DATASHEET AX-SIGFOX Ultra-Low Power, AT Command Controlled, Sigfox Compliant Transceiver IC for Up-Link and Down-Link Revision 2 2 Table of Contents 1. Overview .................................................................................................................. 4 1.1. Circuit description ....................................................................................................... 4 1.2. Features .................................................................................................................... 4 1.3. Applications ............................................................................................................... 5 2. Block Diagram .......................................................................................................... 6 3. Pin Function Descriptions ......................................................................................... 7 3.1. Pinout Drawing ........................................................................................................... 9 4. Specifications ......................................................................................................... 10 4.1. Absolute Maximum Ratings ......................................................................................... 10 4.2. DC Characteristics ..................................................................................................... 11 Supplies .................................................................................................................... 11 Typical Current Waveform ........................................................................................... 12 Battery Life Examples ................................................................................................. 13 Logic ........................................................................................................................ 14 4.3. AC Characteristics ...................................................................................................... 14 TCXO Reference Input ................................................................................................ 14 Transmitter ............................................................................................................... 15 Receiver.................................................................................................................... 16 ADC / Temperature Sensor .......................................................................................... 16 5. Command Interface ............................................................................................... 17 5.1. Serial Parameters: 9600,8,N,1 .................................................................................... 17 5.2. Power Modes ............................................................................................................. 17 Standby .................................................................................................................... 17 Sleep ........................................................................................................................ 17 Deep Sleep................................................................................................................ 17 5.3. AT Commands ........................................................................................................... 18 Numerical Syntax ....................................................................................................... 18 Command Syntax....................................................................................................... 18 www.onsemi.com AX-SIGFOX/D Table of Contents Return Codes ............................................................................................................. 18 Examples .................................................................................................................. 18 Commands ................................................................................................................ 19 Registers................................................................................................................... 