TI1 LMC7101BIM5 Tiny low-power operational amplifier Datasheet

Product
Folder
Sample &
Buy
Support &
Community
Tools &
Software
Technical
Documents
Reference
Design
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
LMC7101, LMC7101Q-Q1 Tiny Low-Power Operational Amplifier
With Rail-to-Rail Input and Output
1 Features
3 Description
•
The LMC7101 device is a high-performance CMOS
operational amplifier available in the space-saving 5pin SOT-23 tiny package. This makes the LMC7101
ideal for space- and weight-critical designs. The
performance is similar to a single amplifier of the
LMC6482 and LMC6484 types, with rail-to-rail input
and output, high open-loop gain, low distortion, and
low-supply currents.
1
•
•
•
•
•
•
•
Tiny 5-Pin SOT-23 Package Saves
Space—Typical Circuit Layouts Take Half the
Space of 8-Pin SOIC Designs
Ensured Specifications at 2.7-V, 3-V, 5-V, 15-V
Supplies
Typical Supply Current 0.5 mA at 5 V
Typical Total Harmonic Distortion of 0.01% at 5 V
1-MHz Gain Bandwidth
Similar to Popular LMC6482 and LMC6484
Rail-to-Rail Input and Output
Temperature Range –40°C to 125°C
(LMC7101Q-Q1)
The main benefits of the tiny package are most
apparent in small portable electronic devices, such as
mobile phones, pagers, notebook computers,
personal digital assistants, and PCMCIA cards. The
tiny amplifiers can be placed on a board where they
are needed, thus simplifying board layout.
Device Information(1)
2 Applications
•
•
•
•
•
PART NUMBER
Mobile Communications
Notebooks and PDAs
Battery Powered Products
Sensor Interface
Automotive Applications (LMC7101Q-Q1)
LMC7101,
LMC7101Q-Q1
PACKAGE
SOT-23 (5)
BODY SIZE (NOM)
2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Example Application
R2
V+
R1
–
OUT
IN
+
V–
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
6.12
7
1
1
1
2
3
4
Absolute Maximum Ratings ...................................... 4
ESD Ratings: LMC7101............................................ 4
ESD Ratings: LMC7101Q-Q1 ................................... 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 5
Electrical Characteristics: 2.7 V ................................ 5
DC Electrical Characteristics: 3 V ............................ 6
DC Electrical Characteristics: 5 V ............................. 7
DC Electrical Characteristics: 15 V .......................... 8
AC Electrical Characteristics: 5 V ........................... 9
AC Electrical Characteristics: 15 V ......................... 9
Typical Characteristics .......................................... 10
Detailed Description ............................................ 20
7.1
7.2
7.3
7.4
8
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
20
20
20
21
Application and Implementation ........................ 22
8.1 Application Information............................................ 22
8.2 Typical Application ................................................. 23
9 Power Supply Recommendations...................... 25
10 Layout................................................................... 25
10.1 Layout Guidelines ................................................. 25
10.2 Layout Example .................................................... 25
11 Device and Documentation Support ................. 26
11.1
11.2
11.3
11.4
11.5
11.6
Documentation Support ........................................
Related Links ........................................................
Community Resource............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
26
26
26
26
26
26
12 Mechanical, Packaging, and Orderable
Information ........................................................... 26
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (March 2013) to Revision G
•
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision E (March 2013) to Revision F
•
2
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 22
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
LMC7101, LMC7101Q-Q1
www.ti.com
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
5 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View
Pin Functions
PIN
NO.
NAME
TYPE
DESCRIPTION
1
OUTPUT
O
Output
2
V+
P
Positive Supply
3
INPUT+
I
Noninverting Input
4
INPUT–
I
Inverting Input
5
V–
P
Negative Supply
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
Submit Documentation Feedback
3
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN
Difference input voltage
UNIT
(V+) + 0.3, (V–) – 0.3
Voltage at input and output pins
+
MAX
±Supply Voltage
–
Supply voltage (V – V )
V
16
V
Current at input pin
–5
5
mA
Current at output pin (3)
–35
35
mA
Current at power supply pin
35
mA
Lead temperature (soldering, 10 sec.)
260
°C
150
°C
150
°C
Junction temperature
(4)
Storage temperature
(1)
(2)
(3)
(4)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, contact the TI Sales Office or Distributors for availability and specifications.
Applies to both single-supply and split-supply operation. Continuous short operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature at 150°C.
The maximum power dissipation is a function of TJ(MAX), RθJA and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly into a PC board.
