Rohm BD8303MUV-E2 Step-up/down, high-efficiency switching regulators (controller type) Datasheet

Large Current External FET Controller Type Switching Regulators
Step-up/down, High-efficiency
Switching Regulators (Controller type)
No.13028EBT02
BD8303MUV
● General Description
ROHM’s highly-efficient step-up/down switching regulator BD8303MUV generates step-up/down output including 3.3 V / 5 V
from 1 cell of lithium battery, 4 batteries, or 2 cells of Li batteries with just one inductor.
This IC adopts an original step-up/down drive system and creates a higher efficient power supply than conventional
Sepic-system or H-bridge system switching regulators.
● Features
1)Highly-efficient step-up/down DC/DC converter to be constructed just with one inductor.
2) Supports a wide range of power supply voltage range (input voltage: 2.7 V - 14.0 V)
3) Supports high-current application with external Nch FET.
4) Incorporates soft-start function.
5) Incorporates timer latch system short protecting function.
6) High heat radiation surface mounted package QFN16 pin, 3 mm × 3 mm
● Application
General portable equipment like DVC, single-lens reflex cameras, portable DVDs, or mobile PCs
● Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
15
7
V
V
7
V
20
V
Power dissipation
Operating temperature range
Storage temperature range
VCC
VREG
Between BOOT
1, 2 and SW 1, 2
Between BOOT
1, 2 and GND
SW1, 2
Pd
Topr
Tstg
15
620
－25 to +85
－55 to +150
V
mW
°C
°C
Junction temperature
Tjmax
+150
°C
Maximum applied power voltage
When installed on a 70.0 mm × 70.0 mm × 1.6 mm glass epoxy board. The rating is reduced by 4.96 mW/°C at Ta = 25°C or more.
● Operating Conditions (Ta = 25°C)
Parameter
Symbol
Power supply voltage
Output voltage
Oscillation frequency
VCC
VOUT
fosc
Standard value
MIN
TYP
2.7
－
1.8
－
0.2
0.6
MAX
14
12
1.0
Unit
V
V
MHz
* These specifications are subject to change without advance notice for modifications and other reasons.
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2013.07 - Rev.B
Technical Note
BD8303MUV
● Electrical Characteristics
(Unless otherwise specified, Ta = 25 °C, VCC = 7.4 V)
Parameter
Symbol
Minimum
Target Value
Typical
Maximum
[Low voltage input malfunction preventing circuit]
Detection threshold voltage
VUV
Hysteresis range
ΔVUVhy
50
[Oscillator]
Oscillation frequency
fosc
480
[Regulator]
Output voltage
VREG
4.7
[Error AMP]
INV threshold voltage
VINV
0.9875
Input bias current
IINV
-50
Soft-start time
Tss
2.4
Output source current
IEO
10
Output sink current
IEI
0.6
[PWM comparator]
SW1 Max Duty
Dmax1
85
SW2 Max Duty
Dmax2
85
SW2 Min Duty
Dmin2
5
[Output]
HG1, 2 High side ON resistance
RONHp
HG1, 2 Low side ON resistance
RONHn
LG1, 2 High side ON resistance
RONLp
LG1, 2 Low side ON resistance
RONLn
HG1-LG1 dead time
Tdead1
50
HG2-LG2 dead time
Tdead2
50
[STB]
Operation
VSTBH
2.5
STB pin
control voltage No-operation
VSTBL
-0.3
STB pin pull-down resistance
250
RSTB
[Circuit current]
Standby
VCC pin
ISTB
current
Circuit current at operation
Icc1
VCC
Circuit current at operation
Icc2
BOOT1,2
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Unit
Conditions
2.4
100
2.6