24 6. Application Information ......................................................................................... 25 6.1. Typical Application Diagrams ....................................................................................... 25 Typical Sigfox Application Diagram ............................................................................... 25 7. QFN40 Package Information .................................................................................. 26 7.1. Package Outline QFN40 5x7mm ................................................................................... 26 7.2. QFN40 Soldering Profile .............................................................................................. 27 7.3. QFN40 Recommended Pad Layout ................................................................................ 28 7.4. Assembly Process ...................................................................................................... 28 Stencil Design & Solder Paste Application ...................................................................... 28 8. Device Versions ...................................................................................................... 30 www.onsemi.com AX-SIGFOX/D 3 4 Table of Contents (1V or 10V range) or single ended (1V range) with 10 bit resolution 1. Overview o 1.1. Circuit description 2 GPIO pins with selectable sigma delta DAC output functionality o 2 GPIO pins with selectable output clock AX-Sigfox is an ultra-low power single o 3 GPIO pins selectable as SPI master interface o Integrated RX/TX switching with differential antenna pins chip solution for a node on the Sigfox network with both up- and down-link functionality. The AX-Sigfox chip is delivered fully ready for operation and contains all the necessary firmware to transmit and receive data from the Sigfox network in Europe. It connects to the customer product using a logic level RS232 UART. AT commands are used to send frames and configure radio parameters. Power Consumption Features 1.2. Ultra-low power consumption: • o Charge required to send a Sigfox OOB packet at 14dBm output power: 0.28 C o Deepsleep mode current: 100 nA o Sleep mode current: 1.3 μA o Standby mode current: 0.5 mA o Continuous radio RX-mode at 869.525 MHz : 10 mA o Continuous radio TX-mode at 868.130 MHz 19 mA @ 0 dBm 49 mA @ 14 dBm Functionality and Ecosystem Sigfox up-link and down-link functionality controlled by AT commands • The AX-Sigfox IC is part of a whole development and product ecosystem available from AXSEM for any Sigfox requirement. Other parts of the ecosystem include • o Sigfox Ready certified reference design for the AX-Sigfox IC o PIOX by AXSEM Sigfox modules with SMA connector or chip antenna Receiver • Ready to go AX-Sigfox development kit with fully functional AX-Sigfox module including Sigfox subscription o o High performance narrow-band Sigfox RF transceiver o Carrier frequency 869.525 MHz o Data-rate 600 bps o o 0 dBm maximum input power Transmitter • AX-Sigfox-API IC for customers wishing to write their own application software based on the AXSEM Sigfox Library Sensitivity -126 dBm @ 600bps, 869.525MHz, GFSK o Carrier frequency 868.13 MHz o Data-rate 100 bps o High efficiency, high linearity integrated power amplifier o Maximum output power 14 dBm o Power level programmable in 1dBm steps General Features QFN40 4mm x 5mm package • • Supply range 1.8V - 3.6V • -40°C to 85°C • Temperature sensor • Supply voltage measurements • 10 GPIO pins o 4 GPIO pins with selectable voltage measure functionality, differential www.onsemi.com AX-SIGFOX/D Overview 1.3. Applications Sigfox networks up-link and down-link. Sigfox and Sigfox Ready are registered trademarks of Sigfox SARL. www.onsemi.com AX-SIGFOX/D 5 Block Diagram 2. Block Diagram AX-Sigfox CLKP CLKN ANTP ANTN TCXO interface RF synthesis Receive RX/TX switch and antenna interface UARTRX UARTTX Communication controller Transmit UART DAC GPIO[9:0] GPIO CPU ADC RADIO_LED CPU_LED TX_LED dedicated status outputs RX_LED power mode control RAM Program memory (FLASH) RESET_N VTCXO VDD_ANA GND Sigfox application VDD_IO 6 Figure 1 Functional block diagram of the AX-Sigfox www.onsemi.com AX-SIGFOX/D Pin Function Descriptions 3. Pin Function