erase algorithm.
Writing the reset command to the device resets the device to reading array data. Address bits are don't care for
this command.
The reset command may be written between the sequence cycles in an erase command sequence before
erasing begins. This resets the device to reading array
data. Once erasure begins, however, the device ignores
reset commands until the operation is complete.
After the device accepts an Erase Suspend command,
the device enters the Erase Suspend mode. The system can read array data using the standard read timings, except that if it reads at an address within erasesuspended sectors, the device outputs status data. After completing a programming operation in the Erase
Suspend mode, the system may once again read array
data with the same exception. See "Erase Suspend/Erase
Resume Commands" for more infor-mation on this mode.
The system must issue the reset command to re-enable the device for reading array data if Q5 goes high, or
while in the autoselect mode. See the "Reset Command"
section, next.
The reset command may be written between the sequence cycles in a program command sequence be-fore
programming begins. This resets the device to reading
array data (also applies to programming in Erase Suspend mode). Once programming begins, however, the
device ignores reset commands until the operation is
complete.
The reset command may be written between the sequence cycles in an SILICON ID READ command sequence. Once in the SILICON ID READ mode, the reset
command must be written to return to reading array data
(also applies to SILICON ID READ during Erase Suspend).
If Q5 goes high during a program or erase operation, writing the reset command returns the device to reading array data (also applies during Erase Suspend).
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MX29LV004C T/B
SECTOR ERASE COMMANDS
The Automatic Sector Erase does not require the device to be entirely pre-programmed prior to executing
the Automatic Sector Erase Set-up command and Automatic Sector Erase command. Upon executing the
Automatic Sector Erase command, the device will automatically program and verify the sector(s) memory for
an all-zero data pattern. The system is not required to
provide any control or timing during these operations.
(no erase verification command is required). Sector erase
is a six-bus cycle operation. There are two "unlock" write
cycles. These are followed by writing the set-up command 80H. Two more "unlock" write cycles are then followed by the sector erase command 30H. The sector
address is latched on the falling edge of WE# or CE#,
whichever happens later, while the command (data) is
latched on the rising edge of WE# or CE#, whichever
happens first. Sector addresses selected are loaded
into internal register on the sixth falling edge of WE# or
CE#, whichever happens later. Each successive sector
load cycle started by the falling edge of WE# or CE#,
whichever happens later must begin within 50us from
the rising edge of the preceding WE# or CE#, whichever
happens first. Otherwise, the loading period ends and
internal auto sector erase cycle starts. (Monitor Q3 to
determine if the sector erase timer window is still open,
see section Q3, Sector Erase Timer.) Any command other
than Sector Erase(30H) or Erase Suspend(B0H) during
the time-out period resets the device to read mode.
When the sector(s) is automatically verified to contain
an all-zero pattern, a self-timed sector erase and verify
begin. The erase and verify operations are complete
when the data on Q7 is "1" and the data on Q6 stops
toggling for two consecutive read cycles, at which time
the device returns to the Read mode. The system is not
required to provide any control or timing during these
operations.
When using the Automatic sector Erase algorithm, note
that the erase automatically terminates when adequate
erase margin has been achieved for the memory array
Table 7. Write Operation Status
Status
Q7
(Note1)
Q6
Q7#
Toggle
0
0
Toggle
0
1
No
Toggle
0
Erase Suspend Read
(Non-Erase Suspended Sector)
Data
Data
Erase Suspend Program
Q7#
Toggle
0
N/A
N/A
0
Q7#
Toggle
1
N/A
No
Toggle
0
0
Toggle
1
1
Toggle
0
Q7#
Toggle
1
N/A
N/A
0
Byte Program in Auto Program Algorithm
Auto Erase Algorithm
Erase Suspend Read
(Erase Suspended Sector)
Q5
Q3
(Note2)
Q2
RY/BY#
N/A
No
Toggle
0
1
Toggle
0
N/A Toggle
1
In Progress
Erase Suspended Mode
Byte Program in Auto Program Algorithm
Exceeded
Time Limits
Auto Erase Algorithm
Erase Suspend Program
Data Data Data
1
Note:
1. Q7 and Q2 require a valid address when reading status information. Refer to the appropriate subsection for further details.
2. Q5 switches to '1' when an Auto Program or Auto Erase operation has exceeded the maximum timing limits.
See "Q5:Exceeded Timing Limits " for more information.
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MX29LV004C T/B
also begins the programming operation. The system is
not required to provide further controls or timings. The
device will automatically provide an adequate internally
generated program pulse and verify margin.
ERASE SUSPEND
This command only has meaning while the state machine is executing Automatic Sector Erase operation,
and therefore will only be responded during Automatic
Sector Erase operation. When the Erase Suspend command is written during a sector erase operation, the device requires a maximum of 20us to suspend the erase
operations. However, When the Erase Suspend command
is written during the sector erase time-out, the device
immediately terminates the time-out period and suspends
the erase operation. After this command has been executed, the command register will initiate erase suspend
mode. The state machine will return to read mode automatically after suspend is ready. At this time, state machine only allows the command register to respond to
the Read Memory Array, Erase Resume and program
commands.
The device provides Q2, Q3, Q5, Q6, Q7, and RY/BY#
to determine the status of a write operation. If the program operation was unsuccessful, the data on Q5 is
"1"(see Table 7), indicating the program operation exceed
internal timing limit. The automatic programming operation is completed when the data read on Q6 stops toggling for two consecutive read cycles and the data on Q7
and Q6 are equivalent to data written to these two bits,
at which time the device returns to the Read mode(no
program verify command is required).
BYTE PROGRAM COMMAND SEQUENCE
The system can determine the status of the program
operation using the Q7 or Q6 status bits, just as in the
standard program operation. After an erase-suspend program operation is complete, the system can once again
read array data within non-suspended sectors.
The device programs one byte of data for each program
operation. The command sequence requires four bus
cycles, and is initiated by writing two unlock write cycles,
followed by the program set-up command. The program
address and data are written next, which in turn initiate
the Embedded Program algorithm. The system is not
required to provide further controls or timings. The device
automatically generates the program pulses and verifies
the programmed cell margin. Table 1 shows the address
and data requirements for the byte program command
sequence.
ERASE RESUME
This command will cause the command register to clear
the suspend state and return back to Sector Erase mode
but only if an Erase Suspend command was previously
issued. Erase Resume will not have any effect in all
other conditions. Another Erase Suspend command can
be written after the chip has resumed erasing. The minimum time from Erase Resume to next Erase Suspend
is 400us. Repeatedly suspending the device more often
may have undetermined effects.
When the Embedded Program algorithm is complete,
the device then returns to reading array data and
addresses are no longer latched. The system can
determine the status of the program operation by using
Q7, Q6, or RY/BY#. See "Write Operation Status" for
information on these status bits.
Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a
hardware reset immediately terminates the programming
operation. The Byte Program command sequence should
be reinitiated once the device has reset to reading array
data, to ensure data integrity.
AUTOMATIC PROGRAM COMMANDS
To initiate Automatic Program mode, A three-cycle command sequence is required. There are two "unlock" write
cycles. These are followed by writing the Automatic Program command A0H.
Programming is allowed in any sequence and across
sector boundaries. A bit cannot be programmed from a
"0" back to a "1". Attempting to do so may halt the
operation and set Q5 to "1", or cause the Data# Polling
algorithm to indicate the operation was successful.
However, a succeeding read will show that the data is
still "0". Only erase operations can convert a "0" to a
"1".
Once the Automatic Program command is initiated, the
next WE# pulse causes a transition to an active programming operation. Addresses are latched on the falling edge, and data are internally latched on the rising
edge of the WE# or CE#, whichever happens first. The
rising edge of WE# or CE#, whichever happens first,
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MX29LV004C T/B
When the system detects Q7 has changed from the
complement to true data, it can read valid data at Q7-Q0
on the following read cycles. This is because Q7 may
change asynchronously with Q0-Q6 while Output Enable (OE#) is asserted low.
WRITE OPERATION STATUS
The device provides several bits to determine the status of a write operation: Q2, Q3, Q5, Q6, Q7, and RY/
BY#. Table 10 and the following subsections describe
the functions of these bits. Q7, RY/BY#, and DQ6 each
offer a method for determining whether a program or erase
operation is complete or in progress. These three bits
are discussed first. Please note that RY/BY# pin is provided for 40-pin TSOP package type only.
RY/BY#:Ready/Busy# (for 40-pin TSOP package
only)
The RY/BY# is a dedicated, open-drain output pin that
indicates whether an Automatic Erase/Program algorithm
is in progress or complete. The RY/BY# status is valid
after the rising edge of the final WE# or CE#, whichever
happens first, in the command sequence. Since RY/BY#
is an open-drain output, several RY/BY# pins can be tied
together in parallel with a pull-up resistor to Vcc.
Q7: Data# Polling
The Data# Polling bit, Q7, indicates to the host sys-tem
whether an Automatic Algorithm is in progress or completed, or whether the device is in Erase Suspend. Data#
Polling is valid after the rising edge of the final WE# pulse
in the program or erase command sequence.
If the output is low (Busy), the device is actively erasing
or programming. (This includes programming in the Erase
Suspend mode.) If the output is high (Ready), the device is ready to read array data (including during the
Erase Suspend mode), or is in the standby mode.
During the Automatic Program algorithm, the device outputs on Q7 the complement of the datum programmed
to Q7. This Q7 status also applies to programming during Erase Suspend. When the Automatic Program algorithm is complete, the device outputs the datum programmed to Q7. The system must provide the program
address to read valid status information on Q7. If a program address falls within a protected sector, Data# Polling on Q7 is active for approximately 1 us, then the device returns to reading array data.
Table 7 shows the outputs for RY/BY# during write operation.
Q6:Toggle BIT I
Toggle Bit I on Q6 indicates whether an Automatic Program or Erase algorithm is in progress or complete, or
whether the device has entered the Erase Suspend mode.
Toggle Bit I may be read at any address, and is valid
after the rising edge of the final WE# or CE#, whichever
happens first, in the command sequence (prior to the
program or erase operation), and during the sector timeout.
During the Automatic Erase algorithm, Data# Polling produces a "0" on Q7. When the Automatic Erase algorithm is complete, or if the device enters the Erase Suspend mode, Data# Polling produces a "1" on Q7. This is
analogous to the complement/true datum out-put described for the Automatic Program algorithm: the erase
function changes all the bits in a sector to "1" prior to
this, the device outputs the "complement," or "0". The
system must provide an address within any of the sectors selected for erasure to read valid status information
on Q7.
During an Automatic Program or Erase algorithm operation, successive read cycles to any address cause Q6
to toggle. The system may use either OE# or CE# to
control the read cycles. When the operation is complete,
Q6 stops toggling.
After an erase command sequence is written, if all sectors selected for erasing are protected, Data# Polling on
Q7 is active for approximately 100 us, then the device
returns to reading array data. If not all selected sectors
are protected, the Automatic Erase algorithm erases the
unprotected sectors, and ignores the selected sectors
that are protected.
After an erase command sequence is written, if all sectors selected for erasing are protected, Q6 toggles and
returns to reading array data. If not all selected sectors
are protected, the Automatic Erase algorithm erases the
unprotected sectors, and ignores the selected sectors
that are protected.
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MX29LV004C T/B
The system can use Q6 and Q2 together to determine
whether a sector is actively erasing or is erase suspended. When the device is actively erasing (that is, the
Automatic Erase algorithm is in progress), Q6 toggling.
When the device enters the Erase Suspend mode, Q6
stops toggling. However, the system must also use Q2
to determine which sectors are erasing or erase-suspended. Alternatively, the system can use Q7.
pleted the program or erase operation. The system can
read array data on Q7-Q0 on the following read cycle.
However, if after the initial two read cycles, the system
determines that the toggle bit is still toggling, the system also should note whether the value of Q5 is high
(see the section on Q5). If it is, the system should then
determine again whether the toggle bit is toggling, since
the toggle bit may have stopped toggling just as Q5 went
high. If the toggle bit is no longer toggling, the device
has successfully completed the program or erase operation. If it is still toggling, the device did not complete
the operation successfully, and the system must write
the reset command to return to reading array data.
If a program address falls within a protected sector, Q6
toggles for approximately 2 us after the program command sequence is written, then returns to reading array
data.
Q6 also toggles during the erase-suspend-program mode,
and stops toggling once the Automatic Program algorithm is complete.
The remaining scenario is that system initially determines
that the toggle bit is toggling and Q5 has not gone high.
The system may continue to monitor the toggle bit and
Q5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In
this case, the system must start at the beginning of the
algorithm when it returns to determine the status of the
operation.
Table 7 shows the outputs for Toggle Bit I on Q6.
Q2:Toggle Bit II
The "Toggle Bit II" on Q2, when used with Q6, indicates
whether a particular sector is actively erasing (that is,
the Automatic Erase algorithm is in process), or whether
that sector is erase-suspended. Toggle Bit II is valid
after the rising edge of the final WE# or CE#, whichever
happens first, in the command sequence.
Q5
Exceeded Timing Limits
Q5 will indicate if the program or erase time has exceeded the specified limits (internal pulse count). Under
these conditions Q5 will produce a "1". This time-out
condition indicates that the program or erase cycle was
not successfully completed. Data# Polling and Toggle
Bit are the only operating functions of the device under
this condition.
Q2 toggles when the system reads at addresses within
those sectors that have been selected for erasure. (The
system may use either OE# or CE# to control the read
cycles.) But Q2 cannot distinguish whether the sector
is actively erasing or is erase-suspended. Q6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which
sectors are selected for erasure. Thus, both status bits
are required for sectors and mode information. Refer to
Table 7 to compare outputs for Q2 and Q6.
If this time-out condition occurs during sector erase operation, it specifies that a particular sector is bad and it
may not be reused. However, other sectors are still functional and may be used for the program or erase operation. The device must be reset to use other sectors.
Write the Reset command sequence to the device, and
then execute program or erase command sequence. This
allows the system to continue to use the other active
sectors in the device.
Reading Toggle Bits Q6/ Q2
Whenever the system initially begins reading toggle bit
status, it must read Q7-Q0 at least twice in a row to
determine whether a toggle bit is toggling. Typically, the
system would note and store the value of the toggle bit
after the first read. After the second read, the system
would compare the new value of the toggle bit with the
first. If the toggle bit is not toggling, the device has com-
If this time-out condition occurs during the chip erase
operation, it specifies that the entire chip is bad or combination of sectors are bad.
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MX29LV004C T/B
If this time-out condition occurs during the byte programming operation, it specifies that the entire sector containing that byte is bad and this sector maynot be reused, (other sectors are still functional and can be reused).
LOW VCC WRITE INHIBIT
When VCC is less than VLKO the device does not accept any write cycles. This protects data during VCC
power-up and power-down. The command register and
all internal program/erase circuits are disabled, and the
device resets. Subsequent writes are ignored until VCC
is greater than VLKO. The system must provide the proper
signals to the control pins to prevent unintentional write
when VCC is greater than VLKO.
The time-out condition will not appear if a user tries to
program a non blank location without erasing. Please
note that this is not a device failure condition since the
device was incorrectly used.
WRITE PULSE "GLITCH" PROTECTION
Q3
Sector Erase Timer
Noise pulses of less than 5ns(typical) on CE# or WE#
will not initiate a write cycle.
After the completion of the initial sector erase command
sequence, the sector erase time-out will begin. Q3 will
remain low until the time-out is complete. Data# Polling
and Toggle Bit are valid after the initial sector erase command sequence.
LOGICAL INHIBIT
Writing is inhibited by holding any one of OE# = VIL,
CE# = VIH or WE# = VIH. To initiate a write cycle CE#
and WE# must be a logical zero while OE# is a logical
one.
If Data# Polling or the Toggle Bit indicates the device has
been written with a valid erase command, Q3 may be
used to determine if the sector erase timer window is
still open. If Q3 is high ("1") the internally controlled
erase cycle has begun; attempts to write subsequent
commands to the device will be ignored until the erase
operation is completed as indicated by Data# Polling or
Toggle Bit. If Q3 is low ("0"), the device will accept
additional sector erase commands. To insure the command has been accepted, the system software should
check the status of Q3 prior to and following each subsequent sector erase command. If Q3 were high on the
second status check, the command may not have been
accepted.
POWER SUPPLY DECOUPLING
In order to reduce power switching effect, each device
should have a 0.1uF ceramic capacitor connected between its VCC and GND.
POWER-UP SEQUENCE
The MX29LV004C T/B powers up in the Read only mode.
In addition, the memory contents may only be altered
after successful completion of the predefined command
sequences.
DATA PROTECTION
The MX29LV004C T/B is designed to offer protection
against accidental erasure or programming caused by
spurious system level signals that may exist during power
transition. During power up the device automatically resets the state machine in the Read mode. In addition,
with its control register architecture, alteration of the
memory contents only occurs after successful completion of specific command sequences. The device also
incorporates several features to prevent inadvertent write
cycles resulting from VCC power-up and power-down transition or system noise.
TEMPORARY SECTOR UNPROTECT
This feature allows temporary unprotection of previously
protected sector to change data in-system. The Temporary Sector Unprotect mode is activated by setting the
RESET# pin to VID(11.5V-12.5V). During this mode, formerly protected sectors can be programmed or erased
as un-protected sector. Once VID is remove from the
RESET# pin, all the previously protected sectors are protected again.
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MX29LV004C T/B
SECTOR PROTECTION
The MX29LV004C T/B features hardware sector protection. This feature will disable both program and erase
operations for these sectors protected. To activate this
mode, the programming equipment must force VID on
address pin A9 and OE# (suggest VID = 12V). Programming of the protection circuitry begins on the falling edge
of the WE# pulse and is terminated on the rising edge.
Please refer to sector protect algorithm and waveform.
To verify programming of the protection circuitry, the programming equipment must force VID on address pin A9
( with CE# and OE# at VIL and WE# at VIH). When
A1=VIH, A0=VIL, A6=VIL, it will produce a logical "1"
code at device output Q0 for a protected sector. Otherwise the device will produce 00H for the unprotected sector. In this mode, the addresses, except for A1, are don't
care. Address locations with A1 = VIL are reserved to
read manufacturer and device codes. (Read Silicon ID)
It is also possible to determine if the sector is protected
in the system by writing a Read Silicon ID command.
Performing a read operation with A1=VIH, it will produce
a logical "1" at Q0 for the protected sector.
CHIP UNPROTECT
The MX29LV004C T/B also features the chip unprotect
mode, so that all sectors are unprotected after chip
unprotect is completed to incorporate any changes in the
code. It is recommended to protect all sectors before
activating chip unprotect mode.
To activate this mode, the programming equipment must
force VID on control pin OE# and address pin A9. The
CE# pins must be set at VIL. Pins A6 must be set to
VIH.(see Table 2) Refer to chip unprotect algorithm and
waveform for the chip unprotect algorithm. The
unprotection mechanism begins on the falling edge of the
WE# pulse and is terminated on the rising edge.
It is also possible to determine if the chip is unprotected
in the system by writing the Read Silicon ID command.
Performing a read operation with A1=VIH, it will produce
00H at data outputs(Q0-Q7) for an unprotected sector.
It is noted that all sectors are unprotected after the chip
unprotect algorithm is completed.
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MX29LV004C T/B
ABSOLUTE MAXIMUM RATINGS
OPERATING RATINGS
Storage Temperature
Plastic Packages . . . . . . . . . . . . . ..... -65oC to +150oC
Ambient Temperature
with Power Applied. . . . . . . . . . . . . .... -65oC to +125oC
Voltage with Respect to Ground
VCC (Note 1) . . . . . . . . . . . . . . . . . -0.5 V to +4.0 V
A9, OE#, and
RESET# (Note 2) . . . . . . . . . . . ....-0.5 V to +12.5 V
All other pins (Note 1) . . . . . . . -0.5 V to VCC +0.5 V
Output Short Circuit Current (Note 3) . . . . . . 200 mA
Commercial (C) Devices
Ambient Temperature (TA ). . . . . . . . . . . . 0°C to +70°C
Industrial (I) Devices
Ambient Temperature (TA ). . . . . . . . . . -40°C to +85°C
VCC Supply Voltages
VCC for regulated voltage range. . . . . . +3.0 V to 3.6 V
VCC for full voltage range. . . . . . . . . . . +2.7 V to 3.6 V
Operating ranges define those limits between which the
functionality of the device is guaranteed.
Notes:
1. Minimum DC voltage on input or I/O pins is -0.5 V.
During voltage transitions, input or I/O pins may overshoot VSS to -2.0 V for periods of up to 20 ns. Maximum DC voltage on input or I/O pins is VCC +0.5 V.
During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns.
2. Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During voltage transitions, A9, OE#,
and RESET# may overshoot VSS to -2.0 V for periods
of up to 20 ns. Maximum DC input voltage on pin A9 is
+12.5 V which may overshoot to 14.0 V for periods up
to 20 ns. The RESET# pin is provided for 40-pin TSOP
package type.
3. No more than one output may be shorted to ground at
a time. Duration of the short circuit should not be greater
than one second.
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device.
This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational sections of this data sheet is not
implied. Exposure of the device to absolute maximum
rating conditions for extended periods may affect device
reliability.
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Table 8. CAPACITANCE TA = 25oC, f = 1.0 MHz
SYMBOL
CIN1
CIN2
COUT
PARAMETER
MIN.
Input Capacitance
Control Pin Capacitance
Output Capacitance
TYP
MAX.
8
12
12
UNIT
pF
pF
pF
CONDITIONS
VIN = 0V
VIN = 0V
VOUT = 0V
Table 9. DC CHARACTERISTICS TA = -40oC to 85oC, VCC = 2.7V to 3.6V
Symbol
PARAMETER
ILI
MIN.
TYP
MAX.
UNIT
CONDITIONS
Input Leakage Current
±1
uA
VIN = VSS to VCC
ILIT
A9 Input Leakage Current
35
uA
VCC=VCC max; A9=12.5V
ILO
Output Leakage Current
±1
uA
VOUT = VSS to VCC, VCC=VCC max
ICC1
VCC Active Read Current
7
12
mA
CE#=VIL, OE#=VIH @5MHz
2
4
mA
@1MHz
ICC2
VCC Active write Current
15
30
mA
CE#=VIL, OE#=VIH
ICC3
VCC Standby Current
0.2
5
uA
CE#; RESET#=VCC ± 0.3V
(RESET# pin for 40-TSOP)
ICC4
VCC Standby Current
0.2
5
uA
During Reset
ICC5
Automatic sleep mode
VIL
Input Low Voltage(Note 1)
VIH
Input High Voltage
VID
Voltage for Automatic
Select and Temporary
RESET#=VSS ± 0.3V
(RESET# pin for 40-TSOP)
0.2
VIH=VCC ± 0.3V; VIL=VSS ± 0.3V
5
uA
-0.5
0.8
V
0.7xVCC
VCC+ 0.3
V
11.5
12.5
V
VCC=3.3V
0.45
V
IOL = 4.0mA, VCC= VCC min
Chip Unprotect
VOL
Output Low Voltage
VOH1
Output High Voltage(TTL)
VOH2
Output High Voltage
0.85xVCC
IOH = -2mA, VCC=VCC min
VCC-0.4
IOH = -100uA, VCC min
(CMOS)
VLKO
Low VCC Lock-Out Voltage
1.4
2.1
V
(Note 4)
NOTES:
1. VIL min. = -1.0V for pulse width is equal to or less than 50 ns.
VIL min. = -2.0V for pulse width is equal to or less than 20 ns.
2. VIH max. = VCC + 1.5V for pulse width is equal to or less than 20 ns
If VIH is over the specified maximum value, read operation cannot be guaranteed.
3. Automatic sleep mode enable the low power mode when addresses remain stable for tACC +30ns.
4. Not 100% tested.
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MX29LV004C T/B
AC CHARACTERISTICS
TA = -40oC to 85oC, VCC = 2.7V~3.6V (Restricted VCC=3.0V~3.6V for 45R/55R)
Table 10. READ OPERATIONS
Parameter
Speed Options
Std.
Description
45R
55R
70
90
Unit
tRC
Read Cycle Time (Note 1)
MIN.
45
55
70
90
ns
tACC
Address to Output Delay
CE#=OE#=VIL MAX.
45
55
70
90
ns
tCE
CE# to Output Delay
OE#=VIL
MAX.
45
55
70
90
ns
tOE
OE# to Output Delay
CE#=VIL
MAX.
30
30
30
35
ns
tDF
OE# High to Output Float (Note1)
CE#=VIL
MAX.
25
25
25
30
ns
tOEH
Output Enable
Read
MIN.
0
0
0
0
ns
Hold Time
Toggle and Data# Polling
MIN.
10
10
10
10
ns
CE#=OE#=VIL MIN.
0
0
0
0
ns
tOH
Test Setup
Address to Output hold
TEST CONDITIONS:
• Input pulse levels: 0V/3.0V.
• Input rise and fall times is equal to or less than 5ns.
• Output load: 1 TTL gate + 100pF (Including scope and jig), for 29LV004C T/B-90. 1 TTL gate + 30pF (Including scope
and jig) for 29LV004C T/B-70.
• Reference levels for measuring timing: 1.5V.
NOTE:
1. Not 100% tested.
2. tDF is defined as the time at which the output achieves the open circuit condition and data is no longer driven.
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MX29LV004C T/B
Figure 1. SWITCHING TEST CIRCUITS
DEVICE UNDER
TEST
2.7K ohm
+3.3V
CL
6.2K ohm
DIODES=IN3064
OR EQUIVALENT
CL=100pF Including jig capacitance
CL=30pF for MX29LV004T/B-70
Figure 2. SWITCHING TEST WAVEFORMS
3.0V
1.5V
1.5V
TEST POINTS
0V
INPUT
OUTPUT
AC TESTING: Inputs are driven at 3.0V for a logic "1" and 0V for a logic "0".
Input pulse rise and fall times are < 5ns.
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MX29LV004C T/B
Figure 3. READ TIMING WAVEFORMS
tRC
VIH
Addresses
ADD Valid
VIL
tACC
tCE
CE#
VIH
VIL
WE#
VIH
VIL
tOE
tOEH
tDF
VIH
OE#
VIL
tACC
Outputs
VOH
HIGH Z
tOH
DATA Valid
HIGH Z
VOL
VIH
RESET#
VIL
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MX29LV004C T/B
AC CHARACTERISTICS
TA = -40oC to 85oC, VCC = 2.7V~3.6V (Restricted VCC=3.0V~3.6V for 45R/55R)
Table 11. Erase/Program Operations
Parameter
Speed Options
Std.
Description
45R
55R
70
90
Unit
tWC
Write Cycle Time (Note 1)
MIN.
45
55
70
90
ns
tAS
Address Setup Time
MIN.
0
0
0
0
ns
tAH
Address Hold Time
MIN.
45
45
45
45
ns
tDS
Data Setup Time
MIN.
35
35
35
45
ns
tDH
Data Hold Time
MIN.
0
0
0
0
ns
tOES
Output Enable Setup Time
MIN.
0
0
0
0
ns
tGHWL
Read Recovery Time Before Write
MIN.
0
0
0
0
ns
(OE# High to WE# Low)
tCS
CE# Setup Time
MIN.
0
0
0
0
ns
tCH
CE# Hold Time
MIN.
0
0
0
0
ns
tWP
Write Pulse Width
MIN.
35
35
35
35
ns
tWPH
Write Pulse Width High
MIN.
30
30
30
30
ns
tWHWH1
Programming Operation (Note 2)
TYP.
9
9
9
9
us
(Byte program time)
tWHWH2
Sector Erase Operation (Note 2)
TYP.
0.7
0.7
0.7
0.7
sec
tVCS
VCC Setup Time (Note 1)
MIN.
50
50
50
50
us
tRB(Note3)
Recovery Time from RY/BY#
MIN.
0
0
0
0
ns
tBUSY
Program/Erase Vaild to RY/BY# Delay
MAX.
90
90
90
90
ns
Write pulse width for sector protect
MIN.
100
100
100
100
ns
(A9, OE# Control)
TYP.
10
10
10
10
us
Write pulse width for chip unprotect
MIN.
100
100
100
100
ns
(A9, OE# Control)
TYP.
12
12
12
12
ms
Sector Address Load Time
MAX.
50
50
50
50
us
(Note 3)
tWPP1
tWPP2
tBAL
NOTES:
1. Not 100% tested.
2. See the "Erase and Programming Performance" section for more information.
3. RY/BY# pin is provided for 40-TSOP.
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MX29LV004C T/B
AC CHARACTERISTICS
TA = -40oC to 85oC, VCC = 2.7V~3.6V (Restricted VCC=3.0V~3.6V for 45R/55R)
Table 12. Alternate CE# Controlled Erase/Program Operations
Parameter
Speed Options
Std.
Description
45R
55R
70
90
Unit
tWC
Write Cycle Time (Note 1)
MIN.
45
55
70
90
ns
tAS
Address Setup Time
MIN.
0
0
0
0
ns
tAH
Address Hold Time
MIN.
45
45
45
45
ns
tDS
Data Setup Time
MIN.
35
35
35
45
ns
tDH
Data Hold Time
MIN.
0
0
0
0
ns
tOES
Output Enable Setup Time
MIN.
0
0
0
0
ns
tGHEL
Read Recovery Time Before Write
MIN.
0
0
0
0
ns
tWS
WE# Setup Time
MIN.
0
0
0
0
ns
tWH
WE# Hold Time
MIN.
0
0
0
0
ns
tCP
CE# Pulse Width
MIN.
35
35
35
35
ns
tCPH
CE# Pulse Width High
MIN.
30
30
30
30
ns
tWHWH1
Programming Operation(note2)
TYP.
9
9
9
9
us
tWHWH2
Sector Erase Operation (note2)
TYP.
0.7
0.7
0.7
0.7
sec
NOTE:
1. Not 100% tested.
2. See the "Erase and Programming Performance" section for more information.
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MX29LV004C T/B
Figure 4. COMMAND WRITE TIMING WAVEFORM
VCC
Addresses
3V
VIH
ADD Valid
VIL
tAH
tAS
WE#
VIH
VIL
tOES
tWPH
tWP
tCWC
CE#
VIH
VIL
tCS
OE#
tCH
VIH
VIL
tDS
tDH
VIH
Data
DIN
VIL
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MX29LV004C T/B
AUTOMATIC PROGRAMMING TIMING WAVEFORM
after automatic programming starts. Device outputs
DATA# during programming and DATA after programming
on Q7.(Q6 is for toggle bit; see toggle bit, Data# Polling,
timing waveform)
One byte data is programmed. Verify in fast algorithm
and additional verification by external control are not required because these operations are executed automatically by internal control circuit. Programming completion
can be verified by Data# Polling and toggle bit checking
Figure 5. AUTOMATIC PROGRAMMING TIMING WAVEFORM
Program Command Sequence(last two cycle)
tWC
555h
Address
Read Status Data (last two cycle)
tAS
PA
PA
PA
tAH
CE#
tCH
tGHWL
OE#
tWHWH1
tWP
WE#
tCS
tWPH
tDS
tDH
A0h
Status
PD
DOUT
Data
tBUSY
tRB
RY/BY#
tVCS
VCC
NOTES:
1.PA=Program Address, PD=Program Data, DOUT is the true data the program address
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MX29LV004C T/B
Figure 6. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data A0H Address 555H
Write Program Data/Address
Data Poll
from system
Increment
Address
No
Verify Word Ok ?
YES
No
Last Address ?
YES
Auto Program Completed
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MX29LV004C T/B
Figure 7. CE# CONTROLLED PROGRAM TIMING WAVEFORM
555 for program
2AA for erase
PA for program
SA for sector erase
555 for chip erase
Data# Polling
Address
PA
tWC
tAS
tAH
tWH
WE#
tGHEL
OE#
tCP
tWHWH1 or 2
CE#
tCPH
tWS
tDS
tBUSY
tDH
Q7 DOUT
Data
tRH
A0 for program
55 for erase
PD for program
30 for sector erase
10 for chip erase
RESET#
RY/BY#
NOTES:
1.PA=Program Address, PD=Program Data, DOUT=Data Out, Q7=complement of data written to device.
2.Figure indicates the last two bus cycles of the command sequence.
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MX29LV004C T/B
AUTOMATIC CHIP ERASE TIMING WAVEFORM
All data in chip are erased. External erase verification is
not required because data is verified automatically by
internal control circuit. Erasure completion can be verified by Data# Polling and toggle bit checking after auto-
matic erase starts. Device outputs 0 during erasure
and 1 after erasure on Q7. (Q6 is for toggle bit; see toggle
bit, Data# Polling, timing waveform)
Figure 8. AUTOMATIC CHIP ERASE TIMING WAVEFORM
Erase Command Sequence(last two cycle)
tWC
2AAh
Address
Read Status Data
tAS
VA
555h
VA
tAH
CE#
tCH
tGHWL
OE#
tWHWH2
tWP
WE#
tCS
tWPH
tDS
tDH
55h
In
Progress Complete
10h
Data
tBUSY
tRB
RY/BY#
tVCS
VCC
NOTES:
SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status").
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MX29LV004C T/B
Figure 9. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 80H Address 555H
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 10H Address 555H
Data Pall from System
NO
Data=FFh ?
YES
Auto Chip Erase Completed
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MX29LV004C T/B
AUTOMATIC SECTOR ERASE TIMING WAVEFORM
Sector indicated by A12 to A17 are erased. External
erase verify is not required because data are verified
automatically by internal control circuit. Erasure completion can be verified by Data# Polling and toggle bit check-
ing after automatic erase starts. Device outputs 0 during erasure and 1 after erasure on Q7.(Q6 is for toggle
bit; see toggle bit, Data# Polling, timing waveform)
Figure 10. AUTOMATIC SECTOR ERASE TIMING WAVEFORM
Erase Command Sequence(last two cycle)
tWC
Sector
Address 0
2AAh
Address
Read Status Data
tAS
Sector
Address 1
Sector
Address n
VA
VA
tAH
CE#
tCH
tGHWL
OE#
WE#
tCS
tWHWH2
tBAL
tWP
tWPH
tDS tDH
55h
30h
30h
30h
In
Progress Complete
Data
tBUSY
tRB
RY/BY#
tVCS
VCC
NOTES:
SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status").
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MX29LV004C T/B
Figure 11. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 80H Address 555H
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 30H Sector Address
Last Sector
to Erase
NO
YES
Data Poll from System
Data=FFh
NO
YES
Auto Sector Erase Completed
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MX29LV004C T/B
Figure 12. ERASE SUSPEND/ERASE RESUME FLOWCHART
START
Write Data B0H
ERASE SUSPEND
NO
Toggle Bit checking Q6
not toggled
YES
Read Array or
Program
Reading or
Programming End
NO
YES
Write Data 30H
Delay at least
400us (note)
ERASE RESUME
Continue Erase
Another
Erase Suspend ?
NO
YES
Note: Repeatedly suspending the device more often may have undetermined effects.
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MX29LV004C T/B
Figure 13. IN-SYSTEM SECTOR PROTECT/UNPROTECT TIMING WAVEFORM (RESET# Control)
VID
VIH
RESET#
SA, A6
A1, A0
Valid*
Valid*
Sector Protect or Sector Unprotect
Data
60h
1us
60h
Valid*
Verify
40h
Status
Sector Protect =150us
Sector Unprotect =15ms
CE#
WE#
OE#
Note: When sector protect, A6=0, A1=1, A0=0. When sector unprotect, A6=1, A1=1, A0=0.