6.2 ESD Ratings: LMC7101
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±1000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1000
Machine model (MM)
±200
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 ESD Ratings: LMC7101Q-Q1
VALUE
V(ESD)
(1)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±1000
Charged-device model (CDM), per JEDEC specification JESD22-C101
±1000
Machine model (MM)
±200
UNIT
V
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted). (1)
MIN
MAX
2.7
15.5
V
LMC7101AI, LMC7101BI
–40
85
°C
LMC7101Q-Q1
–40
125
°C
Supply voltage, V+
Junction Temperature, TJ
(1)
4
UNIT
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
LMC7101, LMC7101Q-Q1
www.ti.com
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
6.5 Thermal Information
LMC7101
THERMAL METRIC (1)
DBV (SOT-23)
UNIT
5 PINS
RθJA
Junction-to-ambient thermal resistance
170.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
124.7
°C/W
RθJB
Junction-to-board thermal resistance
30.8
°C/W
ψJT
Junction-to-top characterization parameter
17.7
°C/W
ψJB
Junction-to-board characterization parameter
30.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.6 Electrical Characteristics: 2.7 V
Unless otherwise specified, all limits specified for TJ = 25°C, V+ = 2.7 V, V– = 0 V, VCM = VO = V+ / 2 and RL > 1 MΩ.
PARAMETER
TEST CONDITIONS
V+ = 2.7 V
TYP (1)
LMC7101AI
MIN
0.11
LMC7101Q-Q1 (2)
LMC7101BI
MAX
MIN
6
MAX
MIN
9
UNIT
MAX
VOS
Input offset voltage average drift
TCVOS
Input offset voltage
9
IB
Input bias current
–40°C ≤ TJ ≤ 125°C
1
64
64
1000
IOS
Input offset current
–40°C ≤ TJ ≤ 125°C
0.5
32
32
2000
RIN
Input resistance
CMRR
Common-mode rejection ratio
0 V ≤ VCM ≤ 2.7 V
V+ = 2.7 V
VCM
Input common mode voltage
range
For CMRR ≥ 50 dB
PSRR
Power supply rejection ratio
V+ = 1.35 V to 1.65 V
V– = –1.35 V to –1.65 V
VCM = 0
CIN
Common-mode input capacitance
mV
μV/°C
1
pA
Tera Ω
>1
70
55
0
0
3
60
pA
50
50
0
2.7
dB
0
2.7
V
2.7
50
45
45
V
dB
3
pF
RL = 2 kΩ
2.45
2.15
2.15
2.15
RL = 10 kΩ
2.68
2.64
2.64
2.64
RL = 2 kΩ
0.25
0.5
0.5
0.5
RL = 10 kΩ
0.025
0.06
0.06
0.06
0.5
0.81
0.81
0.81
0.5
0.95
0.95
0.95
VO
Output swing, min
VO
Output swing, max
IS
Supply current
SR
Slew rate (3)
0.7
V/μs
GBW
Gain-bandwidth product
0.6
MHz
(1)
(2)
(3)
–40°C ≤ TJ ≤ 125°C
V
V
mA
Typical values represent the most likely parametric normal.
When operated at temperature between –40°C and 85°C, the LMC7101Q-Q1 will meet LMC7101BI specifications.
V+ = 15 V. Connected as a voltage follower with a 10-V step input. Number specified is the slower of the positive and negative slew
rates. RL = 100 kΩ connected to 7.5 V. Amplifier excited with 1 kHz to produce VO = 10 VPP.
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
Submit Documentation Feedback
5
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
6.7 DC Electrical Characteristics: 3 V
Unless otherwise specified, all limits specified for TJ = 25°C, V+ = 3 V, V– = 0 V, VCM = 1.5 V, VO = V+ / 2 and RL = 1 MΩ.
PARAMETER
TEST CONDITIONS
TYP (1)
64
1000
0.5
32
32
2000
–40°C ≤ TJ ≤ 125°C
IOS
Input offset current
–40°C ≤ TJ ≤ 125°C
RIN
Input resistance
CMRR
Common-mode rejection ratio
0 V ≤ VCM ≤ 3 V
V+ = 3 V
VCM
Input common-mode voltage
range
For CMRR ≥ 50 dB
PSRR
Power supply rejection ratio
V+ = 1.5 V to 7.5 V
V– = –1.5 V to –7.5 V
VO = VCM = 0
80
CIN
Common-mode input capacitance
RL = 2 kΩ
2.8
RL = 600 Ω
0.2
RL = 2 kΩ
2.7
RL = 600 Ω
0.37
–40°C ≤ TJ ≤ 125°C
0.5
Supply current
(1)
(2)
6
MAX
64
Input current
IS
MIN
1
Input offset voltage average drift
Output swing, max
MAX
9
IB
VO
MIN
7
TCVOS
Output swing, min
MAX
6
Input offset voltage
VO
MIN
LMC7101Q-Q1 (2)
LMC7101BI
4
VOS
–40°C ≤ TJ ≤ 125°C
LMC7101AI
0.11
7
UNIT
mV
μV/°C
1
pA
pA
Tera Ω
>1
74
64
0
0
3.3
60
60
0
3
db
0
3
3
68
60
60
2.6
2.6
2.6
V
dB
3
pF
0.4
2.5
0.4
2.5
0.4
2.5
0.6
0.6
0.6
0.81
0.81
0.81
0.95
0.95
0.95
V
V
mA
Typical values represent the most likely parametric normal.
When operated at temperature between –40°C and 85°C, the LMC7101Q-Q1 will meet LMC7101BI specifications.
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
LMC7101, LMC7101Q-Q1
www.ti.com
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
6.8 DC Electrical Characteristics: 5 V
Unless otherwise specified, all limits specified for TJ = 25°C, V+ = 5 V, V– = 0 V, VCM = 1.5 V, VO = V+/ 2 and RL = 1 MΩ.
PARAMETER
TEST CONDITIONS
V+ = 5 V
TYP (1)
LMC7101AI
MIN
LMC7101Q-Q1 (2)
LMC7101BI
MAX
MIN
MAX
MIN
MAX
0.11
3
7
7
0.11
5
9
9
VOS
Input offset voltage
TCVOS
Input offset voltage
average drift
IB
Input current
–40°C ≤ TJ ≤ 125°C
1
64
64
1000
IOS
Input offset current
–40°C ≤ TJ ≤ 125°C
0.5
32
32
2000
RIN
Input resistance
CMRR
Positive power supply
+PSRR
rejection ratio
Negative power supply
–PSRR
rejection ratio
VCM
mV
+
V = 5 V, –40°C ≤ TJ ≤ 125°C
Common-mode
rejection ratio
Input common-mode
voltage range
VO
0 V ≤ VCM ≤ 5 V
LMC7101Q-Q1 at 125°C
0.2 V ≤ VCM ≤ 4.8 V
db
55
55
V+ = 5 V to 15 V
V– = 0 V, VO = 1.5 V
82
70
65
65
V+ = 5 V to 15 V
V– = 0 V, VO = 1.5 V
–40°C ≤ TJ ≤ 125°C
82
65
62
62
V– = –5 V to –15 V
V+ = 0 V, VO = –1.5 V
82
70
65
65
V– = –5 V to –15 V
V+ = 0 V, VO = –1.5 V
–40°C ≤ TJ ≤ 125°C
82
65
62
62
dB
dB
For CMRR ≥ 50 dB
–0.3
–0.2
–0.2
–0.2
For CMRR ≥ 50 dB
–40°C ≤ TJ ≤ 125°C
–0.3
0
0
0.2
V
5.3
5.2
5.2
5.2
5.3
5
5
4.8
3
4.9
4.7
4.7
4.7
RL = 2 kΩ, –40°C ≤ TJ ≤ 125°C
4.9
4.6
4.6
4.54
V
0.1
0.18
0.18
0.18
–40°C ≤ TJ ≤ 125°C
0.1
0.24
0.24
0.28
RL = 600 Ω
4.7
4.5
4.5
4.5
RL = 600 Ω, –40°C ≤ TJ ≤ 125°C
4.7
4.24
4.24
4.28
0.5
0.5
0.5
0.3
0.65
0.65
0.8
24
16
16
16
VO = 0 V 24
–40°C ≤ TJ ≤ 125°C
24
11
11
9
VO = 5 V
19
11
11
11
VO = 5 V
–40°C ≤ TJ ≤ 125°C
19
7.5
7.5
5.8
V
V
0.3
VO = 0 V 24
–40°C ≤ TJ ≤ 125°C
V
pF
RL = 2 kΩ
Sinking
(1)
(2)
pA
60
60
Output short circuit
current
Supply current
60
82
Sourcing
IS
65
0 V ≤ VCM ≤ 5 V
LMC7101Q-Q1 at 125°C
0.2 V ≤ VCM ≤ 4.8 V
–40°C ≤ TJ ≤ 125°C
–40°C ≤ TJ ≤ 125°C
ISC
82
pA
Tera Ω
>1
Common-mode input
capacitance
Output swing
μV/°C
1
–40°C ≤ TJ ≤ 125°C
CIN
UNIT
V
mA
mA
0.5
0.85
0.85
0.85
0.5
1
1
1
mA
Typical values represent the most likely parametric normal.
