TI ADS8519IB 16-bit, 250ksps, serial, cmos, sampling analog-to-digital converter Datasheet

ADS8519
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SLAS462A – JUNE 2007 – REVISED MARCH 2008
16-Bit, 250kSPS, Serial, CMOS, Sampling
ANALOG-TO-DIGITAL CONVERTER
FEATURES
1
•
•
•
•
•
23
•
•
•
•
•
•
•
0V to 8.192V, ±5V, and ±10V Input Ranges
93dB SNR with 20kHz Input
±1.5LSB Max INL
±1LSB Max DNL; 16 Bits, No Missing Codes
SPI™-Compatible Serial Output with
Daisy-Chain (TAG) Feature and 3-State Bus
5V Analog Supply, 1.65V to 5.25V I/O Supply
Pinout Similar to 16-Bit ADS7809 (Low-Speed)
and 12-Bit ADS7808 and ADS8508
No External Precision Resistors Required
Uses Internal or External Reference
110mW Typ Power Dissipation at 250kSPS
28-Pin SSOP Package
Simple DSP Interface
The ADS8519 is a complete 16-bit sampling
analog-to-digital (A/D) converter using state-of-the-art
CMOS structures. It contains a complete 16-bit,
capacitor-based, successive approximation register
(SAR) A/D converter with sample-and-hold,
reference, clock, and a serial data interface. Data can
be output using the internal clock or synchronized to
an external data clock. The ADS8519 also provides
an output synchronization pulse for ease-of-use with
standard DSP processors.
The ADS8519 is specified at a 250kSPS sampling
rate over the full temperature range. Internal precision
resistors provide various input ranges including ±10V,
±5V, and 0V to 8.192V, while the innovative design
allows operation from a single 5V supply with power
dissipation under 125mW.
The ADS8519 is available in a 28-pin SSOP
package, and is fully specified for operation over the
industrial –40°C to +85°C temperature range.
APPLICATIONS
•
•
•
•
•
DESCRIPTION
Industrial Process Control
Data Acquisition Systems
Digital Signal Processing
Medical Equipment
Instrumentation
Successive Approximation Register
Clock
CDAC
7kΩ
R1IN
BUSY
7kΩ
R2IN
2.87kΩ
R3IN
EXT/INT
25.67kΩ
Comparator
CAP
Buffer
4kΩ
REF
Internal
+4.096V Ref
Serial
Data
Out
and
Control
DATACLK
TAG
DATA
R/C
SB/BTC
CS
PWRD
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a trademark of Motorola, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
ADS8519
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SLAS462A – JUNE 2007 – REVISED MARCH 2008
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
MINIMUM
INL
(LSB)
NO
MISSING
CODES
MINIMUM
SINAD
(dB)
SPECIFIED
TEMPERATURE
RANGE
PACKAGELEAD
PACKAGE
DESIGNATOR
ADS8519IB
±1.5
16-Bit
90
–40°C to +85°C
SSOP-28
DB
ADS8519I
±3
15-Bit
87
–40°C to +85°C
SSOP-28
DB
(1)
ORDERING
NUMBER
TRANSPORT
MEDIA, QTY
ADS8519IBDB
Tube, 50
ADS8519IBDBR
Tape and Reel, 2000
ADS8519IDB
Tube, 50
ADS8519IDBR
Tape and Reel, 2000
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1) (2)
Over operating free-air temperature range (unless otherwise noted).
UNIT
Analog inputs
R1IN
±25V
R2IN
±25V
R3IN
±25V
REF
+VANA + 0.3V to AGND2 – 0.3V
DGND, AGND2
Ground voltage differences
±0.3V
VANA
6V
VDIG
6V
Digital inputs
–0.3V to +VDIG + 0.3V
Internal power dissipation
700mW
Maximum junction temperature
+165°C
Lead temperature (soldering, 10s)
+300°C
(1)
(2)
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
ELECTRICAL CHARACTERISTICS
At TA = –40°C to +85°C, fs = 250kSPS, and VDIG = VANA = 5V, using internal reference (unless otherwise specified).
ADS8519I
PARAMETER
TEST CONDITIONS
MIN
TYP
Resolution
ADS8519IB
MAX
MIN
TYP
16
MAX
16
UNIT
Bits
ANALOG INPUT
Voltage ranges (1)
Impedance (1)
Capacitance
50
50
pF
THROUGHPUT SPEED
Conversion cycle time
Acquire and convert
Throughput rate
(1)
2
4
250
4
250
µs
kSPS
±10V, ±5V, 0V to 8.192V, etc. (see Table 3)
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ELECTRICAL CHARACTERISTICS (continued)
At TA = –40°C to +85°C, fs = 250kSPS, and VDIG = VANA = 5V, using internal reference (unless otherwise specified).
ADS8519I
PARAMETER
TEST CONDITIONS
MIN
TYP
ADS8519IB
MAX
MIN
TYP
MAX
UNIT
LSB (2)
DC ACCURACY
INL
Integral linearity error
–3
3
–1.5
1.5
DNL
Differential linearity error
–2
2
–1
1
No missing codes
15
Transition noise (3)
Full-scale
error (4) (5)
0.67
±10V range
Internal reference
–0.5
All other ranges
Internal reference
–0.5
–0.05
0.003
Full-scale error drift
Full-scale
error (4) (5)
Internal reference
External reference
–0.05
All other ranges
External reference
–0.5
External reference
Bipolar zero error (4)
0.5
–0.25
0.5
–0.5
–0.05
0.05
–0.05
0.003
0.5
–0.5
4
–2
Bipolar zero error drift
–20
Unipolar zero error drift
Recovery to rated accuracy after
power down
1µF capacitor to CAP
Power supply sensitivity
(VDIG = VANA = VD)
+4.75V < VD < +5.25V
–8
95
6
0.25
0.5
0.5
–20
6
±0.4
±0.4
1
1
8
–8
%FSR
ppm/°C
2
±2
20
%FSR
ppm/°C
0.05
±2
±2
8.192V
LSB
±7
±2
–4
LSB
Bits
0.67
±7
±10V range
Full-scale error drift
Unipolar zero
error (4)
16
mV
ppm/°C
20
mV
ppm/°C
ms
8
LSB
AC ACCURACY
SFDR
Spurious-free dynamic range
fI = 20kHz
THD
Total harmonic distortion
fI = 20kHz
SINAD
Signal-to-(noise+distortion)
SNR
Signal-to-noise ratio
100
–96
fI = 20kHz
87
–60dB Input
97
–94
91
–98
90
30
fI = 20kHz
88
Full-power bandwidth (7)
92
91
500
dB (6)
100
–96
dB
92
dB
32
dB
93
dB
500
kHz
SAMPLING DYNAMICS
Aperture delay
Transient response
5
FS step
5
2
Overvoltage recovery (8)
ns
2
150
150
µs
ns
REFERENCE
Internal reference voltage
No load
4.076
4.076
4.096
4.116
V
1
µA
Internal reference drift
8
8
ppm/°C
External reference current drain
(6)
(7)
(8)
4.116
1
External reference voltage range
for specified linearity
(2)
(3)
(4)
(5)
4.096
Internal reference source current
(must use external buffer)
2.5
4.096
External 4.096V ref.
4.1
100
2.5
4.096
4.1
V
100
µA
LSB means Least Significant Bit. For the ±10V input range, one LSB is 305µV.
Typical rms noise at worst-case transitions and temperatures.
As measured with circuit shown in Figure 29 and Figure 30.
For bipolar input ranges, full-scale error is the worst case of –Full-Scale or +Full-Scale uncalibrated deviation from ideal first and last
code transitions, divided by the transition voltage (not divided by the full-scale range) and includes the effect of offset error. For unipolar
input ranges, full-scale error is the deviation of the last code transition divided by the transition voltage. It also includes the effect of
offset error.
All specifications in dB are referred to a full-scale ±10V input.
Full-power bandwidth is defined as the full-scale input frequency at which signal-to-(noise + distortion) degrades to 60dB.
Recovers to specified performance after 2 x FS input overvoltage.
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ELECTRICAL CHARACTERISTICS (continued)
At TA = –40°C to +85°C, fs = 250kSPS, and VDIG = VANA = 5V, using internal reference (unless otherwise specified).
ADS8519I
PARAMETER
TEST CONDITIONS
MIN
ADS8519IB
TYP
MAX
MIN
TYP
MAX
UNIT
DIGITAL INPUTS
Logic levels
VIL
Low-level input voltage (9)
VDIG = 1.65V to 5.25V
–0.3
0.6
–0.3
0.6
VIH
High-level input voltage (9)
VDIG = 1.65V to 5.25V
0.5 x VDIG
VDIG + 0.3
0.5 x VDIG
VDIG + 0.3
V
IIL
Low-level input current
VIL = 0V
±10
±10
µA
IIH
High-level input current
VIH = 5V
±10
±10
µA
V
DIGITAL OUTPUTS
Data format
Serial, 16-bits
Serial, 16-bits
Data coding
Binary 2's complement
or straight binary
Binary 2's complement
or straight binary
Conversion results only available
after completed conversion
Conversion results only available
after completed conversion
Selectable for internal
or external data clock
Selectable for internal
or external data clock
Pipeline delay
Data clock
Internal clock (output only when
transmitting data)
EXT/INT low
External clock (can run
continually but not recommended
for optimum performance)
EXT/INT high
VOL
Low-level output voltage
ISINK = 1.6mA,
VDIG = 1.65V to 5.25V
VOH
High-level output voltage
ISOURCE = 500µA,
VDIG = 1.65V to 5.25V
Leakage current
Hi-Z state,
VOUT = 0V to VDIG
±5
±5
µA
Output capacitance
Hi-Z state
15
15
pF
5.25
V
9
0.1
9
26
0.1
26
0.45
VDIG – 0.45
MHz
MHz
0.45
V
VDIG – 0.45
V
POWER SUPPLIES
VDIG
Digital input voltage
Must be ≤ VANA
1.65
VANA
Analog input voltage
Must be ≤ VANA
4.75
IDIG
Digital input current
IANA
Analog input current
5.25
1.65
5
5.25
4.75
Must be ≤ VANA
0.1
Must be ≤ VANA
5
5.25
1
0.1
1
mA
V
22
25
22
25
mA
110
125
110
125
mW
POWER DISSIPATION
PWRD Low
fS = 250kSPS
PWRD High
20
µW
20
TEMPERATURE RANGE
θJA
Specified performance
–40
+85
–40
+85
°C
Derated performance (10)
–55
+125
–55
+125
°C
Storage
–65
+150
–65
+150
Thermal resistance
67
67
°C
°C/W
(9) TTL-compatible at 5V supply.
(10) The internal reference may not be started correctly beyond the industrial temperature range (–40°C to +85°C); therefore, use of an
external reference is recommended.
4
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PIN CONFIGURATION
DB PACKAGE
(TOP VIEW)
R1IN 1
AGND1 2
28 VDIG
27 VANA
R2IN 3
26 PWRD
R3IN 4
NC 5
25 BUSY
CAP 6
23 NC
REF 7
22 NC
NC 8
AGND2 9
24 CS
21 R/C
20 NC
NC 10
19 TAG
NC 11
18 NC
SB/BTC 12
EXT/INT 13
DGND 14
17 DATA
16 DATACLK
15 SYNC
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Pin Assignments
PIN
6
NAME
NO.
I/O
AGND1
2
–
Analog ground. Used internally as ground reference point. Minimal current flow.
DESCRIPTION
AGND2
9
–
Analog ground
BUSY
25
O
Busy output. Falls when a conversion is started, and remains low until the conversion is completed and
the data are latched into the output shift register.
CS
24
–
Chip select. Internally ORed with R/C.
CAP
6
Reference buffer capacitor, 2.2µF tantalum capacitor to ground.
DATA
17
O
Serial data output. Data are synchronized to DATACLK, with the format determined by the level of
SB/BTC. In the external clock mode, after 16 bits of data, the ADS8519 outputs the level input on TAG
as long as CS is low and R/C is high (see Figure 8 and Figure 9). If EXT/INT is low, data are valid on
both the rising and falling edges of DATACLK, and between conversions DATA stays at the level of the
TAG input when the conversion was started.
DATACLK
16
I/O
Either an input or an output, depending on the EXT/INT level. Output data are synchronized to this
clock. If EXT/INT is low, DATACLK transmits 16 pulses after each conversion, and then remains low
between conversions.
DGND
14
–
Digital ground
EXT/INT
13
–
Selects external or internal clock for transmitting data. If high, data are output synchronized to the
clock input on DATACLK. If low, a convert command initiates the transmission of the data from the
previous conversion, along with 16 clock pulses output on DATACLK.
NC
5, 8, 10, 11,
18, 20, 22,
23
–
Not connected
PWRD
26
I
Power down input. If high, conversions are inhibited and power consumption is significantly reduced.
Results from the previous conversion are maintained in the output shift register.
R/C
21
I
Read/convert input. With CS low, a falling edge on R/C puts the internal sample-and-hold into the hold
state and starts a conversion. When EXT/INT is low, this also initiates the transmission of the data
results from the previous conversion. If EXT/INT is high, a rising edge on R/C with CS low, or a falling
edge on CS with R/C high, initiates the transmission of data from the previous conversion.
REF
7
I/O
R1IN
1
I
Analog input. See Table 3 for input range connections.
R2IN
3
I
Analog input. See Table 3 for input range connections.
R3IN
4
I
Analog input. See Table 3 for input range connections.
SB/BTC
12
O
Select straight binary or binary two's complement data output format. If high, data are output in a
straight binary format. If low, data are output in a binary two's complement format.
SYNC
15
O
Sync output. This pin is used to supply a data synchronization pulse when the EXT level is high and at
least one external clock pulse has occurred when not in the read mode. See the External DATACLK
section for the external clock mode description.
TAG
19
I
Tag input for use in the external clock mode. If EXT is high, digital data input from TAG is output on
DATA with a delay that depends on the external clock mode. See Figure 8 and Figure 9.
VANA
27
I
Analog supply input. Nominally +5V. Connect directly to pin 20, and decouple to ground with 0.1µF
ceramic and 10µF tantalum capacitors.
VDIG
28
I
Digital supply input. Connect directly to pin 19.
Reference input/output. Outputs internal 4.096V reference. Can also be driven by external system
reference. In both cases, bypass to ground with a 2.2µF tantalum capacitor.
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TIMING REQUIREMENTS, TA = –40°C to +85°C
PARAMETER
MIN
TYP
MAX
6
20
ns
2.2
µs
tw1
Pulse duration, convert
td1
Delay time, BUSY from R/C low
tw2
Pulse duration, BUSY low
td2
Delay time, BUSY, after end of conversion
5
td3
Delay time, aperture
5
tconv
Conversion time
tacq
Acquisition time
tconv + tacq
40
UNIT
ns
ns
ns
2.2
µs
µs
1.8
Cycle time
4
µs
td4
Delay time, R/C Low to internal DATACLK output
270
ns
tc1
Cycle time, internal DATACLK
110
ns
td5
Delay time, data valid to internal DATACLK high
15
35
ns
td6
Delay time, data valid after internal DATACLK low
20
35
ns
tc2
Cycle time, external DATACLK
35
ns
tw3
Pulse duration, external DATACLK high
15
ns
tw4
Pulse duration, external DATACLK low
15
ns
tsu1
Setup time, R/C rise/fall to external DATACLK high
15
ns
tsu2
Setup time, R/C transition to CS transition
10
td7
Delay time, SYNC, after external DATACLK high
3
35
ns
td8
Delay time, data valid from external DATACLK high
2
13
ns
td9
Delay time, CS rising edge to external DATACLK rising edge
td10
tsu3
td11
Delay time, final external DATACLK to BUSY rising edge
tsu4
Setup time, TAG valid
0
ns
th1
Hold time, TAG valid
2
ns
ns
10
ns
Delay time, previous data available after CS, R/C low
2
µs
Setup time, BUSY transition to first external DATACLK
5
ns
1
µs
TIMING DIAGRAMS
CS
R/C
R/C
CS
tsu1
tsu1
tsu1
External
DATACLK
tsu1
External
DATACLK
CS Set Low, Discontinuous Ext DATACLK
R/C Set Low, Discontinuous Ext DATACLK
BUSY
CS
tsu2
tsu2
tsu3
External
DATACLK
R/C
Setup Time, R/C to CS
1
2
CS Set Low, Discontinuous Ext DATACLK
Figure 1. Critical Timing
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TIMING DIAGRAMS (continued)
tw1
tw1
R/C
td1
td1
tw2
tw2
BUSY
td2
td3
STATUS
Error
Correction
Nth Conversion
td2
td11
td3
td11
Error
(N+1)th Conversion Correction
(N+1)th Accquisition
tconv
tconv
tacq
tc1
td4
(N+2)th Accquisition
tacq
td4
Internal
1
DATACLK
2
16
16
td6
td5
DATA
2
1
D15
TAG = 0
TAG = 0
D0
D15
D0
TAG = 0
Nth Conversion Data
(N−1)th Conversion Data
CS, EXT/INT, and TAG are tied low
8 starts READ
Figure 2. Basic Conversion Timing: Internal DATACLK (Read Previous Data During Conversion)
tw1
tw1
R/C
td1
td1
tw2
tw2
BUSY
td2
td3
STATUS
Error
Correction
Nth Conversion
td2
td3
td11
td11
(N+1)th Accquisition
(N+1)th Conversion
tacq
tconv
(N+2)th Accquisition
tacq
tconv
tsu3
tsu1
Error
Correction
tsu3
tsu1
External
1
DATACLK
DATA TAG = 0
16
No more
data to
shift out
1
TAG = 0
EXT/INT tied high, CS and TAG are tied low
2
1
16
Nth Data
TAG = 0
16
1
No more
data to
shift out
TAG = 0
2
16
(N+1)th Data
TAG = 0
tw1 + tsu1 starts READ
Figure 3. Basic Conversion Timing: External DATACLK
8
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TIMING DIAGRAMS (continued)
tw1
R/C
td1
tsu1
tw2
td1
BUSY
td2
td3
td3
td11
STATUS
Nth Conversion
Error
Correction
(N+1) th Accquisition
tsu3
tconv
tacq
tc2
tw3
External
tsu1
tw4
DATACLK
0
1
2
3
4
5
10
11
12
13
14
15
16
SYNC = 0
td8
D14
D13
D12
D11
D10
D05
D04
D03
D02
D01
D00
Null
T00
Txx
T02
T03
T04
T05
T06
T11
T12
T13
T14
T15
T16
Null
T17
Tyy
th1
tsu4
TAG
td8
Nth Conversion Data
D15
DATA
T00
T01
EXT/INT tied high, CS tied low
tw1 + tsu1 starts READ
Figure 4. Read After Conversion (Discontinuous External DATACLK)
tw1
R/C
td1
tw2
BUSY
td10
td3
td2
Error
Correction
Nth Conversion
STATUS
tsu3
tconv
tc2
External
tsu1
tw3
1
0
DATACLK
td11
tw4
2
3
4
5
10
11
12
13
14
15
16
SYNC = 0
td8
Nth Conversion Data
D15
DATA
EXT/INT tied high, CS and TAG tied low
D14
D13
D12
D11
D10
D05
D04
D03
td8
D02
D01
D00
Rising DATACLK change DATA, tw1 + tsu1 Starts READ
TAG is not recommended for this mode. There is not enough
time to do so without violating td11.
Figure 5. Read During Conversion (Discontinuous External DATACLK)
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TIMING DIAGRAMS (continued)
tw1
R/C
td1
tsu1
td1
tsu1
tw2
BUSY
td2
td3
td3
td11
Error
Nth Conversion Correction
STATUS
(N+1)th Accquisition
tconv
tacq
tc2
tsu3
tsu1
External
0
DATACLK
tsu1
tw4
tw3
1
2
3
4
5
6
7
12
13
14
15
16
17
18
tc2
td7
SYNC =0
td8
Nth Conversion Data
D15
DATA
td8
D14
D13
D12
D11
D10
D05
D04
D03
D02
D01
D00
Null
T02
T03
T04
T05
T06
T11
T12
T13
T14
T15
T16
T17
T00
Txx
th1
tsu4
TAG
T00
T01
Tyy
tw1 + tsu1 starts READ
EXT/INT tied high, CS tied low
Figure 6. Read After Conversion With SYNC (Discontinuous External DATACLK)
tw1
R/C
td1
tw2
BUSY
td3
td10
td2
Error
Correction
Nth Conversion
STATUS
tsu3
tconv
tsu1
tsu1
External
tw3
tsu1
0
DATACLK
tc2
tw4
1
2
3
td11
4
5
6
7
12
13
14
15
16
17
18
td7
tc2
SYNC = 0
td8
DATA
EXT/INT tied high, CS and TAG tied low
td8
Nth Conversion Data
D15
D14
D13
D12
D11
D10
D05
D04
D03
D02
D01
D00
tw1 + tsu1 Starts READ
TAG is not recommended for this mode. There is not enough
time to do so without violating td11.
Figure 7. Read During Conversion With SYNC (Discontinuous External DATACLK)
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Tag 18
Tag 17
Tag 16
Tag 15
Tag 2
Tag 0
Tag 1
Bit 15 (MSB)
t c2
t su2
t su1
0
TAG
DATA
SYNC
BUSY
R/C
CS
External
DATACLK
t w1
t su2
t d1
t w3
t d7
1
t c2
t w4
2
t d8
3
Bit 14
4
Bit 1
17
18
Bit 0 (LSB)
Tag 0
t d9
Tag 1
Tag 19
TIMING DIAGRAMS (continued)
Figure 8. Conversion and Read Timing with Continuous External DATACLK (EXT/INT Tied High) Read
After Conversions (Not Recommended)
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Tag 18
Tag 17
Tag 1
TAG
Tag 16
Bit 15 (MSB)
DATA
SYNC
t d1
BUSY
R/C
CS
External
DATACLK
t su2
t w3
t c2
t w1
t w4
t su1
t su1
Tag 0
t c2
t d8
t d10
Bit 0 (LSB)
Tag 0
t d8
Tag 1
Tag 19
TIMING DIAGRAMS (continued)
Figure 9. Conversion and Read Timing with Continuous External DATACLK (EXT/INT Tied High) Read
Previous Conversion Results During Conversion (Not Recommended)
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TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
HISTOGRAM
25
8000
6930
4000
3000
2000
712
547
65531
65532
Code
65533
4.096
4.094
4.092
-20
0
20
40
60
TA - Free-Air Temperature - °C
4.09
-40
80
-20
0
20
40
60
TA - Free-Air Temperature - °C
80
Figure 12.
BIPOLAR ZERO ERROR
vs
FREE-AIR TEMPERATURE
POSITIVE FULL-SCALE ERROR
vs
FREE-AIR TEMPERATURE
NEGATIVE FULL-SCALE ERROR
vs
FREE-AIR TEMPERATURE
3
2
1
0
-1
-2
-3
-20
0
20
40
60
TA - Free-Air Temperature - °C
0.25
0.20
Internal Reference
±10V Range
0.15
0.10
0.05
0
-0.05
-0.10
-0.15
-0.20
-0.25
-40
80
NFSE - Negative Full-Scale Error - %FSR
PFSE - Positive Full-Scale Error - %FSR
BPZ - Bipolar Zero Error - mV
18
4.098
Figure 11.
-4
-20
0
20
40
60
TA - Free-Air Temperature - °C
80
0.25
0.20
0.15
Internal Reference
±10V Range
0.10
0.05
0
-0.05
-0.10
-0.15
-0.20
-0.25
-40
-20
0
20
40
60
TA - Free-Air Temperature - °C
80
Figure 13.
Figure 14.
Figure 15.
POSITIVE FULL-SCALE ERROR
vs
FREE-AIR TEMPERATURE
NEGATIVE FULL-SCALE ERROR
vs
FREE-AIR TEMPERATURE
SPURIOUS FREE DYNAMIC RANGE
vs
FREE-AIR TEMPERATURE
0.1
NFSE - Negative Full-Scale Error - %FSR
PFSE - Positive Full-Scale Error - %FSR
19
4.1
Figure 10.
Internal Reference
±10V Range
0.08
20
15
-40
65534
5
-5
-40
21
16
2
65530
22
17
1
0
23
External Reference
±10V Range
0.06
0.04
0.02
0
-0.02
-0.04
-0.06
-0.08
-0.1
-40
-20
0
20
40
60
TA - Free-Air Temperature - °C
80
Figure 16.
0.1
0.08
SFDR - Spurious Free Dynamic Range - dB
Count
5000
4.102
Internal Reference Voltage - V
ICC - Supply Current - mA
6000
1000
4.104
24
7000
4
INTERNAL VOLTAGE REFERENCE
vs
FREE-AIR TEMPERATURE
External Reference
±10V Range
0.06
0.04
0.02
0
-0.02
-0.04
-0.06
-0.08
-0.1
-40
-20
0
20
40
60
TA - Free-Air Temperature - °C
Figure 17.
80
105
100
fS = 250kSPS
fI = 20kHz
95
90
85
80
75
70
-40
-20
0
20
40
60
TA - Free-Air Temperature - °C
Figure 18.
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TYPICAL CHARACTERISTICS (continued)
TOTAL HARMONIC DISTORTION
vs
FREE-AIR TEMPERATURE
SIGNAL-TO-NOISE RATIO
vs
FREE-AIR TEMPERATURE
-95
-90
-85
-80
-75
fS = 250kSPS
fI = 20kHz
fS = 250kSPS
fI = 20kHz
95
90
85
80
75
70
-40
-20
0
20
40
60
80
TA - Free-Air Temperature - °C
0
40
-20
20
60
TA - Free-Air Temperature - °C
80
100
95
fS = 250kSPS
fI = 20kHz
90
85
80
75
70
-40
-20
0
20
40
60
TA - Free-Air Temperature - °C
80
Figure 20.
Figure 21.
SIGNAL-TO-NOISE AND DISTORTION
vs
INPUT FREQUENCY
SIGNAL-TO-NOISE RATIO
vs
INPUT FREQUENCY
SPURIOUS FREE DYNAMIC RANGE
vs
INPUT FREQUENCY
100
100
95
90
85
80
75
95
90
85
80
75
70
70
1
10
100
fi - Input Frequency - kHz
1
1000
Figure 22.
10
100
fi - Input Frequency - kHz
1000
Figure 23.
SFDR - Spurious Free Dynamic Range - dB
Figure 19.
SNR - Signal-to-Noise Ratio - dB
SINAD - Signal-to-Noise and Distortion - dB
-70
-40
SNR - Signal-to-Noise and Distortion - dB
100
SNR - Signal-to-Noise Ratio - dB
THD - Total Harmonic Distortion - dB
-100
SIGNAL-TO-NOISE AND DISTORTION
vs
FREE-AIR TEMPERATURE
105
100
95
90
85
80
75
70
1
10
100
fi - Input Frequency - kHz
1000
Figure 24.
TOTAL HARMONIC DISTORTION
vs
INPUT FREQUENCY
THD - Total Harmonic Distortion - dB
105
100
95
90
85
80
75
70
1
10
100
fi - Input Frequency - kHz
1000
Figure 25.
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TYPICAL CHARACTERISTICS (continued)
INL
2
1.5
INL - LSBs
1
0.5
0
-0.5
-1
-1.5
-2
0
10000
20000
30000
40000
50000
60000
70000
50000
60000
70000
Code
Figure 26.
DNL
2
1.5
DNL - LSBs
1
0.5
0
-0.5
-1
-1.5
-2
0
10000
20000
30000
40000
Code
Figure 27.
BASIC OPERATION
Two signals control conversion in the ADS8519: CS and R/C. These two signals are internally ORed together. To
start a conversion, the chip must be selected (CS low) and the conversion signal must be active (R/C low). Either
signal can be brought low first. Conversion starts on the falling edge of the second signal. BUSY goes low when
conversion starts and returns high after the data from that conversion are shifted into the internal storage
register. Sampling begins when BUSY goes high.
To reduce the number of control pins, CS can be tied low permanently. The R/C pin then controls conversion and
data reading exclusively. In the external clock mode, this configuration means that the ADS8519 clocks out data
whenever R/C is brought high and the external clock is active. In the internal clock mode, data are clocked out
every convert cycle, regardless of the states of CS and R/C. The ADS8519 provides a TAG input for cascading
multiple converters together.
READING DATA
The conversion result is available as soon as BUSY returns to high; therefore, data always represent the
conversion previously completed, even when it is read during a conversion. The ADS8519 outputs serial data in
either straight binary or binary two’s complement format. The SB/BTC pin controls the format. data are shifted
out MSB first. The first conversion immediately following a power-up does not produce a valid conversion result.
Data can be clocked out with either the internally-generated clock or with an external clock. The EXT/INT pin
controls this function. If an external clock is used, the TAG input can be used to daisy-chain multiple ADS8519
data pins together.
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INTERNAL DATACLK
In the internal clock mode, data for the previous conversion are clocked out during each conversion period. The
internal data clock is synchronized to the internal conversion clock so that it does not interfere with the
conversion process.
The DATACLK pin becomes an output when EXT/INT is low. 16 clock pulses are generated at the beginning of
each conversion after timing td4 is satisfied (that is, previous conversion results can only be read during the
current conversion). DATACLK returns to low when it is inactive. The 16 bits of serial data are shifted out of the
DATA pin synchronous to this clock, with each bit available on a rising and then a falling edge. The DATA pin
then returns to the state of the TAG pin input sensed at the start of transmission.
EXTERNAL DATACLK
The external clock mode offers several ways to retrieve conversion results. However, care must be taken to
avoid corrupting the data because the external clock cannot be synchronized to the internal conversion clock.
When EXT/INT is set high, the R/C and CS signals control the read state. When the read state is initiated, the
result from the previously completed conversion is shifted out of the DATA pin synchronous to the external clock
that is connected to the DATACLK pin. Each bit is available on a falling and then a rising edge. The maximum
external clock speed of 28.5MHz allows data to be shifted out quickly either at the beginning of conversion or the
beginning of sampling.
There are several modes of operation available when using an external clock. It is recommended that the
external clock run only while reading data. This mode is the discontinuous clock mode. Because the external
clock is not synchronized to the internal clock that controls conversion, slight changes in the external clock can
cause conflicts that can corrupt the conversion process. Specifications with a continuously running external clock
cannot be ensured. It is especially important that the external clock does not run during the second half of the
conversion cycle (approximately the time period specified by td11; see the Timing Requirements table).
In the discontinuous clock mode, data can be read during conversion or during sampling, with or without a SYNC
pulse. Data read during a conversion must meet the td11 timing specification. Data read during sampling must be
complete before starting a conversion.
Whether reading during sampling or during conversion, a SYNC pulse is generated whenever at least one rising
edge of the external clock occurs while the device is not in the read state. In the Discontinuous External Clock
with SYNC mode, a SYNC pulse follows the first rising edge after the read command. Data are shifted out after
the SYNC pulse. The first rising clock edge after the read command generates a SYNC pulse. The SYNC pulse
can be detected on the next falling edge and then the next rising edge. Successively, each bit can be read first
on the falling edge and then on the next rising edge. Thus, 17 clock pulses after the read command are required
to read on the falling edge; 18 clock pulses are necessary to read on the rising edge.
If the clock is entirely inactive when not in the read state, no SYNC pulse is generated. In this case, the first
rising clock edge shifts out the MSB. The MSB can be read on the first falling edge or on the next rising edge. In
this Discontinuous External Clock with No SYNC mode, 16 clocks are necessary to read the data on the falling
edge and 17 clocks for reading on the rising edge. Data always represent the conversion already completed.
Table 2 summarizes the required DATACLK pulses.
Table 2. DATACLK Pulses
DATACLK PULSES REQUIRED
16
DESCRIPTION
WITH SYNC
WITHOUT SYNC
Read on falling edge of DATACLK
17
16
Read on rising edge of DATACLK
18
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TAG FEATURE
The TAG feature allows the data from multiple ADS8519 converters to be read on a single serial line. The
converters are cascaded together using the DATA pins as outputs and the TAG pins as inputs, as illustrated in
Figure 28. The DATA pin of the last converter drives the processor serial data input. Data are then shifted
through each converter, synchronous to the externally supplied data clock, onto the serial data line. The internal
clock cannot be used for this configuration.
The preferred timing uses the discontinuous, external data clock during the sampling period. Data must be read
during the sampling period because there is not sufficient time to read data from multiple converters during a
conversion period without violating the td11 constraint (see External DATACLK section). The sampling period
must be sufficiently long to allow all data words to be read before starting a new conversion.
In Figure 28, note that a null bit separates the data word from each converter. The state of the DATA pin at the
end of a read cycle reflects the state of the TAG pin at the start of the cycle. This condition is true in all read
modes, including the internal clock mode. For example, when a single converter is used in the internal clock
mode, the state of the TAG pin determines the state of the DATA pin after all 16 bits have shifted out. When
multiple converters are cascaded together, this state forms the null bit that separates the words. Thus, with the
TAG pin of the first converter grounded as shown in Figure 28, the null bit becomes a zero between each data
word.
Processor
ADS8519A
DATA
CS
R/C
DATACLK
TAG
SCLK
ADS 8519B
TAG(A)
DATA
CS
R/C
DATACLK
TAG
TAG(B)
GPIO
GPIO
SDI
Null
D
A00
Q
D
Q
D
Null
D
A15
Q
D
Q
D
B00
DATA (A)
A16
Q
D
Q
D
B15
Q
B16
DATA (B)
Q
DATACLK
R/C
(both A & B)
BUSY
(both A & B)
SYNC
(both A & B)
External
DATACLK
1
2
3
4
16
17
DATA ( A )
A15
A14
A13
A01
A00
DATA ( B )
B15
B14
B13
B01
B00
18
19
20
21
Null
TAG(A) = 0
A
Nth Conversion Data
Null A15
A14 A13
B
EXT/INT tied high, CS of both converter A and B, TAG input of converter A are tied low.
34
A01
35
36
A00
Null
A
TAG(A) = 0
.
Figure 28. Timing of TAG Feature With Single Conversion (Using External DATACLK)
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ANALOG INPUTS
The ADS8519 has three analog input ranges, as shown in Table 3. The offset specification is factory-calibrated
with internal resistors. The gain specification is factory-calibrated with 0.1%, 0.25W, external resistors, as shown
in Figure 29 and Figure 30. The external resistors can be omitted if a larger gain error is acceptable or if using
software calibration. The hardware trim circuitry shown in Figure 29 and Figure 30 can reduce the error to zero.
Table 3. Input Range Connections
(see Figure 29 and Figure 30 for complete information)
ANALOG
INPUT
RANGE
CONNECT R1IN TO
CONNECT R2IN TO
CONNECT R3IN TO
IMPEDANCE
±10V
VIN
AGND
CAP
8.88kΩ
±10V
AGND
VIN
CAP
8.88kΩ
±5V
VIN
VIN
CAP
6.08kΩ
0V to 8.192V
AGND
AGND
VIN
5.95kΩ
Input Range
With Trim
(Adjust Gain)
Without Trim
0V − 8.192V
R1IN
AGND1
AGND1
R2IN
R2IN
R3IN
VIN
2.2µF
R1IN
CAP
+
2.2µF
+
R3IN
VIN
2.2µF
+
REF
CAP
+ 5V
576kΩ
50 kΩ
2.2µF
AGND2
+
REF
AGND2
Figure 29. Offset/Gain Circuits for Unipolar Input Ranges
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Input Range
With Trim
(Adjust Gain)
Without Trim
VIN
R1IN
±10V
AGND1
AGND1
R2IN
R2IN
R3IN
R3IN
+5V
CAP
+
2.2µF
2.2µF
+
R1IN
VIN
50kΩ
REF
2.2µF
576kΩ
+
CAP
REF
2.2µF
+
AGND2
VIN
R1IN
R1IN
AGND1
AGND1
R2IN
±5V
AGND2
VIN
R2IN
R3IN
2.2µF
+5V
CAP
+
2.2µF
2.2µF
+
REF
50kΩ
R3IN
+
CAP
576kΩ
REF
+
AGND2
2.2µF
AGND2
Figure 30. Offset/Gain Circuits for Bipolar Input Ranges
Analog input pins R1IN, R2IN, and R3IN have ±25V overvoltage protection. The input signal must be referenced to
AGND1. This referencing minimizes the ground-loop problem typical to analog designs. The analog input should
be driven by a low-impedance source. A typical driving circuit using the OPA627 or OPA132 is shown in
Figure 30.
The ADS8519 can operate with its internal 4.096V reference or an external reference. An external reference
connected to pin 6 (REF) bypasses the internal reference. The external reference must drive the 4kΩ resistor
that separates pin 6 from the internal reference (see the illustration on page 1). The load varies with the
difference between the internal and external reference voltages. The external reference voltage can vary from
3.9V to 4.2V. The internal reference is approximately 4.096V. The reference, whether internal or external, is
buffered internally with the output on pin 5 (CAP).
The ADS8519 is factory-tested with 2.2µF capacitors connected to pin 5 (CAP) and pin 6 (REF). Each capacitor
should be placed as close as possible to its pin. The capacitor on pin 6 band-limits the internal reference noise.
A smaller capacitor can be used, but it may degrade SNR and SINAD The capacitor on pin 5 stabilizes the
reference buffer and provides switching charge to the CDAC during conversion. Capacitors smaller than 1µF
may cause the buffer to become unstable and not hold sufficient charge for the CDAC. The parts are tested to
specifications with 2.2µF, so larger capacitors are not necessary. The equivalent series resistance (ESR) of
these compensation capacitors is also critical. Keep the total ESR under 3Ω. See the Typical Characteristics
section concerning how ESR affects performance.
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Neither the internal reference nor the buffer should be used to drive an external load. Such loading can degrade
performance. Any load on the internal reference causes a voltage drop across the 4kΩ resistor and affects gain.
The internal buffer is capable of driving ±2mA loads, but any load can cause perturbations of the reference at the
CDAC, degrading performance. It should be pointed out that, unlike other devices with a similar input structure,
the ADS8519 does not require a second high-speed amplifier used as a buffer to isolate the CAP pin from the
signal-dependent current in the R3IN pin, but can tolerate it if one does exist.
The external reference voltage can vary from 3.9V to 4.2V. The reference voltage determines the size of the
least significant bit (LSB). The larger reference voltages produce a larger LSB, which can improve SNR. Smaller
reference voltages can degrade SNR.
+15V
2.2mF
22pF
ADS8519
100nF
R1IN
GND
2kW
AGND
Pin 7
2kW
Pin 2
Vin
22pF
Pin 1
−
OPA627
or OPA132
+
Pin3
R2IN
Pin6
R3IN
Pin4
CAP
2.2mF
GND
2.2mF
AGND2
GND
100nF
2.2mF
−15V
GND
Figure 31. Typical Driving Circuitry (±10V, No Trim)
Table 4. Control Truth Table
SPECIFIC FUNCTION
Initiate conversion and
output data using internal
clock
Initiate conversion and
output data using external
clock
No actions
CS
R/C
BUSY
EXT/INT
DATACLK
PWRD
SB/BTC
OPERATION
1>0
0
1
0
Output
0
x
0
1>0
1
0
Output
0
x
Initiates conversion n. Data from conversion n - 1
clocked out on DATA synchronized to 16 clock
pulses output on DATACLK.
1>0
0
1
1
Input
0
x
Initiates conversion n.
0
1>0
1
1
Input
0
x
Initiates conversion n.
1>0
1
1
1
Input
x
x
Outputs data with or without SYNC pulse. See the
Reading Data section.
1>0
1
0
1
Input
0
x
0
0>1
0
1
Input
0
x
Outputs data with or without SYNC pulse. See
Reading Data section.
0
0
0>1
x
x
0
x
This is an acceptable condition.
x
x
x
x
x
0
x
Analog circuitry powered. Conversion can
proceed..
x
x
x
x
x
1
x
Analog circuitry disabled. Data from previous
conversion maintained in output registers.
x
x
x
x
x
x
0
Serial data are output in binary two's complement
format.
x
x
x
x
x
x
1
Serial data are output in straight binary format.
Power down
Selecting output format
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Table 5. Output Codes and Ideal Input Voltages
DESCRIPTION
ANALOG INPUT RANGE
DIGITAL OUTPUT
Full-scale range
±10V
±5V
0V to 8.192V
BINARY TWO'S COMPLEMENT
(SB/BTC LOW)
STRAIGHT BINARY
(SB/BTC HIGH)
Least significant
bit (LSB)
305µV
153µV
125µV
BINARY CODE
HEX CODE
BINARY CODE
HEX CODE
+Full-scale
(FS – 1LSB)
9.999695V
4.999847V
8.191875V
0111 1111 1111 1111
7FFF
1111 1111 1111 1111
FFFF
Midscale
0V
0V
4.096V
0000 0000 0000 0000
0000
1000 0000 0000 0000
8000
One LSB below
midscale
–305µV
153µV
4.095975V
1111 1111 1111 1111
FFFF
0111 1111 1111 1111
7FFF
–Full scale
–10V
–5V
0V
1000 0000 0000 0000
8000
0000 0000 0000 0000
0000
1
± 10V
2
+5V
2.2mF
+
175kW
20kW
Gain
30kW
3
4
+
VIN
1
± 10V
2
AGND1
2.2mF
5
AGND2
(a) ± 10V With Hardware Trim
3
4
CAP
2.2mF
2.2mF
+
REF
VIN
AGND1
REF
CAP
+
5
AGND2
(b) ± 10V Without Hardware Trim
Note: Use 1% metal film resistors.
Figure 32. Gain Adjust Trim
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PACKAGE OPTION ADDENDUM
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20-Mar-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ADS8519IBDB
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8519IBDBG4
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8519IBDBR
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8519IBDBRG4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8519IDB
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8519IDBG4
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8519IDBR
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8519IDBRG4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Jul-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ADS8519IBDBR
SSOP
DB
28
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
ADS8519IDBR
SSOP
DB
28
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Jul-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS8519IBDBR
SSOP
DB
28
2000
346.0
346.0
33.0
ADS8519IDBR
SSOP
DB
28
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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• DALLAS, TEXAS 75265
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