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MX29LV004C T/B
Figure 14. IN-SYSTEM SECTOR PROTECTION ALGORITHM WITH RESET#=VID
START
PLSCNT=1
RESET#=VID
Wait 1us
First Write
Cycle=60H
No
Temporary Sector
Unprotect Mode
Yes
Set up sector address
Write 60H to sector address
with A6=0, A1=1, A0=0
Wait 150us
Verify sector protect :
write 40H with A6=0,
A1=1, A0=0
Increment PLSCNT
Reset PLSCNT=1
Read from sector address
No
PLSCNT=25?
No
Data=01H ?
Yes
Device failed
Yes
Protect another
sector?
Yes
No
Remove VID from RESET#
Write reset command
Sector protect complete
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MX29LV004C T/B
Figure 15. SECTOR PROTECT TIMING WAVEFORM (A9, OE# Control)
A1
A6
12V
3V
A9
tVLHT
Verify
12V
3V
OE#
tVLHT
tVLHT
tWPP 1
WE#
tOESP
CE#
Data
01H
F0H
tOE
A18-A12
Sector Address
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MX29LV004C T/B
Figure 16. SECTOR PROTECTION ALGORITHM (A9, OE# Control)
START
Set Up Sector Addr
PLSCNT=1
OE#=VID, A9=VID, CE#=VIL
A6=VIL
Activate WE# Pulse
Time Out 150us
Set WE#=VIH, CE#=OE#=VIL
A9 should remain VID
Read from Sector
Addr=SA, A1=1
No
PLSCNT=32?
No
Data=01H?
Yes
Device Failed
Protect Another
Sector?
Yes
Remove VID from A9
Write Reset Command
Sector Protection
Complete
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MX29LV004C T/B
Figure 17. IN-SYSTEM SECTOR UNPROTECTION ALGORITHM WITH RESET#=VID
START
PLSCNT=1
RESET#=VID
Wait 1us
First Write
Cycle=60H ?
No
Temporary Sector
Unprotect Mode
Yes
All sector
protected?
No
Protect all sectors
Yes
Set up first sector address
Chip unprotect :
write 60H with
A6=1, A1=1, A0=0
Wait 50ms
Verify chip unprotect
write 40H to sector address
Increment PLSCNT
with A6=1, A1=1, A0=0
Read from sector address
with A6=1, A1=1, A0=0
No
PLSCNT=1000?
No
Yes
Device failed
Set up next sector address
Data=00H ?
Yes
Last sector
verified?
Yes
No
Remove VID from RESET#
Write reset command
Chip unprotect complete
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MX29LV004C T/B
Figure 18. TIMING WAVEFORM FOR CHIP UNPROTECTION (A9, OE# Control)
A1
12V
3V
A9
tVLHT
A6
Verify
12V
3V
OE#
tVLHT
tVLHT
tWPP 2
time out 50ms
WE#
tOESP
CE#
Data
00H
F0H
tOE
A18-A12
Sector Address
Notes: tWPP1 (Write pulse width for sector protect)=100ns min, 10us(typ.).
tWPP2 (Write pulse width for chip unprotect)=100ns min, 12ms(typ).
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MX29LV004C T/B
Figure 19. CHIP UNPROTECTION ALGORITHM (A9, OE# Control)
START
Protect All Sectors
PLSCNT=1
Set OE#=A9=VID
CE#=VIL, A6=1
Activate WE# Pulse
Time Out 50ms
Increment
PLSCNT
Set OE#=CE#=VIL
A9=VID,A1=1
Set Up First Sector Addr
Read Data from Device
No
Data=00H?
Increment
Sector Addr
No
PLSCNT=1000?
Yes
Yes
No
All sectors have
been verified?
Device Failed
Yes
Remove VID from A9
Write Reset Command
Chip Unprotect
Complete
* It is recommended before unprotect whole chip, all sectors should be protected in advance.
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MX29LV004C T/B
WRITE OPERATION STATUS
Figure 20. DATA# POLLING ALGORITHM
Start
Read Q7~Q0
Add.=VA(1)
Yes
Q7 = Data ?
No
No
Q5 = 1 ?
Yes
Read Q7~Q0
Add.=VA
Yes
Q7 = Data ?
(2)
No
FAIL
Pass
NOTE : 1.VA=Valid address for programming
2.Q7 should be re-checked even Q5="1" because Q7 may change
simultaneously with Q5.
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MX29LV004C T/B
Figure 21. TOGGLE BIT ALGORITHM
Start
Read Q7-Q0
Read Q7-Q0
(Note 1)
NO
Toggle Bit Q6 =
Toggle ?
YES
NO
Q5= 1?
YES
Read Q7~Q0 Twice
(Note 1,2)
Toggle bit Q6=
Toggle?
NO
YES
Program/Erase Operation
Not Complete,Write
Reset Command
Program/Erase
operation Complete
Note:1.Read toggle bit twice to determine whether or not it is toggling.
2. Recheck toggle bit because it may stop toggling as Q5 change to "1".
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MX29LV004C T/B
Figure 22. DATA# POLLING TIMINGS (DURING AUTOMATIC ALGORITHMS)
tRC
Address
VA
VA
VA
tACC
tCE
CE#
tCH
tOE
OE#
tOEH
tDF
WE#
tOH
Q7
Complement
Complement
True
Valid Data
Q0-Q6
Status Data
Status Data
True
Valid Data
High Z
High Z
tBUSY
RY/BY#
NOTES:
1. VA=Valid address. Figure shows are first status cycle after command sequence, last status read cycle, and array data read cycle.
2. CE# must be toggled when DATA# polling.
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MX29LV004C T/B
Figure 23. TOGGLE BIT TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)
tRC
VA
VA
Address
VA
VA
tACC
tCE
CE#
tCH
tOE
OE#
tDF
tOEH
WE#
tOH
High Z
Q6/Q2
Valid Status
(first read)
Valid Status
Valid Data
(second read)
(stops toggling)
Valid Data
tBUSY
RY/BY#
NOTES:
1. VA=Valid address; not required for Q6. Figure shows first two status cycle after command sequence, last status read cycle,
and array data read cycle.
2. CE# must be toggled when toggle bit toggling.
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MX29LV004C T/B
Table 13. AC CHARACTERISTICS (for 40-pin TSOP package type)
Parameter Std
Description
Test Setup All Speed Options Unit
tREADY1
RESET# PIN Low (During Automatic Algorithms)
MAX
20
us
MAX
500
ns
to Read or Write (See Note)
tREADY2
RESET# PIN Low (NOT During Automatic
Algorithms) to Read or Write (See Note)
tRP
RESET# Pulse Width (During Automatic Algorithms)
MIN
500
ns
tRH
RESET# High Time Before Read (See Note)
MIN
50
ns
tRB
RY/BY# Recovery Time(to CE#, OE# go low)
MIN
0
ns
Note:Not 100% tested
Figure 24. RESET# TIMING WAVEFORM (for 40-pin TSOP package type)
RY/BY#
CE#, OE#
tRH
RESET#
tRP
tREADY2
Reset Timing NOT during Automatic Algorithms
tREADY1
RY/BY#
tRB
CE#, OE#
RESET#
tRP
Reset Timing during Automatic Algorithms
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MX29LV004C T/B
Table 14. TEMPORARY SECTOR UNPROTECT
Parameter Std. Description
Test Setup All Speed Options Unit
tVIDR
VID Rise and Fall Time (See Note)
Min
500
ns
tRSP
RESET# Setup Time for Temporary Sector Unprotect
Min
4
us
Note:
Not 100% tested
Figure 25. TEMPORARY SECTOR UNPROTECT TIMING DIAGRAM
12V
RESET#
0 or Vcc
0 or Vcc
Program or Erase Command Sequence
tVIDR
tVIDR
CE#
WE#
tRSP
RY/BY#
Figure 26. Q6 vs Q2 for Erase and Erase Suspend Operations
Enter Embedded
Erasing
Erase
Suspend
Enter Erase
Suspend Program
Erase
WE#
Erase
Resume
Erase
Suspend
Program
Erase Suspend
Read
Erase
Erase
Complete
Q6
Q2
NOTES:
The system can use OE# or CE# to toggle Q2/Q6, Q2 toggles only when read at an address within an erase-suspended
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MX29LV004C T/B
Figure 27. TEMPORARY SECTOR UNPROTECT ALGORITHM
Start
RESET# = VID (Note 1)
Perform Erase or Program Operation
Operation Completed
RESET# = VIH
Temporary Sector Unprotect Completed(Note 2)
Note :
1. All protected sectors are temporary unprotected.
VID=11.5V~12.5V
2. All previously protected sectors are protected again.
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MX29LV004C T/B
Figure 28. ID CODE READ TIMING WAVEFORM
VCC
3V
ADD
VID
VIH
A9
VIL
ADD
A0
VIH
VIL
tACC
tACC
VIH
A1
VIL
ADD
A2-A8
A10-A18
CE#
VIH
VIL
VIH
VIL
WE#
VIH
tCE
VIL
OE#
VIH
tOE
VIL
tDF
tOH
tOH
VIH
DATA
Q0-Q7
DATA OUT
DATA OUT
C2H
B5H/B6H
VIL
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MX29LV004C T/B
RECOMMENDED OPERATING CONDITIONS
At Device Power-Up
AC timing illustrated in Figure A is recommended for the supply voltages and the control signals at device power-up.
If the timing in the figure is ignored, the device may not operate correctly.
VCC(min)
VCC
GND
tVR
tACC
tR or tF
VIH
ADDRESS
tR or tF
Valid
Address
VIL
tF
tCE
tR
VIH
CE#
VIL
VIH
WE#
VIL
tF
tOE
tR
VIH
OE#
VIL
VIH
WP#/ACC
VIL
VOH
DATA
High Z
Valid
Ouput
VOL
Figure A. AC Timing at Device Power-Up
Symbol
Parameter
tVR
VCC Rise Time
tR
Input Signal Rise Time
tF
Input Signal Fall Time
Notes
Min.
Max.
Unit
1
20
500000
us/V
1,2
20
us/V
1,2
20
us/V
Notes :
1. Sampled, not 100% tested.
2. This specification is applied for not only the device power-up but also the normal operations.
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MX29LV004C T/B
Table 15. ERASE AND PROGRAMMING PERFORMANCE(1)
LIMITS
PARAMETER
MIN.
TYP.(2)
MAX.(3)
UNIT
0.7
15
sec
Chip Erase Time
4
32
sec
Byte Programming Time
9
300
us
Chip Programming Time
4.5
13.5
sec
Sector Erase Time
Erase/Program Cycles
Note:
100,000
Cycles
1.Not 100% Tested, Excludes external system level over head.
2.Typical values measured at 25°C, 3V.
3.Maximum values measured at 25°C, 2.7V.
Table 16. LATCH-UP CHARACTERISTICS
MIN.
MAX.
Input Voltage with respect to GND on all pins except I/O pins
-1.0V
12.5V
Input Voltage with respect to GND on all I/O pins
-1.0V
VCC + 1.0V
-100mA
+100mA
Test Conditions
Min
Unit
150°C
10
Years
125°C
20
Years
Current
Includes all pins except VCC. Test conditions: VCC = 3.0V, one pin at a time.
Table 17. DATA RETENTION
Parameter Description
Data Retention Time
P/N:PM1148
REV. 1.3, APR. 24, 2006
50
MX29LV004C T/B
QUERY COMMAND AND COMMON FLASH
described in Table 18.
INTERFACE (CFI) MODE ( for MX29LV004CT/
CB)
The single cycle Query command is valid only when the
device is in the Read mode, including Erase Suspend,
Standby mode, and Read ID mode; however, it is ignored
otherwise.
MX29LV004CT/CB is capable of operating in the CFI
mode. This mode all the host system to determine the
manufacturer of the device such as operating parameters and configuration. Two commands are required in
CFI mode. Query command of CFI mode is placed first,
then the Reset command exits CFI mode. These are
The Reset command exits from the CFI mode to the
Read mode, or Erase Suspend mode, or read ID mode.
The command is valid only when the device is in the CFI
mode.
TABLE 18-1. CFI mode: Identification Data Values
(All values in these tables are in hexadecimal)
Description
Query-unique ASCII string "QRY"
Primary vendor command set and control interface ID code
Address for primary algorithm extended query table
Alternate vendor command set and control interface ID code (none)
Address for secondary algorithm extended query table (none)
Address
(Byte Mode)
20
22
24
26
28
2A
2C
2E
30
32
34
Data
0051
0052
0059
0002
0000
0040
0000
0000
0000
0000
0000
TABLE 18-2. CFI Mode: System Interface Data Values
(All values in these tables are in hexadecimal)
Description
VCC supply, minimum (2.7V)
VCC supply, maximum (3.6V)
VPP supply, minimum (none)
VPP supply, maximum (none)
Typical timeout for single word/byte write (2N us)
Typical timeout for Minimum size buffer write (2N us)
Typical timeout for individual block erase (2N ms)
Typical timeout for full chip erase (2N ms)
Maximum timeout for single word/byte write times (2N X Typ)
Maximum timeout for buffer write times (2N X Typ)
Maximum timeout for individual block erase times (2N X Typ)
Maximum timeout for full chip erase times (not supported)
P/N:PM1148
Address
(Byte Mode)
36
38
3A
3C
3E
40
42
44
46
48
4A
4C
Data
0027
0036
0000
0000
0004
0000
000A
0000
0005
0000
0004
0000
REV. 1.3, APR. 24, 2006
51
MX29LV004C T/B
TABLE 18-3. CFI Mode: Device Geometry Data Values
(All values in these tables are in hexadecimal)
Description
Device size (2N bytes)
Flash device interface code (refer to the CFI publication 100)
Maximum number of bytes in multi-byte write (not supported)
Number of erase block regions
Erase block region 1 information (refer to the CFI publication 100)
Erase block region 2 information
Erase block region 3 information
Erase block region 4 information
Address
(Byte Mode)
4E
50
52
54
56
58
5A
5C
5E
60
62
64
66
68
6A
6C
6E
70
72
74
76
78
Data
0013
0000
0000
0000
0000
0004
0000
0000
0040
0000
0001
0000
0020
0000
0000
0000
0080
0000
0006
0000
0000
0001
TABLE 18-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values
(All values in these tables are in hexadecimal)
Description
Query-unique ASCII string "PRI"
Major version number, ASCII
Minor version number, ASCII
Address sensitive unlock (0=required, 1= not required)
Erase suspend (2= to read and write)
Sector protect (N= # of sectors/group)
Temporary sector unprotected (1=supported)
Sector protect/unprotected scheme
Simultaneous R/W operation (0=not supported)
Burst mode type (0=not supported)
Page mode type (0=not supported)
P/N:PM1148
Address
(Byte Mode)
80
82
84
86
88
8A
8C
8E
90
92
94
96
98
Data
0050
0052
0049
0031
0030
0000
0002
0001
0001
0004
0000
0000
0000
REV. 1.3, APR. 24, 2006
52
MX29LV004C T/B
ORDERING INFORMATION
PART NO.
Access Time
Operating Current Standby Current
PACKAGE
Remark
(ns)
MAX. (mA)
MAX. (uA)
MX29LV004CTTC-55R
55
30
5
40 Pin TSOP
MX29LV004CBTC-55R
55
30
5
40 Pin TSOP
MX29LV004CTTC-70
70
30
5
40 Pin TSOP
MX29LV004CBTC-70
70
30
5
40 Pin TSOP
MX29LV004CTTC-90
90
30
5
40 Pin TSOP
MX29LV004CBTC-90
90
30
5
40 Pin TSOP
MX29LV004CTTI-55R
55
30
5
40 Pin TSOP
MX29LV004CBTI-55R
55
30
5
40 Pin TSOP
MX29LV004CTTI-70
70
30
5
40 Pin TSOP
MX29LV004CBTI-70
70
30
5
40 Pin TSOP
MX29LV004CTTI-90
90
30
5
40 Pin TSOP
MX29LV004CBTI-90
90
30
5
40 Pin TSOP
MX29LV004CTQC-55R
55
30
5
32 Pin PLCC
MX29LV004CBQC-55R
55
30
5
32 Pin PLCC
MX29LV004CTQC-70
70
30
5
32 Pin PLCC
MX29LV004CBQC-70
70
30
5
32 Pin PLCC
MX29LV004CTQC-90
70
30
5
32 Pin PLCC
MX29LV004CBQC-90
70
30
5
32 Pin PLCC
MX29LV004CTQI-55R
55
30
5
32 Pin PLCC
MX29LV004CBQI-55R
55
30
5
32 Pin PLCC
MX29LV004CTQI-70
70
30
5
32 Pin PLCC
MX29LV004CBQI-70
70
30
5
32 Pin PLCC
MX29LV004CTQI-90
70
30
5
32 Pin PLCC
MX29LV004CBQI-90
70
30
5
32 Pin PLCC
MX29LV004CTTC-55Q
55
30
5
40 Pin TSOP
PB free
MX29LV004CBTC-55Q
55
30
5
40 Pin TSOP
PB free
MX29LV004CTTC-70G
70
30
5
40 Pin TSOP
PB free
MX29LV004CBTC-70G
70
30
5
40 Pin TSOP
PB free
MX29LV004CTTC-90G
90
30
5
40 Pin TSOP
PB free
MX29LV004CBTC-90G
90
30
5
40 Pin TSOP
PB free
MX29LV004CTTI-55Q
55
30
5
40 Pin TSOP
PB free
MX29LV004CBTI-55Q
55
30
5
40 Pin TSOP
PB free
MX29LV004CTTI-70G
70
30
5
40 Pin TSOP
PB free
MX29LV004CBTI-70G
70
30
5
40 Pin TSOP
PB free
MX29LV004CTTI-90G
90
30
5
40 Pin TSOP
PB free
MX29LV004CBTI-90G
90
30
5
40 Pin TSOP
PB free
P/N:PM1148
REV. 1.3, APR. 24, 2006
53
MX29LV004C T/B
PART NO.
Access Time
Operating Current Standby Current
PACKAGE
Remark
(ns)
MAX. (mA)
MAX. (uA)
MX29LV004CTQC-55Q
55
30
5
32 Pin PLCC
PB free
MX29LV004CBQC-55Q
55
30
5
32 Pin PLCC
PB free
MX29LV004CTQC-70G
70
30
5
32 Pin PLCC
PB free
MX29LV004CBQC-70G
70
30
5
32 Pin PLCC
PB free
MX29LV004CTQC-90G
90
30
5
32 Pin PLCC
PB free
MX29LV004CBQC-90G
90
30
5
32 Pin PLCC
PB free
MX29LV004CTQI-55Q
55
30
5
32 Pin PLCC
PB free
MX29LV004CBQI-55Q
55
30
5
32 Pin PLCC
PB free
MX29LV004CTQI-70G
70
30
5
32 Pin PLCC
PB free
MX29LV004CBQI-70G
70
30
5
32 Pin PLCC
PB free
MX29LV004CTQI-90G
90
30
5
32 Pin PLCC
PB free
MX29LV004CBQI-90G
90
30
5
32 Pin PLCC
PB free
MX29LV004CTTI-45Q
45
30
5
40 Pin TSOP
PB free
MX29LV004CBTI-45Q
45
30
5
40 Pin TSOP
PB free
P/N:PM1148
REV. 1.3, APR. 24, 2006
54
MX29LV004C T/B
PART NAME DESCRIPTION
MX 29
LV 004 C T T C
70 G
OPTION:
G: Lead-free package
R: Restricted VCC (3.0V~3.6V)
Q: Restricted VCC (3.0V~3.6V) with Lead-free package
SPEED:
45: 45ns
55: 55ns
70: 70ns
90: 90ns
TEMPERATURE RANGE:
C: Commercial (0˚C to 70˚C)
I: Industrial (-40˚C to 85˚C)
PACKAGE:
Q: PLCC
T: TSOP
BOOT BLOCK TYPE:
T: Top Boot
B: Bottom Boot
REVISION:
C
DENSITY & MODE:
004: 4M, x8 Boot Block
TYPE:
L, LV: 3V
DEVICE:
29:Flash
P/N:PM1148
REV. 1.3, APR. 24, 2006
55
MX29LV004C T/B
PACKAGE INFORMATION
P/N:PM1148
REV. 1.3, APR. 24, 2006
56
MX29LV004C T/B
P/N:PM1148
REV. 1.3, APR. 24, 2006
57
MX29LV004C T/B
REVISION HISTORY
Revision No. Description
1.0
1. Removed "Preliminary"
2. Added "Recommended Operating Conditions"
1.1
1. Modified "Low power consumption--active current" from 20mA(Max.)
to 30mA(Max.)
2. Added description about Pb-free devices are RoHS Compliant
1.2
1. Modified Erase Resume from delay 10ms to delay 400us
1.3
1. Modified table 18. CFI mode
2. Added access time:45Rns
3. Added VLKO description
P/N:PM1148
Page
P1
P49
P1
P1
P13,33
P51,52
All
P16,19
Date
JUN/30/2005
AUG/30/2005
JAN/17/2006
APR/24/2006
REV. 1.3, APR. 24, 2006
58
MX29LV004C T/B
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TEL:+886-3-578-6688
FAX:+886-3-563-2888
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TEL:+32-2-456-8020
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http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.