LME49740 www.ti.com SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 LME49740 Quad High-Performance, High-Fidelity Audio Operational Amplifier Check for Samples: LME49740 FEATURES DESCRIPTION • • • • • The LME49740 is part of the ultra-low distortion, low noise, high slew rate operational amplifier series optimized and fully specified for high-performance, high-fidelity applications. Combining advanced leading-edge process technology with state-of-the-art circuit design, the LME49740 audio operational amplifiers deliver superior audio signal amplification for outstanding audio performance. The LME49740 combines extremely low voltage noise density (2.7nV/√HZ) with vanishingly low THD+N (0.00003%) to easily satisfy the most demanding audio applications. To ensure that the most challenging loads are driven without compromise, the LME49740 has a high slew rate of ±20V/μs and an output current capability of ±26mA. Further, dynamic range is maximized by an output stage that drives 2kΩ loads to within 1V of either power supply voltage and to within 1.4V when driving 600Ω loads. 1 2 Easily Drives 600Ω Loads Optimized for Superior Audio Signal Fidelity Output Short Circuit Protection PSRR and CMRR Exceed 120dB (Typ) SOIC and PDIP Packages APPLICATIONS • • • • • • • • • Ultra High-Quality Audio Amplification High-Fidelity Preamplifiers High-Fidelity Multimedia State-of-the-Art Phono Pre Amps High-Performance Professional Audio High-Fidelity Equalization and Crossover Networks High-Performance Line Drivers High-Performance Line Receivers High-Fidelity Active Filters KEY SPECIFICATIONS • • • • • • • • • Power Supply Voltage Range: ±2.5V to ±17V THD+N (AV = 1, VOUT = 3VRMS, fIN = 1kHz) – RL = 2kΩ: 0.00003% (typ) – RL = 600Ω: 0.00003% (typ) Input Noise Density: 2.7nV/√Hz (typ) Slew Rate: ±20V/μs (typ) Gain Bandwidth Product: 55MHz (typ) Open Loop Gain (RL = 600Ω): 140dB (typ) Input Bias Current: 10nA (typ) Input Offset Voltage: 0.1mV (typ) DC Gain Linearity Error: 0.000009% The LME49740's outstanding CMRR (120dB), PSRR (120dB), and VOS (0.1mV) give the amplifier excellent operational amplifier DC performance. The LME49740 has a wide supply range of ±2.5V to ±17V. Over this supply range the LME49740’s input circuitry maintains excellent common-mode and power supply rejection, as well as maintaining its low input bias current. The LME49740 is unity gain stable. The Audio Operational Amplifier achieves outstanding AC performance while driving complex loads with values as high as 100pF. The LME49740 is available in 14-lead narrow body SOIC and 14-lead PDIP. Demonstration boards are available for each package. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007–2013, Texas Instruments Incorporated LME49740 SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 www.ti.com TYPICAL APPLICATION 150: 3320: 150: 3320: 26.1 k: + 909: - - LME49740 + INPUT LME49740 22 nF//4.7 nF//500 pF 10 pF 47 k: + 3.83 k: + 100: OUTPUT 47 nF//33 nF Note: 1% metal film resistors, 5% polypropylene capacitors Figure 1. Passively Equalized RIAA Phono Preamplifier CONNECTION DIAGRAM Figure 2. 14-Lead SOIC (D Package) 14-Lead PDIP (NFF Package) These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 LME49740 www.ti.com SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 ABSOLUTE MAXIMUM RATINGS (1) (2) (3) Power Supply Voltage (VS = V+ - V-) 36V −65°C to 150°C Storage Temperature Input Voltage (V-) - 0.7V to (V+) + 0.7V Output Short Circuit (4) Continuous Power Dissipation Internally Limited ESD Susceptibility (5) ESD Susceptibility 2000V (6) 200V Junction Temperature 150°C Thermal Resistance θJA (MA) 107°C/W θJA (NA) 74°C/W Temperature Range TMIN ≤ TA ≤ TMAX –40°C ≤ TA ≤ 85°C Supply Voltage Range ±2.5V ≤ VS ≤ ± 17V (1) (2) (3) (4) (5) (6) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Amplifier output connected to GND, any number of amplifiers within a package. Human body model, 100pF discharged through a 1.5kΩ resistor. Machine Model ESD test is covered by specification EIAJ IC-121-1981. A 200pF cap is charged to the specified voltage and then discharged directly into the IC with no external series resistor (resistance of discharge path must be under 50Ω). Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 3 LME49740 SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 www.ti.com ELECTRICAL CHARACTERISTICS (1) (2) The following specifications apply for VS = ±15V, RL = 2kΩ, fIN = 1kHz, and TA = 25C, unless otherwise specified. Symbol THD+N Parameter Total Harmonic Distortion + Noise Conditions LME49740 Typical (3) AV = 1, VOUT = 3VRMS RL = 2kΩ RL = 600Ω 0.00003 0.00003 AV = 1, VOUT = 3VRMS Two-tone, 60Hz & 7kHz 4:1 0.00005 Limit (4) (5) 0.00009 Units (Limits) % (max) % (max) IMD Intermodulation Distortion GBWP Gain Bandwidth Product 55 45 MHz (min) SR Slew Rate ±20 ±15 V/μs (min) FPBW Full Power Bandwidth VOUT = 1VP-P, –3dB referenced to output magnitude at f = 1kHz ts Settling time AV = 1, 10V step, CL = 100pF 0.1% error range 1.2 Equivalent Input Noise Voltage fBW = 20Hz to 20kHz 0.34 0.65 μVRMS Equivalent Input Noise Density f = 1kHz f = 10Hz 2.7 6.4 4.7 nV/√Hz nV/√Hz in Current Noise Density f = 1kHz f = 10Hz 1.6 3.1 VOS Offset Voltage ΔVOS/ΔTemp Average Input Offset Voltage Drift vs Temperature 40°C ≤ TA ≤ 85°C 0.2 PSRR Average Input Offset Voltage Shift vs Power Supply Voltage ΔVS = 20V (6) 120 ISOCH-CH Channel-to-Channel Isolation fIN = 1kHz fIN = 20kHz 118 112 IB Input Bias Current VCM = 0V 10 ΔIOS/ΔTemp Input Bias Current Drift vs Temperature –40°C ≤ TA ≤ 85°C 0.1 IOS Input Offset Current VCM = 0V 11 65 nA (max) VIN-CM Common-Mode Input Voltage Range +14.1 –13.9 (V+)–2.0 (V-)+2.0 V (min) V (min) CMRR Common-Mode Rejection 120 110 dB (min) en ZIN Common Mode Input Impedance AVOL Open Loop Voltage Gain –10V<VCM<10V Maximum Output Voltage Swing IOUT Output Current IOUT-CC Short Circuit Current ROUT Output Impedance (1) (2) (3) (4) (5) (6) 4 MHz μs pA/√Hz pA/√Hz ±0.7 mV (max) μV/°C 110 dB (min) dB dB 72 nA (max) nA/°C 30 kΩ –10V<VCM<10V 1000 MΩ –10V<VOUT<10V, RL = 600Ω 140 dB (min) –10V<VOUT<10V, RL = 2kΩ 140 dB (min) –10V<VOUT<10V, RL = 10kΩ VOUTMAX 10 ±0.1 Differential Input Impedance % (max) 140 125 dB (min) RL = 600Ω ±13.6 ±12.5 V (min) RL = 2kΩ ±14.0 RL = 10kΩ ±14.1 RL = 600Ω, VS = ±17V fIN = 10kHz Closed-Loop Open-Loop ±26 V (min) V (min) ±23 mA (min) +30 –38 mA mA 0.01 13 Ω Ω Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Typical specifications are specified at +25ºC and represent the most likely parametric norm. Tested limits are specified to AOQL (Average Outgoing Quality Level). Datasheet min/max specification limits are specified by design, test, or statistical analysis. PSRR is measured as follows: VOS is measured at two supply voltages, ±5V and ±15V. PSRR = |20log(ΔVOS/ΔVS)|. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 LME49740 www.ti.com SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 ELECTRICAL CHARACTERISTICS(1)(2) (continued) The following specifications apply for VS = ±15V, RL = 2kΩ, fIN = 1kHz, and TA = 25C, unless otherwise specified. Symbol Parameter Conditions CLOAD Capacitive Load Drive Overshoot 100pF IS Total Quiescent Current IOUT = 0mA LME49740 Typical (3) Limit (4) (5) Units (Limits) 20 mA (max) 16 18.5 % Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 5 LME49740 SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS 6 THD+N vs Output Voltage VCC = 15V, VEE = –15V, RL = 2kΩ THD+N vs Output Voltage VCC = 17V, VEE = –17V, RL = 2kΩ Figure 3. Figure 4. THD+N vs Frequency VCC = 15V, VEE = –15V, RL = 2kΩ, VOUT = 3VRMS THD+N vs Frequency VCC = 17V, VEE = –17V, RL = 2kΩ, VOUT = 3VRMS Figure 5. Figure 6. THD+N vs Frequency VCC = 15V, VEE = –15V, RL = 600Ω, VOUT = 3VRMS THD+N vs Frequency VCC = 17V, VEE = –17V, RL = 600Ω, VOUT = 3VRMS Figure 7. Figure 8. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 LME49740 www.ti.com SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) 0.01 IMD vs Output Voltage VCC = 15V, VEE = –15V, RL = 2kΩ 0.005 0.005 0.002 0.002 IMD (%) 0.001 IMD (%) 0.01 0.0005 0.0002 0.001 0.0005 0.0002 0.0001 0.0001 0.00005 0.00005 0.00002 0.00002 0.00001 10m 100m 1 IMD vs Output Voltage VCC = 17V, VEE = –17V, RL = 2kΩ 0.00001 10m 10 20 100m VRMS Figure 10. PSRR+ vs Frequency VCC = 15V, VEE = –15V, RL = 2kΩ, VRIPPLE = 200mVpp PSRR- vs Frequency VCC = 15V, VEE = –15V, RL = 2kΩ RL = 2kΩ, VRIPPLE = 200mVpp -60 -70 -70 -80 -80 -90 -90 -100 -110 -120 -100 -110 -120 -130 -130 -140 -140 -150 -150 -160 20 100 10k 20k 1k -160 20 FREQUENCY (Hz) 0 10 20 Figure 9. PSRR (dB) PSRR (dB) -60 1 VRMS 100 1k 10k 20k FREQUENCY (Hz) Figure 11. Figure 12. CMRR vs Frequency VCC = 15V, VEE = –15V, RL = 2kΩ Crosstalk vs Frequency VCC = 15V, VEE = –15V, RL = 2kΩ -10 -20 CMRR (dB) -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 10 100 1k 10k 100k FREQUENCY (Hz) Figure 13. Figure 14. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 7 LME49740 SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) Output Voltage vs Supply Voltage RL = 2kΩ, THD+N = 1% Output Voltage vs Load Resistance THD+N = 1% Figure 15. Figure 16. Supply Current vs Supply Voltage RL = 2kΩ, THD+N = 1% Full Power Bandwidth vs Frequency 2 0 0 dB = 1 VPP MAGNITUDE (dB) -2 -4 -6 -8 -10 -12 -14 1 10 100 1k 10k 100k 1M 10M 100M FREQUENCY (Hz) Figure 17. Figure 18. Gain Phase vs Frequency Voltage Noise Density vs Frequency 100 160 VS = 30V 140 VCM = 15V VOLTAGE NOISE (nV/ Hz) GAIN (dB), PHASE LAG (q 180 120 100 80 60 40 10 20 0 10 100 1k 10k 100k 1M 10M FREQUENCY (Hz) 1 10 100 1k 10k 100k FREQUENCY (Hz) Figure 19. 8 1 Figure 20. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 LME49740 www.ti.com SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Small-Signal Transient Response AV = 1, CL = 100pF Large-Signal Transient Response AV = 1, CL = 100pF Figure 21. Figure 22. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 9 LME49740 SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 www.ti.com APPLICATION INFORMATION DISTORTION MEASUREMENTS The vanishingly low residual distortion produced by LME49740 is below the capabilities of all commercially available equipment. This makes distortion measurements just slightly more difficult than simply connecting a distortion meter to the amplifier’s inputs and outputs. The solution, however, is quite simple: an additional resistor. Adding this resistor extends the resolution of the distortion measurement equipment. The LME49740’s low residual distortion is an input referred internal error. As shown in Figure 23, adding the 10Ω resistor connected between the amplifier’s inverting and non-inverting inputs changes the amplifier’s noise gain. The result is that the error signal (distortion) is amplified by a factor of 101. Although the amplifier’s closed-loop gain is unaltered, the feedback available to correct distortion errors is reduced by 101, which means that measurement resolution increases by 101. To ensure minimum effects on distortion measurements, keep the value of R1 low as shown in Figure 23. This technique is verified by duplicating the measurements with high closed loop gain and/or making the measurements at high frequencies. Doing so produces distortion components that are within the measurement equipment’s capabilities. This datasheet’s THD+N and IMD values were generated using the above described circuit connected to an Audio Precision System Two Cascade. R2 1000: LME49740 R1 10: Distortion Signal Gain = 1+(R2/R1) + Analyzer Input Generator Output Audio Precision System Two Cascade Actual Distortion = AP Value/100 Figure 23. THD+N and IMD Distortion Test Circuit APPLICATION HINTS The LME49740 is a high-speed op amp with excellent phase margin and stability. Capacitive loads up to 100pF will cause little change in the phase characteristics of the amplifiers and are therefore allowable. Capacitive loads greater than 100pF must be isolated from the output. The most straightforward way to do this is to put a resistor in series with the output. This resistor will also prevent excess power dissipation if the output is accidentally shorted. 10 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 LME49740 www.ti.com SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 NOISE MEASUREMENT CIRCUIT +VCC -VEE + 47 PF 47 PF + + V1 0.47 PF LME49740 390 + V2 15 nF 0.47 PF + 39k - 4.7 nF 39k AVERAGE RESPONDING AC VOLT METER 16k 99k 27 pF 1k 390 27 pF 1k RIAA PREAMP 35 dB, f = 1 kHz A. VO - 99k 200k 4.7 PF + FLAT AMP. 40 dB + 40 dB Complete shielding is required to prevent induced pick up from external sources. Always check with oscilloscope for power line noise. Figure 24. Total Gain: 115 dB at f = 1 kHz Input Referred Noise Voltage: en = VO/560,000 (V) Flat Amp Voltage Gain vs Frequency VO = 0dB, AV = 80.0dB, f = 1kHz 50 90 40 80 VOLTAGE GAIN (dB) RIAA DEVIATION (dB) VOLTAGE GAIN (dB) RIAA Preamp Voltage Gain, RIAA Deviation vs Frequency VIN = 10mV, AV = 35.0dB, f = 1kHz 30 20 10 0 +1 70 60 50 40 30 0 20 -1 20 100 1k 10k 20k FREQUENCY (Hz) 10 100 1k 10k 100k FREQUENCY (Hz) Figure 25. Figure 26. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 11 LME49740 SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 www.ti.com TYPICAL APPLICATIONS + 1 4 LME49740 VI TAPE HEAD VO 15 nF 3.6k 200k 200 + 47 PF AV = 34.5 F = 1 kHz En = 0.38 μV A Weighted Figure 27. NAB Preamp 70 VOLTAGE GAIN (dB) 60 50 40 30 20 10 0 20 100 1k 10k 20k FREQUENCY (Hz) Figure 28. NAB Preamp Voltage Gain vs Frequency VIN = 10mV, AV = 34.5dB, f = 1kHz R R V2 1 4 LME49740 R V1 VO + R VO = V1–V2 Figure 29. Balanced to Single-Ended Converter 12 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 LME49740 www.ti.com SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 R V1 + R V2 1 4 LME49740 R VO R V3 R R V4 VO = V1 + V2 − V3 − V4 Figure 30. Adder/Subtracter C C R R + 1 4 LME49740 VO 14 mA @ 10V 750 Figure 31. Sine Wave Oscillator R1 11k C1 C2 0.01 PF 0.01 PF VI R2 22k + 1 4 LME49740 VO - Illustration is f0 = 1 kHz Figure 32. Second-Order High-Pass Filter (Butterworth) Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 13 LME49740 SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 