200
V
mV
VREG monitor
600
720
kHz
RT=51kΩ
5.1
5.5
V
1.00
0
4.0
20
1.3
1.0125
50
5.6
30
3
V
nA
msec
μA
mA
90
90
10
95
95
15
%
%
%
4
4
4
4
100
100
8
8
8
8
200
200
Ω
Ω
Ω
Ω
nsec
nsec
400
VCC
0.3
700
V
V
kΩ
-
1
μA
650
1000
μA
VINV=1.2V
120
240
μA
VINV=1.2V
Vcc=12.0V , IINV=6.0V
RT=51kΩ
VINV=0.8V , VFB =1.5V
VINV=1.2V , VFB =1.5V
HG1 ON
LG2 ON
LG2 OFF
2013.07 - Rev.B
Technical Note
BD8303MUV
● Reference Data
1.050
6.0
1.050
1.000
0.975
VREG VOLTAGE [V]
VREF VOLTAGE [V]
VREF VOLTAGE [V]
5.0
1.025
1.025
1.000
0.975
4.0
3.0
2.0
1.0
0.950
0
5
10
0.950
15
0.0
-40
VCC VOLTAGE [V]
0
40
80
120
0
5
AMBIENT TEMPERATURE[℃]
Fig.2 Standard voltage Temperature property
Fig.1 Standard voltage Power supply property
5.300
10
15
VCC VOLTAGE [V]
Fig.3 VREG voltage Power supply property
700
800
680
5.100
5.000
4.900
VREF VOLTAGE [V]
VREF VOLTAGE [V]
VREF VOLTAGE [V]
5.200
700
600
500
4.800
660
640
620
600
580
560
540
520
400
4.700
-40
0
40
80
500
0
120
5
10
15
AMBIENT TEMPERATURE[℃]
VCC VOLTAGE [V]
Fig.4 VREG voltage –
Temperature property
Fig.5 Oscillation frequency –
Power supply property
VCC CURRENT [uA]
600
500
400
300
200
700
650
600
550
100
0
5
10
15
VCC VOLTAGE [V]
Fig.7 ICC - Power supply
property
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120
140
120
100
80
60
40
20
0
500
0
80
Fig.6 Oscillation frequency Temperature property
BOOT PIN CURRENT [uA]
750
700
40
160
900
800
0
AMBIENT TEMPERATURE[℃]
800
1000
VCC CURRENT [uA]
-40
-40
0
40
80
120
0
1
2
3
4
5
6
VCC VOLTAGE [V]
BOOT PIN VOLTAGE [V]
Fig.8 ICC - Temperature
property
Fig.9 IBOOT - Power supply
property
3/15
2013.07 - Rev.B
Technical Note
BD8303MUV
5.050
100
5.050
5.025
5.000
4.975
80
5.025
EFFICIENCY [%]
VOUT VOLTAGE [V]
VOUT VOLTAGE [V]
90
5.000
4.975
70
60
50
40
30
20
10
4.950
0
4.950
0
5
10
15
0
VCC VOLTAGE [V]
500
1000
0
1500
LOAD CURRENT [mA]
Fig.10 Line regulation
500
1000
1500
LOAD CURRENT [mA]
Fig.12 MAX Duty / MIN Duty
temperature property
Fig.11 Load regulation
STB(5.0V/div)
VOUT(100mV/div)
SW1 oscillation
waveform (2.0V/div)
VOUT(2.0V/div)
ILOAD(500mA/div)
SW2 oscillation
waveform (2.0V/div)
Input current (200mA/div)
Fig.13 Starting waveform
(Example of Application Circuit [2])
L=10uH, Cout = 47 uH, fosc = 750
kHz, unloaded
Fig.14 Oscillation waveform
VCC = 5.0 V, Vout = 5.0 V
I LOAD = 1000 mA
Fig.15 Load variation waveform
(Example of Application Circuit [2])
VCC = 7.4 V, Vout = 5.0 V,
I LOAD = 200 mA1000 mA :40 mA/usec
100
100
90
90
90
80
80
80
70
60
50
40
30
EFFICIENCY [%]
100
EFFICIENCY [%]
EFFICIENCY [%]
500usec/div
500usec/div
70
60
50
40
30
70
60
50
40
30
20
20
20
10
10
10
0
0
0
1000
2000
3000
LOAD CURRENT [mA]
0
0
500
1000
1500
LOAD CURRENT [mA]
Fig.16
Efficiency data (VOUT = 3.3 V)
Example of Application Circuit [1]
Fig.17
Efficiency data (VOUT = 5.0 V)
Example of Application Circuit [2]
0
500
1000
1500
2000
LOAD CURRENT [mA]
Fig.18
Efficiency data (VOUT = 8.4 V)
Example of Application Circuit [3]
● Package Heat Reduction Curve
POWER DISSIPATION [mW]
700
600
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE[℃]
Fig.19 heat reduction curve (IC alone)
When used at Ta = 25°C or more, it is reduced by 4.96 mW/°C.
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4/15
2013.07 - Rev.B
Technical Note
BD8303MUV
Pin No.
Pin Name
Function
1
RT
Oscillation frequency set terminal
2
INV
Error AMP input terminal
3
FB
Error AMP output terminal
4
GND
Ground terminal
5
STB
HG1
BOOT1
VREG
VCC
● Description of Pins
RT
SW1
INV
LG1
6
BOOT2
PGND
7
HG2
LG2
8
SW2
9
LG2
10
PGND
11
LG1
12
SW1
13
HG1
14
BOOT1
15
VREG
ON/OFF terminal
Output side high-side driver input
terminal
Output side high-side FET gate drive
terminal
Output side coil connecting terminal
Output side low-side FET gate drive
terminal
Driver part ground terminal
Input side low-side FET gate drive
terminal
Input side coil connecting terminal
Input side high-side FET gate drive
terminal
Input side high-side driver input
terminal
5 V internal regulator output terminal
16
VCC
Power input terminal
FB
SW2
HG2
BOOT2
STB
GND
Fig. 20 Pin layout
● Block Diagram
OSC
HG1
VREG
VCC
UVLO
RT
BOOT1
VBAT
PRE
DRIVER
VREG
VOUT
SW1
VREF
VREF
1.0V
+
ERROR AMP
TIMMING
CONTROL
PWM
CONTROL
FB=H
PGND
TIMMING
CONTROL
SCP
LG2
OSC x 8200 count
PRE
DRIVER
BOOT2
STB
ON/OFF
LOGIC
HG2
GND
LG1
VREG
FB
PRE
DRIVER
SOFT
START
OSC x 2400 count
SW2
INV
PRE
DRIVER
VREG
ON/OFF
Fig. 21 Block diagram
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2013.07 - Rev.B
Technical Note
BD8303MUV
● Description of Blocks
1.
VREF
This block generates ERROR AMP reference voltage.
The reference voltage is 1.0 V.
2. VREG
5.0 V output voltage regulator. Used as power supply for IC internal circuit and BOOT pin supply.
Follows power supply voltage when it is 5.0 V or below and also drops output voltage.
For external oscillation preventive capacitor, 1.0 uF is recommended.
3. UVLO
Circuit for preventing low voltage malfunction
Prevents malfunction of the internal circuit at activation of the power supply voltage or at low power supply voltage.
Monitors VREG pin voltage to turn off DC/DC converter output by changing output voltage of HG1, 2 and LG1, 2 pin to L-logic
when VREG voltage is 2.4 V or below, and reset the timer latch of the internal SCP circuit and soft-start circuit.
4.
SCP
Timer latch system short-circuit protection circuit
When the INV pin is the set 1.0 V or lower voltage, the internal SCP circuit starts counting.
The internal counter is in synch with OSC; the latch circuit activates after the counter counts about 8200 oscillations to turn off
DC/DC converter output (about 13.6 msec when RT = 51 kΩ).
To reset the latch circuit, turn off the STB pin once. Then, turn it on again or turn on the power supply voltage again.
5.
OSC
Oscillation circuit to change frequency by external resistance of the RT pin (1 pin).
When RT = 51 kΩ, operation frequency is set at 600 kHz.
6.
ERROR AMP
Error amplifier for detecting output signals and output PWM control signals
The internal reference voltage is set at 1.0 V.
7.
PWM COMP
Voltage-pulse width converter for controlling output voltage corresponding to input voltage
Comparing the internal SLOPE waveform with the ERROR AMP output voltage, PWM COMP controls the pulse width and
outputs to the driver.
Also controls Max Duty and Min Duty.
Max Duty and Min Duty are set at the primary side and the secondary side of the inductor respectively, which are as follows:
Primary side (SW1)
Secondary side (SW 2)
HG1 Max Duty
HG1 Min Duty
LG2 Max Duty
LG2 Min Duty
: About 90 %,
:
0%
: About 90 %,
: About 10 %,
8.
SOFT START
Circuit for preventing in-rush current at startup by bringing the output voltage of the DC/DC converter into a soft-start
Soft-start time is in synch with the internal OSC, and the output voltage of the DC/DC converter reaches the set voltage after
about 2400 oscillations (About 4 msec when RT = 51 kΩ).
9.
Nch DRIVER
CMOS inverter circuit for driving external Nch FET.
Dead time is provided for preventing feedthrough during switching of HG1 = L → LG1 = H, HG2 = L → LG2 = H and LG1 = L →
HG1 = H, LG2 = L → HG2 = H.
The dead time is set at about 100 nsec in the internal circuit.
10. ON/OFF LOGIC
Voltage applied on STB pin (5 pin) to control ON/OFF of IC. Turned ON when a voltage of 2.5 V or higher is applied and turned
OFF when the terminal is open or 0 V is applied.
Incorporates approximately 400 kΩ pull-down resistance.
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Technical Note
BD8303MUV
● Example of Application Circuit
* Example of application circuit: VCC = 2.7 – 5.5V, Vout = 3.3V, Iout = 100 mA – 2000 mA
VCC =
2.7 V – 5.5 V
Insert a filter
as required.
RB521CS-30
1μF
22μF
0.1μF
RB521CS-30
INV
10000p
HG1
RT
43k
BOOT1
VCC
VREG
0.1μF
51k
47μF
RTQ045N03
RTQ045N03
LG2
SW2
STB
BOOT2
GND
150p
SW1
VOUT (set at 3.3 V)
PGND
HG2
6.2k
100k
(TDK SLF10165) RTQ045N03
LG1
FB
7.5k
RTQ045N03
4.7μH
0.1μF
ON/OFF
Fig. 22 Example of application circuit (1)
* Example of application circuit: VCC=2.7 – 14 V,
Vout＝5.0 V,
Iout＝100 mA – 1500 mA
VCC =
2.7 V –14 V
Insert a filter
as required.
1μF
RB521CS-30
0.1μF
47μF
RB521CS-30
4700p
INV
HG1
BOOT1
RT
30k
VREG
VCC
0.1μF
51k
47μF
RTQ045N03
SW2
LG2
HG2
GND
PGND
BOOT2
120k
120p
SW1
VOUT (set at 5.0 V)
RTQ045N03
STB
4.7k
(TDK SLF10165) RTQ045N03
LG1
FB
5.1k
RTQ045N03
4.7μH
0.1μF
ON/OFF
Fig. 23 Example of application circuit (2)
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7/15
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Technical Note
BD8303MUV
* Example of application circuit: VCC=4.0 – 14 V,
Vout＝8.4 V,
Iout＝100 mA – 1500 mA
VCC =
4.0V – 14V
Insert a filter
as required.
1μF
RB521CS-30
47μF
0.1μF
RB521CS-30
4700p
INV
HG1
BOOT1
VCC
RT
27k
VREG
0.1μF
100k
47μF×2
RSS065N03
RSS065N03
LG2
SW2
STB
BOOT2
GND
100p
SW1
VOUT (set at 8.4 V)
PGND
HG2
3.9k
200k
(TDK SLF10165) RSS065N03
LG1
FB
7.5k
RSS065N03
4.7μH
0.1μF
ON/OFF
Fig. 24 Example of application circuit (3)
* Example of application circuit:VCC=5– 14 V,
Vout＝12 V,
Iout＝100 mA – 1500 mA
VCC =
5 V – 14 V
Insert a filter
as required.
1μF
RB521CS-30
10μF
0.1μF
RB521CS-30
RTQ045N03
10μH
INV
HG1
BOOT1
VCC
RT
30k
VREG
0.1μF
27k
(TDK SLF10165) RTQ045N03
SW1
47μF
LG1
RTQ045N03
1500p
FB
RTQ045N03
SW2
LG2
HG2
180p
GND
PGND
BOOT2
15k
330k
STB
5.1k
VOUT12V
0.1μF
ON/OFF
Fig. 25 Example of application circuit (4)
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Technical Note
BD8303MUV
● Selection of parts for applications
(1) Output inductor
A shielded inductor that satisfies the current rating (current value, Ipeak as shown in the drawing below) and has a low DCR
(direct current resistance component) is recommended.
Inductor values affect output ripple current greatly.
Ripple current can be reduced as the coil L value becomes larger and the
Δ IL
switching frequency becomes higher as the equations shown below.
Ipeak =Iout ×(Vout/VIN) /η＋ ∆IL/2 [A]
Vout
(Vin-Vout)
⊿IL=
×
Vin
|(Vin-Vout)|
L
(Vout-Vin)
f
[A] (in step-down mode)
×
Vin
×
Vout
L
(2)
1
Vout×2×0.8
×
(Vin+Vout)
⊿IL=
⊿IL=
1
×
L
Fig. 26Ripple current
(1)
×
[A]
((in step-up/down mode)
(3)
f
1
[A] (in step-up mode)
(4)
f
(η: Efficiency, ∆IL: Output ripple current, f: Switching frequency)
As a guide, output ripple current should be set at about 20 to 50% of the maximum output current.
* Current over the coil rating flowing in the coil brings the coil into magnetic saturation, which may lead to lower efficiency or
output oscillation. Select an inductor with an adequate margin so that the peak current does not exceed the rated current of
the coil.
(2) Output capacitor
A ceramic capacitor with low ESR is recommended for output in order to reduce output ripple.
There must be an adequate margin between the maximum rating and output voltage of the capacitor, taking the DC bias
property into consideration.
Output ripple voltage when ceramic capacitor is used is obtained by the following equation.
1
＋
Vpp=⊿IL×
⊿IL×RESR
[V]
・・・ (5)
2π×f×Co
Vpp = ∆IL ×
1
+
∆IL × RESR
[V] … (5)
2π×f×Co
Setting must be performed so that output ripple is within the allowable ripple voltage.
(3) External FET
An external FET which satisfies the following items and has small Ciss (input capacitance), Qg (total gate charge quantity) and
ON resistance should be selected. There must be an adequate margin between the turn OFF time of MOS and the dead time to
prevent through-current.
Drain-source voltage rating: (Output voltage + BodyDiode Vf of MOS or higher)
Gate-source voltage rating: 7.0 V or higher
Drain-source current rating: IPEAK of Output inductor paragraph or higher
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Technical Note
BD8303MUV
(5) BOOT-SW capacitor
The capacitor between BOOT and SW should be designed so that the gate drive voltage will not be below Vgs necessary for the
FET to use, taking circuit current input to the BOOT pin into consideration. There must be an adequate margin between the
maximum rating and gate drive voltage.
Gate drive voltage
= (VREG voltage) − (Vf of Di) − (Voltage drop by BOOT pin consumption) [V]
Voltage drop by BOOT pin consumption
＝ (Iboot × (1 / fosc) + Qg of external FET) / Cboot [V]
(6)
(7)
(6) REG-BOOT diode
A Schottky diode which satisfies the following items and has less forward pressure drop (Vf) should be selected.
Average rectified current: There must be an adequate margin against the current consumed by MOSFET switching.
DC inverse voltage: Input voltage or higher
(3) Setting of oscillation frequency
Oscillation frequency can be set using a resistance value connected to the RT pin (1 pin).
Oscillation frequency is set at 600 kHz when RT = 51 kΩ, and frequency is inversely proportional to RT value.
See Fig. 27 for the relationship between RT and frequency.
Soft-start time changes along with oscillation frequency.
See Fig. 28 for the relationship between RT and soft-start time.
100
SOFT START TIME [msec]
SWITCHNG FREQUENCY [kHz]
10000
1000
100
10
10
1
10
100
1000
10
RT PIN RESISTANCE [kΩ]
Fig. 27 Oscillation
resistance
frequency
100
1000
RT PIN RESISTANCE [kΩ]
–
RT
pin
Fig. 28 Soft-start time – RT pin resistance
* Note that the above example of frequency setting is just a design target value, and may differ from the actual equipment.
(4) Output voltage setting
The internal reference voltage of the ERROR AMP is 1.0 V.
Fig. 29.
Output voltage should be obtained by referring to Equation (8) of
VOUT
ERROR AMP
R1
INV
(R1+R2)
Vo=
×1.0 [V] … (8)
R2
R2
VREF
1.0V
Fig. 29 Setting of feedback resistance
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Technical Note
BD8303MUV
(9) Determination of external phase compensation
Condition for stable application
The condition for feedback system stability under negative feedback is as follows:
- Phase delay is 135 °or less when gain is 1 (0 dB) (Phase margin is 45° or higher)
Since DC/DC converter application is sampled according to the switching frequency, the GBW of the whole system (frequency
at which gain is 0 dB) must be set to be equal to or lower than 1/5 of the switching frequency.
In summary, target property of applications is as follows:
- Phase delay must be 135°or lower when gain is 1 (0 dB) (Phase margin is 45° or higher).
- The GBW at that time (frequency when gain is 0 dB) must be equal to or lower than 1/5 of the switching frequency.
For this reason, switching frequency must be increased to improve responsiveness.
One of the points to secure stability by phase compensation is to cancel secondary phase delay (-180°) generated by LC
resonance by the secondary phase lead (i.e. put two phase leads).
Since GBW is determined by the phase compensation capacitor attached to the error amplifier, when it is necessary to reduce
GBW, the capacitor should be made larger.
-20dB/decade
(A)
A
GAIN
C
[dB]
(B)
0
R
FB
0°
PHASE
[degree] -90°
Phase margin
-180°
Fig.30 General integrator
1
Error AMP is a low-pass filter because phase compensation such
as (1) and (2) is performed. For DC/DC converter application, R is a
parallel feedback resistance.
Point (A) fp=
[Hz]
2πRCA
1
Point (B) fGBW=2πRC
[Hz]
(9)
(10)
Fig.31 Frequency property of integrator
Phase compensation when output capacitor with low ESR such as ceramic capacitor is used is as follows:
When output capacitor with low ESR (several tens of mΩ) is used for output, secondary phase lead (two phase leads) must be
put to cancel secondary phase lead caused by LC.
One of the examples of phase compensation methods is as follows:
VOUT
1
C1
R1
Phase lead fz1=
R4
C2
R3
Phase lead fz2 =
FB
2πR1C1
1
2πR4C2
[Hz]
(11)
[Hz]
(12)
[Hz]
(13)
1
R2
Phase delay fp1 =
2πR3C1
1
LC resonance frequency =
2π√(LC)
Fig.32 Example of setting of phase compensation
[Hz]
(14)
For setting of phase-lead frequency, both of them should be put near LC resonance frequency.
When GBW frequency becomes too hjgh due to the secondary phase lead, it may get stabilized by putting the primary phase
delay in a frequency slightly higher than the LC resonance frequency to compensate it.
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c 2009 ROHM Co., Ltd. All rights reserved.
○
11/15
2013.07 - Rev.B
Technical Note
BD8303MUV
● Example of Board Layout
Fig.33 Example of Board Layout
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c 2009 ROHM Co., Ltd. All rights reserved.
○
12/15
2013.07 - Rev.B
Technical Note
BD8303MUV
● I/O Equivalence Circuit
RT
INV
VREG
VREG
VREG
VREG
RT
INV
GND
GND
FB
STB
VREG
VREG
VCC
VCC
FB
STB
GND
GND
BOOT1,2
HG1,2
SW1,2
LG1,2
PGND
VCC
VREG
GND
BOOT1,2
VREG
VCC
GND
PGND
SW1,2
VREG
LG1,2
HG1,2
PGND
Fig.34 I/O equivalence circuit
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c 2009 ROHM Co., Ltd. All rights reserved.
○
13/15
2013.07 - Rev.B
Technical Note
BD8303MUV
● Precautions for Use
1) Absolute Maximum Rating
We dedicate much attention to the quality control of these products, however the possibility of deterioration or destruction exists
if the impressed voltage, operating temperature range, etc., exceed the absolute maximum ratings. In addition, it is impossible to
predict all destructive situations such as short-circuit modes, open circuit modes, etc. If a special mode exceeding the absolute
maximum rating is expected, please review matters and provide physical safety means such as fuses, etc.
2) GND Potential
Keep the potential of the GND pin below the minimum potential at all times.
3) Thermal Design
Work out the thermal design with sufficient margin taking power dissipation (Pd) in the actual operation condition into account.
4) Short Circuit between Pins and Incorrect Mounting
Attention to IC direction or displacement is required when installing the IC on a PCB. If the IC is installed in the wrong way, it
may break. Also, the threat of destruction from short-circuits exists if foreign matter invades between outputs or the output and
GND of the power supply.
5) Operation under Strong Electromagnetic Field
Be careful of possible malfunctions under strong electromagnetic fields.
6) Common Impedance
When providing a power supply and GND wirings, show sufficient consideration for lowering common impedance and reducing
ripple (i.e., using thick short wiring, cutting ripple down by LC, etc.) as much as you can.
7) Thermal Protection Circuit (TSD Circuit)
This IC contains a thermal protection circuit (TSD circuit). The TSD circuit serves to shut off the IC from thermal runaway
and does not aim to protect or assure operation of the IC itself. Therefore, do not use the TSD circuit for continuous use or
operation after the circuit has tripped.
8) Rush Current at the Time of Power Activation
Be careful of the power supply coupling capacity and the width of the power supply and GND pattern wiring and routing since
rush current flows instantaneously at the time of power activation in the case of CMOS IC or ICs with multiple power supplies.
9) IC Terminal Input
This is a monolithic IC and has P+ isolation and a P substrate for element isolation between each element. P-N junctions are
formed and various parasitic elements are configured using these P layers and N layers of the individual elements.
For example, if a resistor and transistor are connected to a terminal as shown on Fig.-8:
○ The P-N junction operates as a parasitic diode when GND > (Terminal A) in the case of a resistor or when GND > (Pin B) in
the case of a transistor (NPN)
○ Also, a parasitic NPN transistor operates using the N layer of another element adjacent to the previous diode in the case of
a transistor (NPN) when GND > (Pin B).
The parasitic element consequently rises under the potential relationship because of the IC’s structure. The parasitic element
pulls interference that could cause malfunctions or destruction out of the circuit. Therefore, use caution to avoid the operation of
parasitic elements caused by applying voltage to an input terminal lower than the GND (P board), etc.
Transistor (NPN)
B
E
C
～
～
Resistor
(Pin B)
(Pin A)
GND
N
N
N
N
P
P＋
P＋
N
Ｎ
(Pin A)
P＋
～
～
P
P＋
N
Parasitic Element
P Substrate
P Substrate
Parasitic Element
Parasitic Element
GND
GND
Fig.35 Example of simple structure of Bipolar IC
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c 2009 ROHM Co., Ltd. All rights reserved.
○
14/15
2013.07 - Rev.B
Technical Note
BD8303MUV
 Ordering part number
B
D
8
Part No.
3
0
Part No.
3
M
U
V
-
E
Package
MUV: VQFN016V3030
2
Packaging and forming specification
E2: Embossed tape and reel
VQFN016V3030
3.0 ± 0.1
<Tape and Reel information>
Embossed carrier tape
Tape
3.0 ± 0.1
<Dimension>
Direction
of feed
1.0MAX
1PIN MARK
+ 0.03
− 0.02
0.02
1.4 ± 0.1
0.5
1.4 ± 0.1
0.4 ± 0.1
1234
8
12
0.75
1234
13
1234
5
1234
4
16
1234
1
1234
C0.2
(The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand)
(0.22)
S
0.08 S
3000pcs
E2
Quantity
9
0.25
+ 0.05
− 0.04
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c 2009 ROHM Co., Ltd. All rights reserved.
○
(Unit:mm)
Reel
15/15
1pin
Direction of feed
※When you order , please order in times the amount of package quantity.
2013.07 - Rev.B
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.