ETC1 MX26C512AMC-90 512k-bit [64k x 8] cmos multiple-time-programmable eprom Datasheet

INDEX
MX26C512A
512K-BIT [64K x 8] CMOS
MULTIPLE-TIME-PROGRAMMABLE EPROM
FEATURES
•
•
•
•
•
•
•
64K x 8 organization
+5V operating power supply
+12.75V program/erase voltage
Electric erase instead of UV light erase
Fast access time: 70/90/100/120/150 ns
Totally static operation
Completely TTL compatible
•
•
•
•
Operating current: 30mA
Standby current: 100uA
100 minimum erase/program cycles
Package type:
- 28 pin plastic DIP
Y
- 28 pin SOP
OG
L
O
- 32 pin PLCC
HN
- 28 pin TSOP(I)
TEC
ED
ENT
PAT
GENERAL DESCRIPTION
The MX26C512A is a 12.75V/5V, 512K-bit, MTP
EPROMTM (Multiple Time Programmable Read Only
Memory). It is organized as 64K words by 8 bits per word,
operates from a + 5 volt supply, has a static standby
mode, and features fast single address location programming. It is designed to be reprogrammed and erased by
an EPROM programmer or on-board. All programming/
erasing signals are TTL levels, requiring a single pulse.
The MX26C512A supports an intelligent quick pulse
programming algorithm which can result in a programming time of less than 30 seconds.
This MTP EPROMTM is packaged in industry standard 28
pin dual-in-line packages, 32 pin PLCC packages or 28
pin TSOP packages and 28 pin SOP packages.
BLOCK DIAGRAM
PIN CONFIGURATIONS
A6
5
1
4
32
30
29
A9
A4
A11
A3
NC
A2
MX26C512A
9
25
OE/VPP
A1
A10
A0
CE
NC
P/N: PM0455
A0~A15
ADDRESS
INPUTS
Q7
21
20
Q4
Q3
17
Q0~Q7
.
.
.
.
.
.
.
Y-DECODER
X-DECODER
.
.
.
.
.
.
.
.
.
Y-SELECT
512K BIT
CELL
MAXTRIX
Q6
VCC
GND
Q5
13
14
NC
Q0
OUTPUT
BUFFERS
A8
A5
VPP
PIN DESCRIPTION
TSOP
OE/VPP
A11
A9
A8
A13
A14
VCC
A15
A12
A7
A6
A5
A4
A3
CONTROL
LOGIC
A13
A14
VCC
NC
A15
A12
CE
OE
GND
VCC
A14
A13
A8
A9
A11
OE/VPP
A10
CE
Q7
Q6
Q5
Q4
Q3
Q2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Q1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
MX26C512A
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
A7
PLCC
PDIP/SOP
22
23
24
25
26
27
28
1
2
3
4
5
6
7
MX26C512A
Patent#: US#5,523,307
21
20
19
18
17
16
15
14
13
12
11
10
9
8
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
1
SYMBOL
PIN NAME
A0~A15
Address Input
Q0~Q7
Data Input/Output
CE
Chip Enable Input
OE
Output Enable Input
VPP
Program Supply Voltage
NC
No Internal Connection
VCC
Power Supply Pin (+5V)
GND
Ground Pin
REV.1.8, JUL. 13 , 1998
INDEX
MX26C512A
FUNCTIONAL DESCRIPTION
ERASE MODE
When the MX26C512A is delivered, or it is erased, the
chip has all 512K bits in the "ONE", or HIGH state.
"ZEROs" are loaded into the MX26C512 through the
procedure of programming.
The MX26C512A is erased by EPROM programmer or
in-system. The device is set up in erase mode when
A9 =OE/VPP = 12.75V are applied, with VCC = 5V.
(Algorithm is shown in Figure 3). The erase time is around
1sec. If the erase is not verified, an additional erase
processes will be repeated for a maximum of 200 times.
PROGRAMMING MODE
PROGRAMMMING ALGORITHM
PROGRAM INHIBIT MODE
The MX26C512A is programmed by an EPROM
programmer or on-board. The device is set up in the
programming mode when the programming voltage OE/
VPP = 12.75V is applied, with VCC = 5 V (Algorithm
shown in Figure 1). Programming is achieved by applying
a single TTL low level 25us pulse to the CE input after
addresses and data lines are stable. If the data is not
verified, additional pulses are applied for a maximum of
20 pulses. After the data is verified, one 25us pulse is
applied to overprogram the byte so that program margin
is assured. This process is repeated while sequencing
through each address of the device. When programming
is completed, the data at all the addresses are verified
at VCC = 5V ± 10%.
Programming of multiple MX26C512A in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX26C512 may be common. A
TTL low-level program pulse applied to an MX26C512A
CE input with OE/VPP = 12.75 ± 0.25 V will program
that MX26C512A. A high-level CE input inhibits the other
MX26C512A from being programmed.
PROGRAM VERIFY MODE
Verification should be performed on the programmed bits
to determine that they were correctly programmed. The
verification should be performed with OE/VPP and CE,
at VIL. Data should be verified tDV after the falling edge
of CE.
The VCC supply of the MXIC On-Board Programming
Algorithm is designed to be 5V ± 10% particularly to
facilitate the programming operation under the on-board
application environment. But it can also be implemented
in an industrial-standard EPROM programmer.
ERASE VERIFY MODE
Verification should be performed on the erased chip to
determine that whole chip(all bits) was correctly erased.
Verification should be performed with OE/VPP and CE
at VIL and VCC = 5V.
COMPATIBILITY WITH MX27C512 FAST PROGRAMMING
ALGORITHM
Besides the On-Board Programming Algorithm, the Fast
Programming Algorithm of MX27C512 also applies to
MX26C512A. MXIC Fast Algorithm is the conventional
EPROM programing algorithm and is available in
industrial-standard EPROM programmers. A user of
industrial-standard EPROM programmer can choose
either of the algorithms base on his preference.
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary
code from a MTP that will identify its manufacturer and
device type. This mode is intended for use by
programming equipment for the purpose of automatically
matching the device to be programmed with its
corresponding programming algorithm. This mode is
functional in the 25°C ± 5°C ambient temperature range
that is required when programming the MX26C512A.
The device is set up in the fast programming mode when
the programming voltage OE/VPP = 12.75V isapplied,
with VCC = 6.25V, (Algorithm is shown in Figure 2). The
programming is achieved by appling a single TTL low
level 25~100us pulse to the CE input after addresses and
data line are stable. If the data is not verified, an additional
pulse is applied for a maximum of 25 pulses. This process
is repeated while sequencing through each address of
the device. When the programming mode is completed,
the data in all address is verified at VCC = 5V ± 10%.
P/N: PM0455
To activate this mode, the programming equipment must
force 12.75V on address line A9 of the device. Two
identifier bytes may then be sequenced from the device
outputs by toggling address line A0 from VIL to VIH. All
REV.1.8, JUL. 13 , 1998
Patent#: US#5,523,307
2
INDEX
MX26C512A
memory device.
other address lines must be held at VIL during auto identify
mode.
SYSTEM CONSIDERATIONS
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For
the MX26C512A, these two identifier bytes are given in
the Mode Select Table. All identifiers for the manufacturer
and device codes will possess odd parity, with the MSB
(DQ7) defined as the parity bit.
During the switch between active and standby conditions,
transient current peaks are produced on the rising and
falling edges of Chip Enable. The magnitude of these
transient current peaks is dependent on the output
capacitance loading of the device. At a minimum, a 0.1
uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be used
between VCC and GND for each of the eight devices.
The location of the capacitor should be close to where
the power supply is connected to the array.
READ MODE
The MX26C512A has two control functions, both of
which must be logically satisfied in order to obtain data
at the outputs. Chip Enable (CE) is the power control
and should be used for device selection. Output Enable
(OE) is the output control and should be used to gate
data to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tOE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tOE.
STANDBY MODE
The MX26C512A has a CMOS standby mode which
reduces the maximum VCC current to 100 uA. It is placed
in CMOS standby when CE is at VCC ± 0.3 V. The
MX26C512A also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is placed
in TTL-standby when CE is at VIH. When in standby
mode, the outputs are in a high-impedance state,
independent of the OE input.
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a twoline control function is provided to allow for:
1. Low memory power dissipation,
2. Assurance that output bus contention will not occur.
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
P/N: PM0455
REV.1.8, JUL. 13 , 1998
Patent#: US#5,523,307
3
INDEX
MX26C512A
MODE SELECT TABLE
PINS
MODE
CE
OE/VPP
A0
A9
OUTPUTS
Read
VIL
VIL
X
X
DOUT
Output Disable
VIL
VIH
X
X
High Z
Standby (TTL)
VIH
X
X
X
High Z
Standby (CMOS)
VCC
X
X
X
High Z
Program
VIL
VPP
X
X
DIN
Program Verify
VIL
VIL
X
X
DOUT
Erase
VIL
VPP
X
VPP
HIGH Z
Erase Verify
VIL
VIL
X
X
DOUT
Program Inhibit
VIH
X
X
X
High Z
Manufacturer Code
VIL
VIL
VIL
VH
C2H
Device Code(26C512)
VIL
VIL
VIH
VH
D1H
NOTES: 1. VH = 12.0V ± 0.5V
2. X = Either VIH or VIL(For auto select)
3. A1 - A8 = A10 - A15 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during
programming.
FIGURE 1. PROGRAMMING FLOW CHART
START
ADDRESS = FIRST LOCATION
VCC = 5V
VPP = 12.75V
X=0
PROGRAM ONE 25us PULSE
INCREMENT X
INTERACTIVE
SECTION
YES
X = 20 ?
NO
FAIL
VERIFY BYTE
?
PROGRAM ONE 25us PULSE
PASS
NO
LAST ADDRESS
INCREMENT ADDRESS
FAIL
YES
PROGRAM ONE 25us PULSE
VCC = 5V
VERIFY SECTION
VPP = VIL
VERIFY ALL BYTES
?
FAIL
DEVICE FAILED
PASS
DEVICE PASSED
P/N: PM0455
REV.1.8, JUL. 13 , 1998
Patent#: US#5,523,307
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INDEX
MX26C512A
FIGURE 2. COMPATIBILITY WITH MX27C512 FAST PROGRAMMING FLOW CHART
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
OE/VPP = 12.75V
PROGRAM ONE 25~100us PULSE
LAST
NO
INCREMENT ADDRESS
ADDRESS ?
YES
ADDRESS = FIRST LOCATION
X=0
INCREMENT ADDRESS
NO
LAST
ADDRESS ?
PASS
VERIFY BYTE
FAIL
INCREMENT X
YES
NO
PROGRAM ONE 25~100us PULSE
YES
VCC = 5.0V
OE/VPP = VIL
COMPARE
ALL BYTES
TO ORIGINAL
DATA
X = 25 ?
FAIL
DEVICE FAILED
PASS
DEVICE PASSED
P/N: PM0455
REV.1.8, JUL. 13 , 1998
Patent#: US#5,523,307
5
INDEX
MX26C512A
FIGURE 3. ERASING MODE FLOW CHART
START
X=0
PROGRAM ALL "0"
A9 = 12.75V
VCC = 5V
VPP = 12.75V
CHIP ERASE (0.5s)
A9 = VIL or VIH
VCC = 5V
OE/VPP = VIL
All Bits Verify
NO
FAIL
ERASE VERIFY ?
INCREMENT X
X = 200 ?
YES
PASS
CHIP ERASE (0.5s)
DEVICE FAILED
DEVICE PASSED
P/N: PM0455
REV.1.8, JUL. 13 , 1998
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6
INDEX
MX26C512A
SWITCHING TEST CIRCUITS
1.8K ohm
DEVICE
UNDER
+5V
TEST
CL
6.2K ohm
DIODES = IN3064
OR EQUIVALENT
CL = 100 pF including jig capacitance(30pF for 70 ns parts)
SWITCHING TEST WAVEFORMS
3.0V
TEST POINTS
1.5V
1.5V
0V
OUTPUT
INPUT
AC TESTING: (1) Inputs are driven at 3.0V for a logic "1" and 0V for a logic "0".
Input pulse rise and fall times are < 10ns.
(2) For MX26C512A
P/N: PM0455
REV.1.8, JUL. 13 , 1998
Patent#: US#5,523,307
7
INDEX
MX26C512A
ABSOLUTE MAXIMUM RATINGS
RATING
VALUE
Ambient Operating Temperature
0oC to 70oC
Storage Temperature
-65oC to 125oC
Applied Input Voltage
-0.5V to 7.0V
Applied Output Voltage
-0.5V to VCC + 0.5V
VCC to Ground Potential
-0.5V to 7.0V
A9 & Vpp
-0.5V to 13.5V
NOTICE:
Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating
conditions for extended period may affect reliability.
NOTICE:
Specifications contained within the following tables are subject to
change.
DC CHARACTERISTICS TA = 0oC to 70oC, VCC = 5V ± 10%
SYMBOL
PARAMETER
MIN.
VOH
Output High Voltage
2.4
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MAX.
UNIT
CONDITIONS
V
IOH = -0.4mA
0.4
V
IOL = 2.1mA
2.0
VCC + 0.5
V
Input Low Voltage
-0.3
0.8
V
ILI
Input Leakage Current
-10
10
uA
VIN = 0 to 5.5V
ILO
Output Leakage Current
-10
10
uA
VOUT = 0 to 5.5V
ICC3
VCC Power-Down Current
100
uA
CE = VCC ± 0.3V
ICC2
VCC Standby Current
1.5
mA
CE = VIH
ICC1
VCC Active Current
30
mA
CE = VIL, f=5MHz, Iout = 0mA
CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only)
SYMBOL
PARAMETER
TYP.
MAX.
UNIT
CONDITIONS
CIN
Input Capacitance
8
8
pF
VIN = 0V
COUT
Output Capacitance
8
12
pF
VOUT = 0V
CVPP
VPP Capacitance
18
25
pF
VPP = 0V
P/N: PM0455
REV.1.8, JUL. 13 , 1998
Patent#: US#5,523,307
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INDEX
MX26C512A
AC CHARACTERISTICS TA = 0oC to 70oC, VCC = 5V± 10%
26C512A
26C512A
-70
-90
SYMBOL
PARAMETER
MIN.
tACC
Address to Output Delay
70
tCE
Chip Enable to Output Delay
70
tOE
tDF
Output Enable to Output Delay
OE High to Output Float,
tOH
or CE High to Output Float
Output Hold from Address,
CE or OE which ever occurred firs
0
MAX.
MIN.
35
20
MAX.
0
0
UNIT
CONDITIONS
90
ns
CE = OE = VIL
90
ns
OE = VIL
40
25
ns
ns
CE = VIL
0
ns
26C512A
26C512A
26C512A
-10
-12
-15
SYMBOL
PARAMETER
MIN.
tACC
Address to Output Delay
100
tCE
Chip Enable to Output Delay
100
tOE
tDF
Output Enable to Output Delay
OE High to Output Float,
tOH
or CE High to Output Float
Output Hold from Address,
0
CE or OE which ever occurred first
0
MAX.
45
30
MIN.
0
MAX.
MIN.
MAX.
UNIT
CONDITIONS
120
150
ns
CE = OE = VIL
120
150
ns
OE = VIL
65
50
ns
ns
CE = VIL
50
35
0
0
0
ns
DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5oC
SYMBOL
PARAMETER
MIN.
VOH
Output High Voltage
2.4
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MAX.
UNIT
CONDITIONS
V
IOH = -0.40mA
0.4
V
IOL = 2.1mA
2.0
VCC + 0.5
V
Input Low Voltage
-0.3
0.8
V
ILI
Input Leakage Current
-10
10
uA
VH
A9 Auto Select Voltage
11.5
12.5
V
ICC3
VCC Supply Current (Program/Erase & Verify)
50
mA
IPP2
VPP Supply Current(Program)/Erase
50
mA
VIN = 0 to 5.5V
CE = PGM = VIL,
OE = VIH
VCC2
Programming & Erase Supply Voltage
4.5
6.5
V
VPP2
Programming & Erase Voltage
12.5
13.0
V
IPP A9
A9 Auto Select Current /Erase
1
mA
CE = PGM = VIL,
OE = VIH
P/N: PM0455
REV.1.8, JUL. 13 , 1998
Patent#: US#5,523,307
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INDEX
MX26C512A
AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5oC
SYMBOL
PARAMETER
MIN.
MAX.
tAS
Address Setup Time
2.0
us
tOES
OE Setup Time
2.0
us
tDS
Data Setup Time
2.0
us
tAH
Address Hold Time
0
us
tDH
Data Hold Time
2.0
us
tDFP
CE to Output Float Delay
0
tVPS
VPP Setup Time
2.0
tPW
Program Pulse Width
20
tVCS
VCC Setup Time
2.0
tDV
Data Valid from CE
tCES
CE Setup Time
tOE
Data valid from OE
tER
Erase Recovery Time
0.5
s
tEW
Erase Pulse Width
0.5
s
tEV
Erase Verify Time
200
ns
tPV
Program Verify Time
200
ns
tA9S
A9 Setup Time
2.0
us
tPVS
Program Verify Setup
2
us
tEVS
Erase Verify Setup
0.5
s
130
UNIT
CONDITIONS
ns
us
105
us
us
250
2.0
ns
us
150
ns
WAVEFORMS
READ CYCLE
ADDRESS
INPUTS
DATA ADDRESS
tACC
CE
tCE
OE
tDF
DATA
OUT
VALID DATA
tOE
P/N: PM0455
tDH
REV.1.8, JUL. 13 , 1998
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INDEX
MX26C512A
PROGRAMMING WAVEFORMS
PROGRAM
PROGRAM VERIFY
VIH
Addresses
VIL
tAS
DATA
tDFP
tDS
tDH
tDV
VPP1
OE/VPP
VIL
tPRT
tAH
tPR
tVPS
tPVS
tPW
VIH
CE
VIL
tPV
tVCS
VCC1
VCC
VCC
ERASE WAVEFORMS
ERASE
VPP
ADDRESS
ERASE VERIFY
A9
VIH
OTHERS NOT CARE
VIL
OUT
OUT
tEVS
VPP
OE/VPP
VIL
tVPS
tEV
VIH
CE
VIL
P/N: PM0455
tCES
tEW
tER
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INDEX
MX26C512A
ORDERING INFORMATION
PLASTIC PACKAGE
PART NO.
ACCESS TIME(ns)
OPERATING CURRENT MAX.(mA)
STANDBY CURRENT MAX.(uA)
PACKAGE
MX26C512APC-70
70
30
100
28 Pin DIP
MX26C512AMC-70 70
30
100
28 Pin SOP
MX26C512AQC-70 70
30
100
32 Pin PLCC
MX26C512ATC-70
70
30
100
28 Pin TSOP(I)
MX26C512APC-90
90
30
100
28 Pin DIP
MX26C512AMC-90 90
30
100
28 Pin SOP
MX26C512AQC-90 90
30
100
32 Pin PLCC
MX26C512ATC-90
90
30
100
28 Pin TSOP(I)
MX26C512APC-10
100
30
100
28 Pin DIP
MX26C512AMC-10 100
30
100
28 Pin SOP
MX26C512AQC-10 100
30
100
32 Pin PLCC
MX26C512ATC-10
100
30
100
28 Pin TSOP(I)
MX26C512APC-12
120
30
100
28 Pin DIP
MX26C512AMC-12 120
30
100
28 Pin SOP
MX26C512AQC-12 120
30
100
32 Pin PLCC
MX26C512ATC-12
120
30
100
28 Pin TSOP(I)
MX26C512APC-15
150
30
100
28 Pin DIP
MX26C512AMC-15 150
30
100
28 Pin SOP
MX26C512AQC-15 150
30
100
32 Pin PLCC
MX26C512AC-15
30
100
28 Pin TSOP(I)
P/N: PM0455
150
REV.1.8, JUL. 13 , 1998
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INDEX
MX26C512A
PACKAGE INFORMATION
28-PIN PLASTIC DIP (600 mil)
ITEM
MILLIMETERS
INCHES
A
37.34 max
1.470 max
B
2.03 [REF]
.080 [REF]
C
2.54 [TP]
.100 [TP]
D
.46 [Typ.]
.018 [Typ.]
E
32.99
1.300
F
1.52 [Typ.]
.060 [Typ.]
G
3.30 ± .25
.130 ± .010
H
.51 [REF]
.020 [REF]
I
3.94 ± .25
.155 ± .010
J
5.33 max.
.210 max.
K
15.22 ± .25
.600 ± .010
L
13.84 ± .25
.545 ± .010
.25 [Typ.]
.010 [Typ.]
M
NOTE:
28
15
1
14
K
L
A
F
Each lead centerline is located within .25
mm[.01 inch] of its true position [TP] at
maximum material condition.
C
D
I
J
H
G
M
B
0~15¡
E
32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)
A
ITEM
MILLIMETERS
A
12.44 ± .13
.490 ± .005
B
11.50 ± .13
.453 ± .005
C
14.04 ± .13
.553 ± .005
D
14.98 ± .13
.590 ± .005
E
1.93
.076
F
3.30 ± .25
.130 ± .010
G
2.03 ± .13
.080 ± .005
H
.51 ± .13
.020 ± .005
I
1.27 [Typ.]
.050 [Typ.]
J
.71[REF]
.028[REF]
K
L
.46 [REF]
10.40/12.94
(W) (L)
.018 [REF]
.410/.510
(W) (L)
M
.89 R
.035 R
N
.25 (TYP.)
.010 (TYP.)
NOTE:
B
1
INCHES
4
32
30
5
29
9
25
13
C
D
21
14
20
17
E
F
G
Each lead centerline is located within .25
mm[.01 inch] of its true position [TP] at
maximum material condition.
N
H
M
I
J
K
L
P/N: PM0455
REV.1.8, JUL. 13 , 1998
Patent#: US#5,523,307
13
INDEX
MX26C512A
28-PIN PLASTIC TSOP
ITEM
MILLIMETERS
A
13.4 ± .2
B
11.8 ± .1
C
8.0 ± .1
D
.15 ± .01
F
.2 ± .03
H
.55 [Typ.]
I
.425 [Typ.]
J
.05 [Min.]
K
1.00 ± .05
L
1.25 [Max.]
M
.05 ± .20
N
O ° ~ 5°
A
B
C
N
M
K
L
D
E
F
NOTE: Each lead centerline is located within .25 mm
of its true position [TP] at maximum material
condition.
G
I
H
J
28-PIN PLASTIC SOP(330 mil)
ITEM
MILLIMETERS
INCHES
A
18.62 max.
.733 max.
B
1.194 max
.047 max
C
1.27 [TP]
.050 [TP]
D
.41 [Typ.]
.016 [Typ.]
E
.10 min.
.004 min.
F
2.85 max.
.110 max.
G
2.49 ± .13
.098 ± .005
H
11.81 ± .31
.465 ± .012
I
8.41 ± .13
.331± .005
J
1.70 ± .20
.067 ± .008
K
.25 [Typ.]
.010 [Typ.]
L
.91 ± .20
.036 ± .008
NOTE:
P/N: PM0455
Each lead centerline is located within .25
mm[.01 inch] of its true position [TP] at
maximum material condition.
28
15
1
14
A
H
I
G
J
F
K
D
C
B
E
L
REV.1.8, JUL. 13 , 1998
Patent#: US#5,523,307
14
INDEX
MX26C512A
Revision History
Revision#
1.2
1.3
1.4
1.5
1.6
1.7
1.8
P/N: PM0455
Description
Add 28 pin TSOP and SOP packages.
Erasing mode flow chart: Chip erase (5s)----> (1s).
Programming waveforms: CE changed.
MTP ROM--->MTP EPROM
Chip erase(1s)--->0.5s. X = 60?--->200?
Switching Test Waveforms revise.
tEW Erase Pulse Width 1 sec---> 0.5 sec.
Programming/erase waveforms modifiction.
VPP:from 12.0~13V to 12.5V ~13V.
Erase Verify Time: 60 ---->200.
Change Part Name: 26C512 ---> 26C512A
Change tPW:Min. 95us -->Min. 20us.
Programming flow chart revised.
Mode Select Table, Erase Mode A9=VH-->A9=Vpp.
Erase flow chart revised.
Delete IPP in DC CHARACTERISTICS
Date
3/28/1997
4/10/1997
5/30/1997
7/25/1997
11/05/1997
2/10/1998
7/13/1998
REV.1.8, JUL. 13 , 1998
Patent#: US#5,523,307
15
INDEX
MX26C512A
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-8888
FAX:+886-3-578-8887
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MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice.
16
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