www.ti.com C1 0.022 PF R1 10k R2 10k + 1 4 LME49740 VI C2 0.011 PF VO - Illustration is f0 = 1 kHz Figure 33. Second-Order Low-Pass Filter (Butterworth) R2 R2 RG VIN C1 0.01 PF R1 C1 0.01 PF R1 - - - 1 4 LME49740 1 4 LME49740 1 4 LME49740 VHP + R0 VBP + VLP + R2 Figure 34. State Variable Filter 14 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 LME49740 www.ti.com SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 C1 10 PF R5 20k R2 20k R3 10k R1 20k D1 1S1588 - VIN R4 20k - 1 4 LME49740 + 1 4 LME49740 + D2 1S1588 R6 15k VO = |VIN| R7 6.2k Figure 35. AC/DC Converter 3.41R1 51k R1 15k R1 15k 1 4 LME49740 VO1 + VI 0.707R1 10k R1 15k R1 15k 1 4 LME49740 VO2 + 3.41R1 51k Figure 36. 2-Channel Panning Circuit (Pan Pot) Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 15 LME49740 SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 www.ti.com R2 VCC R3 10k R1 - VI 1 LME49740 4 + Q1 R9 10k R7 33 VO R8 33 R5 10k BIAS Q2 R6 10k -VEE Figure 37. Line Driver BOOST BASS CUT R1 R2 R1 VI C1 0.05 PF C1 0.05 PF R3 C2 0.005 PF 1 4 LME49740 R5 R5 VO + R4 BOOST TREBLE CUT Figure 38. Tone Control 16 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 LME49740 www.ti.com SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 33 PF 400 pF Phono Cartridge + 1 4 LME49740 47k 470 - 390 10 PF 100k 16k 200k 4.7 nF 15 nF 100 PF Av = 35 dB En = 0.33 μV S/N = 90 dB f = 1 kHz A Weighted A Weighted, VIN = 10 mV @f = 1 kHz Figure 39. RIAA Preamp VI + 1 4 LME49740 R R3 10k R4 10k R2 10k R1 200 1 4 LME49740 R5 10k VO + 1 4 LME49740 R6 10k R7 10k + V2 R Illustration is: V0 = 101(V2 − V1) Figure 40. Balanced Input Mic Amp Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 17 LME49740 SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 www.ti.com CUT 20k BOOST f01 f02 C2 f03 + 1 4 LME49740 f04 - R2 3k VI C1 R1 + 1 4 LME49740 f05 - f06 VO 3k f07 f08 f09 f010 A. See Table 1. Figure 41. 10-Band Graphic Equalizer Table 1. C1, C2, R1, and R2 Values for Figure 41 (1) (1) 18 fo (Hz) C1 C2 R1 R2 32 0.12μF 4.7μF 75kΩ 500Ω 64 0.056μF 3.3μF 68kΩ 510Ω 125 0.033μF 1.5μF 62kΩ 510Ω 250 0.015μF 0.82μF 68kΩ 470Ω 500 8200pF 0.39μF 62kΩ 470Ω 1k 3900pF 0.22μF 68kΩ 470Ω 2k 2000pF 0.1μF 68kΩ 470Ω 4k 1100pF 0.056μF 62kΩ 470Ω 8k 510pF 0.022μF 68kΩ 510Ω 16k 330pF 0.012μF 51kΩ 510Ω At volume of change = ±12 dB Q = 1.7 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 LME49740 www.ti.com SNAS377B – FEBRUARY 2007 – REVISED APRIL 2013 REVISION HISTORY Rev Date 1.0 02/28/07 Description Initial WEB release. 1.01 02/08/08 Fixed the captions on the LME4970MA package (from Dual-In-Line to Molded Package (SO). B 04/04/13 Changed layout of National Data Sheet to TI format. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LME49740 19 PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LME49740MA/NOPB LIFEBUY SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LME49740 MA LME49740MAX/NOPB LIFEBUY SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LME49740 MA LME49740NA/NOPB LIFEBUY PDIP NFF 14 25 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 85 LME49740NA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2015 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 17-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LME49740MAX/NOPB Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.35 2.3 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LME49740MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NFF0014A N0014A N14A (Rev G) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated