FMA3008 Preliminary Datasheet v2.1 2-20GHZ BROADBAND MMIC AMPLIFIER FEATURES: • • • • • • • FUNCTIONAL SCHEMATIC: Cascode Configuration 11dB Gain pHEMT Technology AGC control with gate bias Input Return Loss <-15dB Output Return Loss <-10dB Medium Power 20dBm VDD RF Input RF Output GENERAL DESCRIPTION: VG The FMA3008 is a high performance 2-20GHz Gallium Arsenide monolithic travelling wave amplifier. It is suitable for use in broadband communication, instrumentation and electronic warfare applications. The die is fabricated using the Filtronic 0.25µm process. The cascode gate voltage is supplied on Chip, with the option of supplying an external voltage. The Circuit is DC blocked at both the input and output. TYPICAL APPLICATIONS: • • • Test Instrumentation Electronic Warfare Broadband Communication Infrastructure ELECTRICAL SPECIFICATIONS: PARAMETER CONDITIONS MIN TYP MAX UNITS Small Signal Gain 2-20GHz 11 dB Input Return Loss 2-20GHz -10 dB Output Return Loss 2-20GHz -14 dB Reverse Isolation 2-20GHz <-40 dB Output Power at 1dB 10GHz 23.5 dBm compression point 18GHz 22.5 dBm Noise Figure 2-20GHz 4.5 dB Gate Voltage For Id=120mA -0.3 V Note: TAMBIENT = +25°C, Z0 = 50Ω, VD=6V 1 Tel: +44 (0) 1325 301111 Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: [email protected] Website: www.filtronic.com FMA3008 Preliminary Datasheet v2.1 ABSOLUTE MAXIMUM RATINGS: PAD LAYOUT: PARAMETER SYMBOL ABSOLUTE MAXIMUM Max Input Power Pin +25dBm Gate Voltage VG1 -2V Drain Voltage VDD +10V Ptot tbd Gain Compression Comp tbd Thermal Resistivity θJC 0.66°C/W Operating Temp Toper -40°C to +85°C Storage Temp Tstor -55°C to +150°C Total Power Dissipation PAD NAME DESCRIPTION PIN COORDINATES (µm) A RF in RF in (105,713) B GND Ground (198, 126) C VG1 Gate Voltage (461, 128) D Out RF Output (663, 713) E GND Ground (2170, 1580) F VD Drain Voltage (1998, 1580) G VG2 Cascode Gate Voltage (132, 1107) B (Optional) Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of bond pad opening Note: Exceeding any one of these absolute maximum ratings may cause permanent damage to the device. F PAD REF E G D A B C DIE SIZE (μm) DIE THICKNESS (μm) MIN. BOND PAD PITCH (μm) MIN. BOND PAD OPENING (μm x μm ) 2350 x 1710 100 179 100 x 100 2 Tel: +44 (0) 1325 301111 Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: [email protected] Website: www.filtronic.com FMA3008 Preliminary Datasheet v2.1 TYPICAL PERFORMANCE FOR ON WAFER MEASUREMENTS: Note: Measurement Conditions VG1= -0.3V, ID= 120mA, VDD= 6V, TAMBIENT = 25°C Gain Input Return Loss 0 14 Input Return Loss (dB) 12 Gain (dB) 10 8 6 4 -10 -20 -30 2 -40 0 2 4 6 8 10 12 14 Frequency (GHz) 16 18 20 2 22 4 6 Output Return Loss 8 10 12 14 Frequency (GHz) 16 18 20 22 16 18 20 22 Reverse Isolation 0 0 Reverse Isolation (dB) Output Return Loss (dB) -10 -20 -30 -20 -40 -60 -40 -80 -50 2 4 6 8 10 12 14 Frequency (GHz) 16 18 20 2 22 4 6 8 10 12 14 Frequency (GHz) Output Power at P1dB Compression Point vs Freq 26 Output Power (dBm) 24 22 20 18 16 14 12 10 2 4 6 8 10 12 Frequency (GHz) 14 16 18 3 Tel: +44 (0) 1325 301111 Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: [email protected] Website: www.filtronic.com FMA3008 Preliminary Datasheet v2.1 BIASING CIRCUIT SCHEMATIC: VDD VG2 100pF 100pF 100nF 100nF Optional Circuit for external cascade Gate Control RF Output RF Input VG1 100nF 100pF ASSEMBLY DIAGRAM: It is recommended that the RF connections be made using two bond wires 25µm in diameter and a maximum length of 300µm. Optimum input and output return loss can be achieved, to compensate for bond wire length, with the addition of a microstrip transformer, shown in the diagram below. To Evaluation Board via an 0402 Surface Mounted capacitor 100pF Chip Capacitor Substrate: Alumina Thickness: 635µm Dimensions in mm 1.1 1.1 0.61 0.61 0.65 0.65 100pF Chip Capacitors Transformer Impedance 36Ω Electrical Length 21º at 10GHz To Evaluation Board via an 0402 Surface Mounted capacitor BILL OF MATERIALS: COMPONENT All RF tracks should be 50Ω characteristic material Capacitor, 100pF, chip capacitor Capacitor, 100pF, 0402 4 Tel: +44 (0) 1325 301111 Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: [email protected] Website: www.filtronic.com FMA3008 Preliminary Datasheet v2.1 PREFERRED ASSEMBLY INSTRUCTIONS: ORDERING INFORMATION: PART NUMBER GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. DESCRIPTION Die in Waffle-pack FMA3008 (Gel-pak available on request) The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290°C; maximum time at temperature is one minute. The recommended wire bond method is thermo-compression wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260°C. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires should be minimised especially when making RF or ground connections. HANDLING PRECAUTIONS: To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V) as defined in JEDEC Standard No. 22A114. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. APPLICATION NOTES & DESIGN DATA: Application Notes and design data including Sparameters, noise data and large-signal models are available on request. DISCLAIMERS: This product is not designed for use in any space based or life sustaining/supporting equipment. 5 Tel: +44 (0) 1325 301111 Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: [email protected] Website: www.filtronic.com