Descriptions Symbol Pin(s) VDD_ANA 1 GND ANTP Type Description P Analog power output, decouple to neighboring GND 2 P Ground, decouple to neighboring VDD_ANA 3 A Differential antenna input/output ANTN 4 A Differential antenna input/output NC 5 N Do not connect GND 6 P Ground, decouple to neighboring VDD_ANA VDD_ANA 7 P Analog power output, decouple to neighboring GND GND 8 P Ground FILT 9 A Synthesizer filter NC 10 A Must be connected to pin 11 NC 11 A Must be connected to pin 10 NC 12 N Do not connect GPIO8 13 I/O/PU General purpose IO GPIO7 14 I/O/PU General purpose IO, selectable SPI functionality (MISO) GPIO6 15 I/O/PU General purpose IO, selectable SPI functionality (MOSI) GPIO5 16 I/O/PU General purpose IO, selectable SPI functionality (SCK) GPIO4 17 I/O/PU General purpose IO, selectable Σ∆ DAC functionality, selectable clock functionality CPU_LED 18 O CPU activity indicator RADIO_LED 19 O Radio activity indicator VTCXO 20 O TCXO power GPIO9 21 I/O/PU UARTTX 22 O UARTRX 23 I/PU RX_LED 24 O TX_LED 25 O Transmit activity indicator NC 26 PD Do not connect RESET_N 27 I/PU General purpose IO, wakeup from deep sleep UART transmit UART receive Receive activity indicator Optional reset pin Internal pull-up resistor is permanently enabled, nevertheless it is recommended to connect this pin to VDD_IO if it is not used. GND 28 P Ground VDD_IO 29 P Unregulated power supply GPIO0 30 I/O/A/PU General purpose IO, selectable ADC functionality, selectable Σ∆ DAC functionality, selectable clock functionality GPIO1 31 I/O/A/PU General purpose IO, selectable ADC functionality GPIO2 32 I/O/A/PU General purpose IO, selectable ADC functionality NC 33 N Do not connect NC 34 N Do not connect www.onsemi.com AX-SIGFOX/D 7 8 Pin Function Descriptions Symbol Pin(s) Type Description GPIO3 35 I/O/A/PU VDD_IO 36 P Unregulated power supply NC 37 N Connect to Ground NC 38 N Connect to Ground CLKN 39 A TCXO interface CLKP 40 A TCXO interface GND Center pad P Ground on center pad of QFN, must be connected A = I = O = PU = General purpose IO, selectable ADC functionality analog signal digital input signal digital output signal pull-up I/O N P PD = = = = digital input/output signal not to be connected power or ground pull-down All digital inputs are Schmitt trigger inputs, digital input and output levels are LVCMOS/LVTTL compatible. Pins GPIO[3:0] must not be driven above VDD_IO, all other digital inputs are 5V tolerant. All GPIO pins and UARTRX start up as input with pull-up. Pin Possible GPIO modes GPIO0 0,1,Z,U,A,T GPIO1 0,1,Z,U,A GPIO2 0,1,Z,U,A GPIO3 0,1,Z,U,A GPIO4 0,1,Z,U,T GPIO5 0,1,Z,U GPIO0 0,1,Z,U GPIO1 0,1,Z,U GPIO2 0,1,Z,U GPIO3 0,1,Z,U 0 1 Z U A T = = = = = = pin drives not to be connected pin is high impedance input pin is input with pull-up pin is analog input pin is driven by clock or DAC www.onsemi.com AX-SIGFOX/D Pin Function Descriptions CLK16P CLK16N NC NC VDD_IO GPIO3 NC NC GPIO2 GPIO1 GPIO0 VDD_IO 3.1. Pinout Drawing 40 39 38 37 36 35 34 33 32 31 30 29 VDD_ANA 1 28 GND GND 2 27 RESET_N ANTP 3 26 NC ANTN 4 25 TXLED NC 5 24 RXLED GND 6 23 UARTRX VDD_ANA 7 22 UARTTX GND 8 21 GPIO9 16 17 18 19 20 TX_LED VTCXO NC 15 CPU_LED NC 14 GPIO4 NC 13 GPIO5 12 GPIO6 11 GPIO7 10 GPIO8 9 NC AX-Sigfox QFN40 Figure 2 Pinout drawing (Top view) www.onsemi.com AX-SIGFOX/D 9 10 Specifications 4. Specifications 4.1. Absolute Maximum Ratings Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SYMBOL DESCRIPTION VDD_IO Supply voltage CONDITION MIN MAX UNIT -0.5 5.5 V IDD Supply current 200 mA Ptot Total power consumption 800 mW Pi Absolute maximum input power at receiver input 10 dBm II1 DC current into any pin except ANTP, ANTN -10 10 mA II2 DC current into pins ANTP, ANTN -100 100 mA 40 mA ANTP and ANTN pins in RX mode IO Output Current Via Input voltage ANTP, ANTN pins -0.5 5.5 V Input voltage digital pins -0.5 5.5 V -2000 2000 V Ves Electrostatic handling HBM Tamb Operating temperature -40 85 °C Tstg Storage temperature -65 150 °C Tj Junction Temperature 150 °C www.onsemi.com AX-SIGFOX/D Specifications 4.2. DC Characteristics Supplies SYM DESCRIPTION CONDITION MIN TYP MAX UNIT Conditions for all current and energy values unless otherwise specified are for the hardware configuration described in the AX-Sigfox Application Note: Sigfox Compliant Reference Design. TAMB Operational ambient temperature -40 27 85 °C VDDIO I/O and voltage regulator supply voltage 1.8 3.0 3.6 V VDDIO_R1 I/O voltage ramp for reset activation; Note 1 Ramp starts at VDD_IO≤0.1V 0.1 V/ms VDDIO_R2 I/O voltage ramp for reset activation; Note 1 Ramp starts at 0.1V<VDD_IO<0.7V 3.3 V/ms IDS Deep sleep mode current AT$P=2 100 nA ISLP Sleep mode current AT$P=1 1.3 μA ISTDBY Standby mode current 0.5 mA 10 mA IRX_CONT Current consumption continuous RX AT$SR=1,1,-1 QSFX_OOB_0 Energy to send a Sigfox out of band message, 0dBm AT$S0 0.12 C QSFX_BIT_0 Energy to send a bit, 0dBm AT$SB=0 0.08 C QSFX_BITDL_0 Energy to send a bit with downlink receive, 0dBm AT$SB=0,1 0.14 C QSFX_LFR_0 Energy to send the longest possible Sigfox frame (12 byte) , 0dBm AT$SF=00112233445566778899aabb 0.27 C QSFX_LFRDL_0 Energy to send the longest possible Sigfox frame (12 byte) with downlink receive, 0dBm AT$SF=00112233445566778899aabb,1 0.27 C QSFX_OOB_14 Energy to send a Sigfox out of band message, 14dBm AT$S0 0.28 C QSFX_BIT_14 Energy to send a bit, 14dBm AT$SB=0 0.20 C QSFX_BITDL_14 Energy to send a bit with downlink receive, 14dBm AT$SB=0,1 0.35 C QSFX_LFR_14 Energy to send the longest possible Sigfox frame (12 byte) , 14dBm AT$SF=00112233445566778899aabb 0.39 C QSFX_LFRDL_14 Energy to send the longest possible Sigfox frame (12 byte) with downlink receive, 14dBm AT$SF=00112233445566778899aabb,1 0.46 C ITXMOD0AVG Modulated Transmitter Current, Notes 3, 4 Pout=0 dBm; average 19.0 mA ITXMOD14AVG Modulated Transmitter Current, Notes 3, 4 Pout=14 dBm; average 49.0 mA Notes : 1. 2. 3. 4. If VDD_IO ramps cannot be guaranteed, an external reset circuit is recommended, see the AX8052 Application Note: Power On Reset Digital circuitry is functional down to typically 1 V. The output power of the AX-Sigfox can be programmed in 1 dB steps from 0 dBm – 14 dBm. Current consumption values are given for a matching network that is optimized for 14 dBm output. 0 dBm transmission with typically 10 mA can be achieved with other networks that are optimized for 0 dBm operation. Values in dBm are typical, the matching network is optimized for 14 dBm www.onsemi.com AX-SIGFOX/D 11 12 Specifications Typical Current Waveform Figure 3 Typical current waveform for a maximum length frame with downlink receive at 14 dBm output power www.onsemi.com AX-SIGFOX/D Specifications Battery Life Examples Scenario 1: • CR2032 coin cell battery • One OOB frame transmitter per day at Pout=0 dBm • Device in Sleep • Neglecting battery self discharge CR2032 capacity 225 mAh * 3600 s/h 810 C Sleep charge per day 1.3 μA * 86400s 0.11 C/day OOB frame transmission 0.12 C/day Total Charge consumption 0.23 C/day Battery life 9.6 Years Scenario 2: • 2 AAA Alkaline batteries in series • One OOB frame transmitter per day at Pout=14 dBm • Four maximum length frames with downlink receive per day at Pout=14 dBm • Device in Sleep • Neglecting battery self discharge 2 AAA alkaline capacity 1500 mAh * 3600 s/h 5400 C Sleep charge per day 1.3 μA * 86400s 0.11 C/day OOB frame transmission Frame transmission with downlink 0.28 C/day 4 * 0.46 C/day 1.84 C/day Total Charge consumption 2.26 C/day Battery life 6.5 Years www.onsemi.com AX-SIGFOX/D 13 14 Specifications Logic SYMBOL DESCRIPTION CONDITION MIN TYP MAX UNIT DIGITAL INPUTS VT+ Schmitt trigger low to high threshold point VT- Schmitt trigger high to low threshold point VIL Input voltage, low VIH Input voltage, high 2.0 VIPA Input voltage range, GPIO[3:0] -0.5 VDD_IO V VIPBC Input voltage range, GPIO[9:4], UARTRX -0.5 5.5 V IL Input leakage current -10 10 μA RPU Programmable Pull-Up Resistance VDD_IO = 3.3V 1.55 V 1.25 V 0.8 V V kΩ 65 DIGITAL OUTPUTS IOH Output Current, high Ports GPIO[9:0], UARTTX, TXLED, RXLED, TXLED, CPULED VOH= 2.4V 8 mA IOL Output Current, low GPIO[9:0], UARTTX, TXLED, RXLED, TXLED, CPULED VOL= 0.4V 8 mA IOZ Tri-state output leakage current -10 10 μA 4.3. AC Characteristics TCXO Reference Input SYMBOL DESCRIPTION CONDITION MIN TYP MAX UNIT A passive network between the TCXO output and the pins CLKP and CLKN is required. fTCXO TCXO frequency For detailed TCXO network recommendations depending on the TCXO output swing refer to the AX5043 Application Note: Use with a TCXO Reference Clock. 48 MHz For TCXO recommendations see the Ax-Sigfox Application Note: Sigfox Compliant Reference Design www.onsemi.com AX-SIGFOX/D Specifications Transmitter SYMBOL DESCRIPTION CONDITION MIN TYP MAX UNIT Conditions for transmitter specifications unless otherwise specified with the antenna network from AX-Sigfox Application Note: Sigfox Compliant Reference Design and at 868.130 MHz. SBR Signal bit rate PTXmin Lowest Transmitter output power AT$CW=868130000,1,0 PTXmax Highest Transmitter output power AT$CW=868130000,1,14 PTXstep Programming step size output power dTXtemp Transmitter power variation vs. temperature dTXVdd Transmitter power variation vs. VDD_IO PTXharm2 Emission @ 2nd harmonic PTXharm3 PTXharm4 rd Emission @ 3 100 bps 0 dBm 14 1 dB -40 °C to +85 °C +/- 0.5 dB 1.8 to 3.6 V +/- 0.5 dB -51 harmonic -63 Emission @ 4 harmonic -84 th dBc Figure 4 Typical spectrum with harmonics at 14 dBm output power www.onsemi.com AX-SIGFOX/D 15 16 Specifications Receiver SYM DESCRIPTION CONDITION MIN TYP MAX UNIT Conditions for transmitter specifications unless otherwise specified with the antenna network from AX-Sigfox Application Note: Sigfox Compliant Reference Design and at 869.525 MHz. SBR Signal bit rate AT$SB=x,1, AT$SF=x,1, AT$SR ISBER868 BLK868 PER < 0.1 Blocking at +/- 10MHz offset Channel/Blocker @ PER = 0.1, wanted signal level is +3 dB above the typical sensitivity, the blocker signal is CW 600 bps -126 dBm 78 dB ADC / Temperature Sensor SYMBOL DESCRIPTION CONDITION MIN TYP MAX ADCRES ADC resolution VADCREF ADC reference voltage ZADC00 Input capacitance DNL Differential nonlinearity +/- 1 LSB INL Integral non inearity +/- 1 LSB OFF Offset 3 LSB GAIN_ERR Gain error 0.8 % 10 0.95 1 UNIT Bits 1.05 V 2.5 pF ADC in Differential Mode VABS_DIFF Absolute voltages & common mode voltage in differential mode at each input VFS_DIFF01 Full swing input for differential signals VFS_DIFF10 Gain x1 Gain x10 0 VDD_IO V -500 500 mV -50 50 mV ADC in Single Ended Mode VMID_SE Mid code input voltage in single ended mode VIN_SE00 Input voltage in single ended mode VFS_SE01 Full swing input for single ended signals 0.5 Gain x1 V 0 VDD_IO V 0 1 V Temperature Sensor TRNG Temperature range AT$T? -40 85 °C TERR_CAL Temperature error AT$T? -2 +2 °C www.onsemi.com AX-SIGFOX/D Command Interface 5. Command Interface 5.1. Serial Parameters: 9600,8,N,1 The AX-Sigfox uses the UART (pins UARTTX, UARTRX) to communicate with a host and uses a bitrate of 9600 baud, no parity, 8 data bits and one stop bit. 5.2. Power Modes Standby After Power-Up and after finishing a SIGFOX transmission, AX-Sigfox enters Standby mode. In Standby mode, AX-Sigfox listens on the UART for commands from the host. Also, OOB frames are transmitted whenever the OOB timer fires. To conserve power, the AX-Sigfox can be put into Sleep or turned off (Deep Sleep) completely. Sleep The command AT$P=1 is used to put the AX-Sigfox into Sleep mode. In this mode, only the wakeup timer for out-of-band messages is still running. To wake the AX-Sigfox up from Sleep mode toggle the serial UARTRX pin, e.g. by sending a break (break is an RS232 framing violation, i.e. at least 10 bit durations low). When an Out of Band (OOB) message is due, AX-Sigfox automatically wakes up to transmit the message, and then returns to Sleep mode. Deep Sleep In Deep Sleep mode, the AX-Sigfox is completely turned off and only draws negligible leakage current. Deep Sleep mode can be activated with AT$P=2. To wake-up from Deep Sleep mode, GPIO9 is pulled to GND. www.onsemi.com AX-SIGFOX/D 17 18 Command Interface When using Deep Sleep mode, keep two things in mind: Everything is turned off, timers are not running at all and all settings will be lost (use AT$WR to save settings to flash before entering Deep Sleep mode). Out-of-band messages will therefore not be sent. The pins states are frozen in Deep Sleep mode. The user must ensure that this will not result in condition which would draw a lot of current. 5.3. AT Commands Numerical Syntax hexdigit hexnum decnum octnum binnum bit optnum frame uint uint_opt ::= ::= ::= ::= ::= ::= ::= ::= ::= ::= [0-9A-Fa-f] “0x” hexdigit+ “0” | [1-9] [0-9]* “0” [0-7]+ “0b” [01]+ [01] “-1” (hexdigit hexdigit)+ hexnum | decnum | octnum | binnum uint | optnum Command Syntax A command starts with ‘AT’ (everything is case sensitive!), continues with the actual command followed by parameters (if any) and ends with any kind of whitespace (space, tab, newline etc.) If incorrect syntax is detected (“parsing error”) all input is ignored up until the next whitespace character. Also note that any number can be entered in any format (Hexadecimal, Decimal, Octal and binary) by adding the corresponding prefix (‘0x’, ‘0’, ‘0b’). The only exception is the 'Send Frame' command (AT$SF) which expects a list of hexadecimal digits without any prefix. Return Codes A successful command execution is indicated by sending ‘OK’. If a command returns a value (e.g. by querying a register) only the value is returned. Examples Bold text is sent to AX-Sigfox. AT$I=0 AXSEM AT Command Interface Here, we execute command ‘I’ to query some general information. AT$SF=aabb1234 OK www.onsemi.com AX-SIGFOX/D Command Interface This sends a Sigfox frame containing { 0x00 : 0x11 : 0x22 : 0x33 : 0x44 }, then waits for a downlink response telegram, which in this example contains { 0xAA : 0xBB : 0xCC : 0xDD }. AT$SF=0011223344,1 OK RX=AA BB CC DD This sends a Sigfox frame containing { 0xAA : 0xBB : 0x12 : 0x34 } without waiting for a response telegram. AT$CB=0xAA,1 OK The ‘CB’ command sends out a continuous pattern of bits, in this case 0xAA = 0b10101010. AT$P=1 OK This transitions the device into sleep mode. Out-of-band transmissions will still be triggered. The UART is powered down. The device can be woken up by a low level on the UART signal, i.e. by sending break. Commands Command Name Description AT Dummy command Just returns 'OK' and does nothing else. Can be used to check communication. AT$SB=bit[,bit] Send bit Send a bit status (0 or 1). Optional bit flag indicates if AX-Sigfox should receive a downlink frame. AT$SF=frame[,bit] Send frame Send payload data, 1 to 12 bytes. Optional bit flag indicates if AXSigfox should receive a downlink frame. AT$SO Manually send out of band message Send the out-of-band message. ATSuint? Get register Query a specific configuration register’s value. See Chapter “Registers” for a list of registers. ATSuint=uint Set register Change a configuration register. AT$IF=uint Set TX frequency Set the output carrier macro channel for Sigfox frames. AT$IF? Get TX frequency Get the currently chosen TX frequency. AT$DR=uint Set RX frequency Set the reception carrier macro channel for Sigfox frames. AT$DR? Get RX frequency Get the currently chosen RX frequency. www.onsemi.com AX-SIGFOX/D 19 20 Command Interface Command Name Description AT$CW= Continuous wave To run emission tests for Sigfox certification it is necessary to send a continuous wave, i.e. just the base frequency without any modulation. uint,bit [,uint_opt] Parameters: AT$CB= Test mode: uint_opt,bit TX constant byte Name Range Description Default frequency 800000000 – 999999999, 0 Continuous wave frequency in Hz. Use 868130000 for Sigfox or 0 to keep previous frequency. mode 0, 1 Enable or disable carrier wave. power 0-14 dBm of signal 14 For emission testing it is useful to send a specific bit pattern. The first parameter specifies the byte to send. Use ‘-1’ for a (pseudo-) random pattern. Parameters: Name Range Description pattern 0-255, -1 Byte to send. Use ‘-1’ for a (pseudo-) random pattern Default mode 0, 1 Enable or disable pattern test mode. AT$T? Get temperature Measure internal temperature and return it in 1/10th of a degree Celsius. AT$V? Get voltages Return current voltage and voltage measured during the last transmission in mV. www.onsemi.com AX-SIGFOX/D Command Interface Command Name Description AT$I=uint Information Display various product information: 0: Software Name & Version Example Response: AX-Sigfox 1.0.6-ETSI 1: Contact Details Example Response: [email protected] 2: Silicon revision lower byte Example Response: 8F 3: Silicon revision upper byte Example Response: 00 4: Major Firmware Version Example Response: 1 5: Minor Firmware Version Example Response: 0 6: Firmware Revision Example Response: 3 7: Firmware Variant (Frequency Band etc. (EU/US)) Example Response: ETSI 8: Firmware VCS Version Example Response: v1.0.2-36 9: SIGFOX Library Version Example Response: DL0-1.4 10: Device ID Example Response: 00012345 11: PAC Example Response: 0123456789ABCDEF AT$P=uint Set power mode To conserve power, the AX-Sigfox can be put to sleep manually. Depending on power mode, you will be responsible for waking up the AX-Sigfox again! 0: software reset (settings will be reset to values in flash) 1: sleep (send a break to wake up) 2: deep sleep (toggle GPIO9 or RESET_N pin to wake up; the AXSigfox is not running and all settings will be reset!) AT$WR Save config Write all settings to flash (RX/TX frequencies, registers) so that they survive reset/deep sleep or loss of power. Use AT$P=0 to reset the AX-Sigfox and load settings from flash. www.onsemi.com AX-SIGFOX/D 21 22 Command Interface Command Name Description AT:Pn? Get GPIO pin Return the setting of the GPIO pin n; n can range from 0 to 9. A character string is returned describing the mode of the pin, followed by the actual value. If the pin is configured as analog pin, then the voltage (range 0...1 V) is returned. The mode characters have the following meaning: Mode Description 0 Pin drives low 1 Pin drives high Z Pin is high impedance input U Pin is input with pull-up A Pin is analog input (GPIO pin 0...3 only) T Pin is driven by clock or DAC (GPIO pin 0 and 4 only) The default mode after exiting reset is U on all GPIO pins. AT:Pn=? Get GPIO pin range Print a list of possible modes for a pin. The table below lists the response. Pin Modes P0 0,1,Z,U,A,T P1 0,1,Z,U,A P2 0,1,Z,U,A P3 0,1,Z,U,A P4 0,1,Z,U,T P5 0,1,Z,U P6 0,1,Z,U P7 0,1,Z,U P8 0,1,Z,U P9 0,1,Z,U AT:Pn=mode Set GPIO pin Set the GPIO pin mode. For a list of the modes see the command AT:Pn? AT:ADC Pn[-Pn[ (1V|10V)]]? Get GPIO pin analog voltage Measure the voltage applied to a GPIO pin. The command also allows measurement of the voltage difference across two GPIO pins. In differential mode, the full scale range may also be specified as 1 V or 10 V. Note however that the pin input voltages must not exceed the range 0..VDD_IO. The command returns the result as fraction of the full scale range (1V if none is specified). The GPIO pins referenced should be initialized to analog mode before issuing this command. www.onsemi.com AX-SIGFOX/D Command Interface Command Name Description AT:SPI[(A|B|C|D)] =bytes SPI transaction This command clocks out bytes on the SPI port. The clock frequency is 312.5kHz. The command returns the bytes read on MISO during output. Optionally the clocking mode may be specified (default is A): Mode Clock Inversion Clock Phase A normal normal B normal alternate C inverted normal D inverted alternate Note that SEL, if needed, is not generated by this command, and must instead be driven using standard GPIO commands (AT:Pn=0|1). AT:CLK=freq, reffreq Set clock generator Output a square wave on the pin(s) set to T mode. The frequency of the square wave is freq × reffreq . Possible values for reffreq 216 are 20000000, 10000000, 5000000, 2500000, 1250000, 625000, 312500, 156250. Possible values if ffreq are 0…65535. AT:CLK=OFF Turn off clock generator Switch off the clock generator. AT:CLK? Get clock generator Return the settings of the clock generator. Two numbers are returned, freq and reffreq. AT:DAC=value Set Σ∆ DAC Output a Σ∆ DAC value on the pin(s) set to T mode. Parameter value may be in the range –32768..32767. The average output voltage is 1 value ( + 17 ) × VDD . 2 2 An external low pass filter is needed to get smooth output voltages. The modulation frequency is 20 MHz. A possible low pass filter choice is a simple RC low pass filter with R=10kΩ and C=1μF AT:DAC=OFF Turn off Σ∆ DAC Switch off the DAC. AT:DAC? Get Σ∆ DAC Return the DAC value. www.onsemi.com AX-SIGFOX/D 23 24 Command Interface Registers Number Name Description Default Range Unit 300 Out of band period AX-Sigfox sends periodic static messages to indicate that they are alive. Set to 0 to disable. 24 0-24 hours 302 Power level The output power of the radio. 14 0-14 dBm www.onsemi.com AX-SIGFOX/D Application Information 6. Application Information 6.1. Typical Application Diagrams Typical Sigfox Application Diagram Figure 5 Typical application diagram For detailed application configuration and BOM see the AX-Sigfox Application Note: Sigfox Compliant Reference Design. www.onsemi.com AX-SIGFOX/D 25 26 QFN40 Package Information 7. QFN40 Package Information 7.1. Package Outline QFN40 5x7mm Notes 1. 2. 3. 4. 5. 6. 7. ‘e’ represents the basic terminal pitch Datum ‘C’ is the mounting surface with which the package is in contact. ‘3’ specifies the vertical shift of the flat part of each terminal from the mounting surface. Dimension ‘A’ includes package warpage. Dimension ‘b’ applies to the metallised terminal and is measured between 0.15 to 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension ‘b’ should not be measured in the radius are Package dimension take reference from JEDEC MO-220 RoHS www.onsemi.com AX-SIGFOX/D QFN40 Package Information 7.2. QFN40 Soldering Profile Preheat Reflow tp Tp Temperature Cooling T tL L TsMAX TsMIN ts 25°C t25° to Peak Time Profile Feature Pb-Free Process Average Ramp-Up Rate 3 °C/sec max. Preheat Preheat Temperature Min TsMIN 150°C Temperature Max TsMAX 200°C Time (TsMIN to TsMAX) ts 60 – 180 sec Time 25°C to Peak Temperature T25 ° to Peak 8 min max. Liquidus Temperature TL 217°C Time over Liquidus Temperature tL 60 – 150 sec Peak Temperature tp 260°C Time within 5°C of actual Peak Temperature Tp 20 – 40 sec Reflow Phase Cooling Phase Ramp-down rate 6°C/sec max. Notes: All temperatures refer to the top side of the package, measured on the package body surface. www.onsemi.com AX-SIGFOX/D 27 28 QFN40 Package Information 7.3. QFN40 Recommended Pad Layout 1. PCB land and solder masking recommendations are shown in Figure 6. A= Clearance from PCB thermal pad to solder mask opening, 0.0635 mm minimum B = Clearance from edge of PCB thermal pad to PCB land, 0.2 mm minimum C = Clearance from PCB land edge to solder mask opening to be as tight as possible to ensure that some solder mask remains between PCB pads D = PCB land length = QFN solder pad length + 0.1mm E = PCB land width = QFN solder pad width + 0.1 mm Figure 6 PCB land and solder mask recommendations 2. 3. Thermal vias should be used on the PCB thermal pad (middle ground pad) to improve thermal conductivity from the device to a copper ground plane area on the reverse side of the printed circuit board. The number of vias depends on the package thermal requirements, as determined by thermal simulation or actual testing. Increasing the number of vias through the printed circuit board will improve the thermal conductivity to the reverse side ground plane and external heat sink. In general, adding more metal through the PC board under the IC will improve operational heat transfer, but will require careful attention to uniform heating of the board during assembly. 7.4. Assembly Process Stencil Design & Solder Paste Application 1. Stainless steel stencils are recommended for solder paste application. 2. A stencil thickness of 0.125 – 0.150 mm (5 – 6 mils) is recommended for screening. 3. For the PCB thermal pad, solder paste should be printed on the PCB by designing a stencil with an array of smaller openings that sum to 50% of the QFN exposed pad area. Solder paste should be applied through an array of squares (or circles) as shown in Figure 7. 4. The aperture opening for the signal pads should be between 50-80% of the QFN pad area as shown in Figure 8. 5. Optionally, for better solder paste release, the aperture walls should be trapezoidal and the corners rounded. 6. The fine pitch of the IC leads requires accurate alignment of the stencil and the printed circuit board. The stencil and printed circuit assembly should be aligned to within + 1 mil prior to application of the solder paste. 7. No-clean flux is recommended since flux from underneath the thermal pad will be difficult to clean if water-soluble flux is used. www.onsemi.com AX-SIGFOX/D QFN40 Package Information Figure 7 Solder paste application on exposed pad Minimum 50% coverage 62% coverage Maximum 80% coverage Figure 8 Solder paste application on pins www.onsemi.com AX-SIGFOX/D 29 30 Device Versions 8. Device Versions Version Device Marking AT$I=0 AT$I=2 AT$I=3 1 AX-Sigfox-1 or AX8052F143-2 AX-Sigfox 1.0.6-ETSI 0x8F 0x51 ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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