MACOM MA4GP907 Gaas flip-chip pin diode Datasheet

MA4GP907
GaAs Flip-Chip PIN Diodes
Features
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V 5.00
Package Outline
Low Series Resistance, 4 Ω
Ultra Low Capacitance, 25 fF
High Switching Cutoff Frequency, 40 GHz
2 Nanosecond Switching Speed
Can be Driven by Buffered TTL
Silicon Nitride Passivation
Polyimide Scratch Protection
Top View Is Shown With Diode Junction Up
Cathode
Description
M/A-COM's MA4GP907 is a Gallium Arsenide Flip-Chip PIN
diode.These devices are fabricated on OMCVD epitaxial
wafers using a process designed for high device uniformity and
extremely low parasitics. The diodes exhibit an extremely low
RC Product, ( 0.1 ps ) and 2 nS switching characteristics. They
are fully passivated with silicon nitride and have an additional
layer of a polymer for scratch protection.The protective
coatings prevent damage to the junction and the anode
airbridge during handling.
Applications
The 25 fF capacitance of the MA4GP907 allows use through
mmwave switch and switched phase shifter applications. This
diode is designed for use in pulsed or CW applications, where
single digit nS switching speed is required. For surface mount
assembly, the low capacitance of the MA4GP907 makes it
ideal for use in microwave multithrow switch assemblies,
where the series capacitance of each “off” port adversely loads
the input and affects VSWR.
Ordering Information
Part Number
Packaging
MA4GP907
Die in Carrier
MA4GP907-T
Tape/Reel
MA4GP907-W
Wafer on Frame
1
GaAs Flip-Chip PIN Diodes
MA4GP907
V5.00
Electrical Specifications and RF Data @TA = 25 °C
Parameters and Test Conditions
Symbol
Units
1 MHz & DC
Specifications
Min.
Typ.
Max.
0.025
0.030
Total Capacitance at -10 V
Ct
pF
Forward Resistance at +10mA
Rs
Ohms
Forward Voltage at +10mA
Vf
Volts
1.33
1.45
Reverse Breakdown Voltage at -10uA3
Vb
Volts
-50
-45
Trise
Tfall
nS
Switching Speed (10 to 90% RF Voltage)4
& (90 to 10% RF Voltage)4
10 GHz Reference
Data 1,2
Min.
Typ.
Max.
0.025
4.2
2
Notes:
1. Capacitance is determined by measuring Single Series Diode Isolation in a 50 ohm line at 10 GHz.
2. Forward Series Resistance is determined by measuring Single Series Diode Insertion Loss in a 50 ohm line
at 10 GHz.
3. Reverse current will not exceed 10 microamperes at the Maximum Voltage Rating.
4. Switching speed is measured between 10% and 90% or 90% to 10% RF Voltage for a Single Series Mounted Diode.
Driver delay is Not included.
Single Series Diode Insertion Loss vs Frequency
I. Loss @5mA
I. Loss @15mA
I. Loss @50mA
Insertion Loss (dB)
0.0
-0.2
-0.4
-0.6
-0.8
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
Frequency (GHz)
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
GaAs Flip-Chip PIN Diodes
MA4GP907
V5.00
Single Series Diode Return Loss vs Frequency
R. Loss @5mA
R. Loss @15mA
R. Loss @50mA
0.0
-5.0
Return Loss (dB)
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
Frequency (GHz)
Single Series Diode Isolation vs Frequency
Isolation @ -10V
Isolation @ 0V
0.0
-5.0
Isolation (dB)
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
Frequency ( GHz )
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
3
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
GaAs Flip-Chip PIN Diodes
MA4GP907
V 5.00
Device Installation Procedures
The following guidelines should be observed to avoid damaging GaAs Flip-Chips.
Cleanliness
These devices should be handled in a clean environment.
Do Not attempt to clean die After installation.
Static Sensitivity
Gallium arsenide PIN diodes are ESD sensitive and can be
damaged by static electricity. Proper ESD techniques should
be used when handling these devices. These devices are rated
Class 0, (0-199 V) per HBM MIL-STD-883, method 3015.7
[C = 100pF ±10%, R = 1.5kW ±1%]. Even though tested die
pass 50V ESD, they must be handled in a static-free environment.
General Handling
These devices have a polymer layer which provides scratch
protection for the junction area and the anode air bridge. Die
can be handled with plastic tweezers or picked and placed
with a #27 tip vacuum pencil.
Assembly Requirements Using
Electrically Conductive Ag Epoxy
and Solder
These chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be mounted
onto silkscreened circuits using Electrically Conductive Ag
Epoxy, approximately 1-2 mils in thickness and cured at approximately 90 °C to 150 °C per manufacturer’s schedule.
For extended cure times > 30 minutes, temperatures must be
below 200 °C.
Sn Rich Solders are not recommended due to the Tungsten
Metallization scheme beneath the gold contacts. Indalloy or
80 Au/20 Sn Solders are acceptable. Maximum soldering
temperature must be < 300 °C for < 10 sec.
Circuit Mounting Dimensions
(Inches)
0.013
Absolute Maximum Ratings5
Parameter
Maximum Ratings
Operating Temperature
-65 °C to +125 °C
Storage Temperature
-65 °C to +150 °C
Dissipated RF & DC Power
50 mW
RF C.W. Incident Power
Mounting Temperature
0.012
(2) PL
+ 23 dBm C.W.
+300 °C for 10 seconds
0.008
(2) PL
5. Exceeding any of these values may result in permanent
damage
Ordering Information
Part Number
Package
MA4GP907
Die in Carrier
MA4GP907-T
Tape and Reel
MA4GP907-W
Wafer on Frame
4
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
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