When operated at temperature between –40°C and 85°C, the LMC7101Q-Q1 will meet LMC7101BI specifications.
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
Submit Documentation Feedback
7
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
6.9 DC Electrical Characteristics: 15 V
Unless otherwise specified, all limits specified for TJ = 25°C, V+ = 15 V, V– = 0 V, VCM = 1.5 V, VO = V+ / 2 and RL = 1 MΩ.
PARAMETER
TEST CONDITIONS
TYP (1)
LMC7101AI
MIN
LMC7101Q-Q1 (2)
LMC7101BI
MAX
MIN
MAX
MIN
MAX
UNIT
VOS
Input offset voltage
0.11
mV
TCVOS
Input offset voltage
average drift
1
μV/°C
IB
Input current
–40°C ≤ TJ ≤ 125°C
1
64
64
1000
IOS
Input offset current
–40°C ≤ TJ ≤ 125°C
0.5
32
32
2000
RIN
Input resistance
CMRR
+PSRR
Common-mode
rejection ratio
Negative power
–PSRR
supply rejection ratio
0 V ≤ VCM ≤ 15 V
LMC7101Q-Q1 at 125°C
0.2 V ≤ VCM ≤ 14.8 V
82
70
65
65
0 V ≤ VCM ≤ 15 V
LMC7101Q-Q1 at 125°C
0.2 V ≤ VCM ≤ 14.8 V
–40°C ≤ TJ ≤ 125°C
82
65
60
60
V+ = 5 V to 15 V
V– = 0 V, VO = 1.5 V
82
70
65
65
82
65
62
62
V– = –5 V to –15 V
V+ = 0 V, VO = –1.5 V
82
70
65
65
V– = –5 V to –15 V
V+ = 0 V, VO = –1.5 V
–40°C ≤ TJ ≤ 125°C
82
65
62
62
–0.3
–0.2
–0.2
–0.2
-0.3
0
0
0.2
V+ = 5 V
For CMRR ≥ 50 dB
dB
dB
dB
V
+
VCM
Input common-mode
voltage range
V =5V
For CMRR ≥ 50 dB
–40°C ≤ TJ ≤ 125°C
–40°C ≤ TJ ≤ 125°C
Sourcing
AV
Large signal voltage
gain (3)
Sinking
Sourcing
Sinking
CIN
VO
8
15.2
15.2
15
15
14.8
340
80
80
80
340
40
40
30
RL = 2 kΩ
24
15
15
15
RL = 2 kΩ
–40°C ≤ TJ ≤ 125°C
24
10
10
4
300
34
34
34
15
6
6
6
V max
V/mV
V/mV
3
pF
V+ = 15 V
RL = 2 kΩ
14.7
14.4
14.4
14.4
V+ = 15 V
RL = 2 kΩ
–40°C ≤ TJ ≤ 125°C
14.7
14.2
14.2
14.2
V
0.16
0.32
0.32
0.32
–40°C ≤ TJ ≤ 125°C
0.16
0.45
0.45
0.45
V+ = 15 V
RL = 600 Ω
14.1
13.4
13.4
13.4
V+ = 15 V
RL = 600 Ω
–40°C ≤ TJ ≤ 125°C
14.1
13
13
12.85
–40°C ≤ TJ ≤ 125°C
(1)
(2)
(3)
15.2
15.3
RL = 2 kΩ
–40°C ≤ TJ ≤ 125°C
Input capacitance
Output swing
15.3
RL = 2 kΩ
RL = 600 Ω
pA
Tera Ω
>1
Positive power supply
V+ = 5 V to 15 V
rejection ratio
V– = 0 V, VO = 1.5 V
–40°C ≤ TJ ≤ 125°C
pA
V
V
0.5
1
1
1
0.5
1.3
1.3
1.5
V
Typical values represent the most likely parametric normal.
When operated at temperature between –40°C and 85°C, the LMC7101Q-Q1 will meet LMC7101BI specifications.
V+ = 15 V, VCM = 1.5 V and RL connect to 7.5 V. For sourcing tests, 7.5 V ≤ VO ≤ 12.5 V. For sinking tests, 2.5 V ≤ VO ≤ 7.5 V.
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
LMC7101, LMC7101Q-Q1
www.ti.com
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
DC Electrical Characteristics: 15 V (continued)
Unless otherwise specified, all limits specified for TJ = 25°C, V+ = 15 V, V– = 0 V, VCM = 1.5 V, VO = V+ / 2 and RL = 1 MΩ.
PARAMETER
TEST CONDITIONS
Sourcing
Output short circuit
current (4)
ISC
Sinking
IS
(4)
Supply current
TYP (1)
LMC7101AI
MIN
LMC7101Q-Q1 (2)
LMC7101BI
MAX
MIN
MAX
MIN
VO = 0 V
50
30
30
30
VO = 0 V
–40°C ≤ TJ ≤ 125°C
50
20
20
20
VO = 12 V
50
30
30
30
VO = 12 V
–40°C ≤ TJ ≤ 125°C
50
20
20
20
0.8
–40°C ≤ TJ ≤ 125°C
MAX
UNIT
mA
1.5
1.5
1.5
1.71
1.71
1.75
mA
Do not short circuit output to V+ when V+ is greater than 12 V or reliability will be adversely affected.
6.10 AC Electrical Characteristics: 5 V
Unless otherwise specified, all limits specified for TJ = 25°C, V+ = 5 V, V– = 0 V, VCM = 1.5 V, VO = V+ / 2 and RL = 1 MΩ.
PARAMETER
TYP (1)
TEST CONDITIONS
f = 10 kHz, AV = –2
RL = 10 kΩ, VO = 4 VPP
LMC7101AI
LIMIT (2)
LMC7101BI
LIMIT (2)
UNIT
THD
Total harmonic distortion
SR
Slew rate
1
V/μs
GBW
Gain bandwidth product
1
MHz
(1)
(2)
0.01%
Typical values represent the most likely parametric normal.
All limits are specified by testing or statistical analysis.
6.11 AC Electrical Characteristics: 15 V
Unless otherwise specified, all limits specified for TJ = 25°C, V+ = 15 V, V– = 0 V, VCM = 1.5 V, VO = V+ / 2 and RL = 1 MΩ.
PARAMETER
Slew rate (3)
SR
TEST CONDITIONS
V+ = 15 V
TYP (1)
Gain-bandwidth
product
φm
Gm
V+ = 15 V
MIN
MAX
MIN
0.5
0.5
0.5
0.4
0.4
0.4
MAX
UNIT
V/μs
min
MHz
Phase margin
45
deg
Gain margin
10
Input-referred voltage
noise
f = 1 kHz, VCM = 1 V
37
In
Input-referred current
noise
f = 1 kHz
1.5
Total harmonic
distortion
f = 10 kHz, AV = –2
RL = 10 kΩ
VO = 8.5 VPP
(1)
(2)
(3)
MAX
LMC7101Q-Q1 (2)
1.1
en
THD
MIN
LMC7101BI
1.1
+
V = 15 V, –40°C ≤ TJ ≤ 125°C
GBW
LMC7101AI
dB
nV
Hz
fA
Hz
0.01%
Typical values represent the most likely parametric normal.
When operated at temperature between –40°C and 85°C, the LMC7101Q-Q1 will meet LMC7101BI specifications.
V+ = 15 V. Connected as a voltage follower with a 10-V step input. Number specified is the slower of the positive and negative slew
rates. RL = 100 kΩ connected to 7.5 V. Amplifier excited with 1 kHz to produce VO = 10 VPP.
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
Submit Documentation Feedback
9
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
6.12 Typical Characteristics
6.12.1 Typical Characteristics: 2.7 V
V+ = 2.7 V, V– = 0 V, TA = 25°C, unless otherwise specified.
10
Figure 1. Open Loop Frequency Response
Figure 2. Input Voltage vs Output Voltage
Figure 3. Gain and Phase vs Capacitance Load
Figure 4. Gain and Phase vs Capacitance Load
Figure 5. dVOS vs Supply Voltage
Figure 6. dVOS vs Common Mode Voltage
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
LMC7101, LMC7101Q-Q1
www.ti.com
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
Typical Characteristics: 2.7 V (continued)
Figure 7. Sinking Current vs Output Voltage
Figure 8. Sourcing Current vs Output Voltage
6.12.2 Typical Characteristics: 3 V
V+ = 3 V, V– = 0 V, TA = 25°C, unless otherwise specified.
Figure 9. Open Loop Frequency Response
Figure 10. Input Voltage vs Output Voltage
Figure 11. Input Voltage Noise vs Input Voltage
Figure 12. Sourcing Current vs Output Voltage
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
Submit Documentation Feedback
11
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
Typical Characteristics: 3 V (continued)
Figure 13. Sinking Current vs Output Voltage
Figure 14. CMRR vs Input Voltage
6.12.3 Typical Characteristics: 5 V
V+ = 5 V, V– = 0 V, TA = 25°C, unless otherwise specified.
12
Figure 15. Open Loop Frequency Response
Figure 16. Input Voltage vs Output Voltage
Figure 17. Input Voltage Noise vs Input Voltage
Figure 18. Sourcing Current vs Output Voltage
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
LMC7101, LMC7101Q-Q1
www.ti.com
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
Typical Characteristics: 5 V (continued)
Figure 19. Sinking Current vs Output Voltage
Figure 20. CMRR vs Input Voltage
6.12.4 Typical Characteristics: 15 V
V+ = +15 V, V– = 0 V, TA = 25°C, unless otherwise specified.
Figure 21. Open Loop Frequency Response
Figure 22. Input Voltage vs Output Voltage
Figure 23. Input Voltage Noise vs Input Voltage
Figure 24. Sourcing Current vs Output Voltage
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
Submit Documentation Feedback
13
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
Typical Characteristics: 15 V (continued)
14
Figure 25. Sinking Current vs Output Voltage
Figure 26. CMRR vs Input Voltage
Figure 27. Supply Current vs Supply Voltage
Figure 28. Input Current vs Temperature
Figure 29. Output Voltage Swing vs Supply Voltage
Figure 30. Input Voltage Noise vs Frequency
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
LMC7101, LMC7101Q-Q1
www.ti.com
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
Typical Characteristics: 15 V (continued)
Figure 31. Positive PSRR vs Frequency
Figure 32. Negative PSRR vs Frequency
Figure 33. CMRR vs Frequency
Figure 34. Open Loop Frequency Response at –40°C
Figure 35. Open Loop Frequency Response at 25°C
Figure 36. Open Loop Frequency Response at 85°C
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
Submit Documentation Feedback
15
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
Typical Characteristics: 15 V (continued)
Figure 37. Maximum Output Swing vs Frequency
Figure 38. Gain and Phase vs Capacitive Load
Figure 39. Gain and Phase vs Capacitive Load
Figure 40. Output Impedance vs Frequency
Figure 41. Slew Rate vs Temperature
16
Submit Documentation Feedback
Figure 42. Slew Rate vs Supply Voltage
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
LMC7101, LMC7101Q-Q1
www.ti.com
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
Typical Characteristics: 15 V (continued)
Figure 43. Inverting Small Signal Pulse Response
Figure 44. Inverting Small Signal Pulse Response
Figure 45. Inverting Small Signal Pulse Response
Figure 46. Inverting Large Signal Pulse Response
Figure 47. Inverting Large Signal Pulse Response
Figure 48. Inverting Large Signal Pulse Response
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
Submit Documentation Feedback
17
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
Typical Characteristics: 15 V (continued)
18
Figure 49. Noninverting Small Signal Pulse Response
Figure 50. Noninverting Small Signal Pulse Response
Figure 51. Noninverting Small Signal Pulse Response
Figure 52. Noninverting Large Signal Pulse Response
Figure 53. Noninverting Large Signal Pulse Response
Figure 54. Noninverting Large Signal Pulse Response
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
LMC7101, LMC7101Q-Q1
www.ti.com
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
Typical Characteristics: 15 V (continued)
Figure 55. Stability vs Capacitive Load
Figure 56. Stability vs Capacitive Load
Figure 57. Stability vs Capacitive Load
Figure 58. Stability vs Capacitive Load
Figure 59. Stability vs Capacitive Load
Figure 60. Stability vs Capacitive Load
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
Submit Documentation Feedback
19
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
7 Detailed Description
7.1 Overview
The LMC7101 is a single channel, low-power operational amplifier available in a space-saving SOT-23 package,
offering rail-to-rail input and output operation across a wide range of power supply configurations. The
LMC7101Q-Q1 is the automotive Q-grade variant.
7.2 Functional Block Diagram
V+
IN–
–
OUT
IN+
+
V–
7.3 Feature Description
7.3.1 Benefits of the LMC7101 Tiny Amplifier
7.3.1.1 Size
The small footprint of the SOT-23-5 packaged tiny amplifier, (0.12 × 0.118 inches, 3.05 × 3 mm) saves space on
printed circuit boards, and enable the design of smaller electronic products. Because they are easier to carry,
many customers prefer smaller and lighter products.
7.3.1.2 Height
The 0.056 inches (1.43 mm) height of the tiny amplifier makes is suitable for use in a wide range of portable
applications in which a thin profile is required.
7.3.1.3 Signal Integrity
Signals can pick up noise between the signal source and the amplifier. By using a physically smaller amplifier
package, the tiny amplifier can be placed closer to the signal source, thus reducing noise pickup and increasing
signal integrity. The tiny amplifier can also be placed next to the signal destination, such as a buffer, for the
reference of an analog-to-digital converter.
7.3.1.4 Simplified Board Layout
The tiny amplifier can simplify board layout in several ways. Avoid long PCB traces by correctly placing amplifiers
instead of routing signals to a dual or quad device.
By using multiple tiny amplifiers instead of duals or quads, complex signal routing and possibly crosstalk can be
reduced.
7.3.1.5 Low THD
The high open-loop gain of the LMC7101 amp allows it to achieve very low audio distortion—typically 0.01% at
10 kHz with a 10-kΩ load at 5-V supplies. This makes the tiny amplifier an excellent for audio, modems, and low
frequency signal processing.
7.3.1.6 Low Supply Current
The typical 0.5-mA supply current of the LMC7101 extends battery life in portable applications, and may allow
the reduction of the size of batteries in some applications.
20
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
LMC7101, LMC7101Q-Q1
www.ti.com
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
Feature Description (continued)
7.3.1.7 Wide Voltage Range
The LMC7101 is characterized at 15 V, 5 V and 3 V. Performance data is provided at these popular voltages.
This wide voltage range makes the LMC7101 a good choice for devices where the voltage may vary over the life
of the batteries.
7.4 Device Functional Modes
7.4.1 Input Common Mode
7.4.1.1 Voltage Range
The LMC7101 does not exhibit phase inversion when an input voltage exceeds the negative supply voltage.
Figure 61 shows an input voltage exceeding both supplies with no resulting phase inversion of the output.
The absolute maximum input voltage is 300-mV beyond either rail at room temperature. Voltages greatly
exceeding this maximum rating, as in Figure 62, can cause excessive current to flow in or out of the input pins,
thus adversely affecting reliability.
An input voltage signal exceeds the LMC7101 power supply
voltages with no output phase inversion.
Figure 61. Input Voltage
A ±7.5-V input signal greatly exceeds the 3-V supply in Figure 63
causing no phase inversion due to RI.
Figure 62. Input Signal
Applications that exceed this rating must externally limit the maximum input current to ±5 mA with an input
resistor as shown in Figure 63.
Figure 63. RI Input Current Protection for
Voltages Exceeding the Supply Voltage
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
Submit Documentation Feedback
21
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers must
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Rail-to-Rail Output
The approximate output resistance of the LMC7101 is 180-Ω sourcing and 130-Ω sinking at VS = 3 V and 110-Ω
sourcing and 80-Ω sinking at VS = 5 V. Using the calculated output resistance, maximum output voltage swing
can be estimated as a function of load.
8.1.2 Capacitive Load Tolerance
The LMC7101 can typically directly drive a 100-pF load with VS = 15 V at unity gain without oscillating. The unity
gain follower is the most sensitive configuration. Direct capacitive loading reduces the phase margin of
operational amplifiers. The combination of the output impedance and the capacitive load of the operational
amplifier induces phase lag, which results in either an underdamped pulse response or oscillation.
Capacitive load compensation can be accomplished using resistive isolation as shown in Figure 64. This simple
technique is useful for isolating the capacitive input of multiplexers and A/D converters.
Figure 64. Resistive Isolation
of a 330-pF Capacitive Load
8.1.3 Compensating for Input Capacitance When Using Large Value Feedback Resistors
When using very large value feedback resistors, (usually > 500 kΩ) the large feed back resistance can react with
the input capacitance due to transducers, photo diodes, and circuit board parasitics to reduce phase margins.
The effect of input capacitance can be compensated for by adding a feedback capacitor. The feedback capacitor
(as in Figure 65), Cf is first estimated by Equation 1 and Equation 2, which typically provides significant
overcompensation.
1
1
³
2pR1CIN 2pR2Cf
(1)
R1 CIN ≤ R2 Cf
(2)
Printed circuit board stray capacitance may be larger or smaller than that of a breadboard, so the actual optimum
value for CF may be different. The values of CF must be checked on the actual circuit (refer to CMOS Quad
Operational Amplifier (SNOSBZ3) for a more detailed discussion).
22
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
LMC7101, LMC7101Q-Q1
www.ti.com
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
Application Information (continued)
Figure 65. Cancelling the Effect of Input Capacitance
8.2 Typical Application
Figure 66 shows a high input impedance noninverting circuit. This circuit gives a closed-loop gain equal to the
ratio of the sum of R1 and R2 to R1 and a closed-loop 3-dB bandwidth equal to the amplifier unity-gain
frequency divided by the closed-loop gain. This design has the benefit of a very high input impedance, which is
equal to the differential input impedance multiplied by loop gain. (Open loop gain/Closed loop gain.) In DC
coupled applications, input impedance is not as important as input current and its voltage drop across the source
resistance. The amplifier output will go into saturation if the input is allowed to float, which may be important if
the amplifier must be switched from source to source.
R2
V+
R1
–
IN
OUT
+
V–
Figure 66. Example Application
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
Submit Documentation Feedback
23
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
Typical Application (continued)
8.2.1 Design Requirements
For this example application, the supply voltage is 5 V, and 100 × ±5% of noninverting gain is necessary. The
signal input impedance is approximately 10 kΩ.
8.2.2 Detailed Design Procedure
Use the equation for a noninverting amplifier configuration; G = 1 + R2 / R1, set R1 to 10 kΩ, and R2 to 99 × the
value of R1, which would be 990 kΩ. Replacing the 990-kΩ resistor with a more readily available 1-MΩ resistor
will result in a gain of 101, which is within the desired gain tolerance. The gain-frequency characteristic of the
amplifier and its feedback network must be such that oscillation does not occur. To meet this condition, the
phase shift through amplifier and feedback network must never exceed 180° for any frequency where the gain of
the amplifier and its feedback network is greater than unity. In practical applications, the phase shift must not
approach 180° because this is the situation of conditional stability. The most critical case occurs when the
attenuation of the feedback network is zero.
8.2.3 Application Curve
VO (V)
VDD
Gain = 1 + R2/R1
= 101 (as shown)
VIN (mV)
Figure 67. Output Response
24
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
LMC7101, LMC7101Q-Q1
www.ti.com
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
9 Power Supply Recommendations
For proper operation, the power supplies must be decoupled. For supply decoupling, TI recommends placing
10-nF to 1-µF capacitors as close as possible to the operational-amplifier power supply pins. For single supply
configurations, place a capacitor between the V+ and V– supply pins. For dual supply configurations, place one
capacitor between V+ and ground, and place a second capacitor between V– and ground. Bypass capacitors
must have a low ESR of less than 0.1 Ω.
10 Layout
10.1 Layout Guidelines
Care must be taken to minimize the loop area formed by the bypass capacitor connection between supply pins
and ground. A ground plane underneath the device is recommended; any bypass components to ground must
have a nearby via to the ground plane. The optimum bypass capacitor placement is closest to the corresponding
supply pin. Use of thicker traces from the bypass capacitors to the corresponding supply pins will lower the
power-supply inductance and provide a more stable power supply.
The feedback components must be placed as close as possible to the device to minimize stray parasitics.
10.2 Layout Example
Figure 68. LMC7101 Example Layout
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
Submit Documentation Feedback
25
LMC7101, LMC7101Q-Q1
SNOS719G – SEPTEMBER 1999 – REVISED SEPTEMBER 2015
www.ti.com
11 Device and Documentation Support
11.1 Documentation Support
For additional information, see LMC660 CMOS Quad Operational Amplifier (SNOSBZ3).
11.2 Related Links
Table 1 lists quick access links. Categories include technical documents, support and community resources,
tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LMC7101
Click here
Click here
Click here
Click here
Click here
LMC7101Q-Q1
Click here
Click here
Click here
Click here
Click here
11.3 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
26
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LMC7101 LMC7101Q-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Apr-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMC7101AIM5
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 85
A00A
LMC7101AIM5/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
A00A
LMC7101AIM5X
NRND
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 85
A00A
LMC7101AIM5X/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
A00A
LMC7101BIM5
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 85
A00B
LMC7101BIM5/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
A00B
LMC7101BIM5X
NRND
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 85
A00B
LMC7101BIM5X/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
A00B
LMC7101QM5/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
AT6A
LMC7101QM5X/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
AT6A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
8-Apr-2015
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LMC7101AIM5
SOT-23
DBV
5
1000
178.0
8.4
LMC7101AIM5/NOPB
SOT-23
DBV
5
1000
178.0
LMC7101AIM5X
SOT-23
DBV
5
3000
178.0
LMC7101AIM5X/NOPB
SOT-23
DBV
5
3000
LMC7101BIM5
SOT-23
DBV
5
LMC7101BIM5/NOPB
SOT-23
DBV
LMC7101BIM5X
SOT-23
DBV
LMC7101BIM5X/NOPB
SOT-23
LMC7101QM5/NOPB
LMC7101QM5X/NOPB
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMC7101AIM5
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMC7101AIM5/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMC7101AIM5X
SOT-23
DBV
5
3000
210.0
185.0
35.0
LMC7101AIM5X/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
LMC7101BIM5
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMC7101BIM5/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMC7101BIM5X
SOT-23
DBV
5
3000
210.0
185.0
35.0
LMC7101BIM5X/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
LMC7101QM5/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMC7101QM5X/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated